WO2002089157A1 - Multilayer coil and its manufacturing method - Google Patents

Abstract

A compact multilayer coil having a novel structure in which the conductor pattern is fine, the number of turns can be freely set, and the inductance can be large. The coil is composed of a plurality of spiral layers the circuit face of which is perpendicular to the plane of the substrate. When a magnetic core structure extending through the center of each circuit face of the multilayer coil is provided, the inductance can be set larger.

Description

 Specification

 Multilayer coil and method of manufacturing the same

Technical field

 The present invention relates to a multilayer coil having a novel structure, which has a small and fine conductor pattern, and whose winding number can be set almost arbitrarily, and a method for manufacturing the same.

Background art

 In recent years, as a coupon card for ski lifts, a coupon for trains and passes, and a commuter pass card, it is not necessary to take out the card and pass it through a reading device such as a ticket gate. Contactless IC cards that can be checked and updated in the evening are being used.

 In addition, a method called Bluetooth, which transmits and receives data wirelessly between a personal computer and a printer or between a personal computer and a mobile phone, has also been adopted. In addition, studies are being made in the field of mouth-sticks, such as RF tags, which can be attached to luggage, etc., and read the information in a non-contact manner to grasp the history of the luggage, etc.

 These cards or elements have a structure called an antenna coil. The transmitted electromagnetic wave is received by an antenna coil, and a semiconductor device such as a microcomputer is driven by the generated power to rewrite or update data, and further transmit data to a reading device. It is known that the generated power is proportional to the number of turns of the coil if the antenna coil has the same area.

 Heretofore, antenna coils have been used in which a wire is spirally wound, formed by printing a conductive paste, or formed on a printed circuit board by etching.

However, these currently used antenna coils have various limitations in a limited area such as a non-contact type IC card, and can exhibit sufficient performance. Absent.

 When a thin coil is made by winding a wire, a thin wire is used. However, if the diameter is small, the resistance increases and proper physical properties cannot be obtained. In some cases, a flat wire is used, but when the number of turns is increased, the coil itself becomes too large.

 Coil formed by printing conductive paste is lower in cost than wire and etching methods, but it has low conductivity and can form only sparse patterns, so it is not possible to obtain sufficient inductance However, for example, when used for a contactless IC card, a high-performance microcomputer cannot be driven, and as a result, a high-performance card cannot be obtained. Furthermore, since the antenna coil occupies a large area, there is a great limitation on mounting other elements.

 The antenna coil formed on the printed circuit board by the etching process cannot secure a sufficient number of turns on a single plane, has insufficient inductance, and has the same problems as when a conductive paste is used.

 In order to solve the above problems, various multilayered antenna coils have been proposed. For example, in Japanese Patent Publication No. 06-466416, opposing conductive layers have spiral patterns wound in opposite directions when viewed from the same direction, and are electrically connected to each other. By connecting antenna coils, that is, coils wound in opposite directions, the current generated by electromagnetic induction can flow in the same direction, and a sufficient inductance can be obtained. Has been made.

 On the other hand, for example, Japanese Patent Application Laid-Open No. Hei 9-131556 proposes a multilayer antenna coil by a transfer lamination method.

However, these conventional antenna coils having a circuit surface in a direction parallel to the plane of the substrate and being multilayered in the same direction are limited in the thickness direction, and it is difficult to secure a sufficient number of turns. In recent years, hybrid power has been developed to provide multiple functions. An IC card called a card is commercially available. This is a non-contact type using a conventional antenna coil, and a contact type using a magnetic tape.

It can be used as an IC card. However, in non-contact type ICs, which are simpler for users and have high durability because they do not have contacts, conventional antenna coils generate an induced current only by a unidirectional magnetic field due to their structure. Therefore, it is difficult to drive multiple microcomputers, etc., with different systems.

 A wide variety of devices are used for audio equipment such as CD players, VTRs, door locks, power electronics such as power windows, home appliances such as shavers, OA equipment such as pudding and copiers, and toys. Have been. In recent years, miniaturization of devices such as portable CD players has been progressing, and small-sized devices have been required. Recently, motors having a diameter of about l mm have been marketed.

 The first class is basically composed of the following three points. In other words, a coil, a permanent magnet, and a brush in which an enamel wire is wound around a core such as iron. Various improvements have been made to the coil section, which has a structure in which an enameled wire is wound around the core, such as the production of a very thin conductor and the development of a winding machine.

However, these currently used coils cannot cope with further miniaturization expected in the future. In other words, it is extremely difficult to uniformly manufacture a conductor having a diameter of 100 zm or less, and it is also difficult to wind the wire around the core at high speed and with high accuracy because of its low mechanical strength. If the winding process is performed at a low speed, the above problem can be solved, but productivity will deteriorate significantly and the cost will increase. The coil is manufactured by winding a wire around the core as described above. Therefore, it is essentially impossible to create a plurality of coils in a series of steps. Furthermore, since the conventional coil has a manufacturing process in which a conductive wire is wound, a slight difference in performance occurs between the coils, and it is necessary to separately provide a device for absorbing variations on the driven side. SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer coil which is small and can arbitrarily secure a sufficient number of windings (number of layers) and can obtain a large inductance, and is particularly suitable as a motor coil or an antenna coil. I have.

Disclosure of the invention

 According to the present invention, the above object can be achieved by the following means.

 (1) A multilayer coil in which a coil having a circuit surface in the direction perpendicular to the plane of the board is formed in multiple layers in a spiral shape. Furthermore,

 (2) A spiral coil in which coils having a circuit surface perpendicular to the plane of the substrate are formed in multiple layers, and adjacent circuits via the insulating layer are wound in opposite directions when viewed from the same direction. Multilayer coils with patterns and electrically connected to each other. Furthermore,

(3) A multilayer coil in which a coil having a circuit surface in the direction perpendicular to the plane of the substrate is formed in a spiral shape in a plurality of layers, and a core structure made of a columnar magnetic material penetrating the center of the circuit surface is provided. Furthermore,

 (4) A spiral coil in which a coil having a circuit surface in a direction perpendicular to the substrate plane is formed in a plurality of layers and adjacent circuits via an insulating layer are wound in opposite directions when viewed from the same direction. A multilayer coil having a pattern, being electrically connected to each other, and having a core structure made of a columnar magnetic material penetrating the center of each circuit surface.

 (5) A spiral coil in which a coil having a circuit surface perpendicular to the plane of the substrate is formed in a plurality of layers and adjacent circuits via an insulating layer are wound in opposite directions when viewed from the same direction. A multilayer coil having a pattern, being electrically connected to each other, and further having a core structure made of a columnar magnetic material penetrating the center of each circuit surface and / or the coil.

 Further, according to the present invention, the above object can also be achieved by the following means.

(6) It is formed integrally with the multilayer substrate, includes a winding portion parallel to the multilayer substrate and a winding portion perpendicular to the multilayer substrate, and is supported in the multilayer substrate. Multi-layer coil.

 (7) The unit windings of the multilayer coil each have a spiral pattern that turns in the opposite direction when viewed from the same direction as the other adjacent unit windings, and the unit windings of the adjacent unit windings The multilayer coil is further characterized in that the sets are connected alternately at the tips or ends of the spiral pattern.

 (8) A winding portion parallel to the multilayer substrate is formed as a part of a stacked conductive layer, and a winding portion perpendicular to the multilayer substrate connects a conductive layer adjacent to the conductive layer via an insulating layer. The multilayer coil further formed as:

 (9) By the build-up method, a winding portion parallel to the multilayer substrate is formed as a part of the stacked conductive layers, and a winding portion perpendicular to the multilayer substrate is formed between the adjacent conductive layers through the insulating layer. A multilayer coil further formed as a connecting via or through hole.

 (10) A multilayer coil further having a core structure made of a columnar magnetic material penetrating the inside of the multilayer coil.

 (11) Having a plurality of multilayer coils, the multilayer coils are field coils of a motor, and the central axes of the multilayer coils are respectively oriented toward the rotation axis of each motor. And the plurality of multilayer coils are arranged at equal intervals to each other.

 (12) Any one of the above-mentioned multilayer coils, a planar coil having a circuit surface in a plane parallel to the multilayer substrate, output combining means for combining an output from the multilayer coil and an output from the planar coil, An antenna, comprising:

Such a multilayer coil having a flat board and a circuit surface in the vertical direction is a novel one that has not been known before, and because of its excellent features, it can be used as a coil for mobile phones or as a non-contact type IC card. It is suitable as an antenna coil used for a Bluetooth module, an RF tag and the like. Further, according to the present invention, the above object can also be achieved by a manufacturing method including the following means.

