[go: up one dir, main page]

WO2002039799A1 - Circuit de commande hybride de moteurs electriques utilisant le couvercle de l'engrenage reducteur comme dissipateur de chaleur - Google Patents

Circuit de commande hybride de moteurs electriques utilisant le couvercle de l'engrenage reducteur comme dissipateur de chaleur Download PDF

Info

Publication number
WO2002039799A1
WO2002039799A1 PCT/ES2000/000426 ES0000426W WO0239799A1 WO 2002039799 A1 WO2002039799 A1 WO 2002039799A1 ES 0000426 W ES0000426 W ES 0000426W WO 0239799 A1 WO0239799 A1 WO 0239799A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit according
components
multichip
circuit
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/ES2000/000426
Other languages
English (en)
Spanish (es)
Inventor
Antonio Ferre Fabregas
Jordi Bigorra Vives
Ignacio Longares Felipe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to PCT/ES2000/000426 priority Critical patent/WO2002039799A1/fr
Publication of WO2002039799A1 publication Critical patent/WO2002039799A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/38—Control circuits or drive circuits associated with geared commutator motors of the worm-and-wheel type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
    • H02K7/10—Structural association with clutches, brakes, gears, pulleys or mechanical starters
    • H02K7/116—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
    • H02K7/1163—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears where at least two gears have non-parallel axes without having orbital motion
    • H02K7/1166—Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears where at least two gears have non-parallel axes without having orbital motion comprising worm and worm-wheel

Definitions

  • the present invention concerns a multichip circuit suitable for control of one or more electromechanical devices for driving the movement of moving parts of vehicles, such as window windows, sliding roofs, seats, backrests, etc., whose electromechanical devices, which can also include locks, generally comprise an electric drive motor and a transmission and have an associated electronic control circuit of said electric motor, constituted according to the invention by means of said multichip circuit arranged on an IMS board and whose IMS board It is in turn arranged to cover at least in part an access opening to a box of said transmission, the components of said multichip control circuit located inside said box being conveniently protected, in general without encapsulating.
  • the multichip circuit of the invention can provide for example a mixed control of a window regulator device, as well as the lock of a door (or
  • the multichip circuit assembly object of this invention and the electromechanical device to which it is associated thus constitute an integrated mechatronic module 25.
  • a chip will be understood as any encapsulated semiconductor device or more generally without encapsulation (preferred application), in which case the device will have electrodes on one of its surfaces.
  • the semiconductor device may be of any kind such as a diode, transistor (eg MOS power), or a more complex module constituting an integrated circuit
  • the IMS plates short for the English name "INSULATED METAL SUBSTRATE" (insulated metal substrate), consist of a relatively thick metal layer (usually aluminum), a very thin layer of an electrical insulator and another layer of a metal (usually copper)
  • the copper and aluminum layers are separated by the electro-insulating layer.
  • it is in the copper layer that the tracks that allow the conduction of the electric current are recorded and where the electronic components are arranged.
  • Aluminum acts as a radiator of the heat generated in the copper layer by the electronic devices arranged there.
  • the electromechanical devices referred to in this invention require, for proper operation, a stop and start control in both directions of rotation for normal use, voluntarily ordered by a user, and an automatic stop device, or reversal of direction of rotation, in case of detecting, in a safe way, an overexertion of the electric motor during a closing operation, whose overexertion is indicative that the Luna has encountered an obstacle in her career.
  • This automatic stop or reversal of the direction of rotation of the electric motor is of great importance for safety purposes since such an obstacle is often a part of the body of a person or pet occupying the vehicle or from outside it is peeking inside the vehicle .
  • the drive of other moving parts of a vehicle, such as sunroofs have similar requirements.
  • control circuit that includes a power distribution stage to the electric motor and a detector device called hereinafter sensor, such as Hall effect or similar to detect the intensity consumed, speed and the direction of rotation of the electric motor shaft.
  • This control circuit is generally arranged on a printed circuit board associated with an assembly formed by said electric motor and a transmission, generally of the screw-endless type and toothed crown.
  • patents EP-A-474904 SIEMENS AG
  • WO-A- 91/01060 BROSE FAHRZEUGTEILE
  • Patents DE-A-3424581 ASMO CO LTD
  • EP-A-803628 AUDI AG
  • a multichip circuit for control of an electromechanical device for driving moving parts in a car, together constituting a mechatronic module integrated on a substrate that has the following main characteristics: the electronic components are arranged in an IMS substrate, with its metallic layer on the outside, which allows a better elimination of the heat generated by the electric motor; - the components are generally arranged without encapsulating (that is, in the form of a silicon die) on the copper layer where the tracks where the electric current circulates have previously been recorded, allowing the circuit to be compacted in a much smaller area , facilitating its installation in relation to the module; - the electronic components are connected to each other and to the circuit tracks by surface mounting techniques for VLSI circuits such as "wirebonding" or "flip-chip”; The IMS substrate itself where the electronic devices are located is provided as a cover, or part of it, of the transmission box of said module, leaving the aluminum layer on the outside and housing the copper layer with all electronic devices in inside; in this way, the elimination of heat is facilitated
  • the circuit is compacted in a much smaller area, which allows a greater ease to integrate a greater amount from electronic devices in a circuit housed in the same electric motor that presents, in general, space limitations.
  • the IMS substrate there is also a surface mount connector that allows the power supply of the circuit and communication with the outside through different input / output lines.
  • the connector used must ensure a good seal of the module once it is arranged in the transmission box associated with the electric motor.
  • the electronic devices that are housed in the module are preferably sensors of various types, power transistors, an oscillator, a microprocessor / microcontroller, external signal conditioning circuits, external communication circuits and transistor control circuits. of power
  • Part or all of the electronic devices can be ASICs, that is to say specific application circuits made specifically for the mechatronic module to achieve greater compaction of the circuit.
  • the microprocessor is mainly used to execute an electric motor control algorithm. This algorithm allows to perform an anti-pinch function to avoid crushing a member or object interposed in the mobile panel race (moon or similar). That is, the detection of an impediment or difficulty in the rotation of the electric motor.
  • the microprocessor can also, through the input / output lines, monitor and control other external devices.
  • the information generated by these sensors is communicated to the microprocessor. This information is used in the aforementioned algorithm.
  • the different sensors introduced allow the use of different anti-pinch algorithms such as pulse counting or the detection of current peaks.
  • the sensors preferably used are magnetic sensors such as Hall or GMR effect, magnetic current sensors, vibration sensors and temperature sensors. These sensors allow to capture external signals that inform the direction of rotation and the speed of rotation of the electric motor, the mechanical movement of the module, the current supplied to the electric motor, false clamp alarms and temperature and overtemperature.
  • the signal conditioning circuits monitor the signals from external devices, such as sensors or switches and prevent the appearance of "glitches” or bounces at the microprocessor inputs.
  • the control circuits of the power transmitters allow the performance of electric motor control techniques based on the pulse width modulation (in English PWM). These techniques allow “soft start” and “soft stop” of the electric motor, that is to say the start and stop with stepped speed.
  • Fig. 1 is an overall perspective view of the mechatronic module referred to in the present invention
  • Fig. 2 is a cross-sectional view of the transmission cover and housing assembly including the IMS plate and a surface mount connector, according to a first embodiment
  • Fig. 3 is an explanatory block diagram of a possible organization of the components of the multichip circuit of the invention
  • Figs. 4 and 5 show in plan and elevation respectively a possible realization of said multichip circuit with the connection of components to each other and to the IMS board by means of the "wirebonding"technique
  • Figs. 5 and 6 are two views equivalent to the previous ones, where the union of the components of the multichip circuit with each other and the tracks of the IMS board has been carried out by means of a flip-chip technique.
  • FIG. 1 there is shown an electromechanical device intended for actuating and controlling the movement of moving parts of vehicles to which control the present invention relates.
  • a device is of special application in the automotive industry for the controlled movement of moving parts of a vehicle such as window windows, sunroofs, seats, backrests, etc.
  • the device comprises a motor 1 provided with a housing 2, whose motor 1 drives a transmission, itself known, housed in a box 3 provided with a cover 4, to which box 3 said motor housing 2 is fixed 1.
  • the motor 1 is connected to an electronic control circuit arranged in an IMS board that constitutes precisely said cover 4, as can be seen better in Fig. 2.
  • IMS board that constitutes precisely said cover 4
  • the cover 4 of said box 3 comprises an IMS circuit, with its thick aluminum layer 5 outside, in order to properly dissipate the thermal energy generated by the components (particularly power) of the circuit, and with said components 6 arranged in surface mounting and in this example connected to each other and to the tracks P1 ... Pn of the circuit by a wirebonding technique consisting of connecting cable bridges 7a.
  • the thin electro-insulating layer 8 is also appreciated between said metallic outer layer 5 and the mentioned tracks P1 ... Pn and a surface mount connector 9, for the power and communications functions of said electronic circuit.
  • the aforementioned IMS plate in cover functions 4 may include two or more conductive faces, one of them supporting connection tracks and the second carrier of the circuit components, indicated above, in surface mounting.
  • FIG. 3 An example of a possible embodiment of the multichip circuit according to the invention is shown schematically in Fig. 3, which generally comprises the following basic components: - a microprocessor 10 (next to which a clock 27 has been indicated), with at least one memory or specialized memory area 10a, capable of housing a control algorithm (optionally replaceable, by programming); - a temperature sensor 11 and one or more sensors of an operation parameter of the electric motor;
  • At least one device 28 eg a power transistor
  • said last circuit can be organized in the form of the three aforementioned sub-blocks 13, 14, 15 differentiated, applied respectively to each of the three mentioned functions to be fulfilled, in a preferred embodiment of the invention it will be constituted by a single circuit ASIC 19.
  • the sub-block or input monitoring chip 13 will generally include an input adaptation stage and a signal filter stage.
  • the communications control sub-block or chip will include, for example, transceivers: a CAN transceiver, an SCI transceiver, a controller of said CAN bus and a UART.
  • the components of this circuit are arranged on the IMS plate without encapsulation, and said plate, acting as a cover of the cavity of the housing that houses the transmission is hermetically sealed, or at least by a seal and said uncapsulated components advantageously integrate a layer of protective epoxy resin
  • a vibration sensor 18 is provided to provide cooperation with said anti-pinch algorithm stored in the memory of the microprocessor 10, to discriminate false pinch detections from those valid detections.
  • the power supply devices 24 have been illustrated in the form of power FET transistors, according to a classic assembly (H-bridge) controlling, for example, the motor 21 for driving a window regulator of a door, the motor 22 for driving the lock of said door and a light source 23 of the interior of the vehicle (generally known in the sector as "courtesy light"), together constituting a module associable with said multifunctional door.
  • H-bridge classic assembly
  • Each device or power supply block 24 also includes a resistor 25 for measuring the intensity consumed by each device, the measurement of which is read by the control of the power actuators 14 and can be used for the detection of accidental overcurrents, producing in this case the disconnection of the group of transistors avoiding their destruction, also allowing the elimination of protection fuses.
  • a multichip electronic circuit is shown with its components connected to each other and to the IMS board by means of the aforementioned "wirebonding" technique
  • Figs. 6 and 7 illustrate an electronic multichip circuit in all equivalent to the circuit of Figs. 4 and 5 except that the union of its components with each other and the tracks of the IMS board has been carried out using the flip-chip technique.
  • the different components arranged on the IMS board and their functionality are identical in both cases.
  • IMS board it comprises an aluminum substrate 5, heat sink generated by the circuit, on the outer face of the box 3 (see Fig. 2) and several conductive tracks P1 .... Pn on the inner face, the substrate 5 being isolated from the tracks P1 ....
  • the circuit essentially comprises, as described with reference to Fig. 3: a control device formed by a microprocessor 10; an ASIC circuit 19 that includes sub-blocks applied to the functions of input monitoring, control of power actuators, and control of communications with the outside; several power supply modules 12, a temperature sensor 11 and a consumption intensity sensor of at least one power supply module 12.
  • a voltage regulator 26 for feeding the different components also appears in Fig. 4.
  • the components 6 are connected to each other through the tracks P1 .... Pn and are connected to said tracks P1 .... Pn by the flip-chip technique consisting of small granules 7b of conductive material .
  • Fig. 6 practically the same components as in Fig. 4, described above, have been indicated, with the addition of a motor speed sensor 17, capable of providing information, together with the intensity sensor 16 to a more complex algorithm resident in the memory 10a of the microprocessor 10.
  • the aforementioned algorithm stored for example in a "flash" memory 10a may be reformed including updates or improvements thereof, being programmable through the communications bus and supported on the chip or subblock 15 of communications control, cited.
  • the inclusion of a voltage regulator 26 to feed the different components of the circuit being explained must be understood as optional given the possibilities of useful space on the IMS board by the capacity of the circuit, although said regulating element could be installed in a point on the outside of the set.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Control Of Direct Current Motors (AREA)
  • Power-Operated Mechanisms For Wings (AREA)

Abstract

L'invention concerne un circuit de commande hybride de dispositifs électromécaniques d'actionnement destinés au déplacement d'éléments mobiles de véhicules, telles que les vitres, les toits ouvrants coulissants, les sièges, les dossiers, etc. Ces dispositifs électromécaniques comprennent globalement un moteur électrique (1) permettant d'actionner une transmission logée dans un boîtier (3) muni d'au moins un couvercle (4). Ce moteur électrique (1) est connecté à un circuit électronique de commande dont les composants (6) sont disposés sur une plaque IMS (substrat métallique isolé) fermant une ouverture d'accès au boîtier (3). Ce boîtier comprend une plaque d'aluminium (5) dissipant la chaleur de ladite plaque IMS située sur sa partie extérieure et une couche conductrice située à l'intérieur du boîtier (3), servant de support aux différents composants (6) en montage superficiel. Seuls un connecteur (9) d'alimentation et des éléments de connexion dudit circuit électronique dépassent à l'extérieur du boîtier, ledit circuit étant conçu pour commander d'autres moteurs électriques, en plus de celui fixé sur le boîtier (3).
PCT/ES2000/000426 2000-11-07 2000-11-07 Circuit de commande hybride de moteurs electriques utilisant le couvercle de l'engrenage reducteur comme dissipateur de chaleur Ceased WO2002039799A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/ES2000/000426 WO2002039799A1 (fr) 2000-11-07 2000-11-07 Circuit de commande hybride de moteurs electriques utilisant le couvercle de l'engrenage reducteur comme dissipateur de chaleur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/ES2000/000426 WO2002039799A1 (fr) 2000-11-07 2000-11-07 Circuit de commande hybride de moteurs electriques utilisant le couvercle de l'engrenage reducteur comme dissipateur de chaleur

Publications (1)

Publication Number Publication Date
WO2002039799A1 true WO2002039799A1 (fr) 2002-05-16

Family

ID=8244287

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/ES2000/000426 Ceased WO2002039799A1 (fr) 2000-11-07 2000-11-07 Circuit de commande hybride de moteurs electriques utilisant le couvercle de l'engrenage reducteur comme dissipateur de chaleur

Country Status (1)

Country Link
WO (1) WO2002039799A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008013059A1 (de) * 2008-03-06 2009-09-10 Sew-Eurodrive Gmbh & Co. Kg System mit Getriebe
WO2014095199A1 (fr) * 2012-12-17 2014-06-26 Phoenix Contact Gmbh & Co Kg Bloc électrique destiné à être monté sur un profilé chapeau
DE102019216492A1 (de) * 2019-10-25 2021-04-29 Robert Bosch Gmbh Verfahren zum Überwachen der Funktion einer Baugruppe im Kraftfahrzeug mittels eines MEMS-Sensors, sowie eine elektrische Antriebseinheit zum Ausführen des Verfahrens

