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WO2003087590A3 - Method of self-assembly and self-assembled structures - Google Patents

Method of self-assembly and self-assembled structures Download PDF

Info

Publication number
WO2003087590A3
WO2003087590A3 PCT/US2003/011078 US0311078W WO03087590A3 WO 2003087590 A3 WO2003087590 A3 WO 2003087590A3 US 0311078 W US0311078 W US 0311078W WO 03087590 A3 WO03087590 A3 WO 03087590A3
Authority
WO
WIPO (PCT)
Prior art keywords
self
liquid
substrate
assembly
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/011078
Other languages
French (fr)
Other versions
WO2003087590A2 (en
Inventor
Heiko O Jacobs
Andrea R Tao
Alexander Schwartz
David H Gracias
George M Whitesides
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harvard University
Original Assignee
Harvard University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harvard University filed Critical Harvard University
Priority to AU2003230860A priority Critical patent/AU2003230860A1/en
Publication of WO2003087590A2 publication Critical patent/WO2003087590A2/en
Publication of WO2003087590A3 publication Critical patent/WO2003087590A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H10W70/611—
    • H10W70/688—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/07321—
    • H10W72/07336—
    • H10W72/354—

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)

Abstract

The present invention is directed to self-assembly of structures, and, in particular, to self-assembly by action of a liquid patterned onto a substrate. In one embodiment, the present invention is directed to method of self-assembling a plurality of structures. The method includes patterning a first liquid onto a first substrate, and, while at least a portion of the first liquid remains in liquid form, self-assembling at least a portion of the plurality of structures onto the substrate by action of the first liquid and according to the pattern of the first liquid. In another embodiment, the present invention is directed to a display. The display includes a first substrate and a first plurality of electrical connectors being in electrical connection with one another. The display further includes a second substrate, at least some of the second plurality of electrical connectors being in electrical connection with one another. The display further includes a plurality of display elements each electrically connected to at least one of the first plurality of electrical connectors and the second plurality of connectors. In this embodiment, each of the plurality of display elements has an average diameter of less than 1 millimeter.
PCT/US2003/011078 2002-04-10 2003-04-10 Method of self-assembly and self-assembled structures Ceased WO2003087590A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003230860A AU2003230860A1 (en) 2002-04-10 2003-04-10 Method of self-assembly and self-assembled structures

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37153202P 2002-04-10 2002-04-10
US60/371,532 2002-04-10

Publications (2)

Publication Number Publication Date
WO2003087590A2 WO2003087590A2 (en) 2003-10-23
WO2003087590A3 true WO2003087590A3 (en) 2004-04-01

Family

ID=29250697

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/011078 Ceased WO2003087590A2 (en) 2002-04-10 2003-04-10 Method of self-assembly and self-assembled structures

Country Status (2)

Country Link
AU (1) AU2003230860A1 (en)
WO (1) WO2003087590A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7232771B2 (en) 2003-11-04 2007-06-19 Regents Of The University Of Minnesota Method and apparatus for depositing charge and/or nanoparticles
US7592269B2 (en) 2003-11-04 2009-09-22 Regents Of The University Of Minnesota Method and apparatus for depositing charge and/or nanoparticles

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7525194B2 (en) 2005-07-27 2009-04-28 Palo Alto Research Center Incorporated System including self-assembled interconnections
US7504331B2 (en) 2005-07-27 2009-03-17 Palo Alto Research Center Incorporated Method of fabricating self-assembled electrical interconnections
US20080075668A1 (en) * 2006-09-27 2008-03-27 Goldstein Alan H Security Device Using Reversibly Self-Assembling Systems
WO2008091581A1 (en) 2007-01-22 2008-07-31 The University Of Minnesota Nanoparticles with grafted organic molecules
DE102009050703B3 (en) 2009-10-26 2011-04-21 Evonik Goldschmidt Gmbh Method for self-assembly of electrical, electronic or micromechanical components on a substrate and product produced therewith

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316278B1 (en) * 1999-03-16 2001-11-13 Alien Technology Corporation Methods for fabricating a multiple modular assembly
US20020001046A1 (en) * 1999-02-05 2002-01-03 Jacobsen Jeffrey Jay Apparatuses and methods for forming assemblies

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020001046A1 (en) * 1999-02-05 2002-01-03 Jacobsen Jeffrey Jay Apparatuses and methods for forming assemblies
US6316278B1 (en) * 1999-03-16 2001-11-13 Alien Technology Corporation Methods for fabricating a multiple modular assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7232771B2 (en) 2003-11-04 2007-06-19 Regents Of The University Of Minnesota Method and apparatus for depositing charge and/or nanoparticles
US7592269B2 (en) 2003-11-04 2009-09-22 Regents Of The University Of Minnesota Method and apparatus for depositing charge and/or nanoparticles

Also Published As

Publication number Publication date
AU2003230860A1 (en) 2003-10-27
WO2003087590A2 (en) 2003-10-23
AU2003230860A8 (en) 2003-10-27

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