 (13) a step of forming one insulating layer constituting the multilayer substrate; and forming at least a part of a winding portion of a multilayer coil parallel to the multilayer substrate on the insulating layer in the multilayer substrate. Forming a vertical connection portion for electrically connecting at least a part of the winding portion of the multilayer coil parallel to the multilayer substrate between the insulating layers, thereby forming a winding portion of the multilayer coil perpendicular to the multilayer substrate; A step of forming at least a part of: a step of forming an insulating layer; a step of forming at least a part of a winding portion of a multilayer coil parallel to the multilayer substrate; and a multilayer coil perpendicular to the multilayer substrate. At least one of the steps forming at least a part of the winding portion of the multilayer coil is defined as a winding portion of a multilayer coil parallel to the multilayer substrate and a winding of a multilayer coil perpendicular to the multilayer substrate. A step of appropriately repeating the portion of the multilayer substrate formed so far until a predetermined multilayer coil supported in the multilayer substrate is formed with the portion. Production method.

 (14) The unit winding of the predetermined multilayer coil has a helical pattern that turns in the opposite direction when viewed from the same direction as other adjacent unit windings, and A method of manufacturing a multilayer coil, further comprising the sets of windings being alternately connected at the tips or ends of the spiral pattern.

(15) The method for manufacturing a multilayer coil, further comprising the vertical connection portion being a bump connecting an adjacent conductive layer via an insulating layer.

 (16) At least one of the steps is carried out by a build-up method, and the vertical connection portion is a via or a through hole connecting an adjacent conductive layer through an insulating layer. Method.

(17) A method for manufacturing a multilayer coil, further comprising a step of forming a core structure made of a magnetic material inside the multilayer coil. (18) The multilayer coil is a motor-field coil, the central axis of the multilayer coil is oriented toward the rotation axis of the motor, and the multilayer coils are mutually equal. A method of manufacturing a field coil for a motor, further comprising a plurality of multilayer coils arranged at intervals.

 (19) A step of forming a planar coil having a circuit surface in a plane parallel to the multilayer substrate; and forming a first coil included in a circuit of the non-contact type IC card inside or on the surface of the multilayer substrate. Forming a circuit, forming a second circuit included in the circuit of the non-contact type IC card inside or on the surface of the multilayer substrate, and connecting the multilayer coil and the first circuit And connecting the planar coil and the second circuit. The first circuit is operated by an output from the multilayer coil, and the second circuit is A method of manufacturing a circuit of a non-contact type IC card, further comprising being operated by an output of the IC card.

(20) A step of forming a planar coil having a circuit surface in a plane parallel to the multilayer substrate, and an output from the multilayer coil and an output from the planar coil inside or on the surface of the multilayer substrate. Forming an output synthesizing means for synthesizing the antenna and a method for manufacturing an antenna.

BRIEF DESCRIPTION OF THE FIGURES

 FIG. 1 is a schematic perspective view showing an example of the multilayer coil according to claims 1 and 12.

 FIG. 2 is a conceptual perspective view showing an example of the multilayer coil according to claims 2 and 13.

 FIG. 3 is a conceptual perspective view showing an example of the multilayer coil according to claims 3 and 16.

FIG. 4 is a conceptual perspective view showing an example of the multilayer coil according to claims 4 and 16. FIG. 5 is a perspective view of a substrate at an early stage of manufacturing the multilayer coil of FIG.

 FIG. 6 is a perspective view of a substrate in an intermediate stage of manufacturing the multilayer coil of FIG.

 FIG. 7 is a perspective view of the substrate at the initial stage of manufacturing the multilayer coil of FIG.

 8A and 8B are cross-sectional views for explaining the production of the multilayer coil of FIG. 2 by the build-up method.

 FIG. 9 is a sectional view for explaining the production of the multilayer coil by the batch lamination method.

 FIG. 10 is a cross-sectional view illustrating the formation of an insulating layer.

 11A, 11B and 11C are cross-sectional views for explaining via formation.

 FIGS. 12A, B, C, and D are cross-sectional views for explaining the conductivity of vias for forming a circuit. FIGS. 13A, 13B and 13C are cross-sectional views illustrating connection by bumps.

 FIG. 14 is an initial manufacturing cross-sectional view of a circuit outer layer portion.

 FIG. 15 is a cross-sectional view of the outer layer portion of the circuit.

 FIG. 16 is a cross-sectional view before press working.

 FIG. 17 is a perspective view of an initial substrate for manufacturing a multilayer coil having a magnetic core structure. FIG. 18 is a plan view when two multilayer coils are arranged for a motor.

 FIG. 19 is a plan view in a case where three multilayer coils are arranged for each module.

 FIG. 20 is a perspective view showing an example of power supply unit wiring of a multilayer coil.

 FIG. 21 is a plan view showing an example of the non-contact type IC card according to claim 8. FIG. 22 is a conceptual perspective view showing an example of the multilayer coil according to claims 4 and 16.

 FIG. 23 is a conceptual perspective view showing an example of the multilayer coil according to claim 5. FIG. 24 is a perspective conceptual view showing an example of the antenna according to claim 18. BEST MODE FOR CARRYING OUT THE INVENTION

 Hereinafter, the present invention will be described in detail with reference to the drawings.

A multilayer coil in which a coil having a circuit surface perpendicular to the substrate plane is formed in a spiral shape As shown in FIGS. 1 and 2, the device has a structure in which conductive circuits 2 are formed in multiple layers (four layers in the drawing) in a direction perpendicular to the plane of the substrate 1. By having a structure in which the circuit surface is provided in the direction perpendicular to the substrate plane, there is no restriction imposed by the thickness of the substrate. It is necessary to obtain sufficient inductance. At the same time, coils with such a structure have the advantage of being easily miniaturized.

 Preferably, the winding portion of the coil parallel to the multilayer substrate is formed as a part of the conductive layer to be laminated, and the winding portion perpendicular to the multilayer substrate is formed between the adjacent conductive layers via the insulating layer. It is formed as a connecting bump, via or through hole. By forming the coil in this manner, a plurality of coils are simultaneously formed in the multilayer substrate in the process of manufacturing the multilayer substrate by utilizing a known multilayer substrate (print substrate) manufacturing technique such as a build-up method. It is possible to do.

 In addition, as shown in FIG. 2, a coil-shaped circuit 3 is formed so as to have a circuit surface in a direction perpendicular to the plane of the substrate 1, and adjacent circuits via an insulating layer are viewed from the same direction. In such a case, a multilayer circuit which is spirally patterned in a direction opposite to each other and electrically connected to each other may be one having a small number of turns on each circuit surface constituting the multilayer as shown in FIG. Even if the number of coils is the same, a stronger inductance is given than a multilayer coil in which the winding direction of the circuit of each layer is the same.

The unit windings of the coil-shaped circuit 3 each have a spiral pattern that turns in the opposite direction when viewed from the same direction as the other adjacent unit windings, and the unit windings adjacent to each other Is different from the configuration of the multilayer coil shown in FIG. 1 in that it is connected to each other at the tips or ends of the spiral pattern. By configuring the multilayer coil in such a manner, the number of turns in a unit winding can be made larger than one, and when a current flows through the multilayer coil, all unit windings generate a magnetic field in the same direction. As a result, the inductance can be increased. Furthermore, as shown in Fig. 3 or 4, the core of the coil (the position penetrating through the center of each circuit surface) is composed mainly of a magnetic substance made of a simple substance such as iron or nickel, or an alloy or its compound. By providing the rod-shaped core structure 4, a multi-layer coil can be obtained in which a stronger inductance can be obtained.

 The multilayer coil of the present invention can be manufactured by applying various known methods. Hereinafter, the present invention will be described by way of examples. However, these are examples, and the present invention is not limited to these examples.

 First, an example of the production of the multilayer coil shown in FIG. 1 (corresponding to the production method of the means (13)), which is an example of the means (1) and (6), will be described. As shown in FIG. 5, a conductor pattern is formed on both sides of a well-known substrate, for example, a copper-clad glass epoxy laminate 5. In FIG. 5, 6 is a pattern on the upper surface of the substrate, and 7 is a pattern on the lower surface. For example, a subtractive method can be applied to the production of this pattern. When a substrate whose surface is not conductive is used, it can be formed by a full additive method, a semi-additive method, or printing of a conductive paste. Then, as shown in Fig. 6, drill holes, via holes, etc. were drilled at predetermined positions 8 using a drill, laser, etc., and then the bow I was used. Connecting. In this way, a plurality of coils (four layers in the drawing) having a circuit surface perpendicular to the substrate plane can be formed in a spiral shape.

 In order to use the coil as an antenna coil and to increase the opening of the coil in order to increase the inductance, it is possible to solve the problem by using a thick substrate 5. Alternatively, it can also be manufactured by forming a pattern corresponding to the outermost layer on each single-sided plate, laminating with insulating sheets or prepregs interposed therebetween, and then making holes and performing electrical connection processing.

The multilayer coil of FIG. 2 which is an example of the means (2) and (7) can be manufactured by forming the substrate into a multilayer structure (corresponding to the manufacturing method of the means (14)). Public knowledge Conventional methods can be applied, but because of the structurally blind vias, appropriate processes are required.

 First, an inner layer pattern 9 as shown in FIG. 7 is created. A double-sided copper-clad laminate can be formed by a known method, such as drilling a hole, conducting through holes by plating, or patterning the surface by a subtractive method. An insulating layer and a conductive layer may be formed on both sides of the inner layer 9 to perform patterning and electrical connection. Several methods will be described with specific examples.

 The case of the so-called build-up method will be described. As shown in FIGS. 8A and 8B, an insulating layer is formed on the substrate including the inner layer 9. As the insulating layer, a glass epoxy-based or aramid resin-based pre-reader, a liquid or film-like thermoplastic or thermosetting resin composition, or a copper foil and an insulating resin layer, which is generally called a resin-coated copper foil, is used. One that has been integrated can be used.

The formation of the insulating layer is performed, for example, as follows. As shown in FIG. 8A, prepregs 10, unpatterned copper foil 11, or resin-coated copper foil 12 as shown in FIG. As described above, these are collectively laminated and cured by a lamination press method, and an insulating layer and a conductive layer are integrally formed. (Alternatively, as shown in FIG. 10, the liquid composition is applied onto the substrate 9 by a known and common method such as screen printing, force coating, spray coating, or the like, and then exposed to UV, electron beam, heat, or the like. Alternatively, the composition in the form of a film is pasted on the substrate by a method such as roll or lamination, and cured by a predetermined method to obtain an insulating layer 13. Subsequently, a via is formed. A via 14 is formed at a predetermined position on the obtained substrate by using a drill, a laser, etc. Fig. 11A shows a case where a pre-predator 10 and a copper foil 11 are used as insulating layers and conductive layers. Similarly, Fig. 11B shows the case of using a resin-coated copper foil 12 and Fig. 11C shows the case of using a liquid or film-like thermoplastic or thermosetting resin composition. Using copper foil When a carbon dioxide gas laser widely used for forming blind vias is used when a conductive layer is also formed together with an insulating layer by etching, if necessary, a conductor at a predetermined position is removed by etching if necessary. Mask processing may be performed.

 When a conductive layer is formed together with an insulating layer using a pre-predeer or a resin-coated copper foil, for example, as shown in Fig. 12A, a conductive paste in which conductive powder such as silver or copper is blended into vias is used. Is embedded by printing, dispensing, etc., and hardened by a predetermined method. Alternatively, as shown in FIG. 12B, a normal through-hole plating, that is, a method in which a plating catalyst is applied in a via, an electroless plating is performed, and then, a plating layer 16 is formed by performing an electrolytic plating. Electrical connection is achieved. When the insulating layer is formed using a liquid or film-like composition, as shown in FIG. 12C, for example, a copper foil 17 is pressed, and a conductive layer is formed outside the insulating layer. After the mask processing, the blind via is made conductive by the conductive paste 15 or the plating layer 16 and connected. In this case, the conductive via of the blind via may be performed first. Further, as shown in FIG. 12D, a catalyst is applied to the substrate on which the insulating layer and the blind via are formed, the electroless plating is performed, and if necessary, the electroconductive plating is performed. The formation of the vias and the conduction of the blind vias (by the plating layer 16) can also be performed at once. In this case, the conduction of the via via can also be performed by the conductive paste 15.

Alternatively, the insulating layer, the conductive layer, and the electrical connection can be collectively performed by the following method. That is, as shown in FIGS. 13A to 13C, a sharp bump 18 is formed at a predetermined location on the inner layer circuit 9 by using a conductive paste or the like, and then (FIG. 13A) prepreg Pressing after placing 10 and copper foil 11 or (Fig. 13B) Film-shaped insulator 13 and copper foil 11 or (Fig. 13C) Resin-coated copper foil 12 As a result, the pointed conductive bumps 18 penetrate the insulating layer and realize connection with the conductive layer. When using the above liquid or film-shaped insulating material using a through-hole substrate connected by plating, or when further laminating on an insulating layer with a blind pier formed once by the build-up method, fill the hole. The surface may be smoothed by filling the through-holes or blind vias with an ink or paint treatment.

 Alternatively, they can be collectively laminated by the following method. The case of a four-layer antenna coil using glass epoxy prepreg as the insulating layer is described. That is, as shown in FIG. 14, a predetermined position on the base material 19 side of the copper-clad single-sided glass epoxy substrate is punched using a laser or the like. Subsequently, electric plating is performed using the copper foil 11 as an electrode, and the resulting hole is filled with the plating 20. Then, a low melting point metal bump 21 is successively formed by a plating method.

 The copper foil 11 is etched into a predetermined pattern as shown in FIG. The same composition 22 as that used for the insulating layer is thinly applied to the bump side and semi-cured. The one shown in FIG. 15 manufactured from this single-sided substrate is the outermost layer, that is, the first and fourth layers.

 Then, as shown in Fig. 16, the inner layer 9 is aligned with the outermost layer in Fig. 15, and the semi-cured composition is removed from the bumps by pressing to form an interlayer insulating layer. At the same time, the bumps are electrically connected to the conductor in the inner layer, and an antenna coil having a four-layer structure is manufactured. By applying this method, further multilayering can be easily performed.

 In order to make the spiral pattern denser, further multilayering is required. Further multilayering is possible using any of the above methods.

In any of the above cases, a known and commonly used insulating material can be used for the insulating layer. For example, epoxy resin, bismaleimide-triazine resin, polyphenylene ether resin, polyetheretherketone resin, polyimide resin, and others Examples thereof include a liquid or film-like thermoplastic or thermosetting compound obtained by mixing a curing agent and an inorganic filler, and a prepreg mixed with a glass cloth or the like. Not only these organic materials but also inorganic materials, so-called ceramic materials, can be used as the insulating layer. When using a ceramic material for the insulating layer, a coil can be formed by stacking and firing a sheet-like composition generally called a green sheet.

 The thickness of the insulating layer can be arbitrarily set according to the application, but from the viewpoint of insulation reliability, it is preferably about 10 to 300 microns in practical use. The thickness of the conductor can be arbitrarily set in accordance with the application as in the case of the insulating layer, but is preferably about 5 microns or 200 microns in practice.

 The wiring pattern of each layer can be formed by a known method such as a subtractive method, a full additive method, a semi-additive method, and a transfer method. As a material for electrically connecting the layers, a known material such as a conductive paste containing various metals, an electroless or electrolytic plating film can be used.

 The coil of the present invention can have a structure in which a stronger inductance is obtained by having a core structure mainly composed of a magnetic material at the center of the coil. That is, the structure is as shown in FIGS.

These structures can be constructed, for example, by the following method. As shown in FIG. 17, a core structure 4 mainly composed of a magnetic material is formed in a base material serving as a base. The core structure 4 is subjected to press working in a state where a rod-shaped magnetic body is sandwiched between the pre-preda when manufacturing the base material. Alternatively, a core structure 4 is formed using a magnetic paste obtained by kneading and dispersing a magnetic substance powder in a polymer on a base material, and then performing a drilling process and the like. The formation of the insulating layer and the conductive layer and the connection between the layers are performed by the method described above. The magnetic material is generally composed of a simple substance such as iron or nickel or an alloy or a compound thereof. What is used can be used.

 The length of the core structure mainly composed of a magnetic material is arbitrary as long as it does not exceed the length of the coil. Also, the thickness and width thereof can be set arbitrarily as long as the insulation with the coil formed therearound is maintained.

 When the coil of the present invention is used for all modes, one of the methods described above can be used to make two or three directions in the same plane as shown in FIG. 18 or FIG. The motor can be formed by preparing the coil 23 (coils in FIGS. 1 to 4) (field coil), forming the substrate into a required shape, attaching a shaft of the motor and a brush, and integrally shaping. Of course, it is possible to create many coils in four or more directions.

 The shaft can be integrated by drilling a predetermined position on the substrate on which the coil is formed, using a drill, etc., and then attaching a shaft suitable for the motor. The integration can also be achieved by bonding a bin, which is used for a PGA (pin grid array), which is a form of semiconductor package, on a substrate. The brush part can be a general one for a single motor. However, the motor part can be further multi-layered to form the brush part as a whole.

 Each coil must be connected to a power supply, similar to conventional motor coils. If you want to create a coil by the various methods described above and wire the power supply IN (IN) side and OUT (OUT) side close to each other, for example, as shown in FIG. .

 By combining the coil of the present invention with a conventional coil formed in a direction parallel to the plane of the substrate, it is possible to provide a non-contact type IC card capable of independently driving a plurality of functions. That is, as shown in FIG. 21, IC 1 (30), a conventional antenna coil 31 and IC 2 (32), and an antenna coil 23 of the present invention are mounted on a card.

Connect 0 and 31, 32 and 23. Conventional antenna, parallel to the plane of the board The coil formed in the direction is electromagnetically induced by a magnetic field in a direction perpendicular to the substrate plane, but does not react to a magnetic field in the same direction as the substrate plane. On the other hand, the antenna coil of the present invention reacts only to the magnetic field in the same direction as the plane of the substrate. Therefore, it is possible to provide a non-contact type, high-performance IC card capable of independently driving two functions. Also, a conventional antenna coil composed of the above-described multilayer coil having a circuit surface (unit winding) in a plane perpendicular to the substrate and a planar coil having a circuit surface in a plane parallel to the substrate. 3 is formed on the same substrate, and the combination of the output from the multilayer coil and the output from the planar coil is combined with the output combining means 33 to form a small polarized wave formed in the substrate. An antenna having diversity performance can be configured. The output combining means 33 combines or switches the outputs by a known maximum ratio combining receiving method, a selective combining receiving method, an equal gain combining receiving method, or the like. With this antenna, fluctuations in antenna output due to fluctuations in the polarization plane of radio waves can be reduced.

 Note that the multilayer coil of the present invention may have a multilayered structure of a circuit having a plurality of coils on the same plane as shown in FIG. Furthermore, as shown in Fig. 23, by providing a rod-shaped core structure 4 mainly composed of a magnetic material at a position penetrating through the center of each circuit surface, a multilayer coil with a stronger inductance can be obtained. . Further, the core structure 4 can be provided in all or some of the plurality of coils at the center. Furthermore, a core structure 4 may be provided at all or a part of the plurality of coils in addition to the center of each circuit surface to form a multilayer coil capable of obtaining a stronger inductance.

 The above-described multilayer coil according to the present invention can set the number of turns of the coil more freely than the conventional one and has a strong inductance.

In addition, since power can be extracted in the middle of the coil and downsizing can be achieved, the degree of freedom in design is dramatically improved. On the other hand, in addition to having a fine conductor pattern and being compact, it can be manufactured at low cost by manufacturing a large number of packages at once. That is, since the coil of the present invention can be applied to a general printed circuit board manufacturing process, it is possible to produce an overwhelmingly fine conductor as compared with an enameled wire. In addition, since a large number of coils can be produced at once, the coil is not only inexpensive, but also has essentially no variation. Therefore, a device for absorbing performance variations conventionally incorporated in a driven part is not required.

 This coil is not only suitable for use as an antenna coil for non-contact type IC cards, B 1 uet 0 'modules, RF tags, etc., but is also excellent as a coil for motors . Furthermore, by combining with a conventional coil, it is possible to provide a non-contact type high-performance IC card capable of independently driving two functions.