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0252481A2 (fr) * 1986-07-07 1988-01-13 Mitsuba Electric Mfg. Co., Ltd. Système à moteur électrique pour véhicules automobiles
WO1998058825A2 (fr) * 1997-06-20 1998-12-30 Ut Automotive Dearborn, Inc. Moteur d'essuie-glace pour vehicule automobile

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0252481A2 (fr) * 1986-07-07 1988-01-13 Mitsuba Electric Mfg. Co., Ltd. Système à moteur électrique pour véhicules automobiles
WO1998058825A2 (fr) * 1997-06-20 1998-12-30 Ut Automotive Dearborn, Inc. Moteur d'essuie-glace pour vehicule automobile

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008013059A1 (de) * 2008-03-06 2009-09-10 Sew-Eurodrive Gmbh & Co. Kg System mit Getriebe
DE102008013059B4 (de) * 2008-03-06 2017-12-14 Sew-Eurodrive Gmbh & Co Kg System mit Getriebe
US9958052B2 (en) 2008-03-06 2018-05-01 Sew-Eurodrive Gmbh & Co. Kg System having a gear unit
WO2014095199A1 (fr) * 2012-12-17 2014-06-26 Phoenix Contact Gmbh & Co Kg Bloc électrique destiné à être monté sur un profilé chapeau
US10104762B2 (en) 2012-12-17 2018-10-16 Phoenix Contact Gmbh & Co. Kg Electric assembly to be mounted on a top-hat rail
DE102019216492A1 (de) * 2019-10-25 2021-04-29 Robert Bosch Gmbh Verfahren zum Überwachen der Funktion einer Baugruppe im Kraftfahrzeug mittels eines MEMS-Sensors, sowie eine elektrische Antriebseinheit zum Ausführen des Verfahrens

Similar Documents

Publication Publication Date Title
CN104742960B (zh) 电子控制单元和具有电子控制单元的电动助力转向装置
KR100605469B1 (ko) 모터 차량의 조절 장치를 위해 전동기를 구비한 구동 유닛
EP1195884A2 (fr) Appareil de conversion/inversion d'énergie électrique
ES2587599T3 (es) Sistema de control para puertas de tren y procedimiento de accionamiento basado en dicho sistema
KR20050067431A (ko) 모터 유닛
WO2008123269A1 (fr) Unité électronique équipée d'un condensateur
US20250047223A1 (en) Brushless dc motor control unit
WO2002039799A1 (fr) Circuit de commande hybride de moteurs electriques utilisant le couvercle de l'engrenage reducteur comme dissipateur de chaleur
ES2228649T3 (es) Dispositivo electronico de control para el control de grupos electricos de puertas de automoviles con diferente equipamiento.
US6724164B2 (en) Opening-and-closing member control device
JPH11317495A (ja) 絶縁ゲート型バイポーラトランジスタモジュールおよび駆動回路付絶縁ゲート型バイポーラトランジスタモジュール
ES2950132T3 (es) Guarnecido de techo con conjunto de módulo electrónico para vehículos y conjunto de techo de vehículo comprendiendo dicho guarnecido
ES2240607T3 (es) Sistema de sensor tactil con transpondedor.
ES2353811T3 (es) Módulo de control y de potencia de un alternador-motor de arranque integrable.
JP2005328018A (ja) 半導体装置
WO2002039566A1 (fr) Dispositif electromecanique permettant d'actionner et de controler le deplacement des parties mobiles de vehicules
ES2202922T3 (es) Dispositivo motor para persianas o similares.
US11241966B2 (en) Protection circuit unit and vehicle power supply device
ES2373092T3 (es) Módulo eléctrico para alternador de vehículo, en particular automóvil, y conjunto que incluye tal alternador y tal módulo.
KR20100112057A (ko) 차량용 선바이저
CN115206911A (zh) 电路基板
ES2219820T3 (es) Sistema de cierre, especialmente para automoviles.
JPH11146507A (ja) 電気車用電動機制御装置
Merino et al. A MCM module for modern power window control in automotive applications
JP2021166441A (ja) 変換回路付き駆動装置

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase