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WO2003088351A1 - Structure d'orifice dans un dispositif de traitement de semi-conducteur - Google Patents

Structure d'orifice dans un dispositif de traitement de semi-conducteur Download PDF

Info

Publication number
WO2003088351A1
WO2003088351A1 PCT/JP2003/003997 JP0303997W WO03088351A1 WO 2003088351 A1 WO2003088351 A1 WO 2003088351A1 JP 0303997 W JP0303997 W JP 0303997W WO 03088351 A1 WO03088351 A1 WO 03088351A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier container
port
door
container
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2003/003997
Other languages
English (en)
Japanese (ja)
Inventor
Yasushi Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to KR1020047010060A priority Critical patent/KR100922051B1/ko
Publication of WO2003088351A1 publication Critical patent/WO2003088351A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/3408—
    • H10P72/50—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H10P30/20—
    • H10P95/90—

Definitions

  • Fig. 2 is a vertical view schematically showing the inside of the vertical heat treatment apparatus shown in Fig. 1. Sectional view.
  • FIG. 7 is a perspective view showing a holding mechanism of the vertical heat treatment apparatus shown in FIG.
  • the area S 1 and the loading area S 2 are separated by a partition wall 4.
  • the partition 4 is formed with a port 41, and the port 41 is opened and closed by a door 43.
  • the area S1 is set to the air atmosphere (the atmosphere in the clean room).
  • the opening area S2 is set in an inert gas atmosphere, for example, a nitrogen ( ⁇ 2) gas atmosphere or a clean dry gas (air having a low particle and organic component and a dew point of less than 60 ° C). You.
  • a vertical heat treatment furnace 91 having a furnace B at its lower end which is opened and closed by a lid 94 is provided.
  • a wafer boat 92 which is a holder for holding a large number of wafers W in a shelf shape, is placed on a lid 94.
  • a heat insulating portion 93 is provided between the wafer boat 92 and the cover 94 on the cover 94.
  • the lid body 94 is supported on an elevating mechanism 95, and the elevating mechanism 95 loads and unloads the wafer port 92 from the heat treatment furnace 91.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de traitement de semi-conducteur comprenant une structure d'orifice permettant d'introduire ou de sortir un substrat (W) soumis à un traitement. Une paroi de séparation (4) destinée à séparer la région extérieure (S1) de la région intérieure (S2) du dispositif est dotée d'un orifice (41) permettant le passage du substrat (W) soumis à un traitement. Ladite paroi de séparation (4) est équipée d'une porte (43) permettant d'ouvrir et de fermer l'orifice (41). Un support (61) est disposé dans la région extérieure (S1) face à l'orifice (41). Un élément de presse (72) est disposé au-dessus dudit support (61). Ledit élément de presse (72) presse un récipient porteur (2) destiné au substrat (W) soumis à un traitement du haut vers le support (61). Cet élément de presse (72) se déplace d'une position inférieure dans laquelle il coopère avec le récipient porteur (2) vers une position supérieure dans laquelle il n'interfère pas avec le déplacement dudit récipient porteur (2).
PCT/JP2003/003997 2002-04-12 2003-03-28 Structure d'orifice dans un dispositif de traitement de semi-conducteur Ceased WO2003088351A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020047010060A KR100922051B1 (ko) 2002-04-12 2003-03-28 반도체 처리 장치에 있어서의 포트 구조

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-111114 2002-04-12
JP2002111114 2002-04-12

Publications (1)

Publication Number Publication Date
WO2003088351A1 true WO2003088351A1 (fr) 2003-10-23

Family

ID=29243258

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/003997 Ceased WO2003088351A1 (fr) 2002-04-12 2003-03-28 Structure d'orifice dans un dispositif de traitement de semi-conducteur

Country Status (4)

Country Link
KR (1) KR100922051B1 (fr)
CN (2) CN1307706C (fr)
TW (1) TWI270955B (fr)
WO (1) WO2003088351A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150243540A1 (en) * 2014-02-24 2015-08-27 Tokyo Electron Limited Substrate processing apparatus and substrate processing method

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4778546B2 (ja) * 2007-11-30 2011-09-21 東京エレクトロン株式会社 半導体製造装置における地震被害拡散低減方法及び地震被害拡散低減システム
JP5134495B2 (ja) 2008-10-16 2013-01-30 東京エレクトロン株式会社 処理装置及び処理方法
KR101258350B1 (ko) * 2010-06-07 2013-04-30 도쿄엘렉트론가부시키가이샤 기판 처리 장치
KR101283312B1 (ko) * 2011-12-29 2013-07-09 로체 시스템즈(주) Ｆｏｓｂ 오토 로딩 시스템
JP7422577B2 (ja) * 2020-03-23 2024-01-26 平田機工株式会社 ロードポート及び制御方法
KR102372513B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템
KR102372514B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템의 풉 고정장치
KR102897579B1 (ko) 2021-08-05 2025-12-09 삼성전자주식회사 링크 암을 갖는 이송 장치 및 이를 포함하는 스토커

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04184958A (ja) * 1990-11-20 1992-07-01 Ebara Corp キャリヤボックス内容物の収容取出方法及び装置
JPH0846005A (ja) * 1994-07-26 1996-02-16 Takenaka Komuten Co Ltd ウエーハ移載装置
US5730573A (en) * 1994-02-22 1998-03-24 Tdk Corporation Clean transfer method and apparatus therefor
WO1999032381A1 (fr) * 1997-12-19 1999-07-01 Semitool, Inc. Systeme de manipulation en entree/sortie de tranches de semi-conducteurs
JP2001127138A (ja) * 1993-12-10 2001-05-11 Tokyo Electron Ltd 処理装置及び処理方法
US6231290B1 (en) * 1998-03-23 2001-05-15 Tokyo Electron Processing method and processing unit for substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501070B1 (en) * 1998-07-13 2002-12-31 Newport Corporation Pod load interface equipment adapted for implementation in a fims system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04184958A (ja) * 1990-11-20 1992-07-01 Ebara Corp キャリヤボックス内容物の収容取出方法及び装置
JP2001127138A (ja) * 1993-12-10 2001-05-11 Tokyo Electron Ltd 処理装置及び処理方法
US5730573A (en) * 1994-02-22 1998-03-24 Tdk Corporation Clean transfer method and apparatus therefor
JPH0846005A (ja) * 1994-07-26 1996-02-16 Takenaka Komuten Co Ltd ウエーハ移載装置
WO1999032381A1 (fr) * 1997-12-19 1999-07-01 Semitool, Inc. Systeme de manipulation en entree/sortie de tranches de semi-conducteurs
US6231290B1 (en) * 1998-03-23 2001-05-15 Tokyo Electron Processing method and processing unit for substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150243540A1 (en) * 2014-02-24 2015-08-27 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US9666464B2 (en) * 2014-02-24 2017-05-30 Tokyo Electron Limited Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
KR20040099260A (ko) 2004-11-26
TWI270955B (en) 2007-01-11
CN1639857A (zh) 2005-07-13
KR100922051B1 (ko) 2009-10-19
TW200402822A (en) 2004-02-16
CN2795158Y (zh) 2006-07-12
CN1307706C (zh) 2007-03-28

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