Claims

The scope of the claims 1. A multi-layer coil characterized in that a coil having a circuit surface perpendicular to the plane of the substrate is spirally formed in a plurality of layers.  2. A spiral pattern in which coils having a circuit surface perpendicular to the plane of the substrate are formed in multiple layers in a spiral shape, and adjacent circuits via an insulating layer are wound in opposite directions when viewed from the same direction. A multilayer coil comprising: a plurality of coils, each of which is electrically connected to each other.  3. A multi-layer coil characterized in that a coil having a circuit surface perpendicular to the plane of the substrate is spirally formed in a plurality of layers, and has a core structure made of a columnar magnetic material penetrating the center of each circuit surface.  4. A spiral pattern in which coils having a circuit surface perpendicular to the plane of the substrate are formed in multiple layers in a spiral shape, and adjacent circuits via an insulating layer are wound in opposite directions when viewed from the same direction. A multilayer coil electrically connected to each other and having a core structure made of a columnar magnetic material penetrating through the center of each circuit surface.  5. A spiral pattern in which coils having a circuit surface perpendicular to the plane of the substrate are formed in multiple layers in a spiral shape, and adjacent circuits via an insulating layer are wound in opposite directions when viewed from the same direction. A multilayer coil electrically connected to each other and having a core structure made of a columnar magnetic material penetrating the center of each circuit surface and / or the center of the coil.  6. The multilayer coil according to any one of claims 1 to 5, wherein the coil is a coil for an antenna. 7. A mobile phone comprising the multilayer coil according to any one of claims 1 to 5 mounted thereon. 8. A non-contact type IC card comprising the multilayer coil according to any one of claims 1 to 5 mounted thereon.  9. A non-contact type wherein the multilayer coil according to any one of claims 1 to 5 and a coil having a circuit surface parallel to the plane of the substrate are simultaneously mounted. IC card.  10. A bluetooth module on which the multilayer coil according to any one of claims 1 to 5 is mounted.  11. An RF antenna comprising the multilayer coil according to any one of claims 1 to 5 mounted thereon.  1 2. Formed integrally with the multilayer substrate,  A multilayer coil including a winding part parallel to the multilayer substrate and a winding part perpendicular to the multilayer substrate, the multilayer coil being supported in the multilayer substrate.  13. The unit windings of the multilayer coil each have a spiral pattern that turns in the opposite direction when viewed from the same direction as the other adjacent unit windings, and the unit windings adjacent to each other 13. The multilayer coil according to claim 12, wherein the sets are alternately connected at the tips or ends of the spiral pattern. 14. In the multilayer coil, a winding portion parallel to the multilayer substrate is formed as a part of a stacked conductive layer, and a winding portion perpendicular to the multilayer substrate is adjacent via the insulating layer. The multilayer coil according to claim 12, wherein the multilayer coil is formed as a bump connecting the conductive layers. 15. In the multilayer coil, a winding portion parallel to the multilayer substrate is formed as a part of a stacked conductive layer by a build-up method, and a winding portion perpendicular to the multilayer substrate is formed of the insulating material. 14. The multilayer coil according to claim 12, wherein the multilayer coil is formed as a via or a through-hole connecting the adjacent conductive layers through a layer. 16. The multilayer coil according to claim 12 or 13, wherein the multilayer coil has a core structure made of a columnar magnetic material penetrating inside the multilayer coil.  17. A multilayer coil according to any one of claims 12 to 16 having a plurality of the multilayer coils,  The plurality of multilayer coils are field coils of a motor;  A center axis of each of the plurality of multilayer coils is oriented toward a rotation axis of the motor; and  2. The field coil according to claim 1, wherein the plurality of multilayer coils are arranged at equal intervals.  18. The multilayer coil according to any one of claims 1 to 5, and 12 to 16, A planar coil having a circuit surface in a plane parallel to the multilayer substrate, Output combining means for combining the output from the multilayer coil and the output from the planar coil; An antenna, comprising:  1 9. A step of forming one insulating layer constituting a multilayer substrate;  Forming at least a part of a winding portion of a multilayer coil parallel to the multilayer substrate on an insulating layer in the multilayer substrate;  A vertical connection portion is formed to electrically connect at least some of the winding portions of the multilayer coil parallel to the multilayer substrate between insulating layers, thereby forming a winding portion of the multilayer coil perpendicular to the multilayer substrate. Forming at least a part of; The step of forming an insulating layer; the step of forming at least a part of a winding part of a multilayer coil parallel to the multilayer substrate; and the forming of at least a part of a winding part of a multilayer coil perpendicular to the multilayer substrate. Performing at least one of the steps of: winding a multilayer coil parallel to the multilayer substrate and a multilayer coil perpendicular to the multilayer substrate Until a predetermined multilayer coil supported in the multilayer substrate is formed with the winding portion of the multilayer substrate, and appropriately repeating the portion of the multilayer substrate formed up to that point. A method for producing a multilayer coil.  20. Each of the unit windings of the predetermined multilayer coil has a spiral pattern that turns in the opposite direction when viewed from the same direction as the other adjacent unit windings. 10. The method for manufacturing a multilayer coil according to claim 19, wherein the sets of unit windings are connected alternately at the tips of the spiral pattern or at the ends thereof.  21. The multilayer coil according to claim 19, wherein the vertical connection portion is a bump connecting the adjacent conductive layers via the insulating layer. Production method.  22. At least one of the steps is performed by a build-up method, and  20. The multi-layer coil according to claim 19, wherein the vertical connection portion is a via or a through hole connecting the adjacent conductive layers through the insulating layer. Method.  23. The multilayer coil according to any one of claims 19 to 22, further comprising a step of forming a core structure made of a magnetic material inside the multilayer coil. Production method.  24. A method for manufacturing a multilayer coil according to any one of claims 19 to 23,  The multi-layer coil is a Mo-Yuichi field coil, Manufacturing a field coil for a motor, wherein a center axis of the multilayer coil is oriented toward a rotation axis of a motor, and the multilayer coil is a plurality of multilayer coils arranged at equal intervals to each other. Method. 25. A method for manufacturing a multilayer coil according to any one of claims 19 to 23,  Forming a planar coil having a circuit surface in a plane parallel to the multilayer substrate; forming a first circuit included in a circuit of a non-contact type IC card inside or on the surface of the multilayer substrate;  Forming a second circuit included in the circuit of the non-contact type IC card inside or on the surface of the multilayer substrate;  Connecting the multilayer coil and the first circuit;  Connecting the planar coil and the second circuit; Further having  Manufacturing the circuit of the non-contact type IC card, wherein the first circuit is operated by an output from the multilayer coil, and the second circuit is operated by an output from the planar coil. Method.  26. A method for manufacturing a multilayer coil according to any one of claims 19 to 23,  Forming a planar coil having a circuit surface in a plane parallel to the multilayer substrate; and output combining for combining an output from the multilayer coil and an output from the planar coil inside or on the surface of the multilayer substrate. Forming means; A method for manufacturing an antenna further comprising: