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WO2003066771A1 - Resine adhesive: composition et utilisation - Google Patents

Resine adhesive: composition et utilisation Download PDF

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Publication number
WO2003066771A1
WO2003066771A1 PCT/JP2003/001044 JP0301044W WO03066771A1 WO 2003066771 A1 WO2003066771 A1 WO 2003066771A1 JP 0301044 W JP0301044 W JP 0301044W WO 03066771 A1 WO03066771 A1 WO 03066771A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
component
resin composition
adherend
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2003/001044
Other languages
English (en)
Japanese (ja)
Inventor
Mahito Fujita
Toshiyuki Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to AU2003208099A priority Critical patent/AU2003208099A1/en
Priority to KR10-2004-7012015A priority patent/KR20040088052A/ko
Publication of WO2003066771A1 publication Critical patent/WO2003066771A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Definitions

  • R represents a hydrocarbon group having a double bond and having 2 to 18 carbon atoms, and a halogen atom may be bonded to the hydrocarbon group.
  • X is a single bond or a carbonyl group.
  • R ′ represents a hydrocarbon group having a double bond and having 2 to 18 carbon atoms, and a halogen atom may be bonded to the hydrocarbon group.
  • Y is a carbonyl group [3]
  • the component (A) is obtained by polymerizing a monomer copolymerizable with ethylene, which does not react with an epoxy group, the above-mentioned monomer) and the above-mentioned monomer (a 2 ).
  • the component (B) is used in an amount of 0.01 to 1 in terms of the structural unit derived from the monomer (b 2 ) with respect to a total of 100 parts by weight of all the structural units constituting the component (B). 20 parts by weight, (b 3) the adhesive resin composition according to (4), which contains 25 to 70 parts by weight of a structural unit derived from a monomer,
  • An adherend is laminated on the adhesive film layer side obtained by forming the adhesive resin composition of the adhesive laminated film according to [13] or [14] into a film.
  • the adherend is separated from the laminate by heating the laminate according to any one of [15] to [18] above the decomposition temperature of the component (C). To collect adherends
  • the component (A) in the present invention is an epoxy resin containing an epoxy group, and specifically, an olefin resin containing a carbon-carbon double bond such as Epofriend (registered trademark, manufactured by Daicel Chemical Industries, Ltd.).
  • an olefin resin containing a carbon-carbon double bond such as Epofriend (registered trademark, manufactured by Daicel Chemical Industries, Ltd.).
  • Examples include an olefin resin in which an epoxy group is generated by oxidation, and a resin obtained by polymerizing a monomer containing an epoxy group-containing carbon-carbon double bond.
  • R in the general formula (1) is a hydrocarbon group having a double bond, particularly a non-aromatic CC double bond and having 2 to 18 carbon atoms.
  • R ′ in the formula (2) is a hydrocarbon group having a double bond, particularly a non-aromatic CC double bond and having 2 to 18 carbon atoms.
  • hydrogen on the hydrocarbon group The atoms may be replaced by halogen atoms.
  • —X in general formula (1) is a simple bond between R and the oxygen atom in general formula (1). A bond or a carbonyl group.
  • (a 2) a monomer, ⁇ Li glycidyl ether, 2-Mechiruari Legris Siji Honoré ether, styrene - p - unsaturated Gurishijinore ethers such glycidyl ether; glycidyl ⁇ chestnut rate, glycidyl methacrylate, itaconic Thang And unsaturated dalicidyl esters such as ricidyl esters.
  • the content of the structural unit derived from the (a 2 ) monomer in the A1 copolymer is usually in the range of 100 parts by weight of all the structural units constituting the epoxy group-containing ethylene copolymer. It is about 1 to 30 parts by weight.
  • (A 2 ) When the content of the structural unit derived from the monomer is 1 part by weight or more, the mechanical strength of the obtained adhesive film tends to be improved, so that it is preferably 30 parts by weight or less. It is preferable because the storage stability as an epoxy group-containing ethylene copolymer tends to be excellent.
  • the A 1 copolymer not to react with an epoxy group, an ethylene copolymerized with available-monomer (hereinafter sometimes referred to as (a 3) monomer.), I.e., () Single A monomer which is different from the monomer (a 2 ) and is copolymerizable with ethylene is polymerized together with the monomer ( ai ) and the monomer (a 2 ). You may. Incidentally, (a 3) monomer is a carboxylic acid group or a hydroxyl group, it does not contain functional groups capable of reacting with an epoxy group.
  • the (a 3) a monomer, among others, propylene, acetic Bulle, acrylic acid methylation, Atariru acid Echiru, Atariru acid n- butyl, methyl Metatariru acid Ru preferred der.
  • the content of the structural unit derived from the monomer (a 3 ) in the A1 copolymer is usually calculated based on 100 parts by weight of all the structural units constituting the epoxy group-containing ethylene copolymer. It is about 0 to 70 parts by weight, particularly preferably about 25 to 60 parts by weight.
  • the amount is preferably 70 parts by weight or less, because the A1 copolymer tends to be easily produced by a high-pressure radical method or the like.
  • a 1 copolymers, block copolymers, graph preparative copolymer, a random copolymer may be any of alternating copolymer, for example, propylene - ethylene block copolymer (a 2) Single A copolymer obtained by grafting an ⁇ ,] 3-unsaturated carboxylic acid ester onto an ethylene-epoxy group-containing monomer copolymer Polymers (Japanese Patent No. 26020048) and the like.
  • a monomer as a raw material other than ethylene is mixed with ethylene and a radical generator in the presence of ethylene and a radical generator at about 500 to 400 atm.
  • the A1 copolymer is commercially available, and such a commercially available product can also be used.
  • Examples of such commercial products include “Bondfast (registered trademark)” series such as “Bondfast CG501”, “Bondfast E”, and “Bondfast 20B” (Sumitomo Chemical Ethylene copolymers and terpolymers with glycidyl methacrylate manufactured by Kogyo Co., Ltd .; Sepolsion G series (manufactured by Sumitomo Seika Co., Ltd.); be able to.
  • a polymer containing a carboxylic acid group and an acid anhydride group is preferable, and in particular, a () monomer, a (b 2 ) monomer, and a (b 3 ) monomer are polymerized.
  • the ethylene / ⁇ , -unsaturated carboxylic acid copolymer (hereinafter sometimes referred to as B 1 copolymer) obtained by the above method is preferred.
  • the content of the structural unit derived from the (b 2 ) monomer in the B1 copolymer is usually 0.01 parts by weight based on 100 parts by weight of all the structural units constituting the B1 copolymer. About 20 parts by weight, preferably about 0.1 to 15 parts by weight. (B 2 ) When the content of the structural unit derived from the monomer is at least 0.01 part by weight, the mechanical strength of the obtained adhesive film tends to be improved. Is preferred because it tends to have excellent storage stability as a B1 copolymer. No.
  • Examples of the unsaturated carboxylic acid ester of the (b 3 ) monomer in the Bl copolymer include an ⁇ , ⁇ -unsaturated carboxylic acid alkyl ester having about 3 to 8 carbon atoms.
  • the content of the structural unit derived from the monomer (b 3 ) is usually 25 to 100 parts by weight of all the structural units constituting the B1 copolymer. To 70 parts by weight, preferably about 25 to 65 parts by weight. (B 3 )
  • the content of the structural unit derived from the monomer is 25 parts by weight or more, it is preferable because handling when kneading the adhesive resin composition of the present invention tends to be easy, Further, it is preferable because the B 1 copolymer tends to be easily dissolved in an organic solvent.
  • the content of 70 parts by weight or less is preferable because the B1 copolymer tends to be easily produced by a high-pressure radical method or the like.
  • organic foaming agent examples include azo compounds such as azodicarbonamide and azobisisobutyl mouth-tolyl, dinitrosopentamethylenetetramine, nitroso compounds such as N, N'-dinitroso N, N'-dimethyl terephthalamide, p — Toluenesulfonylhydrazide, p, p '—Hydroxyzide compounds such as oxybis (benzenesulfonylhydrazide) and hydrazolcarbonamide, p-Toluenesulfonylazide Acetone-p-sulfonylhydrazone, melamine, urea, dicyanamide and the like.
  • azo compounds such as azodicarbonamide and azobisisobutyl mouth-tolyl, dinitrosopentamethylenetetramine
  • nitroso compounds such as N, N'-dinitroso N, N'-dimethyl terephthalamide
  • blowing agent two or more types of blowing agents may be used. Further, among the foaming agents, organic foaming agents are preferable, and azodicarbonamide is particularly preferable.
  • the adhesive resin composition of the present invention includes an inorganic filler, a pigment, an antioxidant, a processing stabilizer, a weathering agent, a heat stabilizer, a light stabilizer, a nucleating agent, a lubricant, as long as the effects of the present invention are not impaired.
  • Additives such as a release agent, a flame retardant, and an antistatic agent may be contained.
  • the adhesive resin composition thus obtained can be used as it is as an adhesive, but the adhesive resin composition of the present invention is formed into a film to form an adhesive film. (Hereinafter sometimes referred to as the present adhesive film).
  • the present adhesive film is formed, for example, by a method of press-molding a kneaded product obtained by kneading the adhesive resin composition of the present invention, dissolving or dispersing the adhesive resin composition of the present invention in a solvent, and coating the flat surface on a plane It can be easily obtained by a drying method.
  • the thickness of the present adhesive film is usually about 3 ⁇ or more, preferably about 3 to 200 ⁇ m, and particularly preferably about 10 to 150 ⁇ m.
  • the adhesive laminated film obtained by laminating the adhesive film on a supporting substrate (hereinafter sometimes referred to as the present adhesive laminated film) is easy to handle because the surface of the supporting substrate does not adhere. This is a preferred embodiment in terms of the point.
  • the present adhesive laminated film is, for example, a method of laminating the adhesive resin composition of the present invention obtained as a kneaded product and a supporting substrate by co-extrusion molding;
  • a method of laminating the adhesive resin composition of the present invention in the form of a solution or an emulsion on a supporting base material for example, a reverse roll coater, a gravure coater 1 to a microno coater, a kiss coater, a Mayno coater, or air. It can be manufactured by a method such as coating with a lono-recorder such as a knife coater, a blade coater, etc., followed by drying with a heated air-open, a vacuum dryer or the like.
  • examples of the supporting substrate include films made of polyolefin such as polyethylene, polypropylene, and 4-methyl-1-pentene copolymer; release paper; films made of release polyethylene terephthalate; films made of cellulose triacetate, and the like. Is mentioned.
  • release paper films made of release paper and release polyethylene terephthalate
  • these release treated surfaces are usually in contact with the present adhesive film layer in order to peel off the supporting substrate.
  • the heating temperature at the time of bonding varies depending on the type of the component (C) to be used, but it is lower than the decomposition temperature of the component (C), specifically, about 80 to 150 ° C. While confirming the state of adhesion by heating, the time can be appropriately determined within a range in which the decomposition of the component (C) does not substantially occur, but when performed at a relatively high temperature, the time is relatively short. In the case of performing at a low temperature, it is generally performed for a long time.
  • the gel time at the set temperature of the adhesive resin composition of the present invention and the time required for foaming of the component (C) are confirmed in advance, and as a result, the time during which gelation occurs and foaming does not occur is determined.
  • the material constituting the adherend is a material that can adhere to the present adhesive layer.
  • cellulosic polymer materials metals such as gold, silver, copper, iron, tin, lead, and silicon; inorganic substances such as glass and ceramics; melamine resins, acrylic urethane resins, Examples include urethane-based resins, (meth) acryl-based resins, styrene-acrylonitrile-based copolymers, polycarbonate-based resins, phenolic resins, alkyd resins, epoxy resins, and polymer materials such as silicone resins.
  • the material of the adherend two or more different materials may be mixed and compounded.
  • the materials forming the two adherends are the same type of material but different types of materials. Either may be used.
  • the adherend has a heat resistance temperature higher than the heating temperature at the time of peeling and collecting the adherend, the interface between the adherend and the adhesive layer tends to peel off. preferable.
  • (C) the foaming temperature of the component to about + 20 ° C. and about 5 to 60 minutes can be mentioned.
  • the adherend recovered in this way can be easily peeled off from the laminate, and the adherent hardly has the substance derived from the present adhesive layer or has the substance derived from the present adhesive layer attached thereto. Even if it is worn, it can be easily separated from the adherend, and the adherend can be recycled (reused) or easily obtained as a product.
  • the recovered adherend such as metal or plastic may be melted, separately molded, and reused.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Adhesive Tapes (AREA)

Abstract

L'invention concerne une composition de résine adhésive à trois composants, en l'occurrence (A) une résine d'oléfine époxydée, (B) un durcisseur, et (C) un agent moussant thermiquement décomposable. L'invention concerne également un film autocollant fait à partir de la composition, un film stratifié autocollant produit par stratification d'un film adhésif sur un support, un stratifié obtenu par liaison d'un agent adhérant sur une couche adhésive formée par chauffage du film adhésif, et un procédé de décollage et de récupération de l'agent adhérant du stratifié par chauffage du stratifié.
PCT/JP2003/001044 2002-02-07 2003-02-03 Resine adhesive: composition et utilisation Ceased WO2003066771A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2003208099A AU2003208099A1 (en) 2002-02-07 2003-02-03 Adhesive resin composition and use thereof
KR10-2004-7012015A KR20040088052A (ko) 2002-02-07 2003-02-03 접착성 수지 조성물 및 그 용도

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002/30739 2002-02-07
JP2002030739 2002-02-07

Publications (1)

Publication Number Publication Date
WO2003066771A1 true WO2003066771A1 (fr) 2003-08-14

Family

ID=27677911

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/001044 Ceased WO2003066771A1 (fr) 2002-02-07 2003-02-03 Resine adhesive: composition et utilisation

Country Status (5)

Country Link
KR (1) KR20040088052A (fr)
CN (1) CN1290958C (fr)
AU (1) AU2003208099A1 (fr)
TW (1) TWI263666B (fr)
WO (1) WO2003066771A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422601B (zh) * 2007-11-29 2014-01-11 Sumitomo Chemical Co Thermosetting resin composition
JP6068236B2 (ja) * 2013-04-02 2017-01-25 富士フイルム株式会社 積層フィルム、太陽電池モジュール用バックシート及び太陽電池モジュール
CN103627336A (zh) * 2013-05-14 2014-03-12 苏州邦立达新材料有限公司 一种压敏胶带及其制备方法
CN104497905A (zh) * 2014-12-11 2015-04-08 安徽明讯新材料科技股份有限公司 一种低粘性保护膜及其制备方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614574A (en) * 1979-07-16 1981-02-12 Hitachi Chem Co Ltd Self-adhesive or adhesive tape
JPS6414235A (en) * 1987-07-08 1989-01-18 Showa Denko Kk Crosslinked ethylenic copolymer mixture
EP0527505A2 (fr) * 1991-08-14 1993-02-17 Nitto Denko Corporation Adhésif piézo-sensible pelable et matériau adhésif en faisant utilisation
JPH0543855A (ja) * 1991-08-13 1993-02-23 Nippon Synthetic Chem Ind Co Ltd:The 剥離性粘着剤組成物
JPH06184504A (ja) * 1992-09-14 1994-07-05 Nitto Denko Corp 加熱剥離性接着剤及び粘着部材
JPH07133472A (ja) * 1993-11-11 1995-05-23 Sekisui Chem Co Ltd 粘着剤組成物
JPH107719A (ja) * 1996-06-28 1998-01-13 Mitsui Petrochem Ind Ltd オレフィン・極性モノマー共重合体からなる改質剤
JP2002069422A (ja) * 2000-08-30 2002-03-08 Toyo Chem Co Ltd 熱発泡型粘着剤及びその粘着部材
WO2002033017A2 (fr) * 2000-10-18 2002-04-25 Nitto Denko Corporation Feuille adhesive autocollante thermodetachable et durcissable par faisceau d'energie et procede de production de pieces decoupees a l'aide de cette feuille
JP2002146326A (ja) * 2000-11-02 2002-05-22 Three M Innovative Properties Co 接着シート
JP2002249744A (ja) * 2001-02-26 2002-09-06 Sekisui Chem Co Ltd 光硬化型粘接着剤組成物、粘接着剤及び粘接着剤の剥離方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614574A (en) * 1979-07-16 1981-02-12 Hitachi Chem Co Ltd Self-adhesive or adhesive tape
JPS6414235A (en) * 1987-07-08 1989-01-18 Showa Denko Kk Crosslinked ethylenic copolymer mixture
JPH0543855A (ja) * 1991-08-13 1993-02-23 Nippon Synthetic Chem Ind Co Ltd:The 剥離性粘着剤組成物
EP0527505A2 (fr) * 1991-08-14 1993-02-17 Nitto Denko Corporation Adhésif piézo-sensible pelable et matériau adhésif en faisant utilisation
JPH06184504A (ja) * 1992-09-14 1994-07-05 Nitto Denko Corp 加熱剥離性接着剤及び粘着部材
JPH07133472A (ja) * 1993-11-11 1995-05-23 Sekisui Chem Co Ltd 粘着剤組成物
JPH107719A (ja) * 1996-06-28 1998-01-13 Mitsui Petrochem Ind Ltd オレフィン・極性モノマー共重合体からなる改質剤
JP2002069422A (ja) * 2000-08-30 2002-03-08 Toyo Chem Co Ltd 熱発泡型粘着剤及びその粘着部材
WO2002033017A2 (fr) * 2000-10-18 2002-04-25 Nitto Denko Corporation Feuille adhesive autocollante thermodetachable et durcissable par faisceau d'energie et procede de production de pieces decoupees a l'aide de cette feuille
JP2002146326A (ja) * 2000-11-02 2002-05-22 Three M Innovative Properties Co 接着シート
JP2002249744A (ja) * 2001-02-26 2002-09-06 Sekisui Chem Co Ltd 光硬化型粘接着剤組成物、粘接着剤及び粘接着剤の剥離方法

Also Published As

Publication number Publication date
AU2003208099A1 (en) 2003-09-02
CN1628163A (zh) 2005-06-15
CN1290958C (zh) 2006-12-20
TW200401019A (en) 2004-01-16
KR20040088052A (ko) 2004-10-15
TWI263666B (en) 2006-10-11

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