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WO2002077692A1 - Optical system manufacturing method and exposure device having an optical system manufactured by the manufacturing method - Google Patents

Optical system manufacturing method and exposure device having an optical system manufactured by the manufacturing method Download PDF

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Publication number
WO2002077692A1
WO2002077692A1 PCT/JP2002/002939 JP0202939W WO02077692A1 WO 2002077692 A1 WO2002077692 A1 WO 2002077692A1 JP 0202939 W JP0202939 W JP 0202939W WO 02077692 A1 WO02077692 A1 WO 02077692A1
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WIPO (PCT)
Prior art keywords
optical system
lens
manufacturing
aberration
measuring
Prior art date
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PCT/JP2002/002939
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French (fr)
Japanese (ja)
Inventor
Akikazu Tanimoto
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Nikon Corp
Original Assignee
Nikon Corp
Nippon Kogaku KK
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Publication of WO2002077692A1 publication Critical patent/WO2002077692A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70308Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift

Definitions

  • the present invention relates to a method for manufacturing an optical system and an exposure apparatus including the optical system manufactured by the method.
  • the present invention relates to a method for manufacturing a projection optical system used in an exposure apparatus for manufacturing a micro device such as a semiconductor device, an imaging device, a liquid crystal display device, and a thin film magnetic head in one lithography process.
  • a semiconductor exposure apparatus using ultraviolet light as a light source is used in a lithography process for forming a circuit pattern.
  • This type of semiconductor exposure apparatus incorporates a projection optical system for transferring a pattern on a mask to a resist on a wafer, and the projection optical system is required to reduce aberrations to the utmost.
  • the degree of integration of LSIs has increased at twice the rate in three years, but with the improvement in the resolution of exposure equipment (and projection optics) and resists, processing can be performed at a speed that meets the demand for high integration of LSIs. Miniaturization is realized.
  • the speed of improving the resolution performance of the exposure apparatus and the resist is lower than the speed of miniaturization of the LSI, so that there is no room for the resolution.
  • the LSI pattern is formed under conditions close to the limit of resolution performance.
  • the parameter called the k1 factor was about 0.8 ten years ago, but now it is about 0.6, and in the future, development will be made on the assumption of about 0.4. I have.
  • the line width and shape of the circuit pattern tend to vary due to the aberration of the projection optical system. Therefore, it is essential to keep the aberration of the projection optical system within a certain range in order to suppress variations in circuit characteristics well and to maintain good LSI quality.
  • a projection optical system mounted on an exposure apparatus has at least 20 lenses (lens required).
  • the aberration of the projection optical system is suppressed to a predetermined value or less at the stage of optical design.
  • individual lenses actually manufactured have characteristics that deviate from the design values due to manufacturing errors. For example, even if we try to obtain synthetic quartz with a uniform refractive index as the optical material (lens material) that forms the individual lenses, there is a limit to the uniformity of the refractive index of the optical materials that are actually available.
  • the refractive index non-uniformity is one of the factors that eventually deteriorate the aberration of the projection optical system.
  • polishing is repeated while measuring the surface shape as needed with an interferometer.However, in order to economically manufacture the projection optical system, a processing error that affects the aberration to some extent remains. I have no choice. That is, an error in the surface shape of the lens is one of the factors that cause aberration in the projection optical system.
  • the adjustment step of optically adjusting the projection optical system assembled using a large number of lenses so as to minimize aberrations the adjustment of the distance between the lenses by moving the lenses along the optical axis, By adjusting the eccentricity by shifting (moving) or tilting (tilting) the lens perpendicularly to the optical axis, the projection optical system is brought to the minimum aberration state. Further, in order to further reduce the aberration of the projection optical system, the influence of the rotationally asymmetric error of the lens is reduced by rotating the lens around the optical axis.
  • the transmitted portion of the light beam differs for each lens, and the phase advance and delay of the wavefront received when passing through a large number of lenses are randomly overlapped.
  • the effects of lens wavefront errors are not cumulative. Therefore, for example, when manufacturing a projection optical system having a wavefront aberration of about ⁇ ( ⁇ : wavelength of exposure light) using 25 lenses, the wavefront error (wavefront Is about 2 mA. In this case, since there is a refractive index distribution in the lens, the allowable surface shape error (wavefront error) on one surface of the lens is about 0.5 to 1 ⁇ .
  • the wavelength ⁇ of the exposure light is 248 nm
  • the refractive index of the optical material forming the lens is Assuming 1.6, a wavefront error of about 0.5 to 1 ⁇ corresponds to a shape error of 0.25 to 0.5 nm along the traveling direction of the light beam. Even with the current state-of-the-art polishing technology, it is impossible to process lenses with a diameter of 200 mm or more with such an error. It is about.
  • the present invention has been made in view of the above-described problems, and even if individual lenses have a certain degree of refractive index distribution or surface shape error, for example, projection optics having an extremely low wavefront aberration of 10 mA or less. It is an object of the present invention to provide a method for producing an optical system capable of producing a system.
  • Another object of the present invention is to provide an exposure apparatus including a projection optical system having an extremely low aberration of, for example, 1 O mA or less in terms of wavefront aberration, and capable of performing good exposure under high resolution.
  • the present invention uses an exposure apparatus having a projection optical system having an extremely low wavefront aberration of 1 ⁇ or less, for example, to manufacture a good microdevice under a high resolution and good exposure condition. It is an object of the present invention to provide a method for manufacturing a micro device that can perform the method.
  • the surface of the at least one lens is determined based on a calculation result of the calculation step. And forming a correction film for forming a thin film having a predetermined thickness distribution.
  • an assembling step of assembling the optical system using the plurality of lenses in the method for manufacturing an optical system having a plurality of lenses, an assembling step of assembling the optical system using the plurality of lenses;
  • a method of correcting the thickness of a thin film formed on the surface of one lens is a method of correcting the thickness of a thin film formed on the surface of one lens.
  • an assembling step of assembling the optical system using the plurality of lenses in the method for manufacturing an optical system having a plurality of lenses, an assembling step of assembling the optical system using the plurality of lenses;
  • a first aberration measurement step of measuring aberration of the optical system assembled in the assembly step is a first aberration measurement step of measuring aberration of the optical system assembled in the assembly step
  • a second aberration measurement step for measuring the aberration of the optical system adjusted in the lens adjustment step
  • an illumination optical system for illuminating a mask on which a predetermined pattern is formed
  • An exposure apparatus comprising: an optical system manufactured by the manufacturing method according to any one of the first to third inventions for projecting the pattern image of the mask onto a photosensitive substrate.
  • FIG. 1A is a first diagram illustrating the basic principle of the present invention.
  • FIG. 1B is a second diagram illustrating the basic principle of the present invention.
  • FIG. 2 is a diagram schematically illustrating a relationship between a thickness distribution of a thin film and correction of a wavefront error.
  • FIG. 3 is a diagram schematically showing a configuration of an exposure apparatus having a projection optical system manufactured by a manufacturing method according to each embodiment of the present invention.
  • FIG. 4 is a flowchart showing a manufacturing flow of the manufacturing method according to the first embodiment of the present invention.
  • FIG. 5 is a diagram schematically showing a configuration of an interferometer device for measuring an absolute value and a refractive index distribution of a refractive index of a block glass material on which each lens is to be formed.
  • FIG. 6 is a diagram schematically showing a configuration of an interferometer device for measuring a surface shape error of each lens.
  • FIG Furochiya an bets antireflection film formation step in the first embodiment, illustrating a first method for imparting a predetermined thickness distribution at the time of forming the antireflection film is there.
  • FIG. 9 is a diagram schematically showing a configuration of an ion beam processing apparatus used in a second method for correcting the thickness distribution of the once formed antireflection film to a predetermined thickness distribution.
  • FIG. 10 is a diagram showing the relationship between the film thickness correction amount of the antireflection film used for light having a wavelength of 248 nm, the shift of the wavefront (change of the wavefront), and the reflectance.
  • FIG. 11 is a diagram schematically showing the configuration of a Fizeau interferometer type wavefront aberration measuring instrument for measuring the wavefront aberration of a projection optical system using a KrF excimer laser light source.
  • FIG. 12 is a diagram schematically showing a configuration of a PDI type wavefront aberration measuring instrument for measuring a wavefront aberration of a projection optical system using an ArF excimer laser light source.
  • FIG. 13 is a diagram schematically showing an internal configuration of a projection optical system configured to be capable of adjusting an interval and an eccentricity.
  • FIG. 14 shows one of the plurality of partial lens barrels in the projection optical system shown in FIG. FIG. 3 is a top view showing a configuration of a split lens barrel.
  • FIG. 15 is a diagram schematically showing a configuration of a lens center thickness measuring device using a Michelson interferometer.
  • Fig. 16 shows the relationship between the intensity of the interference light incident on the light-receiving element and the position of the reflection mirror when a light source that supplies light is sufficiently smaller than the distance to be measured (lens center thickness). It is a figure showing a relation.
  • FIG. 17 is a flowchart showing a production flow of the production method according to the second embodiment of the present invention.
  • FIG. 18 is a flowchart showing a manufacturing flow of a method for manufacturing a projection optical system according to the third embodiment of the present invention.
  • FIG. 19 is a flowchart of a method for obtaining a semiconductor device as a micro device.
  • FIG. 20 is a flowchart of a method for obtaining a liquid crystal display element as a micro device.
  • FIG. 1A and FIG. 1B are diagrams for explaining the basic principle of the present invention.
  • Fig. 1A the case where the surface 2 of the actually manufactured lens 1 is deviated from the ideal design surface (best fit surface) 3 by d along the traveling direction of the light beam 11 is assumed.
  • the light transmitted through the lens 1 is caused by an error in the surface shape of the lens 1, that is, by a shift d between the design ideal surface 3 and the actual surface 2 along the light beam traveling direction.
  • a wavefront error (a shift between the wavefront obtained through the ideal lens and the wavefront obtained through the actual lens along the light beam traveling direction) occurs in the wavefront.
  • a thin film for example, an antireflection film
  • a predetermined thickness distribution is formed in order to correct a wavefront error (wavefront deviation) generated due to a surface shape error of the lens 1.
  • the lower layer 4 is rotationally symmetric with respect to the optical axis according to the design.
  • the outermost upper layer 5 according to the present invention Accordingly, a predetermined thickness distribution considering the surface shape error is given.
  • the solid line 5a indicates the surface of the upper layer 5 formed according to the present invention
  • the broken line 5b indicates the designed surface of the upper layer 5 (that is, the designed surface).
  • the surface 5 a of the upper layer 5 of the thin film is moved from the design surface 5 b by e only along the traveling direction of the light beam 11. It is formed shifted.
  • the correction amount e is e 2 (n 1 / n 2) expressed as d.
  • FIG. 2 is a diagram schematically illustrating a relationship between a thickness distribution of a thin film and correction of a wavefront error.
  • a lower layer 8 having a uniform film thickness is formed on the surface of a lens 7, and upper layers 9 and 10 having different film thicknesses are formed thereon.
  • the number of layers forming an antireflection film as a thin film is often about 1 to 5 layers.
  • the lower layer 8 shown in FIG. 2 does not exist.
  • the light beam 12 incident on the region of the upper layer 9 of the thin film and the light beam 13 incident on the region of the upper layer 10 of the thin film are converted into light beams 14 and 15 via the lens 7.
  • the light flux passing through the upper layer 9 of the thin film is A wavefront shift (phase difference) can be imparted to the light flux passing through the layer 10.
  • the wavefront error can be corrected by the difference in thin film thickness between the two regions.
  • a predetermined thickness distribution may be given to the thin film formed on the surface on the entrance side of the lens, or the surface on the exit side of the lens may be provided.
  • a predetermined thickness distribution may be given to the formed thin film.
  • a predetermined thickness distribution can be imparted to both the thin film formed on the entrance surface of the lens and the thin film formed on the exit surface of the lens.
  • the thin film includes a multilayer film, it is preferable to add a correction amount of 15% or less of the thickness of the outermost layer of the multilayer film.
  • the refractive index distribution non-uniform refractive index, for example, rotationally asymmetric or random refractive index distribution
  • Light has a wavefront error.
  • the wavefront error caused by the refractive index distribution for example, random or rotation
  • Asymmetric wavefront aberration can also be corrected.
  • the phase correction based on the thickness distribution of the thin film is performed on the lens surface, so strictly speaking, the wavefront error caused by the refractive index distribution is completely eliminated. In some cases, the correction cannot be completed and some correction error remains.
  • a refractive index distribution of an optical material forming a lens is measured, and a surface shape of the lens is measured. Then, based on the measurement result of the refractive index distribution and the measurement result of the surface shape, a wavefront error generated via the lens is calculated as an optical error of the lens. Further, based on the calculation result of the wavefront error, the thickness distribution of the thin film to be formed on the surface of the lens to correct the wavefront error is calculated. Thus, a thin film having a predetermined thickness distribution with respect to the lens surface is formed based on the calculation result of the thickness distribution.
  • the aberration of the assembled optical system is measured.
  • the lens in the optical system is adjusted based on the measurement result.
  • lens adjusted optics Measure the system aberrations.
  • the refractive index distribution of each optical material forming each of the plurality of lenses and the surface shape of each of the plurality of lenses are measured. In this way, the thickness distribution of the thin film formed on the surface of the lens is corrected based on the measurement result regarding the aberration of the lens-adjusted optical system and the measurement result regarding the refractive index distribution and the surface shape of the lens.
  • the exposure apparatus of the present invention including an optical system having an extremely low wavefront aberration of 1 ⁇ or less as a projection optical system can perform favorable exposure with high resolution.
  • a micro-portal device of the present invention using an exposure apparatus having a projection optical system having an extremely low aberration of 1 ⁇ or less in terms of wavefront difference, high resolution and favorable exposure conditions are obtained.
  • a good microphone opening device can be manufactured.
  • FIG. 3 is a diagram schematically showing a configuration of an exposure apparatus having a projection optical system manufactured by a manufacturing method according to each embodiment of the present invention.
  • the ⁇ axis is parallel to the optical axis ⁇ ⁇ of the projection optical system
  • the ⁇ axis is parallel to the plane of FIG. 3 in a plane perpendicular to the optical axis ⁇ ⁇
  • the ⁇ axis is the optical axis ⁇ ⁇ .
  • the X axis is set perpendicular to the plane of the paper in Fig. 3 in a vertical plane.
  • the exposure apparatus shown in FIG. 3 includes, for example, a KrF excimer laser light source (wavelength: 248 nm) as a light source 21 for supplying illumination light (exposure light).
  • the light emitted from the light source 21 illuminates a mask (reticle) 23 on which a predetermined pattern is formed, via an illumination optical system 22.
  • the mask 23 is held in parallel with the XY plane on a mask stage 25 via a mask holder 24.
  • the mask stage 25 can be moved along the mask plane (that is, the XY plane) by the action of a drive system (not shown), and its position coordinates are determined by a mask interferometer (not shown). It is configured to be measured and controlled in position.
  • the light from the pattern formed on the mask 23 forms a mask pattern image on a wafer 27 as a photosensitive substrate via a projection system 26.
  • the wafer 27 is held in parallel with the XY plane on a wafer stage 29 via a wafer table (wafer holder) 28.
  • the wafer stage 29 can be moved along the wafer surface (that is, the XY plane) by the action of a drive system (not shown), and its position coordinates are measured by a wafer interferometer (not shown) and position control is performed. It is configured to be. In this manner, by performing batch exposure or scan exposure while controlling the wafer 27 two-dimensionally in a plane (XY plane) orthogonal to the optical axis AX of the projection optical system 26, each wafer 27 can be exposed.
  • the pattern of the mask 23 is sequentially exposed on the exposure area.
  • FIG. 4 is a flowchart showing a manufacturing flow of the manufacturing method according to the first embodiment of the present invention.
  • the manufacturing method of the first embodiment after manufacturing a block glass material (blanks) on which each lens is to be formed, the absolute value of the refractive index and the refractive index distribution of the manufactured block glass material are measured, for example, as shown in FIG. The measurement is performed using a measuring device (S11).
  • a block glass material 103 as a test object is set at a predetermined position in a sample case 102 filled with oil 101.
  • light emitted from the interferometer unit 105 controlled by the control system 104 enters a Fizeau flat (Fizeau plane) 106 supported on a Fizeau stage 106a.
  • Fizeau flat Fizeau plane
  • the light reflected by the Fizeau flat 106 becomes reference light, and returns to the interferometer unit 105.
  • the light transmitted through the Fizeau flat 106 becomes measurement light, and enters the test object 103 in the sample case 102.
  • the light transmitted through the test object 103 is reflected by the reflection plane 107 and returns to the interferometer unit 105 via the test object 103 and the Fizeau flat 106.
  • the wavefront aberration due to the refractive index distribution of each block glass material 103 as an optical material is measured based on the phase shift between the reference light and the measurement light returned to the interferometer unit 105.
  • each lens that constitutes the projection optical system 26 is manufactured using a block glass material that is ground as necessary from a block glass material whose refractive index distribution has been measured. That is, the surface of each lens is polished with a design value as a target according to a known polishing process (S12). In the polishing process, polishing is repeated while measuring the error in the surface shape of each lens with an interferometer to bring the surface shape of each lens closer to the target surface shape (best-fit spherical shape). Thus, when the surface shape error of each lens falls within a predetermined range, the surface shape error of each lens is measured using, for example, a more precise interferometer device shown in FIG. 6 (S13).
  • FIG. 6 light emitted from the interferometer unit 112 controlled by the control system 111 enters the Fizeau lens 113 supported on the Fizeau stage 113a.
  • the light reflected by the reference surface (Fizeau surface) of the Fizeau lens 113 becomes reference light, and returns to the interferometer unit 112.
  • the Fizeau lens 1 13 is shown as a single lens, but the actual Fizeau lens is composed of a plurality of lenses (lens groups).
  • the light transmitted through the Fizeau lens 113 becomes measurement light, and is incident on the optical surface of the lens 114 to be measured.
  • the measurement light reflected by the test optical surface of the test lens 1 14 returns to the interferometer unit 1 12 via the Fizeau lens 1 13. In this way, based on the phase shift between the reference light and the measurement light returned to the interferometer unit 112, the wavefront aberration of the test optical surface of the test lens 114 with respect to the reference surface and, consequently, the test lens 1
  • the error of the surface shape (deviation from the best-fit small spherical surface in the design) in 14 is measured.
  • FIG. 7 is a flowchart of an antireflection film forming step in the first embodiment.
  • the wavefront error generated in each lens is calculated based on the shape error information (S111).
  • the thickness distribution of the antireflection film required to correct the generation of the wavefront error is calculated (S112). .
  • an antireflection film having a predetermined thickness distribution is formed on the surface of each lens (S113) ).
  • an antireflection film having a thickness distribution that is rotationally symmetric with respect to the optical axis designed independently of the refractive index distribution information and the surface shape error information is formed. And forming an antireflection film having a predetermined thickness distribution calculated based on the surface shape error information.
  • an antireflection film having a predetermined thickness distribution on the surface of each lens There are two methods for providing a predetermined thickness distribution to the antireflection film.
  • a predetermined thickness distribution is provided from the beginning when the antireflection film is formed in consideration of the refractive index distribution information and the surface shape error information.
  • an antireflection film having a designed thickness distribution is formed without considering the refractive index distribution information and the surface shape error information. Then, the thickness distribution of the formed antireflection film is corrected to a predetermined thickness distribution in consideration of the refractive index distribution information and the surface shape error information.
  • the second method can be realized by, for example, ion beam processing.
  • FIG. 8 is a view for explaining a first method for providing a predetermined thickness distribution when forming an anti-reflection film.
  • a case is considered in which an antireflection film having a thickness distribution as represented by contour lines 52 and 53 is formed on the surface of a lens having an outer shape indicated by reference numeral 51.
  • the thickness of the anti-reflection film in the area indicated by the contour line 53 is the largest, and the thickness correction minimum unit is smaller than the thickness of the anti-reflection film in the area indicated by the contour line 52 (excluding the area indicated by the contour line 53). It is larger by the amount ⁇ .
  • the thickness of the anti-reflection coating in the area indicated by the contour line 52 is the thickness of the anti-reflection coating in other areas (excluding the area indicated by the contour lines 53 and 52). It is larger than the thickness by the thickness correction minimum unit amount ⁇ .
  • the shape shown by the contour line 52 is the same.
  • a mask having an opening with a shape is positioned immediately before the lens surface, and a film thickness ⁇ is formed through the mask by an evaporation method or a sputtering method.
  • a mask having an opening having the same shape as the shape shown by the contour line 53 is positioned immediately before the lens surface, and a film thickness ⁇ is formed through this mask.
  • the thickness correction minimum unit amount ⁇ is, for example, 1 nm
  • the minimum unit of the wavefront error that can be corrected for light having a wavelength of 248 nm is about 2 ⁇ .
  • FIG. 9 is a diagram schematically showing a configuration of an ion beam processing apparatus used in a second method for correcting the thickness distribution of the once formed antireflection film to a predetermined thickness distribution.
  • the ion beam processing apparatus shown in FIG. 9 has a stage 42 that can move two-dimensionally while holding the processing lens 41, and a surface (strictly speaking, an antireflection film surface) of the processing lens 41.
  • the control system 46 receives the energy of the ion beam 43 irradiated from the ion beam processing device main body 44 and the energy of the stage 42.
  • the thickness distribution of the antireflection film formed on the surface of the processing lens 41 is corrected to a predetermined thickness distribution by so-called ion beam application.
  • ion beam application local correction of the film thickness can be performed without using a mask.
  • FIG. 10 is a diagram showing the relationship between the film thickness correction amount of the antireflection film used for light having a wavelength of 248 nm, the shift of the wavefront (change of the wavefront), and the reflectance.
  • the horizontal axis represents the thickness correction amount (n) of the anti-reflection film formed on one surface of the lens. m)
  • the vertical axis on the left shows the wavefront deviation ( ⁇ )
  • the vertical axis on the right shows the reflectance (%).
  • the line connecting the square points shows the relationship between the film thickness correction amount and the deviation of the wavefront
  • the line connecting the triangle points shows the relationship between the film thickness correction amount and the reflectance. ing. Referring to FIG.
  • the projection optical system 26 is assembled using a plurality of lenses on which a reflection preventing film having a predetermined thickness distribution is formed as necessary. S15). Specifically, by holding a plurality of lenses in a predetermined holding frame according to the design, each optical unit is assembled sequentially. Then, the assembled optical units are sequentially dropped into the lens barrel through the upper opening of the lens barrel. At this time, a predetermined washer is interposed between the optical units. In this way, the optical unit first dropped into the lens barrel is supported via a pusher at the protrusion formed at one end of the lens barrel, and all the optical units are accommodated in the lens barrel. The assembly of the projection optical system is completed. For details regarding the assembly of the projection optical system, reference can be made, for example, to Japanese Patent Application Laid-Open No. H10-154657.
  • the wavefront aberration of the actually assembled projection optical system is measured (S16).
  • a projection optical system using a KrF excimer laser light source using a Fizeau interferometer type wavefront aberration measuring device disclosed in US Pat. No. 5,898,501 is disclosed.
  • Wavefront aberration can be measured.
  • laser light having substantially the same wavelength as the exposure light for example, the second harmonic of the Ar laser light
  • the light enters the projection optical system 26 as the test optical system via 6a.
  • the light reflected by the Fizeau surface 61 a becomes so-called reference light, and reaches the imaging device 62 such as a CCD via the Fizeau lens 61 and the half prism 60.
  • the light transmitted through the Fizeau surface 61 a becomes so-called measurement light, and enters the reflective spherical surface 63 via the projection optical system 26.
  • the measurement light reflected by the reflective spherical surface 63 reaches the CCD 62 via the projection optical system 26, the Fizeau lens 61 and the half prism 60.
  • the wavefront aberration remaining in the projection optical system 26 is measured based on the interference between the reference light and the measurement light.
  • the wavefront aberration of a projection optical system using an ultra-high pressure mercury lamp is measured using a Fizeau interferometer type wavefront aberration measuring device disclosed in, for example, US Pat. No. 5,898,501. Can also be measured.
  • U.S. Pat. No. 5,898,501 is incorporated by reference.
  • JP-A-2000-97616 is incorporated by reference.
  • the illumination light for exposure emitted from the light source 21 (not shown in FIG. 12) and passed through the illumination optical system 22 is moved to the first position which is positioned at the mask setting position. Incident on the pinhole 71 of.
  • the spherical wave formed via the first pinhole 71 is transmitted through the projection optical system 26 as an optical system to be measured, and is incident on a grating (one-dimensional diffraction grating) 72.
  • the first-order diffracted light generated by the diffraction action in the drayring 72 is incident on almost the center of an opening (not shown) formed in the mask 73.
  • the 0th-order diffracted light passing through the second pinhole and the 1st-order diffracted light passing through the opening reach the imaging device 75 such as a CCD via the collimating lens 74.
  • the spherical wave formed via the second pinhole is used as the reference wavefront
  • the wavefront of the first-order diffracted light that has passed through the opening is used as the measurement wavefront
  • the projection optical system 26 is used based on the interference between the reference wavefront and the measurement wavefront. Is measured.
  • step S17 it is determined whether or not the wavefront aberration of the projection optical system measured in the aberration measurement step S16 falls within an allowable range (S17). Judgment If it is determined in step S17 that the wavefront aberration of the projection optical system is within the allowable range (YES in FIG. 4), the manufacture of the projection optical system according to the first embodiment ends. On the other hand, if it is determined in the determination step S17 that the wavefront aberration of the projection optical system is not within the allowable range (in the case of NO in FIG. 4), the lens is moved along the optical axis AX and the distance between the lenses is reduced. Adjust the interval to change the angle, and adjust the eccentricity by shifting or tilting the lens perpendicular to the optical axis AX (S18).
  • FIG. 13 is a diagram schematically showing an internal configuration of a projection optical system configured to be capable of adjusting an interval and an eccentricity.
  • FIG. 14 is a top view showing the configuration of one of the partial barrels in the projection optical system of FIG. 13 and 14 employ a common XYZ coordinate system corresponding to FIG.
  • the lens barrel 30 includes a plurality of split lens barrels 30 a to 301, and is supported by a frame of an exposure apparatus (not shown) via a flange 31.
  • the plurality of split lens barrels 30a to 301 are stacked in the optical axis AX direction.
  • 2g are movable lenses that can move in the optical axis direction (Z direction) and can be tilted about the XY direction.
  • the configuration of the split lens barrel 30 b, 30 d, 30 e, 30 f, 30 g holding the movable lens 2 b, 2 d, 2 e, 2 f, 2 g This will be explained as a representative.
  • the configuration of the other divided lens barrels 30d, 30e, 30f, and 30g is substantially the same as the configuration of the divided lens barrel 30b, and thus the description thereof is omitted.
  • the split lens barrel 3Ob holds an outer ring 37b connected to split lens barrels 30a and 30c located above and below (in the Z direction) the split lens barrel 3Ob, and a movable lens 2b.
  • the lens room 38b is provided. This lens chamber 38b is in the optical axis direction with respect to the outer ring 37b.
  • the split lens barrel 30b has an actuator 32b attached to the outer ring 37b.
  • the actuator 32b for example, a piezoelectric element can be used.
  • the actuary 32b is elastic
  • the lens chamber 38b is driven via a link mechanism as a displacement magnifying mechanism constituted by a hinge.
  • the actuator 32b is attached to three places of the split lens barrel 30b, whereby the three places of the lens chamber 38b move independently in the optical axis direction (Z direction).
  • the lens chamber 38 includes clamp portions 381 to 383, which hold three flange portions 201 to 203 of the lens 2. Then, the lens chamber 38 is independently driven along the Z direction by three actuators (not shown) via link mechanisms at the positions of the driving points DP1 to DP3 at every azimuth angle of 120 ° in the XY plane. Driven.
  • the lens chamber 38 moves in the Z direction (optical axis direction) with respect to the outer ring 37, and the three actuators are moved together.
  • the lens chamber 38 is inclined with respect to the outer ring 37 about the XY direction. If the driving amount in the Z direction by the three actuators is different, the lens chamber 38 may move in the Z direction (optical axis direction) with respect to the outer ring 37.
  • the split lens barrel 3 Ob is attached to the outer ring 37b and includes a drive amount measuring unit 39b composed of, for example, an optical encoder.
  • the driving amount measuring section 39b is arranged in the Z direction (optical axis direction) of the lens chamber 38 with respect to the outer ring 37b at the positions of the three measuring points MP1 to MP3 at azimuth angles of 120 ° shown in FIG. Measure the amount of movement. Therefore, the movement of the lens chamber 38 and, consequently, the movement of the lens 2b can be controlled in a closed loop by the actuator 32b and the drive amount measuring unit 39.
  • lenses 2a, 2c, 2 supported by the divided lens barrels 30a, 30c, 30h, 30i, 30j, 30k, 301 h, 2i, 2j, 2k, 21 are fixed lenses.
  • the divided lens barrels 30a, 30c, 30h, 30i, 30j, 30k, which hold these fixed lenses 2a, 2c, 2h, 2i, 2j, 2k, 21 30 Regarding the configuration of 1, the configuration of the split lens barrel 30c The following is a description of the configuration. Note that the configuration of the other divided barrels 30a, 30h, 30i, 30j, 30k, 301 is almost the same as the configuration of the divided barrel 30c. Here, the description is omitted.
  • the split lens barrel 30c includes an outer ring 37c connected to split lens barrels 30b and 30d located above and below (in the Z direction) the split lens barrel 30c, and an outer ring 3c.
  • a lens chamber 38c attached to 7c and holding a lens 2c.
  • the actuators are made of high-precision, low-heat, high-rigidity, and high-cleanliness piezoelectric elements, the driving force of these piezoelectric elements is expanded by a link mechanism consisting of a natural hinge. There is an advantage that the piezoelectric element itself can be made compact.
  • the actuating unit 32 may be constituted by a magnetostrictive unit or a fluid pressure unit instead of being constituted by a piezoelectric element.
  • the movement adjustment (interval adjustment) for moving the lens along the optical axis AX and the tilt adjustment for tilting the lens with respect to the optical axis AX are limited. It is also possible to perform a shift adjustment for shifting the lens along a direction perpendicular to the lens.
  • the wavefront aberration of the projection optical system whose lens has been adjusted by adjusting the distance or the eccentricity is measured again (S16). Then, it is determined again whether or not the wavefront aberration of the projection optical system measured again in the aberration measurement step S16 falls within an allowable range (S17). If it is determined in the determination step S17 that the wavefront aberration of the projection optical system falls within the allowable range, the production of the projection optical system ends. However, if it is determined in the determination step S 17 that the wavefront aberration of the projection optical system is not within the allowable range, the lens adjustment step S 17 is performed until a determination of YES is obtained in the determination step S 17. 18 and the aberration measurement step S 16 are further repeated.
  • the manufacturing method of the first embodiment it is also possible to manufacture a large number of each lens constituting the projection optical system 26 and assemble the projection optical system by combining lenses selected from the manufactured many lenses. it can.
  • a plurality of lenses that constitute the projection optical system 26 are manufactured (lens manufacturing step).
  • information on the shape of the plurality of manufactured lenses such as the radius of curvature of the processed surface of each lens and the center thickness of each lens, is measured (lens shape measurement step). Soshi Then, a plurality of lenses to constitute the projection optical system 26 are selected, for example, at random from the plurality of lenses whose lens shapes have been measured (selection step).
  • the optical performance of the virtually assembled projection optical system is predicted and evaluated based on the measurement information on the shapes of the selected plurality of lenses (prediction evaluation step). Then, the selection step and the prediction evaluation step are repeated until the optimum combination of a plurality of lenses that allows the predicted optical performance of the projection optical system is determined (iteration step).
  • the lens is virtually created based on the actual measurement data such as the radius of curvature of the processed surface of each lens and the center thickness of each lens.
  • the projection optical system is predicted and evaluated for the aberration generated by the projection optical system obtained by combining the projection optical system, and the projection optical system is combined with the lens selected based on the prediction evaluation result so that the aberration generated by the virtual projection optical system is relatively small. It is preferable to configure For details of a method of finally selecting a plurality of lenses to constitute a projection optical system from a large number of lenses by this virtual combination, see, for example, Japanese Patent Application Laid-Open No. 2000-249917 and a corresponding US patent application. No. 09Z691, 194 (filed on Oct. 19, 2000) can be referred to. No. 09Z691, 194, filed Oct. 19, 2000, is hereby incorporated by reference.
  • the radius of curvature of the lens processing surface can be measured using a Newton gauge as disclosed in JP-A-5-272944, JP-A-6-129836, and JP-A-6-174451.
  • the test surface of the test lens is superimposed on the gauge surface of the Newton gauge (the radius of curvature is known), and the test object is obtained from the number of Newton interference fringes observed under a light source of a constant wavelength based on a predetermined arithmetic expression. Find the radius of curvature of the test surface.
  • JP-A-5-272944, JP-A-6-129836, and JP-A-6-174451 are incorporated by reference.
  • the radius of curvature of the lens processing surface is disclosed in JP-A-5-340734, JP-A-5-340735, JP-A-5-346315 and the like.
  • it can be measured by a laser interferometer method.
  • the alignment of the apparatus is performed based on the interference between the reference gauge surface of the master lens and the reference gauge surface of the interferometer, which is substantially the same as the surface to be measured of the lens to be measured and has a known radius of curvature.
  • the test lens is installed in place of the master lens, and the difference between the radius of curvature of the test surface with respect to the reference gauge surface by interference measurement, and the absolute value of the radius of curvature of the test surface of the test lens is measured.
  • JP-A-5-340734, JP-A-5-340735, and JP-A-5-346315 are incorporated by reference.
  • FIG. 15 is a diagram schematically showing a configuration of a lens center thickness measuring device using a Michelson interferometer.
  • the distance measuring device as a lens center thickness measuring device includes a light source 121 that emits measuring light of a predetermined wavelength, an optical system 122, and a half mirror 123.
  • the optical system 122 includes a pinhole, a collimator lens, and the like (not shown), and converts the measurement light emitted from the light source 122 into a parallel light beam to be incident on the optical mirror 123.
  • the half mirror 123 has a function of reflecting a part of the incident light beam and transmitting the rest. As a result, a part of the light beam incident from the light source 121 side is reflected to the lens element 124 side to be subjected to the distance measurement, and the remaining light beam is transmitted to the reflection mirror 125 side.
  • the surface of the lens element 124 on the half-mirror 123 side and the back surface of the lens element 124 are respectively reflective surfaces 122a and 122. 4 b.
  • the reflection mirror 125 is attached to a moving stage (not shown), and is movable together with the moving stage in the direction of the arrow in FIG.
  • the reflecting mirror 125 reflects the light beam transmitted through the half mirror 123 and returns it to the half mirror 123.
  • the light beam reflected by the lens element 124 passes through the half mirror 123 as measurement light and enters the light receiving element 126.
  • the light beam reflected by the reflection mirror 125 is reflected by the half mirror 123 as reference light, and reaches the light receiving element 126.
  • the measurement light and the reference light interfere on the light receiving element 126.
  • the light receiving element 1 2 6 As a result, the interference light is photoelectrically converted and output to the outside as an interference signal.
  • FIG. 16 shows the intensity of the interfering light incident on the light receiving element 1 26 when using a light source 1 2 1 that supplies light whose coherence distance is sufficiently smaller than the measurement interval (lens center thickness).
  • FIG. 9 is a diagram showing a relationship with the position of a reflection mirror 125.
  • the measurement light is separated by the half mirror 1 2 3, reflected by the reflection surface 1 2 4 a of the lens element 1 2 4, and the optical path length reaching the half mirror 1 2 3 again is A 1.
  • the measurement light is separated by the half mirror 123, reflected by the reflecting surface 124b of the lens element 124, and the optical path length reaching the half mirror 123 again is A2.
  • the reference light is separated by the half mirror 123, reflected by the reflecting mirror 125, and the optical path length of the optical path reaching the half mirror 123 again is B.
  • the measurement light reflected by the reflecting surfaces 1 24 a and 124 b by the half mirror 123 interferes with the reference light reflected by the reflecting mirror 125 according to the optical path length difference.
  • each measurement light and the reference light interfere when the optical path lengths Al and A2 are substantially equal to the optical path length B, and an interference light whose intensity changes at this time is obtained. Therefore, if the optical path length B becomes almost equal to the optical path length A 1 by changing the position of the reflection mirror 125, the interference light incident on the light receiving element 126 (interference with the reflection surface 124 a) The intensity of the light changes as shown in the waveform on the left in Fig. 16.
  • the intensity of the interference light (interference light relating to the reflecting surface 124 b) incident on the light receiving element 126 becomes equal to the intensity of the right waveform in FIG. To change.
  • the measurement light and the reference light are incident on a medium with a low refractive index, for example, and a medium with a high refractive index is used.
  • a medium with a high refractive index is used.
  • the phase is inverted by 180 degrees, that is, a so-called phase jump occurs.
  • the intensity distribution of the interference light is approximately at the center of its amplitude, like the change in the interference light intensity on the reflecting surface 124a relative to the change in the interference light intensity on the reflecting surface 124b in Fig. 16. In contrast, the state is reversed.
  • the center thickness of the lens element 124 is determined based on the interference signal output from the light receiving element 126 corresponding to the intensity distribution of the interference light and the position of the reflecting mirror 125 set on the moving stage.
  • non-contact light Although the center thickness of the lens is measured using a scientific measuring instrument, the center thickness of the lens can be measured using, for example, a contact measuring instrument using a measuring needle.
  • the refractive index distribution of the optical material forming the lens and the surface shape of the lens are measured, and the wavefront error generated via the lens is calculated based on the measurement result. are doing. Then, the thickness distribution of the antireflection film to be formed on the lens surface in order to correct the calculated wavefront error is calculated.
  • the refractive index distribution and the surface shape error can be reduced to some degree in each lens. Even if present, a projection optical system with extremely low aberration can be manufactured.
  • the wavefront aberration is 1 1 ⁇ or less.
  • An extremely low aberration projection optical system can be manufactured.
  • the wavefront error is calculated based on the measurement results of the refractive index distribution and the surface shape error.
  • the thickness distribution of the antireflection film to be formed to correct the wavefront error is calculated based on the measurement results of the refractive index distribution and the surface shape error and the measurement result of the wavefront error.
  • the manufacturing method of the first embodiment after the aberration measurement step S16, the determination step S17 and the lens adjustment step S18 are provided, but these steps S16 to S18 are omitted. can do. In other words, after the projection optical system assembling step S15, the manufacturing method of the first embodiment can be ended.
  • FIG. 17 is a flowchart showing a manufacturing method of the method for manufacturing a projection optical system according to the second embodiment of the present invention.
  • the manufacturing method of the first embodiment by correcting a wavefront error generated through each lens for each lens, that is, by forming an antireflection film having a predetermined thickness distribution on each lens, the extremely low aberration Manufactures projection optical systems.
  • the film thickness of the antireflection film formed on some of the lenses in the optical system is adjusted without correcting the wavefront error for each lens. By making corrections, an extremely low aberration projection optical system is manufactured.
  • the manufacturing method of the second embodiment will be described, focusing on the differences from the manufacturing method of the first embodiment.
  • the absolute value of the refractive index and the refractive index distribution of the block glass material on which each lens is to be formed are measured (S 21).
  • the surface of each lens is polished (S22).
  • the error of the surface shape of each lens is measured (S23).
  • a uniform antireflection film (rotationally symmetric with respect to the optical axis A X) based on the design is formed on each lens whose surface shape error has been measured (S 24).
  • An anti-reflection film having a thickness distribution that is rotationally symmetric with respect to the optical axis designed independently of the refractive index distribution information and the surface shape error information is formed on the surface of each lens.
  • the projection optical system 26 is assembled using a plurality of lenses on which the antireflection film is formed (S25). At this time, similarly to the first embodiment, a plurality of lenses to be included in the projection optical system are manufactured, and the projection optical system is assembled based on an optimal combination selected from the manufactured many lenses. Can also.
  • the wavefront difference of the actually assembled projection optical system is measured (S26). Then, it is determined whether or not the wavefront aberration of the projection optical system measured in the aberration measurement step S26 falls within the allowable range A (S27). If it is determined in the determination step S27 that the wavefront aberration of the projection optical system falls within the allowable range A (in the case of YES in FIG. 17), the process proceeds to a later-described step S29. On the other hand, if it is determined in the determination step S27 that the wavefront aberration of the projection optical system is not within the allowable range A (NO in FIG. 17), the lens is adjusted (S28).
  • the lens adjustment step S28 of the second embodiment in addition to the interval adjustment and the eccentricity adjustment performed in the first embodiment, rotation adjustment for rotating the lens around the optical axis AX is performed as necessary.
  • the lens adjustment is performed by adjusting the distance, the eccentricity, and the rotation.
  • the wavefront aberration of the adjusted projection optical system is measured again (S26). Then, it is determined again whether or not the wavefront aberration of the projection optical system measured again in the aberration measurement step S26 is within the allowable range A (S27). If it is determined in the determination step S27 that the wavefront aberration of the projection optical system falls within the allowable range A, the process proceeds to step S29 described later.
  • the lens adjustment step S2 is performed until a determination of YES is obtained in the determination step S27. 8 and the aberration measurement step S26 are further repeated.
  • some lenses (one or more lenses) suitable for correcting the wavefront aberration remaining in the projection optical system are taken out of the lens barrel (S 2 9).
  • the thickness distribution of the anti-reflection film formed on the lens taken out of the lens barrel is corrected (S30). That is, in the film thickness correction step S30, in order to correct the wavefront aberration remaining in the projection optical system, the measurement result of the refractive index distribution measurement step S21 and the measurement result of the surface shape measurement step S23 are used.
  • the thickness distribution of the antireflection film is corrected using, for example, the above-described ion beam processing. When an optical material having a sufficiently uniform refractive index distribution is used, the influence of the refractive index distribution can be ignored in correcting the thickness distribution.
  • the lens whose thickness distribution of the anti-reflection film has been corrected is incorporated into the lens barrel (S 3 Do, ie, the lens taken out of the lens barrel is returned to the original predetermined position in the lens barrel.
  • the wavefront aberration of the projection optical system incorporating the lens with the corrected film thickness distribution is measured (S32), and the wavefront aberration of the projection optical system measured in the aberration measurement step S32 is within the allowable range B.
  • the allowable range B in the determining step S33 is an allowable range as a final target value regarding the wavefront aberration of the projection optical system.
  • the allowable range A in the above-described determination step S27 is an intermediate allowable range set for shifting to the above-described step S29, for example, a value twice as large as the final allowable range B. Is set to
  • the projection optical system according to the second embodiment is used. The production of the system ends.
  • the lens is adjusted (S34).
  • the lens adjustment step S34 does not include the lens rotation adjustment. This is because the thickness distribution of the antireflection film is generally corrected to be rotationally asymmetric with respect to the optical axis AX in the film thickness correction step S30.
  • the lens adjustment step S34 similarly to the lens adjustment step S18 of the first embodiment, the adjustment of the distance between the lenses and the adjustment of the eccentricity of the lens are performed.
  • the wavefront aberration of the projection optical system adjusted by the interval adjustment and the eccentricity adjustment through the lens adjustment step S34 is measured again (S32). Then, it is determined again whether or not the wavefront aberration of the projection optical system measured again in the aberration measuring step S32 falls within the allowable range B (S33). If it is determined in the determination step S33 that the wavefront aberration of the projection optical system falls within the allowable range B, the manufacture of the projection optical system according to the second embodiment ends.
  • the lens adjustment step S3 is performed until a determination of YES is obtained in the determination step S33. 4 and the aberration measurement step S32 are further repeated.
  • the wavefront aberration of the assembled projection optical system is measured. Then, the lens in the projection optical system is adjusted based on the measurement result, and the wavefront aberration of the adjusted projection optical system is measured. Prior to assembling the projection optical system, the refractive index distribution and surface shape error were measured. In this manner, in the manufacturing method of the second embodiment, the lens is formed on a part of the lens surface based on the measurement result regarding the wavefront aberration of the projection optical system and the measurement result regarding the refractive index distribution and the surface shape error.
  • the thickness distribution of the anti-reflection coating is corrected, even if there is a refractive index distribution or surface shape error in each lens, for example, a projection optical system with extremely low wavefront aberration of 10 m or less can be used. It can be manufactured.
  • the thickness distribution of the antireflection film is corrected using ion beam processing.
  • the film thickness is corrected by another appropriate method such as polishing. I can.
  • ion beam processing film thickness can be corrected without removing the lens from the holder that holds the lens inside the lens barrel, so productivity is higher than in film thickness correction by polishing, which requires removing the lens from the holder. high.
  • the wavefront aberration of the assembled projection optical system is measured, and the thickness of the antireflection film formed on some lenses is corrected based on the measurement result.
  • the measurement accuracy of the basic data is higher than in the first embodiment using the measurement data relating to the refractive index distribution and the surface shape error of each lens. It has high accuracy and is effective for adjusting the final residual aberration of the projection optical system to a smaller value.
  • the determining step S26 After the aberration measuring step S26, the determining step
  • the manufacturing method of the second embodiment can be ended after the lens incorporating step S31.
  • FIG. 18 is a flowchart showing a manufacturing flow of a method for manufacturing a projection optical system according to the third embodiment of the present invention.
  • the manufacturing method of the third embodiment has a form in which the first embodiment and the second embodiment are partially combined.
  • the manufacturing method of the third embodiment will be briefly described, focusing on differences from the manufacturing method of the first embodiment and the manufacturing method of the second embodiment.
  • the absolute value of the refractive index and the refractive index distribution of the block glass material are measured (S41), and the projection optical system 26 is mounted.
  • the surface of each lens is polished (S42) in order to manufacture each lens to be formed, an error in the surface shape of each lens is measured (S43).
  • an antireflection film is formed on each lens whose surface shape error has been measured (S 4 4). That is, in the antireflection film forming step S44, in order to correct a wavefront error generated through each lens, an antireflection film having a predetermined thickness distribution is provided for each lens according to the manufacturing flow shown in FIG. Form a film.
  • the influence of the refractive index distribution can be neglected when the predetermined thickness distribution is applied.
  • the projection optical system 26 is assembled using a plurality of lenses on which the anti-reflection film having a predetermined thickness distribution is formed (S45).
  • a large number of each lens to constitute the projection optical system is manufactured, and the projection optical system is manufactured based on the optimal combination selected from the manufactured many lenses. Can also be assembled.
  • the wavefront aberration of the actually assembled projection optical system is measured (S46). Then, it is determined whether or not the wavefront aberration of the projection optical system measured in the difference measuring step S46 is within the allowable range A (S47).
  • the process proceeds to the lens removal step S49.
  • the lens is adjusted (S48).
  • the lens adjustment step S48 of the third embodiment as in the first embodiment, only the interval adjustment and the eccentricity adjustment are performed without performing the rotation adjustment. This is because the thickness distribution applied in the antireflection film forming step S44 is generally rotationally asymmetric with respect to the optical axis AX.
  • the wavefront aberration of the projection optical system whose lens has been adjusted by the interval adjustment and the eccentricity adjustment is measured again (S46). Then, it is determined again whether the wavefront aberration of the projection optical system measured again in the aberration measurement step S46 falls within the allowable range A (S47). If it is determined in the determination step S47 that the wavefront aberration of the projection optical system falls within the allowable range A, the process proceeds to a lens removal step S49. However, if it is determined in the determination step S47 that the wavefront aberration of the projection optical system is not within the allowable range A, a determination of YES is made in the determination step S47. Until is obtained, the lens adjustment step S48 and the aberration measurement step S46 are further repeated.
  • the film thickness correction step S50 in order to correct the wavefront aberration remaining in the projection optical system, the measurement result of the refractive index distribution measurement step S41 and the measurement result of the surface shape measurement step S43 are used. Based on the final measurement result of the aberration measurement step S6, the thickness distribution of the antireflection film is corrected using, for example, ion beam processing. When an optical material having a sufficiently uniform refractive index distribution is used, the influence of the refractive index distribution can be ignored when correcting the thickness distribution.
  • the wavefront aberration of the projection optical system is measured (S52). Then, it is determined whether or not the wavefront aberration of the projection optical system measured in the aberration measurement step S52 falls within the allowable range B (S53). In the determination step S53, when it is determined that the wavefront aberration of the projection optical system falls within the allowable range B (YES in FIG. 18), the production of the projection optical system according to the third embodiment is stopped. finish. On the other hand, when it is determined in the determination step S53 that the wavefront aberration of the projection optical system is not within the allowable range B (in the case of NO in FIG. 18), the adjustment of the lens spacing and the eccentricity of the lens are performed. (S54).
  • the wavefront aberration of the projection optical system adjusted by the distance adjustment and the eccentricity adjustment through the lens adjustment step S54 is measured again (S52). Then, it is determined again whether or not the wavefront aberration of the projection optical system measured again in the aberration measurement step S52 falls within the allowable range B (S53). If it is determined in the determination step S53 that the wavefront aberration of the projection optical system falls within the allowable range B, the manufacture of the projection optical system according to the third embodiment ends. However, if it is determined in the determination step S53 that the wavefront aberration of the projection optical system is not within the allowable range B, the lens adjustment step S53 is performed until a determination of YES is obtained in the determination step S53.
  • an antireflection film having a predetermined thickness distribution is formed on the surface of each lens in the same manner as in the first embodiment, and the same as in the second embodiment.
  • the thickness distribution of the antireflection film formed on the surface of some lenses is corrected. Therefore, in the manufacturing method of the third embodiment, as in the first and second embodiments, even if there is a certain degree of refractive index distribution or surface shape error in each lens, for example, 1 ⁇
  • a projection optical system having an extremely low aberration of ⁇ or less can be manufactured.
  • the mask (reticle) is illuminated by the illumination system (illumination step), and the transfer formed on the mask using the projection optical system is performed.
  • a micro device semiconductor element, image pickup element, liquid crystal display element, thin film magnetic head, etc.
  • FIG. 19 shows an example of a method for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a wafer or the like as a photosensitive substrate using the exposure apparatus of each embodiment. It will be described with reference to FIG.
  • a metal film is deposited on one lot of wafers.
  • a photoresist is applied on the metal film on the wafer of the lot.
  • an image of the pattern on the mask is sequentially exposed and transferred to each shot area on the one lot of wafers via the projection optical system.
  • the photoresist on the one lot of wafers is developed, and in step 305, etching is performed on the one lot of wafers using the resist pattern as a mask.
  • a circuit pattern corresponding to the pattern on the mask is formed in each shot area on each wafer.
  • a device such as a semiconductor element is manufactured by forming a circuit pattern of a further upper layer and the like.
  • a semiconductor device manufacturing method a semiconductor device having an extremely fine circuit pattern can be obtained with high throughput.
  • steps 301 to 305 a metal is deposited on the wafer, and a resist is applied on the metal film. Fabric, exposure, development, and etching steps are performed. Prior to these steps, a silicon oxide film is formed on the wafer, and then a resist is applied on the silicon oxide film and exposed. It goes without saying that the respective steps such as development, development and etching may be performed.
  • a liquid crystal display device as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate).
  • a so-called light beam is used to transfer and expose a mask pattern onto a photosensitive substrate (eg, a glass substrate coated with a resist) using the exposure apparatus of each embodiment.
  • the liquidation process is performed.
  • a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate.
  • the exposed substrate is subjected to a developing process, an etching process, a resist stripping process, etc., thereby forming a predetermined pattern on the substrate, and then moving to the next color filter forming process 402. .
  • a set of three dots corresponding to R (Red), G (Green), and B (B 1 ue) are arranged in a matrix, or , G, B are formed as a color filter in which a set of three stripe filters is arranged in a plurality of horizontal scanning line directions.
  • a cell assembling step 403 is executed.
  • a liquid crystal panel is formed using the substrate having the predetermined pattern obtained in the pattern forming step 401 and the color filter obtained in the color filter forming step 402. (Liquid crystal cell).
  • liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step 401 and the color filter obtained in the color filter forming step 402. Then, a liquid crystal panel (liquid crystal cell) is manufactured.
  • each part such as an electric circuit and a backlight for performing the display operation of the assembled liquid crystal panel (liquid crystal cell) is attached.
  • a liquid crystal display device having an extremely fine circuit pattern can be obtained with high throughput.
  • the anti-reflection film having a predetermined thickness distribution is formed on the surface of the lens, or the thickness distribution of the anti-reflection film formed on the surface of the lens is corrected.
  • the present invention is applied to a method of manufacturing a projection optical system mounted on an exposure apparatus.
  • the present invention is not limited to this.
  • the present invention can also be applied to a method.
  • the thickness distribution of the thin film formed on the surface of the lens is formed by forming a thin film having a predetermined thickness distribution on the surface of the lens.
  • the exposure apparatus of the present invention including an optical system having an extremely low wave aberration of 1 ⁇ or less as a projection optical system can perform favorable exposure with high resolution. Furthermore, for example, in the microdevice manufacturing method of the present invention using an exposure apparatus equipped with a projection optical system having an extremely low wavefront aberration of 1 ⁇ or less, a high resolution and a good microdevice under favorable exposure conditions are provided. Can be manufactured.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Lens Barrels (AREA)
  • Lenses (AREA)
  • Surface Treatment Of Optical Elements (AREA)

Abstract

An optical system manufacturing method capable of manufacturing, for example, a projection optical system having an extremely low aberration of a wave aberration of 10 mλ, even if the lenses have a more or less refractive index distribution or a planar shape error. The method comprises a refractive index distribution measuring step (S11) of measuring a refractive index distribution in an optical material for forming a lens a planar shape measuring step (S13) of measuring the surface shape of the lens, and a correction film forming step (S14) of determining the optical error (or the wavefront error) of the lens on the basis of the measurement result at the refractive index distribution measuring step and the measurement result of the planar shape measuring step and forming a thin film (antireflection film) having a predetermined thickness distribution with respect to the surface of the lens, on the basis of the calculatetion results.

Description

明 細 書 光学系の製造方法、 および該製造方法で製造された光学系を備えた露光装置 技術分野  Description: MANUFACTURING METHOD OF OPTICAL SYSTEM AND EXPOSURE APPARATUS HAVING OPTICAL SYSTEM MANUFACTURED BY THE MANUFACTURING METHOD

本発明は、 光学系の製造方法、 および該製造方法で製造された光学系を備えた 露光装置に関する。 特に、 本発明は、 半導体素子、 撮像素子、 液晶表示素子、 薄 膜磁気へッド等のマイクロデバイスをリソグラフィ一工程で製造するための露光 装置に用いられる投影光学系の製造方法に関するものである。 背景技術  The present invention relates to a method for manufacturing an optical system and an exposure apparatus including the optical system manufactured by the method. In particular, the present invention relates to a method for manufacturing a projection optical system used in an exposure apparatus for manufacturing a micro device such as a semiconductor device, an imaging device, a liquid crystal display device, and a thin film magnetic head in one lithography process. . Background art

L S Iの製造において、 回路パターンを形成するリソグラフィー工程では紫外 線を光源とする半導体露光装置が用いられている。 この種の半導体露光装置には マスク上のパターンをウェハ上のレジストに転写する投影光学系が組み込まれ、 投影光学系には収差を極限まで低減することが求められている。 L S Iの集積度 は 3年で 2倍の速度で増大しているが、 露光装置 (ひいては投影光学系) やレジ ストの解像力の向上により、 L S Iの高集積化の要請に合ったスピードで加工の 微細化を実現している。  In the manufacture of LSI, a semiconductor exposure apparatus using ultraviolet light as a light source is used in a lithography process for forming a circuit pattern. This type of semiconductor exposure apparatus incorporates a projection optical system for transferring a pattern on a mask to a resist on a wafer, and the projection optical system is required to reduce aberrations to the utmost. The degree of integration of LSIs has increased at twice the rate in three years, but with the improvement in the resolution of exposure equipment (and projection optics) and resists, processing can be performed at a speed that meets the demand for high integration of LSIs. Miniaturization is realized.

ところが、 近年、 露光装置やレジストの解像性能の向上速度が L S Iの微細化 の速度よりも低いため、 解像力の余裕がなくなりつつある。 その結果、 解像性能 の限界に近い条件で、 L S Iのパターン形成がなされるようになつている。 例え ば、 k 1ファクターと呼ばれるパラメ一夕は 1 0年前には約 0 . 8であったが、 現在では約 0 . 6であり、 今後は約 0 . 4を前提とした開発が進んでいる。 この ような状況においては、 投影光学系の収差により回路パターンの線幅や形状がば らつき易い。 したがって、 回路の特性のばらつきを良好に抑え、 ひいては L S I の品質を良好に保つには、 投影光学系の収差を一定範囲に抑えることが必須とな つている。  However, in recent years, the speed of improving the resolution performance of the exposure apparatus and the resist is lower than the speed of miniaturization of the LSI, so that there is no room for the resolution. As a result, the LSI pattern is formed under conditions close to the limit of resolution performance. For example, the parameter called the k1 factor was about 0.8 ten years ago, but now it is about 0.6, and in the future, development will be made on the assumption of about 0.4. I have. In such a situation, the line width and shape of the circuit pattern tend to vary due to the aberration of the projection optical system. Therefore, it is essential to keep the aberration of the projection optical system within a certain range in order to suppress variations in circuit characteristics well and to maintain good LSI quality.

一般に、 露光装置に搭載される投影光学系は 2 0枚以上のレンズ (レンズ要 素) から構成され、 投影光学系の収差は光学設計の段階では所定の値以下に抑え られている。 しかしながら、 実際に作られる個々のレンズは、 製造誤差により設 計値からずれた特性を有する。 例えば、 個々のレンズを形成する光学材料 (レン ズ材料) として屈折率が均一な合成石英を入手しょうとしても、 実際に入手可能 な光学材料には屈折率の均一性について限界があり、 光学材料の屈折率ムラ (屈 折率分布) が最終的に投影光学系の収差を劣化させる要因の 1つとなる。 また、 レンズ表面の研磨工程では干渉計で面形状を随時計測しながら研磨を繰り返すが、 投影光学系の工業生産を経済的に行うには、 その収差にある程度影響を与えるよ うな加工誤差を残さざるを得ない。 すなわち、 レンズの面形状の誤差も、 投影光 学系における収差発生の要因の 1つとなる。 Generally, a projection optical system mounted on an exposure apparatus has at least 20 lenses (lens required). The aberration of the projection optical system is suppressed to a predetermined value or less at the stage of optical design. However, individual lenses actually manufactured have characteristics that deviate from the design values due to manufacturing errors. For example, even if we try to obtain synthetic quartz with a uniform refractive index as the optical material (lens material) that forms the individual lenses, there is a limit to the uniformity of the refractive index of the optical materials that are actually available. The refractive index non-uniformity (refractive index distribution) is one of the factors that eventually deteriorate the aberration of the projection optical system. In the polishing process of the lens surface, polishing is repeated while measuring the surface shape as needed with an interferometer.However, in order to economically manufacture the projection optical system, a processing error that affects the aberration to some extent remains. I have no choice. That is, an error in the surface shape of the lens is one of the factors that cause aberration in the projection optical system.

さらに、 多数のレンズを用いて組み立てられた投影光学系の収差を小さく抑え るように光学調整する調整工程では、 レンズを光軸に沿って移動させてレンズ間 の間隔を変化させる間隔調整や、 レンズを光軸に対して垂直にシフト (移動) さ せたりチルト (傾斜) させたりする偏芯調整により、 投影光学系を最小の収差状 態にする。 また、 投影光学系の収差をさらに低減するために、 レンズを光軸廻り に回転させる回転調整によりレンズの回転非対称な誤差の影響を低減することも 合わせて行われる。 しかしながら、 間隔調整や偏芯調整や回転調整においても、 その設定 (レンズの移動量、 シフト量、 チルト量、 回転角度など) に誤差が残り、 この設定誤差も投影光学系における収差発生の要因の 1つとなる。  Furthermore, in the adjustment step of optically adjusting the projection optical system assembled using a large number of lenses so as to minimize aberrations, the adjustment of the distance between the lenses by moving the lenses along the optical axis, By adjusting the eccentricity by shifting (moving) or tilting (tilting) the lens perpendicularly to the optical axis, the projection optical system is brought to the minimum aberration state. Further, in order to further reduce the aberration of the projection optical system, the influence of the rotationally asymmetric error of the lens is reduced by rotating the lens around the optical axis. However, even in the interval adjustment, the eccentricity adjustment, and the rotation adjustment, an error remains in the setting (amount of movement of the lens, a shift amount, a tilt amount, a rotation angle, and the like), and the setting error is also a cause of aberration in the projection optical system. Become one.

一般に、 多数のレンズから構成される投影光学系では、 光線の透過部分が各レ ンズによって異なり、 且つ多数のレンズを通過する時に受ける波面の位相の進み と遅れとがランダムに重なり合うので、 必ずしも各レンズの波面誤差の影響がそ のまま累積されるわけではない。 したがって、 例えば 2 5枚のレンズを用いて波 面収差が Ι Ο πι λ ( λ :露光光の波長) 程度の投影光学系を製造する場合、 1枚 のレンズに許容される波面誤差 (波面のずれ) は 2 m A程度である。 この場合、 レンズには屈折率分布が存在するので、 レンズの片面において許容される面形状 の誤差 (波面誤差) は 0 . 5〜1 πι λ程度となる。  In general, in a projection optical system composed of a large number of lenses, the transmitted portion of the light beam differs for each lens, and the phase advance and delay of the wavefront received when passing through a large number of lenses are randomly overlapped. The effects of lens wavefront errors are not cumulative. Therefore, for example, when manufacturing a projection optical system having a wavefront aberration of about πππλ (λ: wavelength of exposure light) using 25 lenses, the wavefront error (wavefront Is about 2 mA. In this case, since there is a refractive index distribution in the lens, the allowable surface shape error (wavefront error) on one surface of the lens is about 0.5 to 1πιλ.

露光光の波長 λを 2 4 8 n mとし、 且つレンズを形成する光学材料の屈折率を 1 . 6とすると、 0 . 5〜1 πι λ程度の波面誤差は、 光線の進行方向に沿って 0 . 2 5〜0 . 5 n mの形状誤差に相当する。 現状の最も進んだ研磨技術をもってし ても、 直径 2 0 0 mm以上のレンズをこのような誤差で加工するのは不可能であ り、 加工誤差の最もよいレンズ部品でもその形状誤差は数 n m程度である。 以上 のように、 従来の投影光学系の製造方法では、 レンズの屈折率分布やレンズの面 形状誤差などの影響により、 波面収差で 1 Ο πι λ以下の極低収差の投影光学系を 製造することはできなかった。 発明の開示 The wavelength λ of the exposure light is 248 nm, and the refractive index of the optical material forming the lens is Assuming 1.6, a wavefront error of about 0.5 to 1πιλ corresponds to a shape error of 0.25 to 0.5 nm along the traveling direction of the light beam. Even with the current state-of-the-art polishing technology, it is impossible to process lenses with a diameter of 200 mm or more with such an error. It is about. As described above, in the conventional method for manufacturing a projection optical system, a projection optical system having an extremely low wavefront aberration of 1Οπιλ or less due to the influence of the refractive index distribution of the lens and the surface shape error of the lens. I couldn't do that. Disclosure of the invention

本発明は、 前述の課題に鑑みてなされたものであり、 個々のレンズに屈折率分 布や面形状誤差がある程度存在しても、 たとえば波面収差で 1 0 mA以下の極低 収差の投影光学系を製造することのできる光学系の製造方法を提供することを目 的とする。  The present invention has been made in view of the above-described problems, and even if individual lenses have a certain degree of refractive index distribution or surface shape error, for example, projection optics having an extremely low wavefront aberration of 10 mA or less. It is an object of the present invention to provide a method for producing an optical system capable of producing a system.

また、 本発明は、 たとえば波面収差で 1 O m A以下の極低収差の投影光学系を 備えて、 高解像のもとで良好な露光を行うことのできる露光装置を提供すること を目的とする。  Another object of the present invention is to provide an exposure apparatus including a projection optical system having an extremely low aberration of, for example, 1 O mA or less in terms of wavefront aberration, and capable of performing good exposure under high resolution. And

さらに、 本発明は、 たとえば波面収差で 1 Ο πι λ以下の極低収差の投影光学系 を備えた露光装置を用いて、 高解像で良好な露光条件のもとで良好なマイクロデ バイスを製造することのできるマイクロデバイスの製造方法を提供することを目 的とする。  Further, the present invention uses an exposure apparatus having a projection optical system having an extremely low wavefront aberration of 1ιπιλ or less, for example, to manufacture a good microdevice under a high resolution and good exposure condition. It is an object of the present invention to provide a method for manufacturing a micro device that can perform the method.

前記課題を解決するために、 本発明の第 1発明では、 少なくとも 1つのレンズ を有する光学系の製造方法において、  In order to solve the above problems, in a first invention of the present invention, in a method of manufacturing an optical system having at least one lens,

前記少なくとも 1つのレンズを形成する光学材料における屈折率分布を計測す る屈折率分布計測工程と、  A refractive index distribution measuring step of measuring a refractive index distribution in the optical material forming the at least one lens;

前記少なくとも 1つのレンズにおける表面形状を計測する面形状計測工程と、 前記屈折率分布計測工程の計測結果と前記面形状計測工程の計測結果とに基づ いて前記少なくとも 1つのレンズの光学的誤差を求める算出工程と、  A surface shape measurement step of measuring a surface shape of the at least one lens; and an optical error of the at least one lens based on a measurement result of the refractive index distribution measurement step and a measurement result of the surface shape measurement step. The calculation process to be determined;

前記算出工程の算出結果に基づいて前記少なくとも 1つのレンズの表面に対し て所定の厚さ分布を有する薄膜を形成する補正膜形成工程とを含むことを特徴と する光学系の製造方法を提供する。 The surface of the at least one lens is determined based on a calculation result of the calculation step. And forming a correction film for forming a thin film having a predetermined thickness distribution.

本発明の第 2発明では、 複数のレンズを有する光学系の製造方法において、 前記複数のレンズを用いて光学系を組み立てる組立工程と、  According to a second aspect of the present invention, in the method for manufacturing an optical system having a plurality of lenses, an assembling step of assembling the optical system using the plurality of lenses;

前記組立工程で組み立てられた前記光学系の収差を測定する収差測定工程と、 前記収差測定工程の測定結果に基づいて前記複数のレンズのうちの少なくとも An aberration measuring step of measuring an aberration of the optical system assembled in the assembling step; and at least one of the plurality of lenses based on a measurement result of the aberration measuring step.

1つのレンズの表面に形成された薄膜の厚さ分布を補正する膜厚補正工程とを含 むことを特徴とする光学系の製造方法を提供する。 A method of correcting the thickness of a thin film formed on the surface of one lens.

本発明の第 3発明では、 複数のレンズを有する光学系の製造方法において、 前記複数のレンズを用いて光学系を組み立てる組立工程と、  In a third aspect of the present invention, in the method for manufacturing an optical system having a plurality of lenses, an assembling step of assembling the optical system using the plurality of lenses;

前記組立工程で組み立てられた前記光学系の収差を測定する第 1収差測定工程 と、  A first aberration measurement step of measuring aberration of the optical system assembled in the assembly step,

前記第 1収差測定工程の測定結果に基づいて前記光学系中の少なくとも 1つの レンズを調整するレンズ調整工程と、  A lens adjustment step of adjusting at least one lens in the optical system based on the measurement result of the first aberration measurement step;

前記レンズ調整工程で調整された前記光学系の収差を測定する第 2収差測定ェ 程と、  A second aberration measurement step for measuring the aberration of the optical system adjusted in the lens adjustment step;

前記第 2収差測定工程の測定結果に基づいて前記複数のレンズのうちの少なく とも 1つのレンズの表面に形成された薄膜の厚さ分布を補正する膜厚補正工程と を含むことを特徴とする光学系の製造方法を提供する。  A film thickness correction step of correcting a thickness distribution of a thin film formed on a surface of at least one of the plurality of lenses based on a measurement result of the second aberration measurement step. An optical system manufacturing method is provided.

本発明の第 4発明では、 所定のパターンが形成されたマスクを照明する照明光 学系と、  According to a fourth aspect of the present invention, there is provided an illumination optical system for illuminating a mask on which a predetermined pattern is formed,

前記マスクのパターン像を感光性基板に投影するための第 1発明〜第 3発明の 製造方法によって製造された光学系とを備えていることを特徴とする露光装置を 提供する。  An exposure apparatus, comprising: an optical system manufactured by the manufacturing method according to any one of the first to third inventions for projecting the pattern image of the mask onto a photosensitive substrate.

本発明の第 5発明では、 第 4発明の露光装置を用いて前記マスクのパターンを 感光性基板に露光する露光工程と、  In a fifth aspect of the present invention, an exposure step of exposing the pattern of the mask to a photosensitive substrate using the exposure apparatus of the fourth aspect of the invention,

前記露光工程により露光された前記感光性基板を現像する現像工程とを含むこ とを特徴とするマイクロデバイスの製造方法を提供する。 図面の簡単な説明 And a developing step of developing the photosensitive substrate exposed in the exposing step. BRIEF DESCRIPTION OF THE FIGURES

第 1 A図は、 本発明の基本的な原理を説明する第 1の図である。  FIG. 1A is a first diagram illustrating the basic principle of the present invention.

第 1 B図は、 本発明の基本的な原理を説明する第 2の図である。  FIG. 1B is a second diagram illustrating the basic principle of the present invention.

第 2図は、 薄膜の厚さ分布と波面誤差の補正との関係を模式的に説明する図で ある。  FIG. 2 is a diagram schematically illustrating a relationship between a thickness distribution of a thin film and correction of a wavefront error.

第 3図は、 本発明の各実施形態にかかる製造方法で製造された投影光学系を備 えた露光装置の構成を概略的に示す図である。  FIG. 3 is a diagram schematically showing a configuration of an exposure apparatus having a projection optical system manufactured by a manufacturing method according to each embodiment of the present invention.

第 4図は、 本発明の第 1実施形態にかかる製造方法の製造フローを示すフロー チャートである。  FIG. 4 is a flowchart showing a manufacturing flow of the manufacturing method according to the first embodiment of the present invention.

第 5図は、 各レンズを形成すべきブロック硝材の屈折率の絶対値および屈折率 分布を測定する干渉計装置の構成を概略的に示す図である。  FIG. 5 is a diagram schematically showing a configuration of an interferometer device for measuring an absolute value and a refractive index distribution of a refractive index of a block glass material on which each lens is to be formed.

第 6図は、 各レンズの面形状誤差を測定する干渉計装置の構成を概略的に示す 図である。  FIG. 6 is a diagram schematically showing a configuration of an interferometer device for measuring a surface shape error of each lens.

第 7図は、 第 1実施形態における反射防止膜形成工程のフローチヤ一トである c 第 8図は、 反射防止膜の形成時に所定の厚さ分布を付与する第 1の方法を説明 する図である。 In Figure 7 Figure, c 8 FIG Furochiya an bets antireflection film formation step in the first embodiment, illustrating a first method for imparting a predetermined thickness distribution at the time of forming the antireflection film is there.

第 9図は、 一旦形成された反射防止膜の厚さ分布を所定の厚さ分布に補正する 第 2の方法に用いられるイオンビーム加工装置の構成を概略的に示す図である。 第 1 0図は、 波長 2 4 8 n mの光に対して用いられる反射防止膜の膜厚補正量 と波面のずれ (波面の変化) と反射率との関係を示す図である。  FIG. 9 is a diagram schematically showing a configuration of an ion beam processing apparatus used in a second method for correcting the thickness distribution of the once formed antireflection film to a predetermined thickness distribution. FIG. 10 is a diagram showing the relationship between the film thickness correction amount of the antireflection film used for light having a wavelength of 248 nm, the shift of the wavefront (change of the wavefront), and the reflectance.

第 1 1図は、 K r Fエキシマレ一ザ光源を使用する投影光学系の波面収差を計 測するフィゾー干渉計方式の波面収差測定機の構成を概略的に示す図である。 第 1 2図は、 A r Fエキシマレーザ光源を使用する投影光学系の波面収差を計 測する P D I方式の波面収差測定機の構成を概略的に示す図である。  FIG. 11 is a diagram schematically showing the configuration of a Fizeau interferometer type wavefront aberration measuring instrument for measuring the wavefront aberration of a projection optical system using a KrF excimer laser light source. FIG. 12 is a diagram schematically showing a configuration of a PDI type wavefront aberration measuring instrument for measuring a wavefront aberration of a projection optical system using an ArF excimer laser light source.

第 1 3図は、 間隔調整や偏芯調整が可能に構成された投影光学系の内部構成を 概略的に示す図である。  FIG. 13 is a diagram schematically showing an internal configuration of a projection optical system configured to be capable of adjusting an interval and an eccentricity.

第 1 4図は、 第 1 3図の投影光学系における複数の部分鏡筒のうちの 1つの部 分鏡筒の構成を示す上面図である。 FIG. 14 shows one of the plurality of partial lens barrels in the projection optical system shown in FIG. FIG. 3 is a top view showing a configuration of a split lens barrel.

第 1 5図は、 マイケルソン型干渉計を利用したレンズ中心厚測定機の構成を概 略的に示す図である。  FIG. 15 is a diagram schematically showing a configuration of a lens center thickness measuring device using a Michelson interferometer.

第 1 6図は、 測定する間隔 (レンズ中心厚) よりも可干渉距離が十分に小さい 光を供給する光源を使用したときの受光素子に入射する干渉光の強度と反射ミラ 一の位置との関係を示す図である。  Fig. 16 shows the relationship between the intensity of the interference light incident on the light-receiving element and the position of the reflection mirror when a light source that supplies light is sufficiently smaller than the distance to be measured (lens center thickness). It is a figure showing a relation.

第 1 7図は、 本発明の第 2実施形態にかかる製造方法の製造フローを示すフロ 一チャートである。  FIG. 17 is a flowchart showing a production flow of the production method according to the second embodiment of the present invention.

第 1 8図は、 本発明の第 3実施形態にかかる投影光学系の製造方法の製造フロ 一を示すフロ一チヤ一トである。  FIG. 18 is a flowchart showing a manufacturing flow of a method for manufacturing a projection optical system according to the third embodiment of the present invention.

第 1 9図は、 マイクロデバイスとしての半導体デバイスを得る際の手法のフロ 一チャートである。  FIG. 19 is a flowchart of a method for obtaining a semiconductor device as a micro device.

第 2 0図は、 マイクロデバイスとしての液晶表示素子を得る際の手法のフロー チヤ一トである。 発明を実施するための最良の形態  FIG. 20 is a flowchart of a method for obtaining a liquid crystal display element as a micro device. BEST MODE FOR CARRYING OUT THE INVENTION

第 1 A図および第 1 B図は、 本発明の基本的な原理を説明する図である。 まず、 第 1 A図に示すように、 実際に製造されたレンズ 1の表面 2が設計上の理想面 (ベストフィット面) 3から光束 1 1の進行方向に沿って dだけずれている場合 を考える。 この場合、 レンズ 1の面形状の誤差に起因して、 すなわち設計上の理 想面 3と実際の表面 2との光束進行方向に沿ったずれ dに起因して、 レンズ 1を 介した透過光には波面の誤差 (理想のレンズを介して得られる波面と実際のレン ズを介して得られる波面との光束進行方向に沿つたずれ) が発生する。  FIG. 1A and FIG. 1B are diagrams for explaining the basic principle of the present invention. First, as shown in Fig. 1A, the case where the surface 2 of the actually manufactured lens 1 is deviated from the ideal design surface (best fit surface) 3 by d along the traveling direction of the light beam 11 is assumed. Think. In this case, the light transmitted through the lens 1 is caused by an error in the surface shape of the lens 1, that is, by a shift d between the design ideal surface 3 and the actual surface 2 along the light beam traveling direction. A wavefront error (a shift between the wavefront obtained through the ideal lens and the wavefront obtained through the actual lens along the light beam traveling direction) occurs in the wavefront.

本発明では、 レンズ 1の面形状誤差に起因して発生する波面誤差 (波面のず れ) を補正するために、 所定の厚さ分布を有する薄膜 (たとえば反射防止膜) を 形成する。 具体的には、 第 1 B図に示すように、 レンズ 1の表面 2に下層 4およ び上層 5からなる薄膜を形成する場合、 たとえば下層 4には設計にしたがつて光 軸に関して回転対称な厚さ分布を付与するが、 最も外側の上層 5には本発明にし たがって面形状誤差を考慮した所定の厚さ分布を付与する。 なお、 第 1 B図にお いて、 実線 5 aは本発明にしたがって形成される上層 5の表面を示し、 破線 5 b は上層 5の設計上の表面 (すなわち設計表面) を示している。 In the present invention, a thin film (for example, an antireflection film) having a predetermined thickness distribution is formed in order to correct a wavefront error (wavefront deviation) generated due to a surface shape error of the lens 1. Specifically, as shown in Fig. 1B, when a thin film composed of the lower layer 4 and the upper layer 5 is formed on the surface 2 of the lens 1, for example, the lower layer 4 is rotationally symmetric with respect to the optical axis according to the design. The outermost upper layer 5 according to the present invention. Accordingly, a predetermined thickness distribution considering the surface shape error is given. In FIG. 1B, the solid line 5a indicates the surface of the upper layer 5 formed according to the present invention, and the broken line 5b indicates the designed surface of the upper layer 5 (that is, the designed surface).

本発明では、 レンズ 1の面形状誤差に起因して発生する波面誤差を補正するた めに、 薄膜の上層 5の表面 5 aを設計表面 5 bから光束 1 1の進行方向に沿って eだけずらして形成している。 ここで、 レンズ 1を形成する光学材料の光束 1 1 に対する屈折率を n 1とし、 上層 5を形成する物質の光束 1 1に対する屈折率を n 2とすると、 補正量 eは e二 ( n 1 /n 2 ) dで表される。 こうして、 実際に 製造されたレンズ 1において面形状誤差が存在していても、 レンズ 1の表面 2に 所定の厚さ分布を有する薄膜 (4 , 5 ) を形成することにより、 レンズ 1の面形 状誤差に起因して発生する波面誤差 (例えばランダムまたは回転非対称な波面収 差) を補正することができる。  In the present invention, in order to correct the wavefront error generated due to the surface shape error of the lens 1, the surface 5 a of the upper layer 5 of the thin film is moved from the design surface 5 b by e only along the traveling direction of the light beam 11. It is formed shifted. Here, assuming that the refractive index of the optical material forming the lens 1 for the light beam 11 is n 1 and the refractive index of the material forming the upper layer 5 for the light beam 11 is n 2, the correction amount e is e 2 (n 1 / n 2) expressed as d. Thus, even if there is a surface shape error in the actually manufactured lens 1, by forming a thin film (4, 5) having a predetermined thickness distribution on the surface 2 of the lens 1, the surface shape of the lens 1 is obtained. Wavefront errors caused by shape errors (eg, random or rotationally asymmetric wavefront errors) can be corrected.

第 2図は、 薄膜の厚さ分布と波面誤差の補正との関係を模式的に説明する図で ある。 第 2図では、 レンズ 7の表面に膜厚の一様な下層 8を形成し、 その上に膜 厚の異なる上層 9および 1 0を形成している。 一般に、 薄膜としての反射防止膜 を形成する層の数は、 1層から 5層程度の場合が多い。 単層で反射防止膜を形成 する場合には、 第 2図に示す下層 8は存在しないことになる。 ここで、 薄膜の上 層 9の領域へ入射する光束 1 2および薄膜の上層 1 0の領域へ入射する光束 1 3 は、 レンズ 7を介して光束 1 4および 1 5に変換される。  FIG. 2 is a diagram schematically illustrating a relationship between a thickness distribution of a thin film and correction of a wavefront error. In FIG. 2, a lower layer 8 having a uniform film thickness is formed on the surface of a lens 7, and upper layers 9 and 10 having different film thicknesses are formed thereon. In general, the number of layers forming an antireflection film as a thin film is often about 1 to 5 layers. When the antireflection film is formed as a single layer, the lower layer 8 shown in FIG. 2 does not exist. Here, the light beam 12 incident on the region of the upper layer 9 of the thin film and the light beam 13 incident on the region of the upper layer 10 of the thin film are converted into light beams 14 and 15 via the lens 7.

第 2図では、 薄膜の上層 9と 1 0とが f だけ異なる膜厚を有するため、 すなわ ち薄膜に所定の厚さ分布が付与されているため、 薄膜の上層 9を介した光束と上 層 1 0を介した光束との間に波面のずれ (位相差) を付与することができる。 一 方、 レンズ 7の表面において薄膜の上層 9に対応する領域と上層 1 0に対応する 領域との間で面形状の誤差の差がある場合、 この 2つの領域を介した光束の間に 波面のずれすなわち位相差が発生する。 したがって、 2つの領域の面形状誤差の 差が dである場合、 上層 9と 1 0との膜厚の差 f を f = eに設定することにより、 2つの領域間の面形状誤差に起因する波面誤差を 2つの領域間の薄膜の膜厚差に よって補正することができる。 換言すると、 レンズの表面に形成される薄膜に所定の厚さ分布を付与すること により、 レンズの面形状誤差に起因する波面誤差を補正することができる。 なお、 レンズの面形状誤差に起因する波面誤差を補正するには、 レンズの入射側の表面 に形成される薄膜に所定の厚さ分布を付与してもよいし、 レンズの射出側の表面 に形成される薄膜に所定の厚さ分布を付与してもよい。 さらに、 必要に応じて、 レンズの入射側の表面に形成される薄膜およびレンズの射出側の表面に形成され る薄膜の双方に所定の厚さ分布を付与することもできる。 なお、 薄膜が多層膜を 含む場合、 多層膜の最も外側の層の膜厚の 1 5 %以下の補正量を付加することが 好ましい。 In FIG. 2, since the upper layers 9 and 10 of the thin film have different thicknesses by f, that is, since the predetermined thickness distribution is given to the thin film, the light flux passing through the upper layer 9 of the thin film is A wavefront shift (phase difference) can be imparted to the light flux passing through the layer 10. On the other hand, when there is a difference in surface shape error between the region corresponding to the upper layer 9 of the thin film and the region corresponding to the upper layer 10 on the surface of the lens 7, the wavefront between the light beams passing through these two regions is A shift, that is, a phase difference occurs. Therefore, if the difference in the surface shape error between the two regions is d, the difference between the film thicknesses of the upper layers 9 and 10 is set to f = e. The wavefront error can be corrected by the difference in thin film thickness between the two regions. In other words, by giving a predetermined thickness distribution to the thin film formed on the surface of the lens, it is possible to correct the wavefront error caused by the surface shape error of the lens. In order to correct the wavefront error caused by the surface shape error of the lens, a predetermined thickness distribution may be given to the thin film formed on the surface on the entrance side of the lens, or the surface on the exit side of the lens may be provided. A predetermined thickness distribution may be given to the formed thin film. Further, if necessary, a predetermined thickness distribution can be imparted to both the thin film formed on the entrance surface of the lens and the thin film formed on the exit surface of the lens. When the thin film includes a multilayer film, it is preferable to add a correction amount of 15% or less of the thickness of the outermost layer of the multilayer film.

また、 レンズの面形状に誤差が全くない場合にも、 レンズを形成する光学材料 の屈折率分布 (屈折率ムラ、 例えば回転非対称またはランダムな屈折率分布) に 起因して、 レンズを介した透過光には波面誤差が発生する。 この場合、 面形状誤 差に起因して発生する波面誤差の補正の場合と同様に、 薄膜に所定の厚さ分布を 付与することにより、 屈折率分布に起因する波面誤差 (例えばランダムまたは回 転非対称な波面収差) も補正することができる。 ただし、 光学材料の屈折率分布 がレンズの内部で生じているのに対し、 薄膜の厚さ分布による位相補正はレンズ 表面で行われるので、 厳密には屈折率分布に起因する波面誤差を完全には補正し 切れずにある程度の補正誤差が残る場合もある。  Even when there is no error in the lens surface shape, transmission through the lens is caused by the refractive index distribution (non-uniform refractive index, for example, rotationally asymmetric or random refractive index distribution) of the optical material forming the lens. Light has a wavefront error. In this case, as in the case of the correction of the wavefront error caused by the surface shape error, by giving a predetermined thickness distribution to the thin film, the wavefront error caused by the refractive index distribution (for example, random or rotation) Asymmetric wavefront aberration) can also be corrected. However, while the refractive index distribution of the optical material occurs inside the lens, the phase correction based on the thickness distribution of the thin film is performed on the lens surface, so strictly speaking, the wavefront error caused by the refractive index distribution is completely eliminated. In some cases, the correction cannot be completed and some correction error remains.

本発明の典型的な光学系の製造方法では、 レンズを形成する光学材料の屈折率 分布を計測するとともに、 レンズの面形状を計測する。 そして、 屈折率分布の計 測結果と面形状の計測結果とに基づいて、 レンズの光学的誤差として、 たとえば レンズを介して発生する波面誤差を算出する。 さらに、 波面誤差の算出結果に基 づいて、 波面誤差を補正するためにレンズの表面に形成すべき薄膜の厚さ分布を 算出する。 こうして、 厚さ分布の算出結果に基づいて、 レンズの表面に対して所 定の厚さ分布を有する薄膜を形成する。  In a typical method for manufacturing an optical system according to the present invention, a refractive index distribution of an optical material forming a lens is measured, and a surface shape of the lens is measured. Then, based on the measurement result of the refractive index distribution and the measurement result of the surface shape, a wavefront error generated via the lens is calculated as an optical error of the lens. Further, based on the calculation result of the wavefront error, the thickness distribution of the thin film to be formed on the surface of the lens to correct the wavefront error is calculated. Thus, a thin film having a predetermined thickness distribution with respect to the lens surface is formed based on the calculation result of the thickness distribution.

あるいは、 本発明の別の典型的な光学系の製造方法では、 複数のレンズを用い て光学系を組み立てた後、 組み立てた光学系の収差を測定する。 そして、 その測 定結果に基づいて、 光学系中のレンズを調整する。 さらに、 レンズ調整した光学 系の収差を測定する。 なお、 光学系の組立に先立って、 複数のレンズをそれぞれ 形成する各光学材料の屈折率分布および複数のレンズそれぞれの面形状を計測し ている。 こうして、 レンズ調整した光学系の収差に関する測定結果とレンズの屈 折率分布および面形状に関する計測結果とに基づいて、 レンズの表面に形成され た薄膜の厚さ分布を補正する。 Alternatively, in another typical method for manufacturing an optical system according to the present invention, after assembling the optical system using a plurality of lenses, the aberration of the assembled optical system is measured. Then, the lens in the optical system is adjusted based on the measurement result. In addition, lens adjusted optics Measure the system aberrations. Prior to assembling the optical system, the refractive index distribution of each optical material forming each of the plurality of lenses and the surface shape of each of the plurality of lenses are measured. In this way, the thickness distribution of the thin film formed on the surface of the lens is corrected based on the measurement result regarding the aberration of the lens-adjusted optical system and the measurement result regarding the refractive index distribution and the surface shape of the lens.

以上のように、 本発明による光学系の製造方法では、 レンズの表面に対して所 定の厚さ分布を有する薄膜を形成することにより、 あるいはレンズの表面に形成 された薄膜の厚さ分布を補正することにより、 個々のレンズに屈折率分布や面形 状誤差がある程度存在しても、 後述するように、 たとえば波面収差で 1 Ο πι λ以 下の極低収差の光学系を製造することができる。 したがって、 たとえば波面収差 で 1 Ο πι λ以下の極低収差の光学系を投影光学系として備えた本発明の露光装置 では、 高解像のもとで良好な露光を行うことができる。 さらに、 たとえば波面収 差で 1 Ο πι λ以下の極低収差の投影光学系を備えた露光装置を用いる本発明のマ ィク口デバイス製造方法では、 高解像で良好な露光条件のもとで良好なマイク口 デバイスを製造することができる。  As described above, in the method of manufacturing an optical system according to the present invention, by forming a thin film having a predetermined thickness distribution on the surface of a lens, or by forming the thin film distribution formed on the surface of the lens, By correcting, even if there is a certain degree of refractive index distribution or surface shape error in each lens, as described later, it is necessary to manufacture an optical system with extremely low aberration of 1 た と え ば πιλ or less due to wavefront aberration, for example. Can be. Therefore, for example, the exposure apparatus of the present invention including an optical system having an extremely low wavefront aberration of 1Οπιλ or less as a projection optical system can perform favorable exposure with high resolution. Furthermore, for example, in the method for manufacturing a micro-portal device of the present invention using an exposure apparatus having a projection optical system having an extremely low aberration of 1Οπιλ or less in terms of wavefront difference, high resolution and favorable exposure conditions are obtained. A good microphone opening device can be manufactured.

本発明の実施形態を、 添付図面に基づいて説明する。  An embodiment of the present invention will be described with reference to the accompanying drawings.

第 3図は、 本発明の各実施形態にかかる製造方法で製造された投影光学系を備 えた露光装置の構成を概略的に示す図である。 なお、 第 3図において、 投影光学 系の光軸 Α Χに平行に Ζ軸を、 光軸 Α Χに垂直な面内において第 3図の紙面に平 行に Υ軸を、 光軸 Α Χに垂直な面内において第 3図の紙面に垂直に X軸をそれぞ れ設定している。  FIG. 3 is a diagram schematically showing a configuration of an exposure apparatus having a projection optical system manufactured by a manufacturing method according to each embodiment of the present invention. In FIG. 3, the Ζ axis is parallel to the optical axis Α の of the projection optical system, the Υ axis is parallel to the plane of FIG. 3 in a plane perpendicular to the optical axis Α 、, and the Ζ axis is the optical axis Χ Χ. The X axis is set perpendicular to the plane of the paper in Fig. 3 in a vertical plane.

第 3図に示す露光装置は、 照明光 (露光光) を供給するための光源 2 1として、 たとえば K r Fエキシマレーザー光源 (波長 2 4 8 n m) を備えている。 光源 2 1から射出された光は、 照明光学系 2 2を介して、 所定のパターンが形成された マスク (レチクル) 2 3を照明する。 マスク 2 3は、 マスクホルダ 2 4を介して、 マスクステージ 2 5上において XY平面に平行に保持されている。 また、 マスク ステージ 2 5は、 図示を省略した駆動系の作用により、 マスク面 (すなわち X Y 平面) に沿って移動可能であり、 その位置座標はマスク干渉計 (不図示) によつ て計測され且つ位置制御されるように構成されている。 The exposure apparatus shown in FIG. 3 includes, for example, a KrF excimer laser light source (wavelength: 248 nm) as a light source 21 for supplying illumination light (exposure light). The light emitted from the light source 21 illuminates a mask (reticle) 23 on which a predetermined pattern is formed, via an illumination optical system 22. The mask 23 is held in parallel with the XY plane on a mask stage 25 via a mask holder 24. The mask stage 25 can be moved along the mask plane (that is, the XY plane) by the action of a drive system (not shown), and its position coordinates are determined by a mask interferometer (not shown). It is configured to be measured and controlled in position.

マスク 2 3に形成されたパターンからの光は、 投影 学系 2 6を介して、 感光 性基板であるウェハ 2 7上にマスクパターン像を形成する。 ウェハ 2 7は、 ゥェ ハテーブル (ウェハホルダ) 2 8を介して、 ウェハステージ 2 9上において X Y 平面に平行に保持されている。 また、 ウェハステージ 2 9は、 図示を省略した駆 動系の作用によりウェハ面 (すなわち X Y平面) に沿って移動可能であり、 その 位置座標はウェハ干渉計 (不図示) によって計測され且つ位置制御されるように 構成されている。 こうして、 投影光学系 2 6の光軸 A Xと直交する平面 (X Y平 面) 内においてウェハ 2 7を二次元的に駆動制御しながら一括露光またはスキヤ ン露光を行うことにより、 ウェハ 2 7の各露光領域にはマスク 2 3のパターンが 逐次露光される。  The light from the pattern formed on the mask 23 forms a mask pattern image on a wafer 27 as a photosensitive substrate via a projection system 26. The wafer 27 is held in parallel with the XY plane on a wafer stage 29 via a wafer table (wafer holder) 28. The wafer stage 29 can be moved along the wafer surface (that is, the XY plane) by the action of a drive system (not shown), and its position coordinates are measured by a wafer interferometer (not shown) and position control is performed. It is configured to be. In this manner, by performing batch exposure or scan exposure while controlling the wafer 27 two-dimensionally in a plane (XY plane) orthogonal to the optical axis AX of the projection optical system 26, each wafer 27 can be exposed. The pattern of the mask 23 is sequentially exposed on the exposure area.

第 4図は、 本発明の第 1実施形態にかかる製造方法の製造フローを示すフロー チャートである。 第 1実施形態の製造方法では、 各レンズを形成すべきブロック 硝材 (ブランクス) を製造した後、 製造されたブロック硝材の屈折率の絶対値お よび屈折率分布を、 たとえば第 5図に示す干渉計装置を用いて計測する (S 1 1 )。 第 5図では、 オイル 1 0 1が充填された試料ケース 1 0 2の中の所定位置 に被検物体であるブロック硝材 1 0 3を設置する。 そして、 制御系 1 0 4に制御 された干渉計ュニット 1 0 5からの射出光が、 フィゾーステージ 1 0 6 a上に支 持されたフィゾーフラット (フィゾー平面) 1 0 6に入射する。  FIG. 4 is a flowchart showing a manufacturing flow of the manufacturing method according to the first embodiment of the present invention. In the manufacturing method of the first embodiment, after manufacturing a block glass material (blanks) on which each lens is to be formed, the absolute value of the refractive index and the refractive index distribution of the manufactured block glass material are measured, for example, as shown in FIG. The measurement is performed using a measuring device (S11). In FIG. 5, a block glass material 103 as a test object is set at a predetermined position in a sample case 102 filled with oil 101. Then, light emitted from the interferometer unit 105 controlled by the control system 104 enters a Fizeau flat (Fizeau plane) 106 supported on a Fizeau stage 106a.

ここで、 フィゾーフラット 1 0 6で反射された光は参照光となり、 干渉計ュニ ット 1 0 5へ戻る。 一方、 フィゾーフラット 1 0 6を透過した光は測定光となり、 試料ケース 1 0 2内の被検物体 1 0 3に入射する。 被検物体 1 0 3を透過した光 は、 反射平面 1 0 7によって反射され、 被検物体 1 0 3およびフィゾーフラット 1 0 6を介して干渉計ュニット 1 0 5へ戻る。 こうして、 干渉計ュニット 1 0 5 へ戻った参照光と測定光との位相ずれに基づいて、 光学材料としての各プロック 硝材 1 0 3の屈折率分布による波面収差が計測される。 なお、 屈折率均質性の干 渉計による計測に関する詳細については、 たとえば特開平 8— 5 5 0 5号公報な どを参照することができる。 次いで、 第 1実施形態の製造方法では、 屈折率分布が計測されたブロック硝材 から必要に応じて研削されたブロック硝材を用いて、 投影光学系 2 6を構成すベ き各レンズを製造する。 すなわち、 周知の研磨工程にしたがって、 設計値を目標 として各レンズの表面を研磨加工する (S 1 2 )。 研磨工程では、 各レンズの面 形状の誤差を干渉計で計測しながら研磨を繰り返し、 各レンズの面形状を目標面 形状 (ベストフィット球面形状) に近づける。 こうして、 各レンズの面形状誤差 が所定の範囲に入ると、 各レンズの面形状の誤差を、 たとえば第 6図に示すさら に精密な干渉計装置を用いて計測する (S 1 3 )。 Here, the light reflected by the Fizeau flat 106 becomes reference light, and returns to the interferometer unit 105. On the other hand, the light transmitted through the Fizeau flat 106 becomes measurement light, and enters the test object 103 in the sample case 102. The light transmitted through the test object 103 is reflected by the reflection plane 107 and returns to the interferometer unit 105 via the test object 103 and the Fizeau flat 106. Thus, the wavefront aberration due to the refractive index distribution of each block glass material 103 as an optical material is measured based on the phase shift between the reference light and the measurement light returned to the interferometer unit 105. The details of the measurement of the refractive index homogeneity by an interferometer can be referred to, for example, JP-A-8-55505. Next, in the manufacturing method according to the first embodiment, each lens that constitutes the projection optical system 26 is manufactured using a block glass material that is ground as necessary from a block glass material whose refractive index distribution has been measured. That is, the surface of each lens is polished with a design value as a target according to a known polishing process (S12). In the polishing process, polishing is repeated while measuring the error in the surface shape of each lens with an interferometer to bring the surface shape of each lens closer to the target surface shape (best-fit spherical shape). Thus, when the surface shape error of each lens falls within a predetermined range, the surface shape error of each lens is measured using, for example, a more precise interferometer device shown in FIG. 6 (S13).

第 6図では、 制御系 1 1 1に制御された干渉計ュニット 1 1 2からの射出光が、 フィゾーステージ 1 1 3 a上に支持されたフィゾーレンズ 1 1 3に入射する。 こ こで、 フィゾーレンズ 1 1 3の参照面 (フィゾー面) で反射された光は参照光と なり、 干渉計ユニット 1 1 2へ戻る。 なお、 第 6図では、 フィゾーレンズ 1 1 3 を単レンズで示しているが、 実際のフィゾーレンズは複数のレンズ (レンズ群) で構成されている。 一方、 フィゾーレンズ 1 1 3を透過した光は測定光となり、 被検レンズ 1 1 4の被検光学面に入射する。  In FIG. 6, light emitted from the interferometer unit 112 controlled by the control system 111 enters the Fizeau lens 113 supported on the Fizeau stage 113a. Here, the light reflected by the reference surface (Fizeau surface) of the Fizeau lens 113 becomes reference light, and returns to the interferometer unit 112. In FIG. 6, the Fizeau lens 1 13 is shown as a single lens, but the actual Fizeau lens is composed of a plurality of lenses (lens groups). On the other hand, the light transmitted through the Fizeau lens 113 becomes measurement light, and is incident on the optical surface of the lens 114 to be measured.

被検レンズ 1 1 4の被検光学面で反射された測定光は、 フィゾーレンズ 1 1 3 を介して干渉計ユニット 1 1 2へ戻る。 こうして、 干渉計ユニット 1 1 2へ戻つ た参照光と測定光との位相ずれに基づいて、 被検レンズ 1 1 4の被検光学面の基 準面に対する波面収差が、 ひいては被検レンズ 1 1 4の面形状の誤差 (設計上の べス小フィット球面からのずれ) が計測される。 なお、 レンズの面形状誤差の干 渉計による計測に関する詳細については、 たとえば米国特許第 5 , 5 6 1 , 5 2 5号、 米国特許第 5 , 5 6 3 , 7 0 6号、 特開平 1 0— 1 5 4 6 5 7号公報など を参照することができる。 ここでは、 米国特許第 5, 5 6 1 , 5 2 5号、 米国特 許第 5 , 5 6 3 , 7 0 6号、 および特開平 1 0 _ 1 5 4 6 5 7号公報を参照とし て援用する。  The measurement light reflected by the test optical surface of the test lens 1 14 returns to the interferometer unit 1 12 via the Fizeau lens 1 13. In this way, based on the phase shift between the reference light and the measurement light returned to the interferometer unit 112, the wavefront aberration of the test optical surface of the test lens 114 with respect to the reference surface and, consequently, the test lens 1 The error of the surface shape (deviation from the best-fit small spherical surface in the design) in 14 is measured. For details on the measurement of the lens surface shape error using an interferometer, see, for example, US Pat. No. 5,561,525, US Pat. No. 5,563,706, and Reference can be made to Japanese Patent Publication No. 0—1 5 4 6 5 7. Here, reference is made to U.S. Pat. No. 5,561,525, U.S. Pat. No. 5,563,706, and Japanese Patent Application Laid-Open No. H10-156457. Invite.

次いで、 第 1実施形態の製造方法では、 面形状誤差が計測された各レンズに所 定の厚さ分布を有する反射防止膜を形成する (S 1 4 )。 第 7図は、 第 1実施形 態における反射防止膜形成工程のフローチャートである。 反射防止膜形成工程で は、 第 7図に示すように、 屈折率分布の計測工程 S 1 1で得られた光学材料の屈 折率分布情報と、 面形状誤差の計測工程 S 1 3で得られた各レンズの面形状誤差 情報とに基づいて、 各レンズで発生する波面誤差を算出する (S 1 1 1 )。 そし て、 波面誤差工程 S 1 1 1で得られた波面誤差発生量に基づいて、 この波面誤差 の発生を補正するのに必要な反射防止膜の厚さ分布を算出する (S 1 1 2 )。 こうして、 厚さ分布算出工程 S 1 1 2で得られた反射防止膜の厚さ分布に基づ いて、 各レンズの表面に所定の厚さ分布を有する反射防止膜を形成する (S 1 1 3 )。 このように、 従来技術では屈折率分布情報や面形状誤差情報とは無関係に 設計された光軸に関して回転対称な厚さ分布を有する反射防止膜を形成するが、 第 1実施形態では屈折率分布および面形状誤差情報に基づいて計算された所定の 厚さ分布を有する反射防止膜を形成する。 Next, in the manufacturing method of the first embodiment, an antireflection film having a predetermined thickness distribution is formed on each lens whose surface shape error has been measured (S14). FIG. 7 is a flowchart of an antireflection film forming step in the first embodiment. In the anti-reflection film forming process As shown in FIG. 7, the refractive index distribution information of the optical material obtained in the refractive index distribution measurement step S11 and the surface shape of each lens obtained in the surface shape error measurement step S13, as shown in FIG. The wavefront error generated in each lens is calculated based on the shape error information (S111). Then, based on the wavefront error generation amount obtained in the wavefront error process S111, the thickness distribution of the antireflection film required to correct the generation of the wavefront error is calculated (S112). . In this way, based on the thickness distribution of the antireflection film obtained in the thickness distribution calculating step S112, an antireflection film having a predetermined thickness distribution is formed on the surface of each lens (S113) ). Thus, in the prior art, an antireflection film having a thickness distribution that is rotationally symmetric with respect to the optical axis designed independently of the refractive index distribution information and the surface shape error information is formed. And forming an antireflection film having a predetermined thickness distribution calculated based on the surface shape error information.

以下、 各レンズの表面に対して所定の厚さ分布を有する反射防止膜を形成する 方法について説明する。 反射防止膜に所定の厚さ分布を付与する方法として、 2 つの方法が考えられる。 第 1の方法では、 屈折率分布情報および面形状誤差情報 を考慮して、 反射防止膜の形成時に最初から所定の厚さ分布を付与する。 一方、 第 2の方法では、 屈折率分布情報および面形状誤差情報を考慮することなく設計 上の厚さ分布を有する反射防止膜を形成する。 そして、 形成された反射防止膜の 厚さ分布を、 屈折率分布情報および面形状誤差情報を考慮して所定の厚さ分布に 補正する。 第 2の方法は、 たとえばイオンビーム加工により実現可能である。 第 8図は、 反射防止膜の形成時に所定の厚さ分布を付与する第 1の方法を説明 する図である。 第 8図では、 参照符号 5 1で示す外形を有するレンズの表面に、 等高線 5 2および 5 3で表されるような厚さ分布を有する反射防止膜を形成する 場合を考える。 ここで、 等高線 5 3で示す領域における反射防止膜の厚さが最も 大きく、 等高線 5 2で示す領域 (等高線 5 3で示す領域を除く) における反射防 止膜の厚さよりも厚さ補正最小単位量△だけ大きい。 また、 等高線 5 2で示す領 域 (等高線 5 3で示す領域を除く) における反射防止膜の厚さは、 他の領域 (等 高線 5 3および 5 2で示す領域を除く) における反射防止膜の厚さよりも厚さ補 正最小単位量 Δだけ大きい。 この場合、 反射防止膜の最も外側の層 (例えば 4 0 n mの膜厚を有する上層) を形成する工程において、 最後の 2△分の膜厚の形成に際して、 等高線 5 2で示 す形状と同じ形状の開口部を有するマスクをレンズ表面の直前に位置決めし、 こ のマスクを介して蒸着法やスパッタリング法にしたがって膜厚 Δ分を形成する。 次いで、 等高線 5 3で示す形状と同じ形状の開口部を有するマスクをレンズ表面 の直前に位置決めし、 このマスクを介して膜厚 Δ分を形成する。 ここで、 厚さ補 正最小単位量 Δを例えば 1 n mと仮定すると、 波長 2 4 8 n mの光に対して補正 可能な波面誤差の最小単位は約 2 ιη λとなる。 Hereinafter, a method of forming an antireflection film having a predetermined thickness distribution on the surface of each lens will be described. There are two methods for providing a predetermined thickness distribution to the antireflection film. In the first method, a predetermined thickness distribution is provided from the beginning when the antireflection film is formed in consideration of the refractive index distribution information and the surface shape error information. On the other hand, in the second method, an antireflection film having a designed thickness distribution is formed without considering the refractive index distribution information and the surface shape error information. Then, the thickness distribution of the formed antireflection film is corrected to a predetermined thickness distribution in consideration of the refractive index distribution information and the surface shape error information. The second method can be realized by, for example, ion beam processing. FIG. 8 is a view for explaining a first method for providing a predetermined thickness distribution when forming an anti-reflection film. In FIG. 8, a case is considered in which an antireflection film having a thickness distribution as represented by contour lines 52 and 53 is formed on the surface of a lens having an outer shape indicated by reference numeral 51. Here, the thickness of the anti-reflection film in the area indicated by the contour line 53 is the largest, and the thickness correction minimum unit is smaller than the thickness of the anti-reflection film in the area indicated by the contour line 52 (excluding the area indicated by the contour line 53). It is larger by the amount △. The thickness of the anti-reflection coating in the area indicated by the contour line 52 (excluding the area indicated by the contour line 53) is the thickness of the anti-reflection coating in other areas (excluding the area indicated by the contour lines 53 and 52). It is larger than the thickness by the thickness correction minimum unit amount Δ. In this case, in the process of forming the outermost layer of the anti-reflection film (for example, the upper layer having a thickness of 40 nm), when forming the final thickness of 2 mm, the shape shown by the contour line 52 is the same. A mask having an opening with a shape is positioned immediately before the lens surface, and a film thickness Δ is formed through the mask by an evaporation method or a sputtering method. Next, a mask having an opening having the same shape as the shape shown by the contour line 53 is positioned immediately before the lens surface, and a film thickness Δ is formed through this mask. Here, assuming that the thickness correction minimum unit amount Δ is, for example, 1 nm, the minimum unit of the wavefront error that can be corrected for light having a wavelength of 248 nm is about 2 ιηλ.

第 9図は、 一旦形成された反射防止膜の厚さ分布を所定の厚さ分布に補正する 第 2の方法に用いられるイオンビーム加工装置の構成を概略的に示す図である。 第 9図に示すイオンビーム加工装置は、 加工用レンズ 4 1を保持して二次元的に 移動可能なステージ 4 2と、 加工レンズ 4 1の表面 (厳密には反射防止膜の表 面) に膜厚加工用のイオンビーム 4 3を照射するイオンビーム加工装置本体 4 4 と、 ステージ 4 2を二次元的に移動させる駆動系 4 5と、 ステージ 4 2の移動お よびイオンビーム加工装置本体 4 4から照射されるイオンビーム 4 3のエネルギ —を制御する制御系 4 6と、 加工レンズ 4 1の膜厚加工に関する情報を入力する 入力系 4 7とを備えている。  FIG. 9 is a diagram schematically showing a configuration of an ion beam processing apparatus used in a second method for correcting the thickness distribution of the once formed antireflection film to a predetermined thickness distribution. The ion beam processing apparatus shown in FIG. 9 has a stage 42 that can move two-dimensionally while holding the processing lens 41, and a surface (strictly speaking, an antireflection film surface) of the processing lens 41. Ion beam processing device main body 4 4 for irradiating ion beam 4 3 for film thickness processing, drive system 45 for moving stage 42 two-dimensionally, movement of stage 42 and main body of ion beam processing device 4 It has a control system 46 for controlling the energy of the ion beam 43 irradiated from 4, and an input system 47 for inputting information on the film thickness processing of the processing lens 41.

そして、 制御系 4 6は、 入力系 4 7からの加工レンズ 4 1の膜厚加工に関する 情報に基づいて、 イオンビーム加工装置本体 4 4から照射されるイオンビーム 4 3のエネルギーおよびステージ 4 2の移動を制御して、 いわゆるイオンビーム加 ェにより加工レンズ 4 1の表面に形成された反射防止膜の厚さ分布を所定の厚さ 分布に補正する。 以上のように、 イオンビーム加工の場合は、 マスクを用いるこ となく膜厚の局所的な補正が可能である。 なお、 イオンビームとして希ガスのィ オン化したものを反射防止膜に低エネルギーで照射すると、 微小量の膜厚加工を 精度良く行うことができる。  Then, based on the information on the film thickness processing of the processing lens 41 from the input system 47, the control system 46 receives the energy of the ion beam 43 irradiated from the ion beam processing device main body 44 and the energy of the stage 42. By controlling the movement, the thickness distribution of the antireflection film formed on the surface of the processing lens 41 is corrected to a predetermined thickness distribution by so-called ion beam application. As described above, in the case of ion beam processing, local correction of the film thickness can be performed without using a mask. When the antireflection film is irradiated with an ion beam of a rare gas as an ion beam at low energy, a minute amount of film thickness processing can be performed with high accuracy.

第 1 0図は、 波長 2 4 8 n mの光に対して用いられる反射防止膜の膜厚補正量 と波面のずれ (波面の変化) と反射率との関係を示す図である。 なお、 第 1 0図 において、 横軸はレンズの片側の面に形成される反射防止膜の膜厚補正量 (n m) を、 左側の縦軸は波面のずれ (ηι λ ) を、 右側の縦軸は反射率 (%) をそれ ぞれ示している。 また、 第 1 0図において、 四角の点を結ぶ線は膜厚補正量と波 面のずれとの関係を示し、 三角の点を結ぶ線は膜厚補正量と反射率との関係を示 している。 第 1 0図を参照すると、 膜厚補正による反射率の増加を 0 . 1 %まで 許容すれば、 1 Ο πι λの波面誤差まで補正可能であることがわかる。 また、 レン ズの両側の面に形成される反射防止膜においてそれぞれ膜厚補正すれば、 更に大 きな波面誤差の補正も可能である。 FIG. 10 is a diagram showing the relationship between the film thickness correction amount of the antireflection film used for light having a wavelength of 248 nm, the shift of the wavefront (change of the wavefront), and the reflectance. In FIG. 10, the horizontal axis represents the thickness correction amount (n) of the anti-reflection film formed on one surface of the lens. m), the vertical axis on the left shows the wavefront deviation (ηιλ), and the vertical axis on the right shows the reflectance (%). In FIG. 10, the line connecting the square points shows the relationship between the film thickness correction amount and the deviation of the wavefront, and the line connecting the triangle points shows the relationship between the film thickness correction amount and the reflectance. ing. Referring to FIG. 10, it can be seen that if the increase in reflectivity due to the film thickness correction is allowed up to 0.1%, the wavefront error of 1Οπιλ can be corrected. Further, by correcting the film thickness of each of the antireflection films formed on both surfaces of the lens, it is possible to correct even larger wavefront errors.

再び第 4図を参照すると、 第 1実施形態の製造方法では、 必要に応じて所定の 厚さ分布を有する反射膜防止膜が形成された複数のレンズを用いて投影光学系 2 6を組み立てる (S 1 5 )。 具体的には、 設計にしたがって複数のレンズを所定 の保持枠で保持することにより、 各光学ユニットを順次組み上げる。 そして、 組 み上げた複数の光学ユニットを、 鏡筒の上部開口を介して、 鏡筒内に順次落とし 込む。 このとき、 各光学ユニットの間には、 所定のヮッシャを介在させる。 こう して、 鏡筒内に最初に落とし込まれた光学ュニットが鏡筒の一端に形成された突 出部においてヮッシャを介して支持され、 すべての光学ュニットが鏡筒内に収容 されることにより、 投影光学系の組立が終了する。 なお、 投影光学系の組立に関 する詳細については、 たとえば特開平 1 0— 1 5 4 6 5 7号公報などを参照する ことができる。  Referring to FIG. 4 again, in the manufacturing method of the first embodiment, the projection optical system 26 is assembled using a plurality of lenses on which a reflection preventing film having a predetermined thickness distribution is formed as necessary. S15). Specifically, by holding a plurality of lenses in a predetermined holding frame according to the design, each optical unit is assembled sequentially. Then, the assembled optical units are sequentially dropped into the lens barrel through the upper opening of the lens barrel. At this time, a predetermined washer is interposed between the optical units. In this way, the optical unit first dropped into the lens barrel is supported via a pusher at the protrusion formed at one end of the lens barrel, and all the optical units are accommodated in the lens barrel. The assembly of the projection optical system is completed. For details regarding the assembly of the projection optical system, reference can be made, for example, to Japanese Patent Application Laid-Open No. H10-154657.

次いで、 第 1実施形態の製造方法では、 実際に組み立てられた投影光学系の波 面収差を測定する (S 1 6 )。 具体的には、 たとえば米国特許第 5, 8 9 8 , 5 0 1号公報に開示されたフィゾー干渉計方式の波面収差測定機を用いて、 K r F エキシマレーザ光源を使用する投影光学系の波面収差を測定することができる。 この場合、 第 1 1図に示すように、 露光光とほぼ同じ波長を有するレーザ光 (た とえば A rレーザ光の第 2高調波) を、 ハーフプリズム 6 0およびフィゾーレン ズ 6 1のフィゾー面 6 1 aを介して、 被検光学系としての投影光学系 2 6に入射 させる。 このとき、 フィゾー面 6 1 aで反射された光は、 いわゆる参照光となり、 フィゾーレンズ 6 1およびハーフプリズム 6 0を介して、 C C Dのような撮像素 子 6 2に達する。 一方、 フィゾー面 61 aを透過した光は、 いわゆる測定光となり、 投影光学系 26を介して、 反射球面 63に入射する。 反射球面 63で反射された測定光は、 投影光学系 26、 フィゾーレンズ 61およびハーフプリズム 60を介して、 CC D 62に達する。 こうして、 参照光と測定光との干渉に基づいて、 投影光学系 2 6に残存する波面収差が測定される。 同様に、 たとえば米国特許第 5, 898, 501号公報に開示されたフィゾー干渉計方式の波面収差測定機を用いて、 超高 圧水銀ランプ (たとえば i線) を使用する投影光学系の波面収差を測定すること もできる。 ここでは、 米国特許第 5, 898, 501号公報を参照として援用す る。 Next, in the manufacturing method according to the first embodiment, the wavefront aberration of the actually assembled projection optical system is measured (S16). Specifically, for example, a projection optical system using a KrF excimer laser light source using a Fizeau interferometer type wavefront aberration measuring device disclosed in US Pat. No. 5,898,501 is disclosed. Wavefront aberration can be measured. In this case, as shown in FIG. 11, laser light having substantially the same wavelength as the exposure light (for example, the second harmonic of the Ar laser light) is applied to the Fizeau surfaces of the half prism 60 and Fizenlens 61. The light enters the projection optical system 26 as the test optical system via 6a. At this time, the light reflected by the Fizeau surface 61 a becomes so-called reference light, and reaches the imaging device 62 such as a CCD via the Fizeau lens 61 and the half prism 60. On the other hand, the light transmitted through the Fizeau surface 61 a becomes so-called measurement light, and enters the reflective spherical surface 63 via the projection optical system 26. The measurement light reflected by the reflective spherical surface 63 reaches the CCD 62 via the projection optical system 26, the Fizeau lens 61 and the half prism 60. Thus, the wavefront aberration remaining in the projection optical system 26 is measured based on the interference between the reference light and the measurement light. Similarly, the wavefront aberration of a projection optical system using an ultra-high pressure mercury lamp (eg, i-line) is measured using a Fizeau interferometer type wavefront aberration measuring device disclosed in, for example, US Pat. No. 5,898,501. Can also be measured. Here, U.S. Pat. No. 5,898,501 is incorporated by reference.

また、 たとえば特開 2000- 97616号公報に開示された、 いわゆる PD I (Phase Diffraction Interferometer:位相回折干渉計) 方式の波面収差測定 機を用いて、 A r Fエキシマレ一ザ光源を使用する投影光学系の波面収差を測定 することもできる。 ここでは、 特開 2000— 976 16号公報を参照として援 用する。 この場合、 第 12図に示すように、 光源 21 (第 12図では不図示) か ら射出されて照明光学系 22を介した露光用照明光が、 マスク設定位置に位置決 めされた第 1のピンホール 71に入射する。 第 1のピンホール 7 1を介して形成 された球面波は、 被検光学系としての投影光学系 26を透過して、 グレーティン グ (一次元回折格子) 72に入射する。  Also, for example, a projection optical system using an ArF excimer laser light source using a so-called PDI (Phase Diffraction Interferometer) type wavefront aberration measuring device disclosed in JP-A-2000-97616. It is also possible to measure the wavefront aberration of the system. Here, JP-A-2000-97616 is incorporated by reference. In this case, as shown in FIG. 12, the illumination light for exposure emitted from the light source 21 (not shown in FIG. 12) and passed through the illumination optical system 22 is moved to the first position which is positioned at the mask setting position. Incident on the pinhole 71 of. The spherical wave formed via the first pinhole 71 is transmitted through the projection optical system 26 as an optical system to be measured, and is incident on a grating (one-dimensional diffraction grating) 72.

グレーティング 72をそのまま透過した 0次回折光は、 マスク 73に形成され た第 2のピンホール (不図示) に入射する。 一方、 ダレ一ティング 72で回折作 用を受けて発生した 1次回折光は、 マスク 73に形成された開口部 (不図示) の ほぼ中央に入射する。 第 2のピンホールを介した 0次回折光および開口部を通過 した 1次回折光は、 コリメ一夕レンズ 74を介して、 CCDのような撮像素子 7 5に達する。 こうして、 第 2のピンホールを介して形成された球面波を参照波面 とし、 開口部を通過した 1次回折光の波面を測定波面とし、 参照波面と測定波面 との干渉に基づいて投影光学系 26に残存する波面収差が測定される。  The zero-order diffracted light transmitted through the grating 72 as it is enters a second pinhole (not shown) formed in the mask 73. On the other hand, the first-order diffracted light generated by the diffraction action in the drayring 72 is incident on almost the center of an opening (not shown) formed in the mask 73. The 0th-order diffracted light passing through the second pinhole and the 1st-order diffracted light passing through the opening reach the imaging device 75 such as a CCD via the collimating lens 74. Thus, the spherical wave formed via the second pinhole is used as the reference wavefront, the wavefront of the first-order diffracted light that has passed through the opening is used as the measurement wavefront, and the projection optical system 26 is used based on the interference between the reference wavefront and the measurement wavefront. Is measured.

次いで、 第 1実施形態の製造方法では、 収差測定工程 S 16で測定した投影光 学系の波面収差が許容範囲内に収まっているか否かを判定する (S 17)。 判定 工程 S 17において投影光学系の波面収差が許容範囲内に収まっていると判定し た場合 (第 4図中 YESの場合)、 第 1実施形態にしたがう投影光学系の製造が 終了する。 一方、 判定工程 S 17において投影光学系の波面収差が許容範囲内に 収まっていないと判定した場合 (第 4図中 NOの場合)、 レンズを光軸 AXに沿 つて移動させてレンズ間の間隔を変化させる間隔調整や、 レンズを光軸 AXに対 して垂直にシフトさせたりチルトさせたりする偏芯調整を行う (S 18)。 Next, in the manufacturing method of the first embodiment, it is determined whether or not the wavefront aberration of the projection optical system measured in the aberration measurement step S16 falls within an allowable range (S17). Judgment If it is determined in step S17 that the wavefront aberration of the projection optical system is within the allowable range (YES in FIG. 4), the manufacture of the projection optical system according to the first embodiment ends. On the other hand, if it is determined in the determination step S17 that the wavefront aberration of the projection optical system is not within the allowable range (in the case of NO in FIG. 4), the lens is moved along the optical axis AX and the distance between the lenses is reduced. Adjust the interval to change the angle, and adjust the eccentricity by shifting or tilting the lens perpendicular to the optical axis AX (S18).

第 13図は、 間隔調整や偏芯調整が可能に構成された投影光学系の内部構成を 概略的に示す図である。 また、 第 14図は、 第 13図の投影光学系における複数 の部分鏡筒のうちの 1つの部分鏡筒の構成を示す上面図である。 なお、 第 13図 および第 14図においては、 第 3図に対応する共通の XYZ座標系を採用してい る。 第 13図に示すように、 鏡筒 30は複数の分割鏡筒 30 a〜30 1を備えて おり、 フランジ 31を介して、 図示なき露光装置のフレームに支持されている。 これら複数の分割鏡筒 30 a〜30 1は、 光軸 AX方向に積層されている。 そし て、 複数の分割鏡筒 30 a〜30 1のうち、 分割鏡筒 30 b, 30 d, 30 e, 30 f, 30 gにより支持されているレンズ 2 b, 2 d, 2 e, 2 f , 2 gは、 光軸方向 (Z方向) に移動可能で且つ XY方向を軸としてチル卜可能な可動レン ズとなっている。  FIG. 13 is a diagram schematically showing an internal configuration of a projection optical system configured to be capable of adjusting an interval and an eccentricity. FIG. 14 is a top view showing the configuration of one of the partial barrels in the projection optical system of FIG. 13 and 14 employ a common XYZ coordinate system corresponding to FIG. As shown in FIG. 13, the lens barrel 30 includes a plurality of split lens barrels 30 a to 301, and is supported by a frame of an exposure apparatus (not shown) via a flange 31. The plurality of split lens barrels 30a to 301 are stacked in the optical axis AX direction. The lenses 2b, 2d, 2e, and 2f supported by the divided lens barrels 30b, 30d, 30e, 30f, and 30g among the plurality of divided lens barrels 30a to 301, respectively. , 2g are movable lenses that can move in the optical axis direction (Z direction) and can be tilted about the XY direction.

可動レンズ 2 b, 2 d, 2 e, 2 f , 2 gを保持している分割鏡筒 30 b, 3 0 d, 30 e, 30 f , 30 gの構成について、 分割鏡筒 30 bの構成を代表さ せて説明する。 なお、 他の分割鏡筒 30 d, 30 e, 30 f , 30 gの構成につ いては、 分割鏡筒 30 bの構成とほぼ同様であるため、 ここでは説明を省略する。 分割鏡筒 3 O bは、 当該分割鏡筒 3 O bの上下 (Z方向) に位置する分割鏡筒 3 0 a, 30 cと接続される外側環 37 bと、 可動レンズ 2 bを保持するレンズ室 38 bとを備えている。 このレンズ室 38 bは、 外側環 37 bに対して光軸方向 About the configuration of the split lens barrel 30 b, 30 d, 30 e, 30 f, 30 g holding the movable lens 2 b, 2 d, 2 e, 2 f, 2 g, the configuration of the split lens barrel 30 b This will be explained as a representative. The configuration of the other divided lens barrels 30d, 30e, 30f, and 30g is substantially the same as the configuration of the divided lens barrel 30b, and thus the description thereof is omitted. The split lens barrel 3Ob holds an outer ring 37b connected to split lens barrels 30a and 30c located above and below (in the Z direction) the split lens barrel 3Ob, and a movable lens 2b. The lens room 38b is provided. This lens chamber 38b is in the optical axis direction with respect to the outer ring 37b.

(Z方向) に移動可能で且つ XY方向を軸としてチルト可能となるように、 外側 環 37 bに連結されている。 また、 分割鏡筒 30 bは、 外側環 37bに取り付け られたァクチユエ一タ 32 bを備えている。 このァクチユエ一夕 32 bとしては、 例えば圧電素子を適用することができる。 ァクチユエ一夕 32 bは、 例えば弾性 ヒンジから構成される変位拡大機構としてのリンク機構を介してレンズ室 38 b を駆動する。 このァクチユエ一タ 32 bは、 分割鏡筒 30 bの 3箇所に取り付け られており、 これにより、 レンズ室 38 bの 3箇所が独立に光軸方向 (Z方向) へ移動する。 It is connected to the outer ring 37b so as to be movable in the (Z direction) and tiltable about the XY direction. Further, the split lens barrel 30b has an actuator 32b attached to the outer ring 37b. As the actuator 32b, for example, a piezoelectric element can be used. For example, the actuary 32b is elastic The lens chamber 38b is driven via a link mechanism as a displacement magnifying mechanism constituted by a hinge. The actuator 32b is attached to three places of the split lens barrel 30b, whereby the three places of the lens chamber 38b move independently in the optical axis direction (Z direction).

第 14図を参照してさらに詳述する。 第 14図において、 レンズ 2の周縁には、 3つの鍔部 201〜203が XY平面内における方位角 120° ごとに設けられ ている。 そして、 レンズ室 38は、 クランプ部 381〜383を備えており、 こ れらがレンズ 2の 3つの鍔部 201〜203を保持している。 そして、 レンズ室 38は、 XY平面内における方位角 120° ごとの駆動点 D P 1〜D P 3の位置 で、 リンク機構を介して 3つのァクチユエ一夕 (不図示) により Z方向に沿って 独立に駆動される。 ここで、 3つのァクチユエ一夕による Z方向の駆動量が同じ 量である場合は、 レンズ室 38は外側環 37に対し Z方向 (光軸方向) へ移動す ることとなり、 3つのァクチユエ一夕による Z方向の駆動量が異なる量である場 合は、 レンズ室 38は外側環 37に対し XY方向を軸として傾くこととなる。 な お、 3つのァクチユエ一夕による Z方向の駆動量が異なる量である場合には、 レ ンズ室 38が外側環 37に対し Z方向 (光軸方向) へ移動することもあり得る。 さて、 第 13図に戻って、 分割鏡筒 3 O bは、 外側環 37 bに取り付けられて、 例えば光学式エンコーダからなる駆動量計測部 39 bを備えている。 この駆動量 計測部 39 bは、 第 14図に示した方位角 120° ごとの 3つの計測点 MP 1〜 MP 3の位置における外側環 37 bに対するレンズ室 38の Z方向 (光軸方向) の移動量を計測する。 従って、 ァクチユエ一夕 32 b及び駆動量計測部 39 に より、 レンズ室 38の移動、 ひいてはレンズ 2 bの移動をクローズドループで制 御することができる。  This will be described in more detail with reference to FIG. In FIG. 14, on the periphery of the lens 2, three flange portions 201 to 203 are provided at every azimuth angle of 120 ° in the XY plane. The lens chamber 38 includes clamp portions 381 to 383, which hold three flange portions 201 to 203 of the lens 2. Then, the lens chamber 38 is independently driven along the Z direction by three actuators (not shown) via link mechanisms at the positions of the driving points DP1 to DP3 at every azimuth angle of 120 ° in the XY plane. Driven. Here, if the driving amounts in the Z direction by the three actuators are the same, the lens chamber 38 moves in the Z direction (optical axis direction) with respect to the outer ring 37, and the three actuators are moved together. When the driving amount in the Z direction is different, the lens chamber 38 is inclined with respect to the outer ring 37 about the XY direction. If the driving amount in the Z direction by the three actuators is different, the lens chamber 38 may move in the Z direction (optical axis direction) with respect to the outer ring 37. Returning to FIG. 13, the split lens barrel 3 Ob is attached to the outer ring 37b and includes a drive amount measuring unit 39b composed of, for example, an optical encoder. The driving amount measuring section 39b is arranged in the Z direction (optical axis direction) of the lens chamber 38 with respect to the outer ring 37b at the positions of the three measuring points MP1 to MP3 at azimuth angles of 120 ° shown in FIG. Measure the amount of movement. Therefore, the movement of the lens chamber 38 and, consequently, the movement of the lens 2b can be controlled in a closed loop by the actuator 32b and the drive amount measuring unit 39.

さて、 分割鏡筒 30 a〜30 1のうち、 分割鏡筒 30 a, 30 c, 30 h, 3 0 i , 30 j , 30 k, 30 1により支持されているレンズ 2 a, 2 c, 2 h, 2 i, 2 j , 2 k, 2 1は、 固定レンズとなっている。 これらの固定レンズ 2 a, 2 c, 2 h, 2 i , 2 j , 2 k, 2 1を保持している分割鏡筒 30 a, 30 c, 30 h, 30 i , 30 j , 30 k, 30 1の構成について、 分割鏡筒 30 cの構 成を代表させて説明する。 なお、 他の分割鏡筒 3 0 a , 3 0 h , 3 0 i, 3 0 j , 3 0 k , 3 0 1の構成については、 分割鏡筒 3 0 cの構成とほぼ同様であるため、 ここでは説明を省略する。 分割鏡筒 3 0 cは、 当該分割鏡筒 3 0 cの上下 (Z方 向) に位置する分割鏡筒 3 0 b , 3 0 dと接続される外側環 3 7 cと、 当該外側 環 3 7 cに取り付けられてレンズ 2 cを保持するレンズ室 3 8 cとを備えている。 なお、 ァクチユエ一夕 3 2として、 高精度、 低発熱、 高剛性及び高クリーン度 の圧電素子を使用して、 この圧電素子の駆動力を弹性ヒンジからなるリンク機構 により拡大させる構成としているため、 圧電素子自体のコンパクト化を図れる利 点がある。 なお、 ァクチユエ一夕 3 2を圧電素子で構成する代わりに、 磁歪ァク チユエ一夕や流体圧ァクチユエ一夕で構成しても良い。 上述の説明では、 レンズ を光軸 A Xに沿って移動させる移動調整 (間隔調整) およびレンズを光軸 A Xに 対して傾斜させるチルト調整に限定したが、 同様に周知の構成にしたがって、 光 軸 A Xに対して垂直な方向に沿ってレンズをシフトさせるシフト調整を行うこと もできる。 Now, among the divided lens barrels 30a to 301, lenses 2a, 2c, 2 supported by the divided lens barrels 30a, 30c, 30h, 30i, 30j, 30k, 301 h, 2i, 2j, 2k, 21 are fixed lenses. The divided lens barrels 30a, 30c, 30h, 30i, 30j, 30k, which hold these fixed lenses 2a, 2c, 2h, 2i, 2j, 2k, 21 30 Regarding the configuration of 1, the configuration of the split lens barrel 30c The following is a description of the configuration. Note that the configuration of the other divided barrels 30a, 30h, 30i, 30j, 30k, 301 is almost the same as the configuration of the divided barrel 30c. Here, the description is omitted. The split lens barrel 30c includes an outer ring 37c connected to split lens barrels 30b and 30d located above and below (in the Z direction) the split lens barrel 30c, and an outer ring 3c. A lens chamber 38c attached to 7c and holding a lens 2c. In addition, since the actuators are made of high-precision, low-heat, high-rigidity, and high-cleanliness piezoelectric elements, the driving force of these piezoelectric elements is expanded by a link mechanism consisting of a natural hinge. There is an advantage that the piezoelectric element itself can be made compact. It should be noted that the actuating unit 32 may be constituted by a magnetostrictive unit or a fluid pressure unit instead of being constituted by a piezoelectric element. In the above description, the movement adjustment (interval adjustment) for moving the lens along the optical axis AX and the tilt adjustment for tilting the lens with respect to the optical axis AX are limited. It is also possible to perform a shift adjustment for shifting the lens along a direction perpendicular to the lens.

第 1実施形態の製造方法では、 間隔調整や偏芯調整によりレンズ調整された投 影光学系の波面収差を再び測定する (S 1 6 )。 そして、 収差測定工程 S 1 6で 再び測定した投影光学系の波面収差が許容範囲内に収まっているか否かを再度判 定する (S 1 7 )。 判定工程 S 1 7において投影光学系の波面収差が許容範囲内 に収まっていると判定した楊合には、 投影光学系の製造が終了する。 しかしなが ら、 判定工程 S 1 7において投影光学系の波面収差が許容範囲内に収まっていな いと判定した場合には、 判定工程 S 1 7において Y E Sの判定が得られるまで、 レンズ調整工程 S 1 8および収差測定工程 S 1 6をさらに繰り返す。  In the manufacturing method of the first embodiment, the wavefront aberration of the projection optical system whose lens has been adjusted by adjusting the distance or the eccentricity is measured again (S16). Then, it is determined again whether or not the wavefront aberration of the projection optical system measured again in the aberration measurement step S16 falls within an allowable range (S17). If it is determined in the determination step S17 that the wavefront aberration of the projection optical system falls within the allowable range, the production of the projection optical system ends. However, if it is determined in the determination step S 17 that the wavefront aberration of the projection optical system is not within the allowable range, the lens adjustment step S 17 is performed until a determination of YES is obtained in the determination step S 17. 18 and the aberration measurement step S 16 are further repeated.

なお、 第 1実施形態の製造方法では、 投影光学系 2 6を構成すべき各レンズを それぞれ多数個製造し、 製造された多数のレンズから選択したレンズを組み合わ せて投影光学系を組み立てることもできる。 この場合、 組立工程 S 1 5に先立つ て、 投影光学系 2 6を構成すべき複数のレンズを製造する (レンズ製造工程)。 次いで、 製造された複数のレンズの形状に関する情報、 たとえば各レンズの加工 面の曲率半径や各レンズの中心厚などを計測する (レンズ形状計測工程)。 そし て、 レンズ形状の計測された複数のレンズから投影光学系 26を構成すべき複数 のレンズを、 たとえばランダムに選択する (選択工程)。 In the manufacturing method of the first embodiment, it is also possible to manufacture a large number of each lens constituting the projection optical system 26 and assemble the projection optical system by combining lenses selected from the manufactured many lenses. it can. In this case, prior to the assembling step S15, a plurality of lenses that constitute the projection optical system 26 are manufactured (lens manufacturing step). Next, information on the shape of the plurality of manufactured lenses, such as the radius of curvature of the processed surface of each lens and the center thickness of each lens, is measured (lens shape measurement step). Soshi Then, a plurality of lenses to constitute the projection optical system 26 are selected, for example, at random from the plurality of lenses whose lens shapes have been measured (selection step).

こうして、 選択された複数のレンズの形状に関する計測情報に基づいて、 仮想 的に組み立てた投影光学系の光学性能を予測評価する (予測評価工程)。 そして、 予測される投影光学系の光学性能が許容できる複数のレンズの最適な組み合わせ が決定されるまで、 選択工程と予測評価工程とを繰り返す (繰り返し工程)。 以 上のように、 レンズの屈折率分布情報および面形状誤差情報に加えて、 各レンズ の加工面の曲率半径や各レンズの中心厚などの実測デ一夕に基づいて、 レンズを 仮想的に組み合わせて得られる投影光学系で発生する収差を予測評価し、 仮想的 な投影光学系で発生する収差が比較的小さくなるように、 予測評価結果に基づい て選択されたレンズを組み合わせて投影光学系を構成することが好ましい。 この 仮想的な組み合わせにより多数のレンズから投影光学系を構成すべき複数のレン ズを最終的に選択する方法の詳細については、 たとえば特開 2000-2499 17号公報およびこれに対応する米国特許出願第 09Z691, 194号 (20 00年 10月 19日出願) などを参照することができる。 ここでは、 2000年 10月 1 9日に米国出願された米国特許出願第 09Z691, 194号を参照と して援用する。  In this way, the optical performance of the virtually assembled projection optical system is predicted and evaluated based on the measurement information on the shapes of the selected plurality of lenses (prediction evaluation step). Then, the selection step and the prediction evaluation step are repeated until the optimum combination of a plurality of lenses that allows the predicted optical performance of the projection optical system is determined (iteration step). As described above, in addition to the refractive index distribution information of the lens and the surface shape error information, the lens is virtually created based on the actual measurement data such as the radius of curvature of the processed surface of each lens and the center thickness of each lens. The projection optical system is predicted and evaluated for the aberration generated by the projection optical system obtained by combining the projection optical system, and the projection optical system is combined with the lens selected based on the prediction evaluation result so that the aberration generated by the virtual projection optical system is relatively small. It is preferable to configure For details of a method of finally selecting a plurality of lenses to constitute a projection optical system from a large number of lenses by this virtual combination, see, for example, Japanese Patent Application Laid-Open No. 2000-249917 and a corresponding US patent application. No. 09Z691, 194 (filed on Oct. 19, 2000) can be referred to. No. 09Z691, 194, filed Oct. 19, 2000, is hereby incorporated by reference.

以下、 研削 ·研磨された後のレンズ加工面の曲率半径を計測する手法について 簡単に説明する。 レンズ加工面の曲率半径は、 特開平 5— 272944号、 特開 平 6— 129836号、 および特開平 6— 174451号公報などに開示されて いるように、 ニュートンゲージを用いて計測することができる。 この場合、 被検 レンズの被検面をニュートンゲージのゲージ面 (曲率半径が既知) に重ね合わせ、 一定波長の光源下で観測されるニュートン干渉縞の本数から所定の演算式に基づ いて被検面の曲率半径を求める。 ここでは、 特開平 5— 272944号、 特開平 6— 129836号、 および特開平 6— 174451号公報を参照として援用す る。  Hereinafter, a method of measuring the radius of curvature of the lens processing surface after grinding and polishing will be briefly described. The radius of curvature of the lens processing surface can be measured using a Newton gauge as disclosed in JP-A-5-272944, JP-A-6-129836, and JP-A-6-174451. . In this case, the test surface of the test lens is superimposed on the gauge surface of the Newton gauge (the radius of curvature is known), and the test object is obtained from the number of Newton interference fringes observed under a light source of a constant wavelength based on a predetermined arithmetic expression. Find the radius of curvature of the test surface. Here, JP-A-5-272944, JP-A-6-129836, and JP-A-6-174451 are incorporated by reference.

また、 レンズ加工面の曲率半径は、 特開平 5— 340734号、 特開平 5— 3 40735号、 および特開平 5— 346315号公報などに開示されているよう に、 レ一ザ干渉計方式で計測することができる。 この場合、 被検レンズの被検面 とほぼ同一で且つ既知の曲率半径を有するマスターレンズの基準ゲージ面と干渉 計の基準参照面との間の干渉に基づいて装置のァライメントを行う。 そして、 こ のァライメント状態においてマスタ一レンズに代えて被検レンズを設置し、 干渉 計測により基準ゲージ面に対する被検面の曲率半径差を、 ひいては被検レンズの 被検面の曲率半径の絶対値を求める。 ここでは、 特開平 5— 3 4 0 7 3 4号、 特 開平 5— 3 4 0 7 3 5号、 および特開平 5— 3 4 6 3 1 5号公報を参照として援 用する。 The radius of curvature of the lens processing surface is disclosed in JP-A-5-340734, JP-A-5-340735, JP-A-5-346315 and the like. In addition, it can be measured by a laser interferometer method. In this case, the alignment of the apparatus is performed based on the interference between the reference gauge surface of the master lens and the reference gauge surface of the interferometer, which is substantially the same as the surface to be measured of the lens to be measured and has a known radius of curvature. In this alignment state, the test lens is installed in place of the master lens, and the difference between the radius of curvature of the test surface with respect to the reference gauge surface by interference measurement, and the absolute value of the radius of curvature of the test surface of the test lens is measured. Ask for. Here, JP-A-5-340734, JP-A-5-340735, and JP-A-5-346315 are incorporated by reference.

次に、 研削 ·研磨された後のレンズの中心厚の計測手法について簡単に説明す る。 第 1 5図は、 マイケルソン型干渉計を利用したレンズ中心厚測定機の構成を 概略的に示す図である。 第 1 5図において、 レンズ中心厚測定機としての間隔測 定装置は、 所定波長の測定光を出射する光源 1 2 1と、 光学系 1 2 2と、 ハーフ ミラ一 1 2 3とを備えている。 光学系 1 2 2は、 図示しないピンホール及びコリ メートレンズ等からなり、 光源 1 2 1から出射された測定光を平行光束にして八 —フミラ一 1 2 3に入射させる。 ハーフミラ一 1 2 3は、 入射光束の一部を反射 し、 残りを透過させる機能を有する。 これにより、 光源 1 2 1側から入射した光 束の一部が、 間隔測定の対象であるレンズ素子 1 2 4側へ反射され、 残りの光束 が反射ミラ一 1 2 5側へ透過する。  Next, a method of measuring the center thickness of the lens after grinding and polishing will be briefly described. FIG. 15 is a diagram schematically showing a configuration of a lens center thickness measuring device using a Michelson interferometer. In FIG. 15, the distance measuring device as a lens center thickness measuring device includes a light source 121 that emits measuring light of a predetermined wavelength, an optical system 122, and a half mirror 123. I have. The optical system 122 includes a pinhole, a collimator lens, and the like (not shown), and converts the measurement light emitted from the light source 122 into a parallel light beam to be incident on the optical mirror 123. The half mirror 123 has a function of reflecting a part of the incident light beam and transmitting the rest. As a result, a part of the light beam incident from the light source 121 side is reflected to the lens element 124 side to be subjected to the distance measurement, and the remaining light beam is transmitted to the reflection mirror 125 side.

レンズ素子 1 2 4側に反射された光束に対して、 レンズ素子 1 2 4のハーフミ ラー 1 2 3側の表面及び該レンズ素子 1 2 4の裏面は、 それぞれ反射面 1 2 4 a および 1 2 4 bとなっている。 反射ミラー 1 2 5は、 図示しない移動ステージに 取り付けられ、 該移動ステージとともに第 1 5図中の矢印の方向に移動可能にな つている。 反射ミラー 1 2 5は、 ハ一フミラ一 1 2 3を透過した光束を反射して ハーフミラー 1 2 3に戻す。  For the light beam reflected on the lens element 124 side, the surface of the lens element 124 on the half-mirror 123 side and the back surface of the lens element 124 are respectively reflective surfaces 122a and 122. 4 b. The reflection mirror 125 is attached to a moving stage (not shown), and is movable together with the moving stage in the direction of the arrow in FIG. The reflecting mirror 125 reflects the light beam transmitted through the half mirror 123 and returns it to the half mirror 123.

レンズ素子 1 2 4で反射した光束は、 計測光としてハーフミラ一1 2 3を透過 して受光素子 1 2 6に入射する。 一方、 反射ミラー 1 2 5で反射した光束は、 参 照光としてハーフミラ— 1 2 3で反射されて、 該受光素子 1 2 6に到る。 これら の計測光と参照光とは、 受光素子 1 2 6上で干渉する。 そして、 受光素子 1 2 6 により、 干渉光が光電変換され、 干渉信号として外部に出力される。 The light beam reflected by the lens element 124 passes through the half mirror 123 as measurement light and enters the light receiving element 126. On the other hand, the light beam reflected by the reflection mirror 125 is reflected by the half mirror 123 as reference light, and reaches the light receiving element 126. The measurement light and the reference light interfere on the light receiving element 126. And the light receiving element 1 2 6 As a result, the interference light is photoelectrically converted and output to the outside as an interference signal.

第 1 6図は、 測定する間隔 (レンズ中心厚) よりも可干渉距離が十分に小さい 光を供給する光源 1 2 1を使用したときの受光素子 1 2 6に入射する干渉光の強 度と反射ミラー 1 2 5の位置との関係を示す図である。 ここで、 計測光がハーフ ミラ一 1 2 3で分離され、 レンズ素子 1 2 4の反射面 1 2 4 aで反射され、 再び ハーフミラー 1 2 3に到る光路の光路長を A 1とする。 また、 計測光がハーフミ ラー 1 2 3で分離され、 レンズ素子 1 2 4の反射面 1 2 4 bで反射され、 再びハ ーフミラ一 1 2 3に到る光路の光路長を A 2とする。 そして、 参照光がハーフミ ラー 1 2 3で分離され、 反射ミラー 1 2 5で反射され、 再びハーフミラー 1 2 3 に到る光路の光路長を Bとする。  Fig. 16 shows the intensity of the interfering light incident on the light receiving element 1 26 when using a light source 1 2 1 that supplies light whose coherence distance is sufficiently smaller than the measurement interval (lens center thickness). FIG. 9 is a diagram showing a relationship with the position of a reflection mirror 125. Here, the measurement light is separated by the half mirror 1 2 3, reflected by the reflection surface 1 2 4 a of the lens element 1 2 4, and the optical path length reaching the half mirror 1 2 3 again is A 1. . The measurement light is separated by the half mirror 123, reflected by the reflecting surface 124b of the lens element 124, and the optical path length reaching the half mirror 123 again is A2. The reference light is separated by the half mirror 123, reflected by the reflecting mirror 125, and the optical path length of the optical path reaching the half mirror 123 again is B.

ハーフミラー 1 2 3により、 反射面 1 2 4 a , 1 2 4 bで反射した計測光は、 反射ミラー 1 2 5で反射した参照光と光路長差に応じて干渉する。 つまり、 各計 測光と参照光とは、 光路長 A l, A 2と光路長 Bとがほぼ等しくなつた時に干渉 し、 このときに強度変化する干渉光が得られる。 よって、 反射ミラ一 1 2 5の位 置を変化させることにより、 光路長 Bが光路長 A 1とほぼ等しくなると、 受光素 子 1 2 6に入射する干渉光 (反射面 1 2 4 aに関する干渉光) の強度は、 第 1 6 図における左側の波形のように変化する。 一方、 光路長 Bが光路長 A 2とほぼ等 しくなると、 受光素子 1 2 6に入射する干渉光 (反射面 1 2 4 bに関する干渉 光) の強度は、 第 1 6図における右側の波形のように変化する。  The measurement light reflected by the reflecting surfaces 1 24 a and 124 b by the half mirror 123 interferes with the reference light reflected by the reflecting mirror 125 according to the optical path length difference. In other words, each measurement light and the reference light interfere when the optical path lengths Al and A2 are substantially equal to the optical path length B, and an interference light whose intensity changes at this time is obtained. Therefore, if the optical path length B becomes almost equal to the optical path length A 1 by changing the position of the reflection mirror 125, the interference light incident on the light receiving element 126 (interference with the reflection surface 124 a) The intensity of the light changes as shown in the waveform on the left in Fig. 16. On the other hand, when the optical path length B becomes almost equal to the optical path length A 2, the intensity of the interference light (interference light relating to the reflecting surface 124 b) incident on the light receiving element 126 becomes equal to the intensity of the right waveform in FIG. To change.

なお、 計測光と参照光とが分離されてハーフミラ一 1 2 3で再び合成されるま での間で、 計測光及び参照光が例えば屈折率が低い媒質から入射して屈折率の高 い媒質との境界面で反射するような場合、 例えば反射面 1 2 4 aで反射する場合 では、 位相の 1 8 0度反転、 いわゆる位相の飛びを生じる。 この場合、 干渉光の 強度分布は、 第 1 6図の反射面 1 2 4 bに関する干渉光の強度変化に対する反射 面 1 2 4 aに関する干渉光の強度変化のように、 その振幅のほぼ中心に対して反 転した状態となる。 そして、 受光素子 1 2 6が干渉光の強度分布に対応して出力 する干渉信号と移動ステージで設定される反射ミラー 1 2 5の位置とに基づいて、 レンズ素子 1 2 4の中心厚が求められる。 なお、 上述の説明では、 非接触型の光 学式測定機を用いてレンズ中心厚を計測しているが、 たとえば測定針を用いる接 触式測定機を用いてレンズ中心厚を計測することもできる。 Until the measurement light and the reference light are separated and combined again by the half-mirror 123, the measurement light and the reference light are incident on a medium with a low refractive index, for example, and a medium with a high refractive index is used. In the case of reflection at the boundary surface with, for example, reflection at the reflecting surface 124a, the phase is inverted by 180 degrees, that is, a so-called phase jump occurs. In this case, the intensity distribution of the interference light is approximately at the center of its amplitude, like the change in the interference light intensity on the reflecting surface 124a relative to the change in the interference light intensity on the reflecting surface 124b in Fig. 16. In contrast, the state is reversed. Then, the center thickness of the lens element 124 is determined based on the interference signal output from the light receiving element 126 corresponding to the intensity distribution of the interference light and the position of the reflecting mirror 125 set on the moving stage. Can be In the above description, non-contact light Although the center thickness of the lens is measured using a scientific measuring instrument, the center thickness of the lens can be measured using, for example, a contact measuring instrument using a measuring needle.

以上のように、 第 1実施形態の製造方法では、 レンズを形成する光学材料の屈 折率分布およびレンズの面形状を計測し、 その計測結果に基づいてレンズを介し て発生する波面誤差を算出している。 そして、 算出された波面誤差を補正するた めにレンズの表面に形成すべき反射防止膜の厚さ分布を算出している。 その結果、 この厚さ分布の算出結果に基づいてレンズの表面に対して所定の厚さ分布を有す る反射防止膜を形成することにより、 個々のレンズに屈折率分布や面形状誤差が ある程度存在しても、 極低収差の投影光学系を製造することができる。 具体的に は、 上述したように、 波長 2 4 8 n mの光に対して補正可能な波面誤差の最小単 位を 2 πι λ以下に設定することにより、 たとえば波面収差で 1 Ο πι λ以下の極低 収差の投影光学系を製造することができる。  As described above, in the manufacturing method of the first embodiment, the refractive index distribution of the optical material forming the lens and the surface shape of the lens are measured, and the wavefront error generated via the lens is calculated based on the measurement result. are doing. Then, the thickness distribution of the antireflection film to be formed on the lens surface in order to correct the calculated wavefront error is calculated. As a result, by forming an anti-reflection film having a predetermined thickness distribution on the surface of the lens based on the calculation result of the thickness distribution, the refractive index distribution and the surface shape error can be reduced to some degree in each lens. Even if present, a projection optical system with extremely low aberration can be manufactured. Specifically, as described above, by setting the minimum unit of the wavefront error that can be corrected for light having a wavelength of 248 nm to 2πιλ or less, for example, the wavefront aberration is 1 1πιλ or less. An extremely low aberration projection optical system can be manufactured.

なお、 第 1実施形態の製造方法では、 屈折率分布および面形状誤差の計測結果 に基づいて、 波面誤差を算出している。 しかしながら、 レンズの表面に反射防止 膜を予め形成し、 反射防止膜の形成されたレンズを介して発生する波面誤差を実 際に計測することもできる。 この場合、 屈折率分布および面形状誤差の計測結果 と波面誤差の計測結果とに基づいて、 波面誤差を補正するために形成すべき反射 防止膜の厚さ分布を算出する。  In the manufacturing method of the first embodiment, the wavefront error is calculated based on the measurement results of the refractive index distribution and the surface shape error. However, it is also possible to form an antireflection film on the surface of the lens in advance, and actually measure a wavefront error generated through the lens on which the antireflection film is formed. In this case, the thickness distribution of the antireflection film to be formed to correct the wavefront error is calculated based on the measurement results of the refractive index distribution and the surface shape error and the measurement result of the wavefront error.

また、 第 1実施形態の製造方法では、 収差測定工程 S 1 6の後に、 判定工程 S 1 7およびレンズ調整工程 S 1 8を設けているが、 これらの工程 S 1 6〜S 1 8 を省略することができる。 すなわち、 投影光学系の組立工程 S 1 5の後に、 第 1 実施形態の製造方法を終了することもできる。  Further, in the manufacturing method of the first embodiment, after the aberration measurement step S16, the determination step S17 and the lens adjustment step S18 are provided, but these steps S16 to S18 are omitted. can do. In other words, after the projection optical system assembling step S15, the manufacturing method of the first embodiment can be ended.

第 1 7図は、 本発明の第 2実施形態にかかる投影光学系の製造方法の製造フ□ 一を示すフロ一チャートである。 第 1実施形態の製造方法では、 各レンズを介し て発生する波面誤差をレンズ毎に補正することにより、 すなわち各レンズに所定 の厚さ分布を有する反射防止膜を形成することにより、 極低収差の投影光学系を 製造している。 これに対し、 第 2実施形態の製造方法では、 レンズ毎に波面誤差 を補正することなく、 光学系中の一部のレンズに形成された反射防止膜の膜厚を 補正することにより、 極低収差の投影光学系を製造している。 以下、 第 1実施形 態の製造方法との相違点に着目して、 第 2実施形態の製造方法を説明する。 FIG. 17 is a flowchart showing a manufacturing method of the method for manufacturing a projection optical system according to the second embodiment of the present invention. In the manufacturing method of the first embodiment, by correcting a wavefront error generated through each lens for each lens, that is, by forming an antireflection film having a predetermined thickness distribution on each lens, the extremely low aberration Manufactures projection optical systems. On the other hand, in the manufacturing method of the second embodiment, the film thickness of the antireflection film formed on some of the lenses in the optical system is adjusted without correcting the wavefront error for each lens. By making corrections, an extremely low aberration projection optical system is manufactured. Hereinafter, the manufacturing method of the second embodiment will be described, focusing on the differences from the manufacturing method of the first embodiment.

第 2実施形態の製造方法では、 第 1実施形態と同様に、 各レンズを形成すべき ブロック硝材の屈折率の絶対値および屈折率分布を計測する (S 2 1 )。 次いで、 第 1実施形態と同様に、 屈折率分布が計測されたブロック硝材から必要に応じて 研削されたブロック硝材を用いて、 投影光学系 2 6を構成すべき各レンズを製造 するために、 各レンズの表面を研磨加工する (S 2 2 )。 さらに、 第 1実施形態 と同様に、 各レンズの面形状の誤差を計測する (S 2 3 )。  In the manufacturing method of the second embodiment, as in the first embodiment, the absolute value of the refractive index and the refractive index distribution of the block glass material on which each lens is to be formed are measured (S 21). Next, similarly to the first embodiment, in order to manufacture each lens to constitute the projection optical system 26 using the block glass material ground as necessary from the block glass material whose refractive index distribution was measured, The surface of each lens is polished (S22). Further, similarly to the first embodiment, the error of the surface shape of each lens is measured (S23).

次いで、 面形状誤差が計測された各レンズに、 設計に基づく一様な (光軸 A X に関して回転対称な) 反射防止膜を形成する (S 2 4 )。 しかしながら、 反射防 止膜の形成工程 S 2 4では、 各レンズを介して発生する波面誤差を捕正するため に所定の厚さ分布を有する反射防止膜を形成する第 1実施形態とは異なり、 屈折 率分布情報や面形状誤差情報とは無関係に設計された光軸に関して回転対称な厚 さ分布を有する反射防止膜を各レンズの表面に形成する。 そして、 反射膜防止膜 が形成された複数のレンズを用いて投影光学系 2 6を組み立てる (S 2 5 )。 こ のとき、 第 1実施形態と同様に、 投影光学系を構成すべき各レンズをそれぞれ多 数個製造し、 製造された多数のレンズから選択した最適な組み合わせに基づいて 投影光学系を組み立てることもできる。  Next, a uniform antireflection film (rotationally symmetric with respect to the optical axis A X) based on the design is formed on each lens whose surface shape error has been measured (S 24). However, in the antireflection film forming step S24, unlike the first embodiment in which an antireflection film having a predetermined thickness distribution is formed in order to correct a wavefront error generated via each lens, An anti-reflection film having a thickness distribution that is rotationally symmetric with respect to the optical axis designed independently of the refractive index distribution information and the surface shape error information is formed on the surface of each lens. Then, the projection optical system 26 is assembled using a plurality of lenses on which the antireflection film is formed (S25). At this time, similarly to the first embodiment, a plurality of lenses to be included in the projection optical system are manufactured, and the projection optical system is assembled based on an optimal combination selected from the manufactured many lenses. Can also.

こうして、 第 1実施形態と同様に、 実際に組み立てられた投影光学系の波面収 差を測定する (S 2 6 )。 そして、 収差測定工程 S 2 6で測定した投影光学系の 波面収差が許容範囲 A内に収まっているか否かを判定する (S 2 7 )。 判定工程 S 2 7において投影光学系の波面収差が許容範囲 A内に収まっていると判定した 場合 (第 1 7図中 Y E Sの場合)、 後述する工程 S 2 9へ移行する。 一方、 判定 工程 S 2 7において投影光学系の波面収差が許容範囲 A内に収まっていないと判 定した場合 (第 1 7図中 N Oの場合)、 レンズ調整を行う (S 2 8 )。 ただし、 第 2実施形態のレンズ調整工程 S 2 8では、 第 1実施形態で行う間隔調整や偏芯調 整に加えて、 レンズを光軸 A X廻りに回転させる回転調整を必要に応じて行う。 第 2実施形態の製造方法では、 間隔調整や偏芯調整や回転調整によりレンズ調 整された投影光学系の波面収差を再び測定する (S 2 6 )。 そして、 収差測定ェ 程 S 2 6で再び測定した投影光学系の波面収差が許容範囲 A内に収まっているか 否かを再度判定する (S 2 7 )。 判定工程 S 2 7において投影光学系の波面収差 が許容範囲 A内に収まっていると判定した場合には、 後述する工程 S 2 9へ移行 する。 しかしながら、 判定工程 S 2 7において投影光学系の波面収差が許容範囲 A内に収まっていないと判定した場合には、 判定工程 S 2 7において Y E Sの判 定が得られるまで、 レンズ調整工程 S 2 8および収差測定工程 S 2 6をさらに繰 り返す。 Thus, similarly to the first embodiment, the wavefront difference of the actually assembled projection optical system is measured (S26). Then, it is determined whether or not the wavefront aberration of the projection optical system measured in the aberration measurement step S26 falls within the allowable range A (S27). If it is determined in the determination step S27 that the wavefront aberration of the projection optical system falls within the allowable range A (in the case of YES in FIG. 17), the process proceeds to a later-described step S29. On the other hand, if it is determined in the determination step S27 that the wavefront aberration of the projection optical system is not within the allowable range A (NO in FIG. 17), the lens is adjusted (S28). However, in the lens adjustment step S28 of the second embodiment, in addition to the interval adjustment and the eccentricity adjustment performed in the first embodiment, rotation adjustment for rotating the lens around the optical axis AX is performed as necessary. In the manufacturing method of the second embodiment, the lens adjustment is performed by adjusting the distance, the eccentricity, and the rotation. The wavefront aberration of the adjusted projection optical system is measured again (S26). Then, it is determined again whether or not the wavefront aberration of the projection optical system measured again in the aberration measurement step S26 is within the allowable range A (S27). If it is determined in the determination step S27 that the wavefront aberration of the projection optical system falls within the allowable range A, the process proceeds to step S29 described later. However, if it is determined in the determination step S27 that the wavefront aberration of the projection optical system is not within the allowable range A, the lens adjustment step S2 is performed until a determination of YES is obtained in the determination step S27. 8 and the aberration measurement step S26 are further repeated.

次に、 第 2実施形態の製造方法では、 投影光学系に残存している波面収差を補 正するのに適した一部のレンズ (1つまたは複数のレンズ) を鏡筒から取り出す ( S 2 9 )。 そして、 鏡筒から取り出したレンズに形成されている反射防止膜の 厚さ分布を補正する (S 3 0 )。 すなわち、 膜厚補正工程 S 3 0では、 投影光学 系に残存している波面収差を補正するために、 屈折率分布計測工程 S 2 1の計測 結果と面形状計測工程 S 2 3の計測結果と収差測定工程 S 2 6の最終測定結果と に基づいて、 たとえば上述したイオンビーム加工を用いて反射防止膜の厚さ分布 を補正する。 なお、 屈折率分布が十分に均一な光学材料を用いる場合には、 厚さ 分布の補正に際して屈折率分布の影響を無視することもできる。  Next, in the manufacturing method of the second embodiment, some lenses (one or more lenses) suitable for correcting the wavefront aberration remaining in the projection optical system are taken out of the lens barrel (S 2 9). Then, the thickness distribution of the anti-reflection film formed on the lens taken out of the lens barrel is corrected (S30). That is, in the film thickness correction step S30, in order to correct the wavefront aberration remaining in the projection optical system, the measurement result of the refractive index distribution measurement step S21 and the measurement result of the surface shape measurement step S23 are used. Based on the final measurement result of the aberration measurement step S26 and, the thickness distribution of the antireflection film is corrected using, for example, the above-described ion beam processing. When an optical material having a sufficiently uniform refractive index distribution is used, the influence of the refractive index distribution can be ignored in correcting the thickness distribution.

こうして、 反射防止膜の厚さ分布が補正されたレンズを鏡筒へ組み込む (S 3 D o すなわち、 鏡筒から取り出したレンズを鏡筒内の元の所定位置に戻す。 そ して、 反射防止膜の厚さ分布が補正されたレンズを組み込んだ投影光学系の波面 収差を測定する (S 3 2 )。 そして、 収差測定工程 S 3 2で測定した投影光学系 の波面収差が許容範囲 B内に収まっているか否かを判定する (S 3 3 )。 ここで、 判定工程 S 3 3における許容範囲 Bは、 投影光学系の波面収差に関する最終的な 目標値としての許容範囲である。 これに対して、 上述の判定工程 S 2 7における 許容範囲 Aは、 上述の工程 S 2 9へ移行するのに設定した中間的な許容範囲であ つて、 たとえば最終的な許容範囲 Bの 2倍の値に設定されている。  Thus, the lens whose thickness distribution of the anti-reflection film has been corrected is incorporated into the lens barrel (S 3 Do, ie, the lens taken out of the lens barrel is returned to the original predetermined position in the lens barrel. The wavefront aberration of the projection optical system incorporating the lens with the corrected film thickness distribution is measured (S32), and the wavefront aberration of the projection optical system measured in the aberration measurement step S32 is within the allowable range B. (S33) Here, the allowable range B in the determining step S33 is an allowable range as a final target value regarding the wavefront aberration of the projection optical system. On the other hand, the allowable range A in the above-described determination step S27 is an intermediate allowable range set for shifting to the above-described step S29, for example, a value twice as large as the final allowable range B. Is set to

判定工程 S 3 3において投影光学系の波面収差が許容範囲 B内に収まっている と判定した場合 (第 1 7図中 Y E Sの場合)、 第 2実施形態にしたがう投影光学 系の製造が終了する。 一方、 判定工程 S 3 3において投影光学系の波面収差が許 容範囲 B内に収まっていないと判定した場合 (第 1 7図中 N Oの場合)、 レンズ 調整を行う (S 3 4 )。 ここで、 レンズ調整工程 S 3 4は、 上述のレンズ調整ェ 程 S 2 8と異なり、 レンズの回転調整を含まない。 これは、 膜厚補正工程 S 3 0 において反射防止膜の厚さ分布が光軸 A Xに関して回転非対称に補正されるのが 一般的であるからである。 すなわち、 レンズ調整工程 S 3 4では、 第 1実施形態 のレンズ調整工程 S 1 8と同様に、 レンズの間隔調整やレンズの偏芯調整を行う。 第 2実施形態の製造方法では、 レンズ調整工程 S 3 4を介して間隔調整や偏芯 調整により調整された投影光学系の波面収差を再び測定する (S 3 2 )。 そして、 収差測定工程 S 3 2で再び測定した投影光学系の波面収差が許容範囲 B内に収ま つているか否かを再度判定する (S 3 3 )。 判定工程 S 3 3において投影光学系 の波面収差が許容範囲 B内に収まっていると判定した場合には、 第 2実施形態に したがう投影光学系の製造が終了する。 しかしながら、 判定工程 S 3 3において 投影光学系の波面収差が許容範囲 B内に収まっていないと判定した場合には、 判 定工程 S 3 3において Y E Sの判定が得られるまで、 レンズ調整工程 S 3 4およ び収差測定工程 S 3 2をさらに繰り返す。 In the determination step S33, when it is determined that the wavefront aberration of the projection optical system falls within the allowable range B (YES in FIG. 17), the projection optical system according to the second embodiment is used. The production of the system ends. On the other hand, if it is determined in the determination step S33 that the wavefront aberration of the projection optical system is not within the allowable range B (NO in FIG. 17), the lens is adjusted (S34). Here, unlike the lens adjustment step S28 described above, the lens adjustment step S34 does not include the lens rotation adjustment. This is because the thickness distribution of the antireflection film is generally corrected to be rotationally asymmetric with respect to the optical axis AX in the film thickness correction step S30. That is, in the lens adjustment step S34, similarly to the lens adjustment step S18 of the first embodiment, the adjustment of the distance between the lenses and the adjustment of the eccentricity of the lens are performed. In the manufacturing method of the second embodiment, the wavefront aberration of the projection optical system adjusted by the interval adjustment and the eccentricity adjustment through the lens adjustment step S34 is measured again (S32). Then, it is determined again whether or not the wavefront aberration of the projection optical system measured again in the aberration measuring step S32 falls within the allowable range B (S33). If it is determined in the determination step S33 that the wavefront aberration of the projection optical system falls within the allowable range B, the manufacture of the projection optical system according to the second embodiment ends. However, if it is determined in the determination step S33 that the wavefront aberration of the projection optical system is not within the allowable range B, the lens adjustment step S3 is performed until a determination of YES is obtained in the determination step S33. 4 and the aberration measurement step S32 are further repeated.

以上のように、 第 2実施形態の製造方法では、 複数のレンズを用いて投影光学 系を組み立てた後、 組み立てた投影光学系の波面収差を測定している。 そして、 その測定結果に基づいて投影光学系中のレンズを調整し、 レンズ調整した投影光 学系の波面収差を測定している。 なお、 投影光学系の組立に先立って、 屈折率分 布および面形状誤差を計測している。 こうして、 第 2実施形態の製造方法では、 レンズ調整した投影光学系の波面収差に関する測定結果と屈折率分布および面形 状誤差に関する計測結果とに基づいて、 一部のレンズの表面に形成された反射防 止膜の厚さ分布を補正するので、 個々のレンズに屈折率分布や面形状誤差がある 程度存在しても、 たとえば波面収差で 1 0 mえ以下の極低収差の投影光学系を製 造することができる。  As described above, in the manufacturing method of the second embodiment, after assembling the projection optical system using a plurality of lenses, the wavefront aberration of the assembled projection optical system is measured. Then, the lens in the projection optical system is adjusted based on the measurement result, and the wavefront aberration of the adjusted projection optical system is measured. Prior to assembling the projection optical system, the refractive index distribution and surface shape error were measured. In this manner, in the manufacturing method of the second embodiment, the lens is formed on a part of the lens surface based on the measurement result regarding the wavefront aberration of the projection optical system and the measurement result regarding the refractive index distribution and the surface shape error. Since the thickness distribution of the anti-reflection coating is corrected, even if there is a refractive index distribution or surface shape error in each lens, for example, a projection optical system with extremely low wavefront aberration of 10 m or less can be used. It can be manufactured.

なお、 第 2実施形態の製造方法では、 イオンビーム加工を用いて反射防止膜の 厚さ分布を補正しているが、 たとえば研磨などの他の適当な方法で膜厚補正を行 うことができる。 ただし、 イオンビーム加工ではレンズを鏡筒内で保持するホル ダ一から取り外すことなく膜厚補正することができるので、 レンズをホルダーか ら取り外さなければならない研磨による膜厚補正方法よりも生産性が高い。 また、 第 2実施形態の製造方法では、 組み立てた投影光学系の波面収差を測定 し、 この測定結果に基づいて一部のレンズに形成された反射防止膜の膜厚を補正 する。 すなわち、 第 2実施形態では、 個々のレンズの屈折率分布や面形状誤差に 関する測定データを用いる第 1実施形態よりも基礎なるデータの測定精度が高い ので、 第 1実施形態に比べて補正の精度が高く、 投影光学系の最終的な残存収差 をより小さく調整するには有効である。 しかしながら、 第 2実施形態では、 一部 のレンズを鏡筒から取り出して膜厚補正を行った後に、 そのレンズを鏡筒に再び 組み込む必要があるので、 第 1実施形態よりも工数が多くかかる。 In the manufacturing method of the second embodiment, the thickness distribution of the antireflection film is corrected using ion beam processing. However, the film thickness is corrected by another appropriate method such as polishing. I can. However, in ion beam processing, film thickness can be corrected without removing the lens from the holder that holds the lens inside the lens barrel, so productivity is higher than in film thickness correction by polishing, which requires removing the lens from the holder. high. In the manufacturing method according to the second embodiment, the wavefront aberration of the assembled projection optical system is measured, and the thickness of the antireflection film formed on some lenses is corrected based on the measurement result. That is, in the second embodiment, the measurement accuracy of the basic data is higher than in the first embodiment using the measurement data relating to the refractive index distribution and the surface shape error of each lens. It has high accuracy and is effective for adjusting the final residual aberration of the projection optical system to a smaller value. However, in the second embodiment, it is necessary to take out a part of the lens from the lens barrel, correct the film thickness, and then re-integrate the lens into the lens barrel.

さらに、 第 2実施形態の製造方法では、 収差測定工程 S 2 6の後に、 判定工程 Further, in the manufacturing method of the second embodiment, after the aberration measuring step S26, the determining step

5 2 7およびレンズ調整工程 S 2 8を設けているが、 これらの工程 S 2 7および S 2 8を省略することができる。 すなわち、 収差測定工程 S 2 6の後に、 レンズ の取出工程 S 2 9へ直接移行することもできる。 また、 収差測定工程 S 3 2の後 に、 判定工程 S 3 3およびレンズ調整工程 S 3 4を設けているが、 これらの工程Although 5 27 and the lens adjustment step S 28 are provided, these steps S 27 and S 28 can be omitted. That is, after the aberration measurement step S26, it is also possible to directly move to the lens removal step S29. After the aberration measurement step S32, a judgment step S33 and a lens adjustment step S34 are provided.

5 3 2〜S 3 4を省略することができる。 すなわち、 レンズの組込工程 S 3 1の 後に、 第 2実施形態の製造方法を終了することもできる。 5 32 to S 34 can be omitted. That is, the manufacturing method of the second embodiment can be ended after the lens incorporating step S31.

第 1 8図は、 本発明の第 3実施形態にかかる投影光学系の製造方法の製造フロ 一を示すフローチャートである。 第 3実施形態の製造方法は、 第 1実施形態と第 2実施形態とを部分的に組み合わせた形態を有する。 以下、 第 1実施形態の製造 方法および第 2実施形態の製造方法との相違点に着目して、 第 3実施形態の製造 方法を簡単に説明する。  FIG. 18 is a flowchart showing a manufacturing flow of a method for manufacturing a projection optical system according to the third embodiment of the present invention. The manufacturing method of the third embodiment has a form in which the first embodiment and the second embodiment are partially combined. Hereinafter, the manufacturing method of the third embodiment will be briefly described, focusing on differences from the manufacturing method of the first embodiment and the manufacturing method of the second embodiment.

第 3実施形態の製造方法では、 第 1実施形態および第 2実施形態と同様に、 ブ ロック硝材の屈折率の絶対値および屈折率分布を計測 (S 4 1 ) し、 投影光学系 2 6を構成すべき各レンズを製造するために各レンズの表面を研磨加工 (S 4 2 ) した後に、 各レンズの面形状の誤差を計測する (S 4 3 )。 次いで、 第 1実 施形態と同様に、 面形状誤差が計測された各レンズに反射防止膜を形成する (S 4 4 )。 すなわち、 反射防止膜の形成工程 S 4 4では、 各レンズを介して発生す る波面誤差を補正するために、 第 7図に示す製造フローにしたがって各レンズに 所定の厚さ分布を有する反射防止膜を形成する。 なお、 屈折率分布が十分に均一 な光学材料を用いる場合には、 所定の厚さ分布の付与に際して屈折率分布の影響 を無視することもできる。 In the manufacturing method of the third embodiment, as in the first and second embodiments, the absolute value of the refractive index and the refractive index distribution of the block glass material are measured (S41), and the projection optical system 26 is mounted. After the surface of each lens is polished (S42) in order to manufacture each lens to be formed, an error in the surface shape of each lens is measured (S43). Next, similarly to the first embodiment, an antireflection film is formed on each lens whose surface shape error has been measured (S 4 4). That is, in the antireflection film forming step S44, in order to correct a wavefront error generated through each lens, an antireflection film having a predetermined thickness distribution is provided for each lens according to the manufacturing flow shown in FIG. Form a film. When an optical material having a sufficiently uniform refractive index distribution is used, the influence of the refractive index distribution can be neglected when the predetermined thickness distribution is applied.

そして、 所定の厚さ分布を有する反射膜防止膜が形成された複数のレンズを用 いて投影光学系 2 6を組み立てる (S 4 5 )。 このとき、 第 1実施形態および第 2実施形態と同様に、 投影光学系を構成すべき各レンズをそれぞれ多数個製造し、 製造された多数のレンズから選択した最適な組み合わせに基づいて投影光学系を 組み立てることもできる。 こうして、 第 1実施形態および第 2実施形態と同様に、 実際に組み立てられた投影光学系の波面収差を測定する (S 4 6 )。 そして、 収 差測定工程 S 4 6で測定した投影光学系の波面収差が許容範囲 A内に収まってい るか否かを判定する (S 4 7 )。  Then, the projection optical system 26 is assembled using a plurality of lenses on which the anti-reflection film having a predetermined thickness distribution is formed (S45). At this time, similarly to the first embodiment and the second embodiment, a large number of each lens to constitute the projection optical system is manufactured, and the projection optical system is manufactured based on the optimal combination selected from the manufactured many lenses. Can also be assembled. In this way, similarly to the first and second embodiments, the wavefront aberration of the actually assembled projection optical system is measured (S46). Then, it is determined whether or not the wavefront aberration of the projection optical system measured in the difference measuring step S46 is within the allowable range A (S47).

判定工程 S 4 7において投影光学系の波面収差が許容範囲 A内に収まっている と判定した場合 (第 1 8図中 Y E Sの場合)、 レンズの取出工程 S 4 9へ移行す る。 一方、 判定工程 S 4 7において投影光学系の波面収差が許容範囲 A内に収ま つていないと判定した場合 (第 1 8図中 N Oの場合)、 レンズ調整を行う (S 4 8 )。 ただし、 第 3実施形態のレンズ調整工程 S 4 8では、 第 1実施形態と同様 に、 回転調整を行うことなく間隔調整や偏芯調整だけを行う。 これは、 反射防止 膜の形成工程 S 4 4において付与される厚さ分布が光軸 A Xに関して回転非対称 になるのが一般的であるからである。  If it is determined in the determination step S47 that the wavefront aberration of the projection optical system falls within the allowable range A (in the case of YES in FIG. 18), the process proceeds to the lens removal step S49. On the other hand, if it is determined in the determination step S47 that the wavefront aberration of the projection optical system does not fall within the allowable range A (NO in FIG. 18), the lens is adjusted (S48). However, in the lens adjustment step S48 of the third embodiment, as in the first embodiment, only the interval adjustment and the eccentricity adjustment are performed without performing the rotation adjustment. This is because the thickness distribution applied in the antireflection film forming step S44 is generally rotationally asymmetric with respect to the optical axis AX.

第 3実施形態の製造方法では、 間隔調整や偏芯調整によりレンズ調整された投 影光学系の波面収差を再び測定する (S 4 6 )。 そして、 収差測定工程 S 4 6で 再び測定した投影光学系の波面収差が許容範囲 A内に収まっているか否かを再度 判定する (S 4 7 )。 判定工程 S 4 7において投影光学系の波面収差が許容範囲 A内に収まっていると判定した場合には、 レンズの取出工程工程 S 4 9へ移行す る。 しかしながら、 判定工程 S 4 7において投影光学系の波面収差が許容範囲 A 内に収まっていないと判定した場合には、 判定工程 S 4 7において Y E Sの判定 が得られるまで、 レンズ調整工程 S 4 8および収差測定工程 S 4 6をさらに繰り 返す。 In the manufacturing method according to the third embodiment, the wavefront aberration of the projection optical system whose lens has been adjusted by the interval adjustment and the eccentricity adjustment is measured again (S46). Then, it is determined again whether the wavefront aberration of the projection optical system measured again in the aberration measurement step S46 falls within the allowable range A (S47). If it is determined in the determination step S47 that the wavefront aberration of the projection optical system falls within the allowable range A, the process proceeds to a lens removal step S49. However, if it is determined in the determination step S47 that the wavefront aberration of the projection optical system is not within the allowable range A, a determination of YES is made in the determination step S47. Until is obtained, the lens adjustment step S48 and the aberration measurement step S46 are further repeated.

次に、 第 3実施形態の製造方法では、 投影光学系に残存している波面収差を補 正するのに適した一部のレンズを鏡筒から取り出す (S 4 9 )。 そして、 鏡筒か ら取り出したレンズに形成されている反射防止膜の厚さ分布を補正する (S 5 Next, in the manufacturing method of the third embodiment, some lenses suitable for correcting the wavefront aberration remaining in the projection optical system are taken out of the lens barrel (S49). Then, the thickness distribution of the anti-reflection film formed on the lens taken out of the lens barrel is corrected (S5).

0 )。 すなわち、 膜厚補正工程 S 5 0では、 投影光学系に残存している波面収差 を補正するために、 屈折率分布計測工程 S 4 1の計測結果と面形状計測工程 S 4 3の計測結果と収差測定工程 S 6の最終測定結果とに基づいて、 たとえばィォ ンビーム加工を用いて反射防止膜の厚さ分布を補正する。 なお、 屈折率分布が十 分に均一な光学材料を用いる場合には、 厚さ分布の補正に際して屈折率分布の影 響を無視することもできる。 0). That is, in the film thickness correction step S50, in order to correct the wavefront aberration remaining in the projection optical system, the measurement result of the refractive index distribution measurement step S41 and the measurement result of the surface shape measurement step S43 are used. Based on the final measurement result of the aberration measurement step S6, the thickness distribution of the antireflection film is corrected using, for example, ion beam processing. When an optical material having a sufficiently uniform refractive index distribution is used, the influence of the refractive index distribution can be ignored when correcting the thickness distribution.

こうして、 反射防止膜の厚さ分布が補正されたレンズを鏡筒へ組み込み (S 5 In this way, the lens whose thickness distribution of the anti-reflection film has been corrected is incorporated into the lens barrel (S 5

1 )、 その後、 投影光学系の波面収差を測定する (S 5 2 )。 そして、 収差測定ェ 程 S 5 2で測定した投影光学系の波面収差が許容範囲 B内に収まっているか否か を判定する (S 5 3 )。 判定工程 S 5 3において投影光学系の波面収差が許容範 囲 B内に収まっていると判定した場合 (第 1 8図中 Y E Sの場合)、 第 3実施形 態にしたがう投影光学系の製造が終了する。 一方、 判定工程 S 5 3において投影 光学系の波面収差が許容範囲 B内に収まっていないと判定した場合 (第 1 8図中 N Oの場合)、 レンズの間隔調整やレンズの偏芯調整を行う (S 5 4 )。 1) Then, the wavefront aberration of the projection optical system is measured (S52). Then, it is determined whether or not the wavefront aberration of the projection optical system measured in the aberration measurement step S52 falls within the allowable range B (S53). In the determination step S53, when it is determined that the wavefront aberration of the projection optical system falls within the allowable range B (YES in FIG. 18), the production of the projection optical system according to the third embodiment is stopped. finish. On the other hand, when it is determined in the determination step S53 that the wavefront aberration of the projection optical system is not within the allowable range B (in the case of NO in FIG. 18), the adjustment of the lens spacing and the eccentricity of the lens are performed. (S54).

第 3実施形態の製造方法では、 レンズ調整工程 S 5 4を介して間隔調整や偏芯 調整により調整された投影光学系の波面収差を再び測定する (S 5 2 )。 そして、 収差測定工程 S 5 2で再び測定した投影光学系の波面収差が許容範囲 B内に収ま つているか否かを再度判定する (S 5 3 )。 判定工程 S 5 3において投影光学系 の波面収差が許容範囲 B内に収まっていると判定した場合には、 第 3実施形態に したがう投影光学系の製造が終了する。 しかしながら、 判定工程 S 5 3において 投影光学系の波面収差が許容範囲 B内に収まっていないと判定した場合には、 判 定工程 S 5 3において Y E Sの判定が得られるまで、 レンズ調整工程 S 5 4およ び収差測定工程 S 5 2をさらに繰り返す。 以上のように、 第 3実施形態の製造方法では、 第 1実施形態と同様に各レンズ の表面に対して所定の厚さ分布を有する反射防止膜を形成するとともに、 第 2実 施形態と同様に一部のレンズの表面に形成された反射防止膜の厚さ分布を補正す る。 したがって、 第 3実施形態の製造方法においても、 第 1実施形態および第 2 実施形態と同様に、 個々のレンズに屈折率分布や面形状誤差がある程度存在して も、 たとえば波面収差で 1 Ο πι λ以下の極低収差の投影光学系を製造することが できる。 In the manufacturing method according to the third embodiment, the wavefront aberration of the projection optical system adjusted by the distance adjustment and the eccentricity adjustment through the lens adjustment step S54 is measured again (S52). Then, it is determined again whether or not the wavefront aberration of the projection optical system measured again in the aberration measurement step S52 falls within the allowable range B (S53). If it is determined in the determination step S53 that the wavefront aberration of the projection optical system falls within the allowable range B, the manufacture of the projection optical system according to the third embodiment ends. However, if it is determined in the determination step S53 that the wavefront aberration of the projection optical system is not within the allowable range B, the lens adjustment step S53 is performed until a determination of YES is obtained in the determination step S53. 4 and the aberration measurement step S52 are further repeated. As described above, in the manufacturing method of the third embodiment, an antireflection film having a predetermined thickness distribution is formed on the surface of each lens in the same manner as in the first embodiment, and the same as in the second embodiment. First, the thickness distribution of the antireflection film formed on the surface of some lenses is corrected. Therefore, in the manufacturing method of the third embodiment, as in the first and second embodiments, even if there is a certain degree of refractive index distribution or surface shape error in each lens, for example, 1Οπι A projection optical system having an extremely low aberration of λ or less can be manufactured.

