[go: up one dir, main page]

WO2002013261A3 - Couverture en des a dissipation thermique - Google Patents

Couverture en des a dissipation thermique Download PDF

Info

Publication number
WO2002013261A3
WO2002013261A3 PCT/US2001/024186 US0124186W WO0213261A3 WO 2002013261 A3 WO2002013261 A3 WO 2002013261A3 US 0124186 W US0124186 W US 0124186W WO 0213261 A3 WO0213261 A3 WO 0213261A3
Authority
WO
WIPO (PCT)
Prior art keywords
frame
heat spreading
cover
die cover
generating component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/024186
Other languages
English (en)
Other versions
WO2002013261A2 (fr
Inventor
Douglas S Ondricek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Priority to AU2001279137A priority Critical patent/AU2001279137A1/en
Publication of WO2002013261A2 publication Critical patent/WO2002013261A2/fr
Anticipated expiration legal-status Critical
Publication of WO2002013261A3 publication Critical patent/WO2002013261A3/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un dissipateur thermique destiné à un composant générateur de chaleur. Ce dissipateur thermique comprend un cadre qui possède une première surface supérieure et une couverture placée sur cette première surface supérieure. Cette couverture est constituée, au moins en partie, d'un matériau thermiquement conducteur. Le cadre peut être fixé par rapport à un substrat de sorte que ce cadre et ce substrat renferment un composant générateur de chaleur couplé à ce substrat. Ce cadre possède des parois intérieures non incurvées qui limitent un espace capable de renfermer un composant générateur de chaleur.
PCT/US2001/024186 2000-08-07 2001-08-01 Couverture en des a dissipation thermique Ceased WO2002013261A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001279137A AU2001279137A1 (en) 2000-08-07 2001-08-01 Heat spreading die cover

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63355100A 2000-08-07 2000-08-07
US09/633,551 2000-08-07

Publications (2)

Publication Number Publication Date
WO2002013261A2 WO2002013261A2 (fr) 2002-02-14
WO2002013261A3 true WO2002013261A3 (fr) 2003-07-10

Family

ID=24540091

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/024186 Ceased WO2002013261A2 (fr) 2000-08-07 2001-08-01 Couverture en des a dissipation thermique

Country Status (3)

Country Link
AU (1) AU2001279137A1 (fr)
TW (1) TW526599B (fr)
WO (1) WO2002013261A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11372043B2 (en) 2019-08-21 2022-06-28 Micron Technology, Inc. Heat spreaders for use in semiconductor device testing, such as burn-in testing
US11385281B2 (en) * 2019-08-21 2022-07-12 Micron Technology, Inc. Heat spreaders for use in semiconductor device testing, such as burn-in testing
CN117156790A (zh) * 2022-05-24 2023-12-01 华为技术有限公司 一种发热模块、散热装置和通信设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0322165A1 (fr) * 1987-12-21 1989-06-28 The Standard Oil Company Composites céramique-polymère thermoconducteurs
US5798565A (en) * 1993-08-16 1998-08-25 Micron Technology, Inc. Repairable wafer scale integration system
WO2000033360A1 (fr) * 1998-12-04 2000-06-08 Formfactor, Inc. Procede et dispositif destines au transport et au suivi d'un composant electronique
WO2000035262A2 (fr) * 1998-12-04 2000-06-15 Formfactor, Inc. Procede de montage d'un composant electronique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0322165A1 (fr) * 1987-12-21 1989-06-28 The Standard Oil Company Composites céramique-polymère thermoconducteurs
US5798565A (en) * 1993-08-16 1998-08-25 Micron Technology, Inc. Repairable wafer scale integration system
WO2000033360A1 (fr) * 1998-12-04 2000-06-08 Formfactor, Inc. Procede et dispositif destines au transport et au suivi d'un composant electronique
WO2000035262A2 (fr) * 1998-12-04 2000-06-15 Formfactor, Inc. Procede de montage d'un composant electronique

Also Published As

Publication number Publication date
WO2002013261A2 (fr) 2002-02-14
TW526599B (en) 2003-04-01
AU2001279137A1 (en) 2002-02-18

Similar Documents

Publication Publication Date Title
EP1381082A3 (fr) Empaquetage semi-conducteur avec caloduc interne
AU2002247045A1 (en) Semiconductor package with lid heat spreader
MY129594A (en) Heat spreader and stiffener having a stiffener extension
WO2006036362A3 (fr) Dissipateur thermique integre
WO2002061825A3 (fr) Ensemble electronique a interface thermique de haute capacite et procedes de production correspondants
KR20050049235A (ko) 휴대용 단말기의 방열장치
GB2341277B (en) An electronic component package with posts on the active surface
WO2002050899A3 (fr) Boitier pour semi-conducteurs
WO2005122663A3 (fr) Structure isolante possedant des proprietes d'isolation et de dissipation thermique
GB9808917D0 (en) Heat sink,in particular for electronic components
AU2002245103A1 (en) Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith
WO2004097935A3 (fr) Ensemble de drain thermique
HK1052799A1 (zh) 有可焊接导热介面的电子组件及其生产方法
AU3138499A (en) Package
TW200501363A (en) Semiconductor die package with increased thermal conduction
WO2003053118A3 (fr) Dispositif de refroidissement pour puce, et procede de realisation
WO2003073475A3 (fr) Dissipateur thermique pour une puce a semi-conducteurs utilisant un systeme de refroidissement a changement de phase
WO2003096416A3 (fr) Matiere de soudure reactive
TWI256707B (en) Cavity-down multiple chip package
USD447795S1 (en) Heater case
WO2005096731A3 (fr) Dissipateur thermique, circuit integre, procedes de fabrication de ce dissipateur thermique et procedes de fabrication de ce circuit integre
WO2002013261A3 (fr) Couverture en des a dissipation thermique
WO2004107566A3 (fr) Compensation de temperature et de procede d'un mosfet fonctionnant en mode infraseuil
EP1253814A3 (fr) Structure de boíte de raccordement électrique isolée thermiquement
USD416188S (en) Electronic equipment mount

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP