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WO2002016051A3 - Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays - Google Patents

Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays Download PDF

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Publication number
WO2002016051A3
WO2002016051A3 PCT/US2001/026546 US0126546W WO0216051A3 WO 2002016051 A3 WO2002016051 A3 WO 2002016051A3 US 0126546 W US0126546 W US 0126546W WO 0216051 A3 WO0216051 A3 WO 0216051A3
Authority
WO
WIPO (PCT)
Prior art keywords
present
methods
surface cleaning
contaminants
reactive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/026546
Other languages
French (fr)
Other versions
WO2002016051A2 (en
Inventor
David P Jackson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deflex LLC
Original Assignee
Deflex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deflex LLC filed Critical Deflex LLC
Priority to US10/362,598 priority Critical patent/US20040011378A1/en
Priority to AU2001288402A priority patent/AU2001288402A1/en
Publication of WO2002016051A2 publication Critical patent/WO2002016051A2/en
Publication of WO2002016051A3 publication Critical patent/WO2002016051A3/en
Anticipated expiration legal-status Critical
Priority to US11/465,762 priority patent/US7901540B2/en
Priority to US13/016,836 priority patent/US8021489B2/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C5/00—Devices or accessories for generating abrasive blasts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning In General (AREA)

Abstract

The present invention relates generally to providing processes, methods and apparatus to produce and apply a variety of surface cleaning and modification spray treatments. More specifically, the present invention provides the simultaneous steps of 1) selectively removing one or more unwanted surface contaminants, including extremely hard coatings, 2) exposing a native clean surface layer and 3) modifying said exposed and cleaned native substrate surface layer to energetic radicals and radiation to improve adhesion, wettability or coatability. Reactive species in combination with non-reactive, but chemically or physically active, species provide a rich reaction control and surface treatment environment by which contaminants and surface interlayers are oxidatively, physically and/or chemically removed or modified to prepare an underlying substrate surface for subsequent bonding, deposition, coating and curing operations. Substrates treated in accordance with the present invention have cleaner and higher surface free energy surfaces.
PCT/US2001/026546 2000-08-23 2001-08-23 Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays Ceased WO2002016051A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US10/362,598 US20040011378A1 (en) 2001-08-23 2001-08-23 Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays
AU2001288402A AU2001288402A1 (en) 2000-08-23 2001-08-23 Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays
US11/465,762 US7901540B2 (en) 2000-08-23 2006-08-18 Dense fluid delivery apparatus
US13/016,836 US8021489B2 (en) 2000-08-23 2011-01-28 Substrate treatment process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22688200P 2000-08-23 2000-08-23
US60/226,882 2000-08-23

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10362598 A-371-Of-International 2001-08-23
US11/465,762 Division US7901540B2 (en) 2000-08-23 2006-08-18 Dense fluid delivery apparatus

Publications (2)

Publication Number Publication Date
WO2002016051A2 WO2002016051A2 (en) 2002-02-28
WO2002016051A3 true WO2002016051A3 (en) 2002-06-06

Family

ID=22850811

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/026546 Ceased WO2002016051A2 (en) 2000-08-23 2001-08-23 Surface cleaning and modification processes, methods and apparatus using physicochemically modified dense fluid sprays

Country Status (2)

Country Link
AU (1) AU2001288402A1 (en)
WO (1) WO2002016051A2 (en)

Families Citing this family (37)

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TW539918B (en) 1997-05-27 2003-07-01 Tokyo Electron Ltd Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
US6748960B1 (en) 1999-11-02 2004-06-15 Tokyo Electron Limited Apparatus for supercritical processing of multiple workpieces
CA2387341A1 (en) 1999-11-02 2001-05-10 Tokyo Electron Limited Method and apparatus for supercritical processing of multiple workpieces
AU2001255656A1 (en) 2000-04-25 2001-11-07 Tokyo Electron Limited Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module
JP4724353B2 (en) 2000-07-26 2011-07-13 東京エレクトロン株式会社 High pressure processing chamber for semiconductor substrates
US6924086B1 (en) 2002-02-15 2005-08-02 Tokyo Electron Limited Developing photoresist with supercritical fluid and developer
JP2006508521A (en) 2002-02-15 2006-03-09 東京エレクトロン株式会社 Drying of resist using solvent bath and supercritical CO2
US7001468B1 (en) 2002-02-15 2006-02-21 Tokyo Electron Limited Pressure energized pressure vessel opening and closing device and method of providing therefor
US7387868B2 (en) 2002-03-04 2008-06-17 Tokyo Electron Limited Treatment of a dielectric layer using supercritical CO2
US7270941B2 (en) 2002-03-04 2007-09-18 Tokyo Electron Limited Method of passivating of low dielectric materials in wafer processing
US7169540B2 (en) 2002-04-12 2007-01-30 Tokyo Electron Limited Method of treatment of porous dielectric films to reduce damage during cleaning
US7021635B2 (en) 2003-02-06 2006-04-04 Tokyo Electron Limited Vacuum chuck utilizing sintered material and method of providing thereof
US7077917B2 (en) 2003-02-10 2006-07-18 Tokyo Electric Limited High-pressure processing chamber for a semiconductor wafer
US7225820B2 (en) 2003-02-10 2007-06-05 Tokyo Electron Limited High-pressure processing chamber for a semiconductor wafer
US7270137B2 (en) 2003-04-28 2007-09-18 Tokyo Electron Limited Apparatus and method of securing a workpiece during high-pressure processing
US7163380B2 (en) 2003-07-29 2007-01-16 Tokyo Electron Limited Control of fluid flow in the processing of an object with a fluid
US7186093B2 (en) 2004-10-05 2007-03-06 Tokyo Electron Limited Method and apparatus for cooling motor bearings of a high pressure pump
US7250374B2 (en) 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing
US7307019B2 (en) 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US7491036B2 (en) 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
US7140393B2 (en) 2004-12-22 2006-11-28 Tokyo Electron Limited Non-contact shuttle valve for flow diversion in high pressure systems
US7434590B2 (en) 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
US7291565B2 (en) 2005-02-15 2007-11-06 Tokyo Electron Limited Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
US7435447B2 (en) 2005-02-15 2008-10-14 Tokyo Electron Limited Method and system for determining flow conditions in a high pressure processing system
US7550075B2 (en) 2005-03-23 2009-06-23 Tokyo Electron Ltd. Removal of contaminants from a fluid
US7380984B2 (en) 2005-03-28 2008-06-03 Tokyo Electron Limited Process flow thermocouple
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
US7494107B2 (en) 2005-03-30 2009-02-24 Supercritical Systems, Inc. Gate valve for plus-atmospheric pressure semiconductor process vessels
US7399708B2 (en) 2005-03-30 2008-07-15 Tokyo Electron Limited Method of treating a composite spin-on glass/anti-reflective material prior to cleaning
US7442636B2 (en) 2005-03-30 2008-10-28 Tokyo Electron Limited Method of inhibiting copper corrosion during supercritical CO2 cleaning
US7789971B2 (en) 2005-05-13 2010-09-07 Tokyo Electron Limited Treatment of substrate using functionalizing agent in supercritical carbon dioxide
US7524383B2 (en) 2005-05-25 2009-04-28 Tokyo Electron Limited Method and system for passivating a processing chamber
BRPI0520574A2 (en) 2005-09-30 2009-05-19 Airbus Espana Sl surface treatment method of composite material structures with atmospheric plasma beams
WO2008087544A1 (en) * 2007-01-19 2008-07-24 L' Air Liquide-Societe Anonyme Pour L' Etude Et L'exploitation Des Procedes Georges Claude Dry ice blasting with ozone-containing carrier gas
US20100254858A1 (en) * 2007-11-14 2010-10-07 Prawin Paulraj Microchannel structures having bonded layers including height control features
US8277741B2 (en) 2008-10-28 2012-10-02 Mccabe Colin Adam Anti-germicidal and/or antimicrobial apparatus for reducing and/or eliminating germs and/or bacteria from the soles of footwear and method for use
EP3536434A1 (en) * 2018-03-06 2019-09-11 Newfrey LLC Protective gas mouthpiece and joining device for joining a stud to a workpiece comprising the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0391035A2 (en) * 1989-04-03 1990-10-10 Hughes Aircraft Company Dense fluid photochemical process for substrate treatment
US5054421A (en) * 1986-07-14 1991-10-08 Mitsubishi Denki K.K. Substrate cleaning device
US5326406A (en) * 1991-07-31 1994-07-05 Kawasaki Steel Corporation Method of cleaning semiconductor substrate and apparatus for carrying out the same
US5725154A (en) * 1995-08-18 1998-03-10 Jackson; David P. Dense fluid spray cleaning method and apparatus
US5782253A (en) * 1991-12-24 1998-07-21 Mcdonnell Douglas Corporation System for removing a coating from a substrate
US5967156A (en) * 1994-11-07 1999-10-19 Krytek Corporation Processing a surface

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5054421A (en) * 1986-07-14 1991-10-08 Mitsubishi Denki K.K. Substrate cleaning device
EP0391035A2 (en) * 1989-04-03 1990-10-10 Hughes Aircraft Company Dense fluid photochemical process for substrate treatment
US5326406A (en) * 1991-07-31 1994-07-05 Kawasaki Steel Corporation Method of cleaning semiconductor substrate and apparatus for carrying out the same
US5782253A (en) * 1991-12-24 1998-07-21 Mcdonnell Douglas Corporation System for removing a coating from a substrate
US5967156A (en) * 1994-11-07 1999-10-19 Krytek Corporation Processing a surface
US5725154A (en) * 1995-08-18 1998-03-10 Jackson; David P. Dense fluid spray cleaning method and apparatus

Also Published As

Publication number Publication date
WO2002016051A2 (en) 2002-02-28
AU2001288402A1 (en) 2002-03-04

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