上述の各実施形態にかかる製造方法で製造された投影光学系を備えた露光装置 では、 照明系によってマスク (レチクル) を照明し (照明工程)、 投影光学系を 用いてマスクに形成された転写用のパターンを感光性基板に露光する (露光ェ 程) ことにより、 マイクロデバイス (半導体素子、 撮像素子、 液晶表示素子、 薄 膜磁気ヘッド等) を製造することができる。 以下、 各実施形態の露光装置を用い て感光性基板としてのウェハ等に所定の回路パターンを形成することによって、 マイクロデバイスとしての半導体デバイスを得る際の手法の一例につき第 1 9図 のフローチャートを参照して説明する。  In the exposure apparatus including the projection optical system manufactured by the manufacturing method according to each of the above-described embodiments, the mask (reticle) is illuminated by the illumination system (illumination step), and the transfer formed on the mask using the projection optical system is performed. By exposing a photosensitive pattern to a photosensitive substrate (exposure step), a micro device (semiconductor element, image pickup element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. The flow chart of FIG. 19 shows an example of a method for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a wafer or the like as a photosensitive substrate using the exposure apparatus of each embodiment. It will be described with reference to FIG.

先ず、 第 1 9図のステップ 3 0 1において、 1ロットのウェハ上に金属膜が蒸 着される。 次のステップ 3 0 2において、 その 1ロットのウェハ上の金属膜上に フォトレジストが塗布される。 その後、 ステップ 3 0 3において、 各実施形態の 露光装置を用いて、 マスク上のパターンの像がその投影光学系を介して、 その 1 ロットのウェハ上の各ショット領域に順次露光転写される。 その後、 ステップ 3 0 4において、 その 1ロットのウェハ上のフォトレジストの現像が行われた後、 ステップ 3 0 5において、 その 1ロットのウェハ上でレジス卜パターンをマスク としてエッチングを行うことによって、 マスク上のパターンに対応する回路パタ ーンが、 各ウェハ上の各ショット領域に形成される。 その後、 更に上のレイヤの 回路パターンの形成等を行うことによって、 半導体素子等のデバイスが製造され る。 上述の半導体デバイス製造方法によれば、 極めて微細な回路パターンを有す る半導体デバイスをスループット良く得ることができる。 なお、 ステップ 3 0 1 〜ステップ 3 0 5では、 ウェハ上に金属を蒸着し、 その金属膜上にレジストを塗 布、 そして露光、 現像、 エッチングの各工程を行っているが、 これらの工程に先 立って、 ウェハ上にシリコンの酸化膜を形成後、 そのシリコンの酸化膜上にレジ ストを塗布、 そして露光、 現像、 エッチング等の各工程を行っても良いことはい うまでもない。 First, in step 301 of FIG. 19, a metal film is deposited on one lot of wafers. In the next step 302, a photoresist is applied on the metal film on the wafer of the lot. Then, in step 303, using the exposure apparatus of each embodiment, an image of the pattern on the mask is sequentially exposed and transferred to each shot area on the one lot of wafers via the projection optical system. Thereafter, in step 304, the photoresist on the one lot of wafers is developed, and in step 305, etching is performed on the one lot of wafers using the resist pattern as a mask. A circuit pattern corresponding to the pattern on the mask is formed in each shot area on each wafer. After that, a device such as a semiconductor element is manufactured by forming a circuit pattern of a further upper layer and the like. According to the above-described semiconductor device manufacturing method, a semiconductor device having an extremely fine circuit pattern can be obtained with high throughput. In steps 301 to 305, a metal is deposited on the wafer, and a resist is applied on the metal film. Fabric, exposure, development, and etching steps are performed. Prior to these steps, a silicon oxide film is formed on the wafer, and then a resist is applied on the silicon oxide film and exposed. It goes without saying that the respective steps such as development, development and etching may be performed.

また、 各実施形態の露光装置では、 プレート (ガラス基板) 上に所定のパ夕一 ン (回路パターン、 電極パターン等) を形成することによって、 マイクロデバイ スとしての液晶表示素子を得ることもできる。 以下、 第 2 0図のフローチャート を参照して、 このときの手法の一例につき説明する。 第 2 0図において、 パ夕一 ン形成工程 4 0 1では、 各実施形態の露光装置を用いてマスクのパターンを感光 性基板 (レジストが塗布されたガラス基板等) に転写露光する、 所謂光リソダラ フィー工程が実行される。 この光リソグラフィー工程によって、 感光性基板上に は多数の電極等を含む所定パターンが形成される。 その後、 露光された基板は、 現像工程、 エッチング工程、 レジスト剥離工程等の各工程を経ることによって、 基板上に所定のパターンが形成され、 次のカラーフィルタ一形成工程 4 0 2へ移 行する。  Further, in the exposure apparatus of each embodiment, a liquid crystal display device as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). . Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 20, in a pattern forming step 401, a so-called light beam is used to transfer and expose a mask pattern onto a photosensitive substrate (eg, a glass substrate coated with a resist) using the exposure apparatus of each embodiment. The liquidation process is performed. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to a developing process, an etching process, a resist stripping process, etc., thereby forming a predetermined pattern on the substrate, and then moving to the next color filter forming process 402. .

次に、 カラ一フィルター形成工程 4 0 2では、 R (Red) , G (Green) , B (B 1 ue) に対応した 3つのドットの組がマトリックス状に多数配列されたり、 ま たは R、 G、 Bの 3本のストライプのフィルターの組を複数水平走査線方向に配 列されたりしたカラ一フィルターを形成する。 そして、 カラ一フィルター形成工 程 4 0 2の後に、 セル組み立て工程 4 0 3が実行される。 セル組み立て工程 4 0 3では、 パターン形成工程 4 0 1にて得られた所定パターンを有する基板、 およ びカラーフィルター形成工程 4 0 2にて得られたカラーフィルタ一等を用いて液 晶パネル (液晶セル) を組み立てる。 セル組み立て工程 4 0 3では、 例えば、 パ ターン形成工程 4 0 1にて得られた所定パターンを有する基板とカラーフィルタ 一形成工程 4 0 2にて得られたカラーフィルターとの間に液晶を注入して、 液晶 パネル (液晶セル) を製造する。  Next, in the color filter forming step 402, a set of three dots corresponding to R (Red), G (Green), and B (B 1 ue) are arranged in a matrix, or , G, B are formed as a color filter in which a set of three stripe filters is arranged in a plurality of horizontal scanning line directions. Then, after the color filter forming step 402, a cell assembling step 403 is executed. In the cell assembling step 403, a liquid crystal panel is formed using the substrate having the predetermined pattern obtained in the pattern forming step 401 and the color filter obtained in the color filter forming step 402. (Liquid crystal cell). In the cell assembling step 403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step 401 and the color filter obtained in the color filter forming step 402. Then, a liquid crystal panel (liquid crystal cell) is manufactured.

その後、 モジュール組み立て工程 4 0 4にて、 組み立てられた液晶パネル (液 晶セル) の表示動作を行わせる電気回路、 バックライト等の各部品を取り付けて 液晶表示素子として完成させる。 上述の液晶表示素子の製造方法によれば、 極め て微細な回路パターンを有する液晶 ¾示素子をスループット良く得ることができ る。 Then, in the module assembling step 404, each part such as an electric circuit and a backlight for performing the display operation of the assembled liquid crystal panel (liquid crystal cell) is attached. Completed as a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display device, a liquid crystal display device having an extremely fine circuit pattern can be obtained with high throughput.

なお、 上述の各実施形態では、 レンズの表面に対して所定の厚さ分布を有する 反射防止膜を形成することにより、 あるいはレンズの表面に形成された反射防止 膜の厚さ分布を補正することにより、 極低収差の光学系を製造している。 しかし ながら、 本発明では、 反射防止膜に限定されることなく、 レンズの表面に形成さ れる一般的な薄膜の厚さ分布を制御することにより、 極低収差の光学系を製造す ることができる。  In each of the embodiments described above, the anti-reflection film having a predetermined thickness distribution is formed on the surface of the lens, or the thickness distribution of the anti-reflection film formed on the surface of the lens is corrected. Produces an extremely low aberration optical system. However, in the present invention, it is possible to manufacture an optical system with extremely low aberration by controlling the thickness distribution of a general thin film formed on the surface of a lens without being limited to the antireflection film. it can.

また、 上述の各実施形態では、 露光装置に搭載される投影光学系の製造方法に 対して本発明を適用しているが、 これに限定されることなく、 他の一般的な光学 系の製造方法に本発明を適用することもできる。 産業上の利用の可能性  In each of the above embodiments, the present invention is applied to a method of manufacturing a projection optical system mounted on an exposure apparatus. However, the present invention is not limited to this. The present invention can also be applied to a method. Industrial applicability

以上説明したように、 本発明による光学系の製造方法では、 レンズの表面に対 して所定の厚さ分布を有する薄膜を形成することにより、 あるいはレンズの表面 に形成された薄膜の厚さ分布を補正することにより、 個々のレンズに屈折率分布 や面形状誤差がある程度存在しても、 たとえば波面収差で 1 Ο πι λ以下の極低収 差の光学系を製造することができる。  As described above, in the method of manufacturing an optical system according to the present invention, the thickness distribution of the thin film formed on the surface of the lens is formed by forming a thin film having a predetermined thickness distribution on the surface of the lens. By correcting this, even if there is a certain degree of refractive index distribution or surface shape error in each lens, it is possible to manufacture an optical system having an extremely low difference of, for example, 1 以下 πιλ or less due to wavefront aberration.

したがって、 たとえば波面収差で 1 Ο πι λ以下の極低収差の光学系を投影光学 系として備えた本発明の露光装置では、 高解像のもとで良好な露光を行うことが できる。 さらに、 たとえば波面収差で 1 Ο πι λ以下の極低収差の投影光学系を備 えた露光装置を用いる本発明のマイクロデバイス製造方法では、 高解像で良好な 露光条件のもとで良好なマイクロデバィスを製造することができる。  Therefore, for example, the exposure apparatus of the present invention including an optical system having an extremely low wave aberration of 1Οπιλ or less as a projection optical system can perform favorable exposure with high resolution. Furthermore, for example, in the microdevice manufacturing method of the present invention using an exposure apparatus equipped with a projection optical system having an extremely low wavefront aberration of 1ππιλ or less, a high resolution and a good microdevice under favorable exposure conditions are provided. Can be manufactured.

Claims

請 求 の 範 囲 The scope of the claims 1 . 少なくとも 1つのレンズを有する光学系の製造方法において、 1. In a method for manufacturing an optical system having at least one lens, 前記少なくとも 1つのレンズを形成する光学材料における屈折率分布を計測す る屈折率分布計測工程と、  A refractive index distribution measuring step of measuring a refractive index distribution in the optical material forming the at least one lens; 前記少なくとも 1つのレンズにおける表面形状を計測する面形状計測工程と、 前記屈折率分布計測工程の計測結果と前記面形状計測工程の計測結果とに基づ いて前記少なくとも 1つのレンズの光学的誤差を求める算出工程と、  A surface shape measurement step of measuring a surface shape of the at least one lens; and an optical error of the at least one lens based on a measurement result of the refractive index distribution measurement step and a measurement result of the surface shape measurement step. The calculation process to be determined; 前記算出工程の算出結果に基づいて前記少なくとも 1つのレンズの表面に対し て所定の厚さ分布を有する薄膜を形成する補正膜形成工程とを含むことを特徴と する光学系の製造方法。  A correction film forming step of forming a thin film having a predetermined thickness distribution on the surface of the at least one lens based on a calculation result of the calculation step. 2 . 請求の範囲第 1項に記載の光学系の製造方法において、 2. In the method for manufacturing an optical system according to claim 1, 前記算出工程は、 少なくとも前記屈折率分布計測工程の計測結果と前記面形状 計測工程の計測結果とに基づいて前記少なくとも 1つのレンズを介して発生する 波面誤差を算出する波面誤差算出工程と、  The calculating step includes a wavefront error calculating step of calculating a wavefront error generated through the at least one lens based on at least the measurement result of the refractive index distribution measuring step and the measurement result of the surface shape measuring step, 前記波面誤差算出工程の算出結果に基づいて前記波面誤差を補正するために前 記少なくとも 1つのレンズの表面に形成すべき薄膜の厚さ分布を算出する厚さ分 布算出工程とを含み、  A thickness distribution calculating step of calculating a thickness distribution of a thin film to be formed on the surface of at least one lens to correct the wavefront error based on the calculation result of the wavefront error calculating step. 前記補正膜形成工程は、 前記厚さ分布算出工程の算出結果に基づいて前記少な くとも 1つのレンズの表面に対して所定の厚さ分布を有する薄膜を形成すること を特徴とする光学系の製造方法。  The correction film forming step includes forming a thin film having a predetermined thickness distribution on a surface of the at least one lens based on a calculation result of the thickness distribution calculating step. Production method. 3 . 請求の範囲第 1項または第 2項に記載の光学系の製造方法において、 前記補正膜形成工程は、 前記少なくとも 1つのレンズの表面に薄膜を形成する 薄膜形成工程と、 3. The method of manufacturing an optical system according to claim 1 or 2, wherein the correcting film forming step includes: forming a thin film on a surface of the at least one lens; 前記薄膜形成工程で形成された薄膜の厚さ分布を補正する薄膜補正工程とを含 むことを特徴とする光学系の製造方法。 A method of correcting the thickness distribution of the thin film formed in the thin film forming step. 4 . 請求の範囲第 1項乃至第 3項のいずれか 1項に記載の光学系の製造方法に おいて、 4. In the method for manufacturing an optical system according to any one of claims 1 to 3, 前記算出工程に先立って、 前記少なくとも 1つのレンズの表面に薄膜を形成す る薄膜形成工程と、 前記少なくとも 1つのレンズを介して発生する波面誤差を計 測する波面誤差計測工程とをさらに含み、  Prior to the calculating step, further comprising: a thin film forming step of forming a thin film on the surface of the at least one lens; and a wavefront error measuring step of measuring a wavefront error generated via the at least one lens, 前記算出工程は、 前記屈折率分布計測工程の計測結果と前記面形状計測工程の 計測結果と前記波面誤差計測工程の計測結果とに基づいて、 前記波面誤差を補正 するために前記少なくとも 1つのレンズの表面に形成すべき薄膜の厚さ分布を算 出することを特徴とする光学系の製造方法。  The calculating step includes correcting the wavefront error based on the measurement result of the refractive index distribution measurement step, the measurement result of the surface shape measurement step, and the measurement result of the wavefront error measurement step. A method for producing an optical system, comprising: calculating a thickness distribution of a thin film to be formed on a surface of a substrate. 5 . 請求の範囲第 1項乃至第 4項のいずれか 1項に記載の光学系の製造方法に おいて、 5. The method for manufacturing an optical system according to any one of claims 1 to 4, wherein 前記補正膜形成工程の後に前記少なくとも 1つのレンズを用いて光学系を組み 立てる組立工程と、  An assembling step of assembling an optical system using the at least one lens after the correcting film forming step; 前記組立工程で組み立てられた前記光学系の収差を測定する収差測定工程と、 前記収差測定工程の測定結果に基づいて前記少なくとも 1つのレンズの表面に 形成された薄膜の厚さ分布を補正する第 2膜厚補正工程とを含むことを特徴とす る光学系の製造方法。  An aberration measuring step of measuring the aberration of the optical system assembled in the assembling step; and correcting a thickness distribution of a thin film formed on a surface of the at least one lens based on a measurement result of the aberration measuring step. 2. A method for manufacturing an optical system, comprising: a film thickness correction step. 6 . 請求の範囲第 1項乃至第 4項のいずれか 1項に記載の光学系の製造方法に おいて、 6. The method of manufacturing an optical system according to any one of claims 1 to 4, wherein 前記補正膜形成工程の後に前記少なくとも 1つのレンズを用いて光学系を組み 立てる組立工程と、  An assembling step of assembling an optical system using the at least one lens after the correcting film forming step; 前記組立工程で組み立てられた前記光学系の収差を測定する第 1収差測定工程 と、  A first aberration measurement step of measuring aberration of the optical system assembled in the assembly step, 前記第 1収差測定工程の測定結果に基づいて前記少なくとも 1つのレンズを調 整するレンズ調整工程と、 前記レンズ調整工程で調整された前記光学系の収差を測定する第 2収差測定ェ 程と、 A lens adjustment step of adjusting the at least one lens based on a measurement result of the first aberration measurement step; A second aberration measurement step for measuring the aberration of the optical system adjusted in the lens adjustment step; 前記第 2収差測定工程の測定結果に基づいて前記少なくとも 1つのレンズの表 面に形成された薄膜の厚さ分布を補正する第 2膜厚補正工程とを含むことを特徴 とする光学系の製造方法。  A second film thickness correcting step of correcting a thickness distribution of a thin film formed on a surface of the at least one lens based on a measurement result of the second aberration measuring step. Method. 7 . 請求の範囲第 1項乃至第 6項のいずれか 1項に記載の光学系の製造方法に おいて、 7. The method for manufacturing an optical system according to any one of claims 1 to 6, wherein 前記薄膜は多層膜を含み、  The thin film includes a multilayer film, 前記補正膜形成工程は、 前記多層膜の最も外側の層の膜厚の 1 5 %以下の補正 量を付加することを特徴とする光学系の製造方法。  The method of manufacturing an optical system, wherein the correcting film forming step adds a correction amount of 15% or less of a film thickness of an outermost layer of the multilayer film. 8 . 複数のレンズを有する光学系の製造方法において、 8. In a method of manufacturing an optical system having a plurality of lenses, 前記複数のレンズを用いて光学系を組み立てる組立工程と、  An assembling step of assembling an optical system using the plurality of lenses, 前記組立工程で組み立てられた前記光学系の収差を測定する収差測定工程と、 前記収差測定工程の測定結果に基づいて前記複数のレンズのうちの少なくとも An aberration measuring step of measuring an aberration of the optical system assembled in the assembling step; and at least one of the plurality of lenses based on a measurement result of the aberration measuring step. 1つのレンズの表面に形成された薄膜の厚さ分布を補正する膜厚補正工程とを含 むことを特徴とする光学系の製造方法。 A film thickness correcting step of correcting a thickness distribution of a thin film formed on the surface of one lens. 9 . 請求の範囲第 8項に記載の光学系の製造方法において、 9. In the method for manufacturing an optical system according to claim 8, 前記複数のレンズをそれぞれ形成する各光学材料の屈折率分布および前記複数 のレンズそれぞれの表面形状のうち少なくとも一方を計測する部材計測工程をさ らに含み、  A member measuring step of measuring at least one of a refractive index distribution of each optical material forming each of the plurality of lenses and a surface shape of each of the plurality of lenses; 前記膜厚補正工程は、 前記収差測定工程の測定結果と前記部材計測工程の計測 結果とに基づいて前記複数のレンズのうちの少なくとも 1つのレンズの表面に形 成された薄膜の厚さ分布を補正することを特徴とする光学系の製造方法。  The film thickness correction step includes: calculating a thickness distribution of a thin film formed on a surface of at least one of the plurality of lenses based on a measurement result of the aberration measurement step and a measurement result of the member measurement step. A method for manufacturing an optical system, comprising correcting. 1 0 . 複数のレンズを有する光学系の製造方法において、 前記複数のレンズを用いて光学系を組み立てる組立工程と、 10. In a method of manufacturing an optical system having a plurality of lenses, An assembling step of assembling an optical system using the plurality of lenses, 前記組立工程で組み立てられた前記光学系の収差を測定する第 1収差測定工程 と、  A first aberration measurement step of measuring aberration of the optical system assembled in the assembly step, 前記第 1収差測定工程の測定結果に基づいて前記光学系中の少なくとも 1つの レンズを調整するレンズ調整工程と、  A lens adjustment step of adjusting at least one lens in the optical system based on the measurement result of the first aberration measurement step; 前記レンズ調整工程で調整された前記光学系の収差を測定する第 2収差測定ェ 程と、  A second aberration measurement step for measuring the aberration of the optical system adjusted in the lens adjustment step; 前記第 2収差測定工程の測定結果に基づいて前記複数のレンズのうちの少なく とも 1つのレンズの表面に形成された薄膜の厚さ分布を補正する膜厚補正工程と を含むことを特徴とする光学系の製造方法。  A film thickness correction step of correcting a thickness distribution of a thin film formed on a surface of at least one of the plurality of lenses based on a measurement result of the second aberration measurement step. Optical system manufacturing method. 1 1 . 請求の範囲第 1 0項に記載の光学系の製造方法において、 11. The method for manufacturing an optical system according to claim 10, wherein: 前記複数のレンズをそれぞれ形成する各光学材料の屈折率分布および前記複数 のレンズそれぞれの表面形状のうち少なくとも一方を計測する部材計測工程をさ らに含み、  A member measuring step of measuring at least one of a refractive index distribution of each optical material forming each of the plurality of lenses and a surface shape of each of the plurality of lenses; 前記膜厚補正工程は、 前記第 2収差測定工程の測定結果と前記部材計測工程の 計測結果とに基づいて前記複数のレンズのうちの少なくとも 1つのレンズの表面 に形成された薄膜の厚さ分布を補正することを特徴とする光学系の製造方法。  The film thickness correction step includes a thickness distribution of a thin film formed on a surface of at least one of the plurality of lenses based on a measurement result of the second aberration measurement step and a measurement result of the member measurement step. A method of manufacturing an optical system, wherein 1 2 . 請求の範囲第 1 0項または第 1 1項に記載の光学系の製造方法において、 前記レンズ調整工程は、 前記光学系中の少なくとも 1つのレンズを前記光学系 の光軸に沿って移動させる移動調整工程と、 前記光学系中の少なくとも 1つのレ ンズを前記光軸と交差する方向に沿ってシフトさせるシフト調整工程と、 前記光 学系中の少なくとも 1つのレンズを前記光軸に対して傾けるチルト調整工程と、 前記光学系中の少なくとも 1つのレンズを前記光軸廻りに回転させる回転調整ェ 程との少なくとも 1つを含むことを特徴とする光学系の製造方法。 12. The method for manufacturing an optical system according to claim 10 or 11, wherein the lens adjusting step comprises: moving at least one lens in the optical system along an optical axis of the optical system. A movement adjusting step of moving; a shift adjusting step of shifting at least one lens in the optical system along a direction intersecting with the optical axis; and at least one lens in the optical system with respect to the optical axis. A method for manufacturing an optical system, comprising: at least one of a tilt adjusting step of tilting the lens relative to the optical system and a rotation adjusting step of rotating at least one lens in the optical system around the optical axis. 1 3 . 請求の範囲第 8項乃至第 1 2項のいずれか 1項に記載の光学系の製造方 法において、 13. The method of manufacturing an optical system according to any one of claims 8 to 12. In the law, 前記組立工程に先立って、 前記光学系を構成すべき複数のレンズを製造するレ ンズ製造工程と、  Prior to the assembling step, a lens manufacturing step of manufacturing a plurality of lenses to constitute the optical system; 前記レンズ製造工程で製造された複数のレンズの形状に関する情報を計測する レンズ形状計測工程と、  A lens shape measuring step of measuring information on the shapes of the plurality of lenses manufactured in the lens manufacturing step; 前記レンズ形状計測工程で計測された複数のレンズから前記光学系を構成すベ き複数のレンズを選択する選択工程と、  A selection step of selecting a plurality of lenses that should constitute the optical system from the plurality of lenses measured in the lens shape measurement step; 前記選択工程で選択された複数のレンズの形状に関する計測情報に基づいて前 記光学系の光学性能を予測評価する予測評価工程と、  A prediction evaluation step of predicting and evaluating the optical performance of the optical system based on the measurement information on the shapes of the plurality of lenses selected in the selection step, 前記予測評価工程で予測される前記光学系の光学性能が許容できる複数のレン ズの最適な組み合わせが決定されるまで前記選択工程と前記予測評価工程とを繰 り返す繰り返し工程とをさらに含むことを特徴とする光学系の製造方法。  The method further includes a repetition step of repeating the selection step and the prediction evaluation step until an optimal combination of a plurality of lenses whose optical performance predicted by the prediction evaluation step is acceptable is determined. A method for producing an optical system, comprising: 1 . 請求の範囲第 8項乃至第 1 3項のいずれか 1項に記載の光学系の製造方 法において、 1. In the method for manufacturing an optical system according to any one of claims 8 to 13, 前記薄膜は多層膜を含み、  The thin film includes a multilayer film, 前記補正膜形成工程は、 前記多層膜の最も外側の層の膜厚の 1 5 %以下の補正 量を付加することを特徴とする光学系の製造方法。  The method of manufacturing an optical system, wherein the correcting film forming step adds a correction amount of 15% or less of a film thickness of an outermost layer of the multilayer film. 1 5 . 請求の範囲第 1項乃至第 1 4項のいずれか 1項に記載の製造方法によつ て製造されたことを特徴とする光学系。 15. An optical system manufactured by the manufacturing method according to any one of claims 1 to 14. 1 6 . 所定のパターンが形成されたマスクを照明する照明光学系と、 1 6. An illumination optical system for illuminating a mask on which a predetermined pattern is formed, 前記マスクのパターン像を感光性基板に投影するための、 請求の範囲第 1項乃 至第 1 4項のいずれか 1項に記載の製造方法によって製造された光学系とを備え ていることを特徴とする露光装置。  An optical system manufactured by the manufacturing method according to any one of claims 1 to 14 for projecting a pattern image of the mask onto a photosensitive substrate. An exposure apparatus characterized by the following. 1 7 . 請求の範囲第 1 6項に記載の露光装置を用いて前記マスクのパターンを 感光性基板に露光する露光工程と、 17. The pattern of the mask is formed by using the exposure apparatus according to claim 16. An exposure step of exposing the photosensitive substrate, 前記露光工程により露光された前記感光性基板を現像する現像工程とを含むこ とを特徴とするマイクロデバイスの製造方法。  A developing step of developing the photosensitive substrate exposed in the exposing step.
PCT/JP2002/002939 2001-03-27 2002-03-26 Optical system manufacturing method and exposure device having an optical system manufactured by the manufacturing method Ceased WO2002077692A1 (en)

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