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WO2002008774A1 - Procede et appareil de guidage de sonde - Google Patents

Procede et appareil de guidage de sonde Download PDF

Info

Publication number
WO2002008774A1
WO2002008774A1 PCT/JP2001/004875 JP0104875W WO0208774A1 WO 2002008774 A1 WO2002008774 A1 WO 2002008774A1 JP 0104875 W JP0104875 W JP 0104875W WO 0208774 A1 WO0208774 A1 WO 0208774A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
driving method
sample
height
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2001/004875
Other languages
English (en)
French (fr)
Inventor
Satoshi Tomimatsu
Hidemi Koike
Junzo Azuma
Tohru Ishitani
Aritoshi Sugimoto
Yuichi Hamamura
Isamu Sekihara
Akira Shimase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Solutions Technology Ltd
Original Assignee
Hitachi Ltd
Hitachi ULSI Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi ULSI Systems Co Ltd filed Critical Hitachi Ltd
Priority to US10/296,887 priority Critical patent/US6960765B2/en
Priority to EP01936933A priority patent/EP1335209A4/en
Publication of WO2002008774A1 publication Critical patent/WO2002008774A1/ja
Anticipated expiration legal-status Critical
Priority to US11/201,222 priority patent/US7301146B2/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q10/00—Scanning or positioning arrangements, i.e. arrangements for actively controlling the movement or position of the probe
    • G01Q10/04—Fine scanning or positioning
    • G01Q10/06—Circuits or algorithms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
PCT/JP2001/004875 2000-07-24 2001-06-08 Procede et appareil de guidage de sonde Ceased WO2002008774A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/296,887 US6960765B2 (en) 2000-07-24 2001-06-08 Probe driving method, and probe apparatus
EP01936933A EP1335209A4 (en) 2000-07-24 2001-06-08 PROBE CONTROL METHOD AND PROBE DEVICE
US11/201,222 US7301146B2 (en) 2000-07-24 2005-08-11 Probe driving method, and probe apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-222882 2000-07-24
JP2000222882A JP4408538B2 (ja) 2000-07-24 2000-07-24 プローブ装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/201,222 Continuation US7301146B2 (en) 2000-07-24 2005-08-11 Probe driving method, and probe apparatus

Publications (1)

Publication Number Publication Date
WO2002008774A1 true WO2002008774A1 (fr) 2002-01-31

Family

ID=18717069

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/004875 Ceased WO2002008774A1 (fr) 2000-07-24 2001-06-08 Procede et appareil de guidage de sonde

Country Status (4)

Country Link
US (2) US6960765B2 (ja)
EP (2) EP2423676A1 (ja)
JP (1) JP4408538B2 (ja)
WO (1) WO2002008774A1 (ja)

Cited By (4)

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Publication number Priority date Publication date Assignee Title
WO2004048002A1 (en) * 2002-11-26 2004-06-10 S. C. Johnson & Son, Inc. Atomizer with improved wire type atomizing element support and method of making same
DE10320381A1 (de) * 2003-05-06 2004-12-16 Scorpion Technologies Ag Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln
US8710464B2 (en) 2009-03-30 2014-04-29 Hitachi High-Technologies Corporation Specimen preparation device, and control method in specimen preparation device
CN110286290A (zh) * 2019-07-09 2019-09-27 江苏安方电力科技有限公司 一种变压器自动接线装置

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US6380751B2 (en) 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5561377A (en) 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6828566B2 (en) * 1997-07-22 2004-12-07 Hitachi Ltd Method and apparatus for specimen fabrication
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
JP4178741B2 (ja) * 2000-11-02 2008-11-12 株式会社日立製作所 荷電粒子線装置および試料作製装置
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US6970634B2 (en) * 2001-05-04 2005-11-29 Cascade Microtech, Inc. Fiber optic wafer probe
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US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
DE10220343B4 (de) * 2002-05-07 2007-04-05 Atg Test Systems Gmbh & Co. Kg Reicholzheim Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde
US6815963B2 (en) 2002-05-23 2004-11-09 Cascade Microtech, Inc. Probe for testing a device under test
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US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
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US20050205430A1 (en) * 2003-11-26 2005-09-22 Microfabrica Inc. EFAB methods including controlled mask to substrate mating
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
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JP4733959B2 (ja) * 2003-12-24 2011-07-27 株式会社日立ハイテクノロジーズ プローブ接触方法及び荷電粒子線装置
DE602005002379T2 (de) 2004-02-23 2008-06-12 Zyvex Instruments, LLC, Richardson Benutzung einer Sonde in einer Teilchenstrahlvorrichtung
US7326293B2 (en) 2004-03-26 2008-02-05 Zyvex Labs, Llc Patterned atomic layer epitaxy
US7176705B2 (en) 2004-06-07 2007-02-13 Cascade Microtech, Inc. Thermal optical chuck
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
JP4980903B2 (ja) 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
JP5436527B2 (ja) * 2004-08-25 2014-03-05 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
JP5001533B2 (ja) * 2004-08-25 2012-08-15 エスアイアイ・ナノテクノロジー株式会社 プローブのアプローチ方法
JP2008512680A (ja) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド 両面プロービング構造体
JP4627168B2 (ja) * 2004-09-24 2011-02-09 日本電信電話株式会社 機能デバイスの作製方法および機能デバイス
JP4842533B2 (ja) * 2004-10-27 2011-12-21 株式会社日立ハイテクノロジーズ 不良検査装置
WO2006050495A2 (en) * 2004-11-03 2006-05-11 Omniprobe, Inc. Method and apparatus for the automated process of in-situ lift-out
US7197110B2 (en) * 2004-11-29 2007-03-27 Motorola, Inc. Method for determining chemical content of complex structures using X-ray microanalysis
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US7665349B2 (en) * 2005-04-12 2010-02-23 Veeco Instruments Inc. Method and apparatus for rapid automatic engagement of a probe
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JP5080459B2 (ja) 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド 広帯域能動／受動差動信号プローブ
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JP4794256B2 (ja) * 2005-09-27 2011-10-19 株式会社東京精密 プローバ、プローブ接触方法及びそのためのプログラム
JP4520926B2 (ja) * 2005-10-14 2010-08-11 株式会社日立ハイテクノロジーズ 試料解析方法
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JP5044003B2 (ja) * 2010-08-31 2012-10-10 日本電信電話株式会社 プローブの作製方法およびプローブ、ならびに走査プローブ顕微鏡
JP5750883B2 (ja) * 2010-12-21 2015-07-22 富士通株式会社 プローブ装置及びプローブ測定方法
JP2013140840A (ja) * 2011-12-28 2013-07-18 Hitachi High-Technologies Corp 試料観察装置
JP5887247B2 (ja) * 2012-10-15 2016-03-16 株式会社日立ハイテクノロジーズ 荷電粒子線装置および試料作製法
CN104377101B (zh) 2013-08-14 2017-08-08 Fei 公司 用于带电粒子束系统的电路探头
CN103983498A (zh) * 2014-04-24 2014-08-13 江苏迈世达电子有限公司 一种用于线路板金相切片分析的微蚀液及其使用方法
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TW201616135A (zh) * 2014-10-29 2016-05-01 力晶科技股份有限公司 縮小探針的針尖尺寸的方法及載台
JP6913344B2 (ja) * 2017-03-27 2021-08-04 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
JP6900026B2 (ja) * 2017-03-27 2021-07-07 株式会社日立ハイテクサイエンス 荷電粒子ビーム装置
JP7182951B2 (ja) * 2018-08-27 2022-12-05 株式会社日本マイクロニクス 検査装置及び検査方法
CN110987550A (zh) * 2019-11-11 2020-04-10 嘉兴华才检测技术有限公司 一种食品加工检测箱
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CN116168996B (zh) * 2023-04-24 2023-06-27 合肥晶合集成电路股份有限公司 一种电子显微镜及其工作方法
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004048002A1 (en) * 2002-11-26 2004-06-10 S. C. Johnson & Son, Inc. Atomizer with improved wire type atomizing element support and method of making same
CN100371088C (zh) * 2002-11-26 2008-02-27 约翰逊父子公司 具有改进的线型雾化元件支架的雾化器及其制造方法
DE10320381A1 (de) * 2003-05-06 2004-12-16 Scorpion Technologies Ag Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln
DE10320381B4 (de) * 2003-05-06 2010-11-04 Scorpion Technologies Ag Platinentestvorrichtung mit schrägstehend angetriebenen Kontaktiernadeln
US8710464B2 (en) 2009-03-30 2014-04-29 Hitachi High-Technologies Corporation Specimen preparation device, and control method in specimen preparation device
CN110286290A (zh) * 2019-07-09 2019-09-27 江苏安方电力科技有限公司 一种变压器自动接线装置

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JP2002040107A (ja) 2002-02-06
EP1335209A1 (en) 2003-08-13
US6960765B2 (en) 2005-11-01
US20030184332A1 (en) 2003-10-02
US20050269511A1 (en) 2005-12-08
JP4408538B2 (ja) 2010-02-03
US7301146B2 (en) 2007-11-27
EP1335209A4 (en) 2009-08-26
EP2423676A1 (en) 2012-02-29

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