WO2002065394A1 - Fingerpirnt image input device having display function - Google Patents
Fingerpirnt image input device having display function Download PDFInfo
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- WO2002065394A1 WO2002065394A1 PCT/JP2002/001242 JP0201242W WO02065394A1 WO 2002065394 A1 WO2002065394 A1 WO 2002065394A1 JP 0201242 W JP0201242 W JP 0201242W WO 02065394 A1 WO02065394 A1 WO 02065394A1
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- WIPO (PCT)
- Prior art keywords
- image input
- fingerprint image
- input device
- light emitting
- housing
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Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
- G09G2300/0809—Several active elements per pixel in active matrix panels
Definitions
- the present invention relates to a fingerprint image input device having a display function.
- the present invention relates to a fingerprint image input device having a display function, and more particularly to a fingerprint image input device having a built-in image display function suitable for application to portable devices such as portable information terminals, mobile phones, and personal computers. is there.
- Conventional technology such as portable information terminals, mobile phones, and personal computers.
- FIG. 17 is a perspective view of a fingerprint image input device disclosed in Japanese Patent No. 2959532 as an example of a conventional capacitance detection type fingerprint image input device.
- This fingerprint image input device includes a signal generation / detection substrate 100 and a high frequency generation source 108.
- the signal generation / detection substrate 100 includes an insulating substrate 101, a signal generating electrode 102 formed in a mesh on the insulating substrate 101, and a plurality of signal detecting electrodes formed in a matrix on the insulating substrate 101. 103, a shift register circuit 109 formed along one side of the insulating substrate 101, and a signal formed along a side orthogonal to the one side on which the shift register circuit 109 is formed.
- the high-frequency generation source 108 is connected to the signal generation electrode 102.
- FIG. 18 is a schematic configuration diagram of the conventional fingerprint image input device shown in FIG. 17, and FIG. 19 shows the capacitance formed in the components of the conventional fingerprint image input device shown in FIG. It is sectional drawing explaining.
- a plurality of thin film transistors (TFT: Thin Film Transistor) Tr are two-dimensionally arranged on the insulating substrate 101.
- a first insulating layer 106 is formed on the insulating substrate 101 so as to cover the plurality of thin film transistors Tr. Further, on the first insulating layer 106, The signal generating electrodes 102 are formed in a net shape.
- a signal detection electrode 103 is arranged in a blank portion between the meshes of the signal generation electrodes 102, and each signal detection electrode 103 is connected to a source electrode of the thin film transistor Tr.
- a second insulating layer 107 is formed so as to cover the signal generating electrode 102 and the signal detecting electrode 103.
- the gate electrodes of all the thin film transistors Tr belonging to the same row are connected to the output terminals of the shift register circuit 109 via the gate electrode wiring 104, and all the thin film transistors T r belonging to the same column are connected.
- the drain electrode of r is connected to the input terminal of the signal detection circuit 110 via the drain electrode wiring 105.
- the tip of the finger F to be input is brought into contact with the surface of the signal generation / detection substrate 100.
- the first output of the shift register circuit 109 is set to the H level, and all the signal detection electrodes 103 belonging to the first row are connected to the signal detection circuit 110 via the drain electrode wiring 105. Electrically connected to
- the signal when a high frequency signal is applied to the signal generating electrode 102 by the high frequency source 108, the signal is detected via the three capacitances C1, C2, and Cd shown in FIG. Charge is applied to the electrode 103.
- the capacitances C l, C 2 and C d are respectively formed between the finger F and the signal detection electrode 103 and between the signal generation electrode 102 and the finger. This is the capacitance formed between the signal generation electrode 102 and the signal detection electrode 103.
- the signal generation electrode 102, the signal detection electrode 103, and the high-frequency signal are designed so that C2 >> C1
- the amount of charge applied to the signal detection electrode 103 is almost electrostatic. It is proportional to the capacity C1.
- the capacitance C 1 is determined by the undulation of the finger F near the signal detection electrode 103, that is, the ridges and valleys
- the output of the signal detection circuit 110 is the output of the finger F in the first row.
- the undulation information that is, the information of the ridges and valleys of the finger F is reflected.
- the fingerprint information obtained by the thin-film transistor Tr in the first row in this manner is externally stored. After recording in the memory, the same operation is repeated for the thin film transistors Tr in the second and subsequent rows, whereby a fingerprint image of the finger F can be obtained.
- the volume, that is, the area and the thickness of the fingerprint image input device be as small as possible.
- an electrostatic fingerprint image input device requires at least an area large enough to press the finger F. Furthermore, considering the ease of pressing the finger F, the fingerprint image input device It is desirable that the area of the device is sufficiently larger than the area of the fingerprint to be input.
- a method has been proposed in which a fingerprint image input device is formed by stacking it on the surface of a liquid crystal display or other display device.
- This has the advantage that the operation of superimposing the actual finger on the figure of the finger displayed on the surface of the display device ensures the fingerprint input operation, and is excellent in usability.
- an insulating substrate 101 of the electrostatic fingerprint image input device shown in Fig. 17 as a transparent substrate made of glass or other transparent material, such a stacked display / image input device is realized. can do.
- this stacked display image input device has the following problems.
- the first problem is that the light use efficiency is low.
- the gate electrode wiring 104 and the drain electrode wiring 105 are opaque. It is difficult to make the light transmittance of the image input device 100% because it is formed of a simple metal material.
- part of the light emitted from the light source is blocked by opaque components such as the gate electrode wiring 104 and the drain electrode wiring 105 of the image input device, and does not reach the observer. For this reason, it is necessary to choose between accepting that the displayed image is dark or accepting an increase in power consumption by increasing the output of the light source.
- the stacked display / image input device has a problem that the light use efficiency is low.
- the second problem is that it is impossible to reduce the thickness of the display image input device.
- the thickness of the stacked display / image input device is the sum of the thicknesses of the stacked components, and it is impossible to further reduce the thickness. For example, if the thickness of a liquid crystal display is 1.4 mm and the thickness of a fingerprint input device is l mm, the thickness of the display image input device will be 2.4 mm, and further reduction in thickness is impossible.
- the third problem is that an increase in the number of manufacturing processes cannot be avoided. If a TFT-type liquid crystal display capable of displaying high-quality images is used, a transparent substrate in which many TFTs are arranged for both the liquid crystal display and the fingerprint image input device is required. A total of 2 boards are required. Therefore, it is not possible to avoid an increase in the manufacturing process and manufacturing time due to the TFT manufacturing, and an increase in the manufacturing cost.
- Japanese Patent No. 2939570/2006 discloses (a) a planar light source, and (b) disposed above the planar light source.
- a photoelectric conversion element that outputs a photoelectric signal in response to light from the planar light source; and a photoelectric conversion element that is provided near the photoelectric conversion element and that turns on and off the photoelectric signal in response to a scanning signal;
- a bias line for supplying a bias voltage to each of the photoelectric change elements, a pixel connection line including a data line and a scan line for transmitting the photoelectric data signal and the scan signal, respectively, and the scan.
- a two-dimensional image sensor comprising: a scanning unit that supplies a signal; and a photoelectric data detecting unit that detects the photoelectric data signal; and (c) the photoelectric conversion element, the switch element, the bias line, and the data line.
- Finger signal generating means for supplying a finger detection signal for detecting the contact of the finger, and (e) finger contact detection means for detecting a change in the finger detection signal in response to the contact of the finger, the two-dimensional image First and second switches for selectively connecting each of the finger signal generation means and the finger contact detection means to one end and the other end of one of the pixel connection lines in response to supply of a control signal; And a switch control means for outputting the control signal corresponding to the detection of the finger contact and the input of the fingerprint image.
- Japanese Patent Application Laid-Open No. H08-305832 discloses an electrode provided on a surface, a detection circuit connected to each of these electrodes and detecting the capacitance of each electrode, and a finger on the surface.
- a fingerprint input device for obtaining an image pattern of ridges and valleys of the fingerprint of the finger according to the magnitude of the capacitance of each electrode detected when the finger is brought into contact with or close to the finger. Has been proposed.
- Japanese Patent Application Laid-Open No. H10_1494446 discloses a data processing circuit for extracting features of image information taken in from a fingerprint detection unit, a feature amount processed by the data processing circuit, and a storage device. Proposed a fingerprint collation device equipped with a comparator for comparing data stored in a device with data whose features have been extracted in advance.
- Japanese Patent Application Laid-Open No. H10-32689 discloses a light-transmitting substrate, a light-emitting substrate that transmits the light-transmitting substrate, and emits light for irradiating an object pressed against the light-transmitting substrate.
- a plurality of light-receiving members provided on the light-transmitting substrate at intervals in the vertical and horizontal directions, for receiving reflected light of light illuminating the subject;
- an image reading apparatus including: reading means for reading an image of a subject;
- Japanese Patent Application Laid-Open No. H11-12553-428 discloses a scanning fingerprint detection system in which an array including capacitive detection elements is provided, wherein the array has a first dimension about the width of a fingerprint, and a fingerprint. A second dimension that is shorter than the length, and each of the capacitive sensing elements has a dimension that is smaller than the width of a fingerprint ridge, and the capacitative sensing element is configured to capture an image of a portion of the fingerprint.
- a scanning fingerprint detection system is proposed in which means are provided for scanning the array, and wherein means are provided for assembling the captured image into a fingerprint image as the fingerprint is moved over the array.
- the present invention has been made in view of the above-described problems of the conventional image input device, and has a thin display function that can be driven with high light use efficiency, consumes low power consumption, and does not cause an increase in the number of manufacturing processes. It is an object of the present invention to provide an image input device incorporating a personal computer. Disclosure of the invention
- the present invention provides a substrate, a plurality of signal detection electrodes arranged on one plane of the substrate, and an arrangement on the same plane as the plane on which the signal detection electrodes are arranged.
- a plurality of light emitting elements for obtaining a fingerprint image by detecting a capacitance formed between the signal detection electrode and a finger; and the light emission according to the capacitance.
- a fingerprint image input device capable of switching a fingerprint image display mode for displaying the fingerprint image by causing the element to emit light.
- the above fingerprint image input device is provided with a protective layer that can be brought into contact with a finger and that covers the signal detection electrode and the light emitting element.
- a part of a wiring for driving the light emitting element is used as a signal wiring for detecting the capacitance. .
- the light emitting elements are arranged in a matrix in a one-to-one correspondence with the signal detection electrodes.
- the fingerprint image input device may include: a plurality of scanning signal wirings arranged on the substrate; a plurality of data signal wirings arranged on the substrate at right angles to the scanning signal wirings; A first switch element connected to the data signal wiring and connected to the signal detection electrode; a second switch element connected to the scanning signal wiring and the data signal wiring; And a current control element connected to the second switch element, wherein the light emitting element is preferably connected in series to the current control element.
- the fingerprint image input device includes: a power supply line disposed on the substrate; and a ground line disposed on the substrate.
- the light emitting element and the current control element are connected in series. And the other side is preferably connected to the ground wiring.
- the fingerprint image input device further includes a signal generation electrode to which either the power supply wiring or the ground wiring is connected when the fingerprint image is input, and the signal generation electrode includes a high-frequency signal. Is preferably applied.
- a scanning signal overlapping with another scanning signal wiring adjacent to the scanning signal wiring for a predetermined time is sequentially applied to each of the inspection signal wirings.
- the above fingerprint image input device may include a mode switching switch element, a display driving circuit to which one end of the data signal wiring is connected via the mode switching switch element, and the other end of the data signal wiring. It is preferable to include an image input detection circuit connected via a mode switching switch element, and a display / image input drive circuit connected to one end of the scanning signal wiring.
- the display drive circuit, the image input detection circuit, and the display image input drive circuit are formed of a thin film transistor formed on the substrate. Is preferred.
- the light emitting element is formed using an organic electroluminescent material.
- the substrate is a transparent substrate
- the lower electrode of the light emitting element is formed of a transparent conductive film
- light emitted from the light emitting element is radiated from the back surface of the substrate.
- an upper electrode of the light emitting element is formed of a transparent conductive film, and that light emitted from the light emitting element is emitted above the substrate.
- the lower electrode or the electrode opposite to the upper electrode is formed of a metal material having a high light reflectance.
- the fingerprint image input device can be applied to various devices.
- the invention provides a first housing, a second housing connected to the first housing via a hinge mechanism so as to be foldable, and the fingerprint image input device described above.
- the fingerprint image input device is configured such that when the first housing and the second housing are folded together, the fingerprint image input surface of the substrate is the first housing or the second housing. It is incorporated in one of the first housing and the second housing so that either one of the outside and the inside of the body faces and the fingerprint image display surface of the substrate faces the other. Provide equipment.
- the present invention provides a first housing, and the first housing, the first housing being interconnected via a hinge mechanism. And a fingerprint image input device as described above, wherein the fingerprint image input device connects the first housing and the second housing to each other.
- the first housing so that when folded, the fingerprint image input surface and the fingerprint image display surface of the substrate face either the outside or the inside of the first housing or the second housing.
- a device incorporated in any one of the second housings As such a device, for example, a mobile phone device can be selected.
- the present invention further includes a step of touching a finger on the one plane of the fingerprint image input device in which a plurality of signal detection electrodes are arranged on one plane of a substrate; and forming between the signal detection electrode and the finger. Providing a fingerprint image by detecting a capacitance of the fingerprint image.
- the present fingerprint image input method may be configured according to the capacitance.
- the method further includes the step of displaying the fingerprint image by causing the light emitting element to emit light.
- FIG. 1 is a perspective view of an image input device according to a first embodiment of the present invention.
- FIG. 2 is a plan view (FIG. 2A) of a unit pixel and an equivalent circuit diagram thereof (FIG. 2B) in the image input device according to the first embodiment of the present invention.
- FIG. 3 is a sectional view of a unit pixel in the image input device according to the first embodiment of the present invention.
- FIG. 4 is a sectional view (FIG. 4 (A)) and an equivalent circuit diagram (FIG. 4 (B)) for explaining the capacitance formed in the image input device according to the first embodiment of the present invention.
- FIG. 5 is a timing chart for explaining the operation of the image input apparatus according to the first embodiment of the present invention.
- FIG. 6 is a cross-sectional view (FIG. 6 (A)) and a plan view (FIG. 6 (B)) showing one manufacturing process stage of the image input device according to the first embodiment of the present invention.
- FIG. 7 is a cross-sectional view (FIG. 7 (A)) and a plan view (FIG. 7 (B)) showing one manufacturing process stage of the image input device according to the first embodiment of the present invention.
- FIG. 8 is a cross-sectional view (FIG. 8 (A)) and a plan view (FIG. 8 (B)) showing one manufacturing process stage of the image input device according to the first embodiment of the present invention.
- FIG. 9 is a cross-sectional view (FIG. 9 (A)) and a plan view (FIG. 9 (B)) showing one manufacturing process stage of the image input device according to the first embodiment of the present invention.
- FIG. 10 is a sectional view (FIG. 10 (A)) for explaining the capacitance formed in the image input device according to the second embodiment of the present invention and an equivalent circuit diagram thereof (FIG. 10 (B)).
- FIG. 11 is a cross-sectional view (FIG. 11 (A)) for explaining the capacitance formed in the image input device according to the third embodiment of the present invention and its equivalent circuit diagram (FIG. 11 (B)).
- FIG. 12 is an evening timing chart for explaining the operation of the image input device according to the third embodiment of the present invention.
- FIG. 13 is a plan view (FIG. 13 (A)) and a sectional view (FIG. 13 (B)) of a unit pixel in the image input device according to the fourth embodiment of the present invention.
- FIG. 14 is a plan view (FIG. 14 (A)), an equivalent circuit diagram (FIG. 14 (B)), and a sectional view (FIG. 1) of a unit pixel in the image input device according to the fifth embodiment of the present invention. 4 (C)).
- FIG. 15 is a perspective view of a mobile phone according to a sixth embodiment of the present invention.
- FIG. 16 is a perspective view of a mobile phone according to a seventh embodiment of the present invention.
- FIG. 17 is a perspective view of a conventional fingerprint image input device of the capacitance detection type.
- FIG. 18 is a configuration diagram of the conventional electrostatic capacitance detection type fingerprint image input device shown in FIG.
- FIG. 19 is a cross-sectional view illustrating the capacitance formed in the conventional capacitance detection type fingerprint image input device shown in FIG. Detailed Description of the Preferred Embodiment
- FIG. 1 is a perspective view of a fingerprint image input device having a display function according to a first embodiment of the present invention.
- the fingerprint image input device 10 includes a transparent substrate 11, a plurality of signal detection electrodes 28 arranged in a matrix on the transparent substrate 11, and a matrix on the transparent substrate 11.
- a plurality of light emitting elements 1 arranged in a matrix, a display drive circuit 2 formed along three sides around the transparent substrate 1, a display Z image input drive circuit 3, and an image input detection A circuit 4, a gate line 18 extending between the display drive circuit 2 and the image input detection circuit 4 so as to partition the formation region of the signal detection electrode 28 and the light emitting element 1, and a display drive circuit 2 ,
- a data line 23 extending perpendicular to the gate line 18, a signal detection electrode 28, a light emitting element 1, a display drive circuit 2, a display / image input drive circuit 3, an image input detection circuit 4,
- a protective layer 29 covering the transparent substrate 11 so as to cover the gate line 18 and the data line 23.
- a GND line 27 is formed on the light emitting element 1, and a signal generating electrode / power supply line 20 is formed alongside the data line 23.
- one pixel as a display device is configured by arranging one red, one green, and two blue light emitting elements in a square shape.
- R, G, and B are added in parentheses after the reference number 1 to indicate the color emitted from the light emitting device. That is, R, G, and B represent red, green, and blue, respectively.
- the reason for using two blue elements is to balance blue with other colors because blue has a lower light quantity or luminance than other red and green elements.
- one signal detection electrode 28 is arranged for one light emitting element 1.
- the display drive circuit 2, display / image input drive circuit 3, and image input detection circuit 4 formed in the peripheral portion of the transparent substrate 1 are formed using a polycrystalline silicon (poly-Si) TFT.
- poly-Si polycrystalline silicon
- the CMOS circuit be configured using both an n-type TFT and a p-type TFT.
- FIG. 2A is a layout diagram showing one light emitting element unit of the pixel shown in FIG. 1, and FIG. 2B is an equivalent circuit diagram thereof.
- the light emitting element 1 includes a transparent electrode 25, a light emitting material layer 26, and a portion of a GND line 27 (see FIG. 3).
- the gate of the first thin film transistor Tr1 for detecting the electric charge applied to the signal detection electrode 28 is connected to the gate line 18, the drain is connected to the data line 23, and the source is connected to the signal detection electrode 28, respectively.
- the gate of the second thin film transistor Tr 2 for charging the capacitor C is connected to the gate line 18, the drain is connected to the data line 23, and the source is connected to one terminal of the capacitor C as described above. It is connected to the gate of the third thin film transistor Tr3.
- the other terminal of the capacitor C and the source of the third thin film transistor Tr 3 are connected to the signal generation electrode / power supply line 20, and the drain of the third thin film transistor Tr 3 is connected to the anode of the light emitting element 1.
- the cathode of the light emitting element 1 is connected to the GND line 27.
- the circuit that constitutes the pixel is connected to four types of wiring, namely, GND line 27, gate line 18, power supply line 20 also serving as signal generating electrode, and data line 23.
- GND line 27 GND line 27
- gate line 18 power supply line 20 also serving as signal generating electrode
- data line 23 data line 23.
- Some of these wires, that is, the gate line 18 and the data line 23, are common in both the display mode in which display is performed by the light emitting element 1 and the image input mode in which the charge of the signal detection electrode 28 is detected.
- the signal generation electrode / power supply line 20 is used as a power supply line in the display mode and as a signal generation electrode in the image input mode.
- the layout in which one wiring is used in both the display mode and the image input mode in this way is to reduce the area occupied by the wiring and increase the area of the signal detection electrode 28 and the light emitting element 1. This is to make it possible.
- FIG. 3 is a cross-sectional view showing main components of the image input device 10 according to the first embodiment of the present invention.
- FIG. 3 is a diagram for easily illustrating the state of the light emitting element 1 and the signal detection electrode 28 and the thin film transistor connected to them, and is not necessarily the configuration of the layout diagram shown in FIG. No match.
- the light emitting element 1 has a light emitting material layer 26 formed of an organic EL material as a light emitting layer, and a transparent electrode 25 as a lower electrode of the light emitting material layer 26 as one electrode (anode).
- the GND line 27 formed so as to cover the material layer 26 is configured as the other electrode (negative electrode).
- the transparent electrode 25 which is the lower electrode of the light emitting element 1, is connected to one of the source / drain regions 15 of the third thin film transistor Tr 3 via the source electrode 21.
- the signal detection electrode 28 is connected to one of the source / drain regions 15 of the first thin film transistor Tr 1 via the source electrode 22.
- a thin film transistor adopts a top gate type polycrystalline silicon (p0y-Si) TFT structure in which a gate electrode is formed on a channel region.
- the gate wiring 17 and the power supply line 20 also serving as a signal generating electrode overlap with the first interlayer insulating film 19 interposed therebetween in the region shown in FIG. 2A.
- the capacitor C is formed.
- FIG. 4B is a circuit diagram showing a circuit configuration of the image input device according to the first embodiment of the present invention. It is a road map.
- the gate line 18 is derived from the display Z image input drive circuit 3, and one end of the data line 23 is connected to the sixth thin film transistor Tr 6 in the display drive circuit 2 and the other end is connected to the image input detection circuit 4. It is connected to the seventh thin film transistor Tr7.
- # 2 n to # 2 (n + 1) are assigned to the gate line 18, and # 2m to # 2 (m + 1) are assigned to the data line 23 and the circuit corresponding to each data line. Numbered.
- the sixth thin-film transistor Tr 6 and the seventh thin-film transistor Tr 7 provided in the display driving circuit 2 and the image input detection circuit 4 are switches for switching between the display mode and the image input mode, respectively. Only one of the circuits is electrically connected to the data line 23 by the switching signals DI SP and DI SPbar.
- the mode switching signal DI SP is set to the H level, all the data lines 23 are connected to the display drive circuit 2, and then the video signal to be displayed from the display drive circuit 2 is displayed.
- the data lines 23 # 2m to # 2 (m + 1) are supplied to the data lines 23 # 2m to # 2 (m + 1) one row at a time.
- the mode switching signal DISPbar becomes H level, and all the data lines 23 are electrically connected to the image input detection circuit 4.
- the image input detection circuit 4 includes amplifiers AMP 2m to # 2 (m + 1) connected to the individual data lines 23. The outputs of these amplifiers 2m to # 2 (m + 1) are configured to be sequentially output to the outside by running signals CLM2m to # 2 (m + 1).
- the display Z image input driving circuit 3 sequentially switches the first thin film transistor Tr1 and the second thin film transistor Tr2 sharing the gate line one row at a time in both the display mode and the image input mode. It is configured to be selectable.
- a characteristic point of the image input device is that two kinds of voltages, POWER (power supply voltage) and CHARGE (high-frequency signal), are switched by the fourth thin film transistor Tr 4 and the fifth thin film transistor Tr 5 to generate a signal. Marked on electrode / power line 20 This is the point that the configuration is added.
- FIG. 4A is a cross-sectional view for explaining the capacitance formed in the image input device according to the present embodiment
- FIG. 5 is an image input device according to the first embodiment of the present invention.
- 3 is a timing chart for explaining the operation of FIG.
- the power supply voltage POWER is applied to the signal generating electrode / power supply line 20, and when the image input mode is selected, the signal generating electrode is used.
- a high-frequency signal CHARGE is applied to the dual-purpose power line 20.
- a display operation of the fingerprint image input device 10 will be described.
- the fourth thin film transistor Tr 4 becomes ⁇ N
- the fifth thin film transistor Tr 5 becomes 0 FF
- all the power sources that also serve as signal generating electrodes P ⁇ WER is applied to line 20.
- POWER is the power supply voltage for all light emitting elements 1 (R), 1 (G), and 1 (B). Usually, it is a constant DC voltage of about 5 V to 10 V.
- All output circuits of the display drive circuit 2 are electrically connected to the corresponding data lines 23.
- the display image input driving circuit 3 sequentially supplies the row scanning signals ROW to the gate lines 18 and the second thin film transistors Tr 2 of all the pixels sharing the gate lines 18. Is made conductive.
- the timing chart of FIG. 5 shows signals before and after selecting the row scanning signals R ⁇ W # 2 n to # 2 (n + 1).
- the light emitting elements of these pixels According to the resistance value of the third thin film transistor Tr 3 (the resistance value corresponding to the video signal), a current is supplied from the power line 20 also serving as the signal generation electrode, and the light emitting elements 1 (R), 1 (G), and 1 Light is emitted from (B).
- a capacitance C 2 is provided between the signal generating electrode and power supply line 20 and the finger F, and a capacitance C 1 is provided between the finger F and the signal detection electrode 28. It is formed. Further, a capacitance C d is also formed between the signal generating electrode power supply line 20 and the signal detecting electrode 28.
- the fourth thin film transistor Tr4 is turned off, the fifth thin film transistor Tr5 is turned on, and all the power supply lines also serve as signal generating electrodes.
- CHARGE is added to 20.
- the seventh thin film transistor Tr7 is turned on, and all the amplifiers AMP 2m to # 2 (m + 1) of the image input detection circuit 4 have corresponding data lines 23 # 2m to # 2 (m +1).
- the outputs of these amplifiers AMP need only be transferred to an external circuit.
- the read scanning signals CLM # 2 m to # 2 (m + 1) generated by the shift register circuit provided inside the image input detection circuit 4 are supplied to the amplifier AMP.
- This is realized by sequentially providing the ninth thin-film transistor Tr9 connected to the output terminal of the ninth thin film transistor.
- the output OUT of the image input detection circuit 4 becomes the gate lines # 2n to # 2 (n + 1) This reflects the unevenness information of the finger F in the area close to.
- the unevenness information of the finger F that is, a fingerprint image can be obtained.
- FIGS. 6 to 9 are cross-sectional views (shown by (A) in each drawing) showing the manufacturing steps of the main components of the pixel portion of the image input device 10 according to the first embodiment of the present invention in the order of steps. It is a top view [in each figure, it shows by (B)]. Note that the cross-sectional view (B) shows a state near the first thin-film transistor Tr1 and the third thin-film transistor Tr3 in an easily understandable manner, and is not necessarily drawn to match an actual layout.
- the manufacturing process is broadly divided into a pre-process for forming a thin film transistor (TFT) and a detection device, and a post-process for forming a light-emitting device using an organic EL material.
- Various thin film transistors can be employed in the manufacturing process of the thin film transistor (TFT) and the detection element as a pre-process.
- a top gate type polycrystalline silicon (p 01 y-Si) TFT will be described as an example.
- a layer made of tungsten silicide (WS i) or another refractory metal silicide material is formed on a glass or other transparent substrate 11 by the Spack method.
- This refractory metal silicide material layer is patterned by photolithography, and a light-shielding layer 12 is formed on the transparent substrate 11 as shown in FIG.
- the light-shielding layer 12 is formed from tungsten silicide (WSi)
- the thickness of the light-shielding layer 12 is set in the range of 100 to 200 nm.
- oxygen and silicon-containing gas e.g., silane (S i H 4)
- a CVD method to deposit onto a substrate and then decomposed in a plasma, silicon dioxide (S i 0 2) or Ranaru Paglia layer 13 Form on one side.
- a layer 13 prevents an impurity element contained in transparent substrate 11 from diffusing into a layer above transparent substrate 11 during a subsequent process.
- the thickness of the barrier layer 13 is 300 to 500 nm.
- an amorphous silicon (aSi) layer which is a precursor of the p01ySi layer, is formed on the layer 13 by a plasma CVD method, a low pressure CVD method, or a sputtering method to a thickness of about 100 nm.
- the amorphous silicon (aSi) layer is irradiated with a very short pulse light of several tens of nanoseconds from the excimer laser to instantaneously melt the amorphous silicon (a-Si) layer, thereby converting the amorphous silicon (aSi) layer to polysilicon ( Reform to P 01 yS i) layer. It is known that when the irradiation energy density at this time is set to around 40 OmJ / cm 2 , a po 1 yS i TFT with good characteristics can be obtained.
- the poly-Si layer is patterned by photolithography to form an island-shaped P 01 y-Si layer in the TFT forming region.
- a silicon dioxide (Si 2 ) film having a thickness of about 50 nm is deposited to form a gate insulating film 16, and a tungsten silicide (WS i) having a thickness of about 20 Onm is formed on the gate insulating film 16.
- a layer is formed by sputtering, etc.
- the gate wiring 17 and the gate line 18 are formed by patterning a tungsten silicide (WS i) layer.
- high-concentration phosphorus (P) or boron (B) is selectively introduced into the island-shaped p 0 1 y-Si layer by ion doping.
- the transparent substrate 11 is heated to a temperature of about 500 degrees Celsius to activate the introduced impurity elements.
- the concentration of the impurity element, the heating time, the temperature, and other process conditions are important, and these process conditions are determined so that an atomic contact with the wiring material to be formed later is obtained. .
- the region doped with the impurity at a high concentration becomes the source / drain region 15, and the region not doped with the impurity element becomes the channel region 14.
- the structure shown in the cross-sectional view of FIG. 6 (FIG. 6A) and the plan view of FIG. 6B is formed.
- the light-shielding layer 12 and the insulating film 16 below the TFT are not shown.
- the gate wiring 17 serving as the gate electrode of the third thin film transistor Tr3 is extended to a region which will later serve as the lower electrode of the capacitor C.
- a first interlayer insulating film 1-9 composed of silicon dioxide (S i 0 2) on the entire surface by plasma CVD method.
- contact holes are made in the first interlayer insulating film 19 and the gate insulating film 16 to deposit chromium (Cr) and other low-resistance metal materials.
- the metal material is patterned to form a power supply line 20 also serving as a signal generation electrode, source electrodes 21 and 22 and a data line 23. At this time, the connection between the source region of the second thin film transistor Tr2 and the gate wiring 17 is achieved.
- a second interlayer insulating film 24 is formed on the entire surface, and then contact is made on the source electrodes 21 and 22 by lithography and etching. Open a hole and sputter indium tin oxide (ITO) over the entire surface.
- ITO indium tin oxide
- the ITO is patterned by lithography and etching to form a transparent electrode 25 in a region to be a lower electrode (anode) of the light emitting device 1.
- the ITO used as the transparent electrode 25 has a sheet resistance of about 2 ⁇ / b and a thickness of about 100 nm.
- a light emitting material layer 26 made of an organic EL material is formed.
- the light-emitting material layer 26 has a two-layer structure including a light-emitting layer and a hole injection / transport layer, a three-layer structure including an electron injection / transport layer, or a structure in which a thin insulating film is disposed at the interface with a metal electrode Can be adopted. That is, in FIG. 8A, the light-emitting material layer 26 is simply shown as the light-emitting material layer 26, but the light-emitting material layer 26 is an organic film that can be formed by a multilayer film.
- a spin coating method, a vacuum evaporation method, or an ink jet printing method can be used as a method for manufacturing the light emitting material layer 26 .
- a polymer or low molecular organic EL material is used as a method for manufacturing the light emitting material layer 26 . Selection, base structure, method of manufacturing upper electrode, and other manufacturing conditions are determined.
- the light-emitting material layer 26 has a two-layer structure of a light-emitting layer and a hole transport layer.
- the material of the hole injection / transport layer include a triarylamine derivative and an oxaziazole derivative.
- a porphyrin derivative can be selected.
- a material of the light emitting layer for example, a metal complex of 8-hydroxyquinoline and its derivative, a tetrafu: nilbutadiene derivative or a distyraryl derivative can be selected.
- Each of the light emitting layer and the hole transport layer is formed by laminating each to a thickness of about 50 nm by a vacuum evaporation method.
- the light-emitting material layer 26 is patterned so as to substantially cover the transparent electrode 25.
- the light-emitting material layer 26 is a layer made of an insulating material, However, patterning is not necessarily required, and the transparent substrate 11 may be formed so as to cover the entire surface.
- the image input device 10 according to the present embodiment is applied to a color display, at least three types of light emitting material layers and their separation are necessary, so that the patterning of the light emitting material layer 26 is required. is necessary.
- a cathode of the light-emitting element 1 aluminum-lithium alloy A1Li or another material having a low work function is vacuum-deposited to a thickness of about 200 nm through a metal shadow mask to emit light.
- a GND line 27 serving as a cathode of the element 1 is formed.
- a signal detection electrode 28 is simultaneously formed on the first thin film transistor Tr1 side. Is done.
- a material used for the cathode of the light emitting element 1 a material having a high work function and a high light reflectance is more preferable.
- a plasma CVD method and other film-forming methods are used to deposit Si ON, Si N x, Si 2 and other inorganic materials to a thickness of about 1 m on the entire surface.
- the protective layer 29 can be formed using an organic material having low oxygen permeability such as an ethylene 'vinyl alcohol' copolymer or a silane-modified fluororesin.
- the image input device 10 As described above, according to the image input device 10 according to the present embodiment, approximately 100% of the light emitted from the light emitting element 1 can be used for display. Therefore, the fingerprint image according to the present embodiment formed using a glass or other transparent substrate 11 is compared with a conventional multi-layer display image input device configured to be stacked on a liquid crystal display or other display device.
- the input device 10 has a high light use efficiency, and as a result, an effect of reducing power consumption can be obtained.
- the thickness of the image input device 10 according to the present embodiment is almost determined by the thickness of the substrate. Therefore, when a glass substrate used in a normal TFT process is used, the thickness is about 0.7 mm. In other words, the thickness of the conventional multi-layer display / image input device shown in FIG. 17 is much thinner than the thickness of about 2.4 mm. This is a great advantage when the image input device according to the present embodiment is built in a portable device or the like.
- a transparent substrate on which a large number of TFTs are arranged is also required for a fingerprint image input device. Therefore, a total of two substrates that have undergone the TFT manufacturing process are required.
- the image input device 10 according to the present embodiment only one substrate having undergone the TFT manufacturing process is sufficient. Therefore, according to the image input device 10 according to the present embodiment, The manufacturing process and manufacturing time for TFTs can be reduced, and the manufacturing cost can be reduced.
- the power supply line was used as the signal generating electrode.
- the 0 line 27 and the gate line 18 were used.
- a GND line is also used as a signal generation electrode instead of a power supply line.
- FIG. 10A is a cross-sectional view illustrating a capacitance formed in the image input device according to the second embodiment of the present invention.
- a capacitance C 1 is provided between the finger F and the signal detection electrode 28, and a capacitance C 1 is provided between the finger F and the signal generation electrode / GND line 27a.
- a capacitance C d is formed between the signal generating electrode and GND line 27 and the signal detecting electrode 28.
- FIG. 10B is a circuit diagram illustrating a circuit configuration of the image input device according to the second embodiment of the present invention.
- the difference from the circuit configuration of the first embodiment is that the power supply voltage 'POWER is always applied to the power supply line 20a, and the display mode or the image input mode is applied to the signal generation electrode / GND line 27a.
- the only difference is that either the ground voltage GND or the high-frequency signal CHA RGE is applied, and the other circuit configuration is the same as the circuit configuration of the first embodiment.
- the operation of the image input device according to the present embodiment is substantially the same as that of the first embodiment.
- the signal generation electrode / power supply line 20 is connected to the signal generation electrode. It can be read as a combined GND line 27a.
- the power supply line is used as the signal generating electrode
- the GND line is used as the signal generating electrode
- the signal generating electrode is used as the signal generating electrode.
- FIG. 11A is a cross-sectional view illustrating a capacitance formed in the image input device according to the third embodiment of the present invention.
- a capacitance C 1 is provided between the finger F and the signal detection electrode 28, and a capacitance C 1 is provided between the finger F and the specific gate line 18A.
- the capacitance C2 is formed between the specific gate line 18A and the signal detection electrode 28, respectively.
- FIG. 11B is a circuit diagram illustrating a circuit configuration of the image input device according to the present embodiment.
- the circuit in the image input device according to the present embodiment differs from the first embodiment in that a constant potential is always applied to the power supply line 20a and the GND line 27.
- This embodiment is characterized by the waveform of the row scanning signal applied to the gate line 18A.
- the gate lines adjacent to each other have a pulse width of 1Z.
- a scanning signal ROW overlapping by two is applied.
- FIG. 12 is a timing chart for explaining the operation of the image input device according to the third embodiment of the present invention.
- the operation of the image input device according to the third embodiment will be described with reference to FIG.
- each amplifier AMP has a voltage value proportional to the charge amount (C1 + Cd) AV. Accordingly, by transferring the outputs of these amplifiers AMP to an external circuit in the same manner as in the above-described embodiment, the unevenness information of the finger F in the region close to the gate line 18 # 2n can be obtained. By repeating this operation for all the gate lines 18, the unevenness information of the finger F, that is, a fingerprint image is obtained.
- the high-frequency signal CHARGE is omitted, and the switching transistors (the fourth thin film transistor Tr 4 and the fifth thin film transistor Tr 5) for selecting between the CHAR GE and the constant potential are omitted.
- Gate line 1 The scanning signals ROW applied to the signal 8 overlap each other with a pulse width of 1 Z2, and the voltage corresponding to the combined capacitance of the signal detection electrodes 28 is read at the switching timing. Therefore, according to the image input device according to the present embodiment, a fingerprint image input device with a display function can be realized with a simpler configuration than the image input device according to the first embodiment.
- the light emitting element 1 is configured to emit light in a direction transmitting the transparent substrate 11. Therefore, the surface on which the image is displayed is the surface opposite to the surface on which the fingerprint is input. As described later, there are cases where it is desired to realize image display and fingerprint image input on the same surface depending on the application form.
- Such a device can be realized by forming the top emission type element by exchanging the arrangement of the transparent electrode and the metal electrode sandwiching the organic EL material.
- FIG. 13 is a plan view (FIG. 13 (A)) and a cross-sectional view (FIG. 13 (B)) of an image input device according to a fourth embodiment of the present invention.
- FIG. 13 is a plan view (FIG. 13 (A)) and a cross-sectional view (FIG. 13 (B)) of an image input device according to a fourth embodiment of the present invention.
- components having the same functions as those of the first embodiment are denoted by the same reference numerals.
- the light emitting element 1 formed on the insulating substrate 11a is formed by laminating a metal electrode 30, an organic EL material layer 26, and a transparent electrode 25 in this order.
- the insulating substrate 11a does not need to be transparent.
- the transparent electrode 25 also serves as a GND line. Therefore, the circuit configuration is the same as that of the second embodiment.
- the light emitting element 1 is configured to be connected to the GND line side, but may be connected to the power supply line side.
- a configuration in which the image display surface and the fingerprint image input surface are matched is realized by connecting the light emitting element to the power supply line side. are doing.
- FIGS. 14A, 14B, and 14C are a plan view, a circuit diagram, and a cross-sectional view, respectively, showing a main part of an image input device according to a fifth embodiment of the present invention.
- the same components as those of the fourth embodiment are denoted by the same reference numerals.
- the source of the third thin film transistor Tr3 is connected to the GND line 27b also serving as a signal generation electrode. Then, in a region where the signal generating electrode / common GND line 27b and the gate wiring 17 overlap, a capacitor C is formed using the first interlayer insulating film 19 as a dielectric layer.
- a metal electrode 30 serving as a cathode is formed below the light emitting material layer 26, and a transparent electrode 25 serving as an anode is formed above the light emitting material layer 26.
- the transparent electrode 25 extends in the row direction to form a power line 20a. That is, in the present embodiment, the GND line 27 b extends in the column direction, and the power supply line 20 a extends in the row direction.
- the operation of the image input device according to the present embodiment is the same as that of the second embodiment.
- the GND line 27b also serves as a signal generating electrode, but the power supply line 20a (transparent electrode 25) may be configured to also serve as a signal generating electrode.
- the fingerprint signals may be obtained by making the scan signals applied to the scans overlap each other by a pulse width of 1 Z2. .,
- the display light is emitted to the back side of the substrate 11a using the upper electrode 25 as a metal electrode and the lower electrode 30 as a transparent electrode. It is also possible. In this case, a transparent substrate is used as the substrate 11a.
- FIG. 15 is a perspective view of a mobile phone 31 according to a sixth embodiment of the present invention.
- the mobile phone 31 includes one of the image input devices according to the first to fifth embodiments. One is installed.
- the mobile phone 31 includes a first housing 35, a second housing 36, a first housing 35, and a second housing. And a hinge mechanism 37 that rotatably connects the end portions 36 with each other at their ends.
- the image input device 10 includes the image input surface 32 of the fingerprint in the state where the mobile phone 31 is folded, and the display surface 3 3 Is implemented so that is inside.
- the mobile phone 31 according to the present embodiment can be used as follows.
- the mobile phone 31 2 1 can be made available.
- the fingerprint can be confirmed through the mobile phone 31 when the service provider authenticates the individual when charging. .
- fingerprints can be used as various payment methods. Further, in the mobile phone 31, since the image input surface 32 and the display surface 33 are separately provided, there is no need to bring a finger into close contact with the display surface 33. Therefore, it is possible to avoid the problem that the image quality of display is deteriorated due to the remaining fingerprints attached to the display surface 33.
- FIG. 16 is a perspective view of a mobile phone 31A according to a seventh embodiment of the present invention.
- the mobile phone 31A has image input devices according to the first to fifth embodiments. Either one is installed.
- the mobile phone 31A includes a first housing 35, a second housing 36, and a first housing, similarly to the mobile phone 31 according to the sixth embodiment. And a hinge mechanism 37 for rotatably connecting the end 35 and the second housing 36 to each other at their ends.
- a fingerprint image input device with a display function in which the fingerprint image display surface and the fingerprint image input surface match each other is mounted. Specifically, as shown in FIG. 16, the fingerprint image is placed on the first housing 35 so that the image input surface and display surface 34 is in the folded state of the mobile phone 31A. Input device is mounted.
- the operation of superimposing the actual finger on the finger figure displayed on the image input surface and display surface 34 is performed by the operation.
- the fingerprint input operation can be performed reliably. Therefore, the stability of fingerprint image input is increased, and the accuracy of personal authentication can be improved.
- the image input / shared display surface 34 is arranged such that the image input / shared display surface 34 is inside when the mobile phone 31A is folded. However, it is also possible to arrange the mobile phone 31A so as to face the outside of the mobile phone 31A.
- Such a function can be realized by switching to the image mode with the actual finger superimposed on the displayed finger figure, or by alternately switching the display mode and the image input mode at high speed. Can be.
- the example of the top gate type po 1 y-Si TFT has been described.
- the circuit can be configured using the bottom gate type p 0 1 y-Si TFT. .
- an a-Si TFT which is widely used in liquid crystal displays, can be used.
- the carrier mobility in a—Si is about 1Z100 of po 1 y—Si
- the resistance must be sufficiently low especially when used as a TFT for supplying current to a light emitting element. Will be needed. For example, by setting the width of the TFT large or reducing the thickness of the gate insulating film, the resistance of the a-Si TFT can be reduced.
- the configuration in which the display driving circuit 2 and the image input detection circuit 4 are formed on the transparent substrate 11 by using a polySi TFT has been described. Is not limited to this.
- TAB Tepe Automated Bonding
- COG Cho On G 1 ass
- a color display can be realized by combining a color filter and a white light-emitting material, or by combining a blue light-emitting material and a color conversion material.
- the fingerprint image input device of the present invention As described above, according to the fingerprint image input device of the present invention, almost 100% of the light emitted from the light emitting element can be used for display, so that the light use efficiency is high, and as a result, However, power consumption can be kept low.
- the area occupied by the wiring can be reduced.
- the area of the light-emitting element can be increased, and a bright display can be realized.
- the thickness of the fingerprint image input device according to the present invention is almost determined by the thickness of the substrate, and when a glass substrate used in a normal TFT process is used as the substrate, the thickness may be about 0.7 mm. It is possible, and a significant reduction in thickness can be achieved. This thinning is a great advantage when the fingerprint image input device according to the present invention is incorporated in a portable device or the like.
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Abstract
A fingerprint image input device has a substrate, signal sensing electrodes arranged on one side of the substrate, and light-emitting elements arranged on the same side of the substrate. The capacitance between the signal sensing electrodes and a finger is measured, and according to the result of the measurement, the mode is switched between a fingerprint input mode for capturing a fingerprint image and a fingerprint image display mode for displaying the fingerprint image by causing the light-emitting elements to emit light depending on the capacitance.
Description
明 細 書 表示機能を備えた指紋画像入力装置 発明の技術分野 TECHNICAL FIELD The present invention relates to a fingerprint image input device having a display function.
本発明は、 表示機能を備えた指紋画像入力装置に関し、 特に、 携帯情報端末、 携帯電話、 パーソナルコンピュータなどの携帯機器への適用に適した画像表示機 能を内蔵した指紋画像入力装置に関するものである。 従来の技術 The present invention relates to a fingerprint image input device having a display function, and more particularly to a fingerprint image input device having a built-in image display function suitable for application to portable devices such as portable information terminals, mobile phones, and personal computers. is there. Conventional technology
人を個別に識別する手段の一つとして指紋を用いる方法が従来から広く用いら れており、 その方式の一つとして静電型の指紋画像入力方法が知られている。 従来の静電容量検出方式の指紋画像入力装置の例として、 特許 2959532 号公報に開示されている指紋画像入力装置の斜視図を図 17に示す。 A method using a fingerprint has been widely used as one of the means for individually identifying a person, and an electrostatic fingerprint image input method is known as one of the methods. FIG. 17 is a perspective view of a fingerprint image input device disclosed in Japanese Patent No. 2959532 as an example of a conventional capacitance detection type fingerprint image input device.
この指紋画像入力装置は、 信号発生 ·検出基板 100と、 高周波発生源 108 とからなる。 信号発生 ·検出基板 100は、 絶縁性基板 101と、 絶縁性基板 1 01上に網状に形成された信号発生電極 102と、 絶縁性基板 101上にマトリ クス状に形成された複数の信号検出電極 103と、 絶縁性基板 101の一側辺に 沿って形成されたシフトレジスタ回路 109と、 シフトレジスタ回路 109が形 成されている一側辺とは直交する側辺に沿って形成されている信号検出回路 1 1 0と、 からなつており、 高周波発生源 108は信号発生電極 102に接続されて いる。 This fingerprint image input device includes a signal generation / detection substrate 100 and a high frequency generation source 108. The signal generation / detection substrate 100 includes an insulating substrate 101, a signal generating electrode 102 formed in a mesh on the insulating substrate 101, and a plurality of signal detecting electrodes formed in a matrix on the insulating substrate 101. 103, a shift register circuit 109 formed along one side of the insulating substrate 101, and a signal formed along a side orthogonal to the one side on which the shift register circuit 109 is formed. The high-frequency generation source 108 is connected to the signal generation electrode 102.
図 18は、 図 17に示した従来の指紋画像入力装置の概略的な構成図であり、 図 19は、 図 17に示した従来の指紋画像入力装置の構成要素に形成される静電 容量を説明する断面図である。 FIG. 18 is a schematic configuration diagram of the conventional fingerprint image input device shown in FIG. 17, and FIG. 19 shows the capacitance formed in the components of the conventional fingerprint image input device shown in FIG. It is sectional drawing explaining.
図 18及び図 19に示すように、 絶縁性基板 101上には、 複数の薄膜トラン ジス夕 (TFT : Th i n F i lm T r a n s i s t o r ) T rが 2次元的 に配列されている。 絶縁性基板 101上には、 複数の薄膜トランジスタ Trを覆 つて、 第 1絶縁層 106が形成されており、 さらに、 第 1絶縁層 106の上には
信号発生電極 1 0 2が網状に形成されている。 信号発生電極 1 0 2の網目の間の 空白部分には信号検出電極 1 0 3が配置されており、 各信号検出電極 1 0 3は薄 膜トランジスタ T rのソース電極に接続されている。 As shown in FIG. 18 and FIG. 19, a plurality of thin film transistors (TFT: Thin Film Transistor) Tr are two-dimensionally arranged on the insulating substrate 101. A first insulating layer 106 is formed on the insulating substrate 101 so as to cover the plurality of thin film transistors Tr. Further, on the first insulating layer 106, The signal generating electrodes 102 are formed in a net shape. A signal detection electrode 103 is arranged in a blank portion between the meshes of the signal generation electrodes 102, and each signal detection electrode 103 is connected to a source electrode of the thin film transistor Tr.
第 1絶縁層 1 0 6の上には、 信号発生電極 1 0 2及び信号検出電極 1 0 3を覆 つて第 2絶縁層 1 0 7が形成されている。 On the first insulating layer 106, a second insulating layer 107 is formed so as to cover the signal generating electrode 102 and the signal detecting electrode 103.
また、 同一行に属する全ての薄膜トランジスタ T rのゲート電極はゲート電極 用配線 1 0 4を介してシフトレジスタ回路 1 0 9の出力端子に接続されており、 また、 同一列に属する全ての薄膜トランジスタ T rのドレイン電極はドレイン電 極用配線 1 0 5を介して信号検出回路 1 1 0の入力端子に接続されている。 次いで、 図 1 8及び図 1 9を参照して、 図 1 7に示した従来の指紋画像入力装 置の動作を説明する。 The gate electrodes of all the thin film transistors Tr belonging to the same row are connected to the output terminals of the shift register circuit 109 via the gate electrode wiring 104, and all the thin film transistors T r belonging to the same column are connected. The drain electrode of r is connected to the input terminal of the signal detection circuit 110 via the drain electrode wiring 105. Next, the operation of the conventional fingerprint image input device shown in FIG. 17 will be described with reference to FIGS.
指紋を入力するときには、 信号発生 ·検出基板 1 0 0の表面に入力したい指 F の先端領域を接触させる。 When inputting a fingerprint, the tip of the finger F to be input is brought into contact with the surface of the signal generation / detection substrate 100.
その後、 シフトレジスタ回路 1 0 9の一番目の出力を Hレベルにして、 第 1行 目に属する全ての信号検出電極 1 0 3をドレイン電極用配線 1 0 5を介して信号 検出回路 1 1 0に電気的に接続する。 After that, the first output of the shift register circuit 109 is set to the H level, and all the signal detection electrodes 103 belonging to the first row are connected to the signal detection circuit 110 via the drain electrode wiring 105. Electrically connected to
ここで、 高周波発生源 1 0 8により信号発生電極 1 0 2に高周波信号を印加す ると、 図 1 9に示した 3つの静電容量 C 1、 C 2、 C dを介して、 信号検出電極 1 0 3に電荷が投入される。 静電容量 C l、 C 2、 C dは、 それぞれ、 指 Fと信 号検出電極 1 0 3との間に形成される静電容量、 信号発生電極 1 0 2と指 との 間に形成される静電容量、 信号発生電極 1 0 2と信号検出電極 1 0 3との間に形 成される静電容量である。 Here, when a high frequency signal is applied to the signal generating electrode 102 by the high frequency source 108, the signal is detected via the three capacitances C1, C2, and Cd shown in FIG. Charge is applied to the electrode 103. The capacitances C l, C 2 and C d are respectively formed between the finger F and the signal detection electrode 103 and between the signal generation electrode 102 and the finger. This is the capacitance formed between the signal generation electrode 102 and the signal detection electrode 103.
ここで、 C 2》C 1となるように、 信号発生電極 1 0 2、 信号検出電極 1 0 3 及び高周波信号を設計すれば、 信号検出電極 1 0 3に投入される電荷量はほぼ静 電容量 C 1に比例する。 静電容量 C 1は信号検出電極 1 0 3の近傍における指 F の起伏、 すなわち、 隆線及び谷線により決定されるので、 信号検出回路 1 1 0の 出力は、 第 1行における指 Fの起伏の情報、 すなわち、 指 Fの隆線及び谷線の情 報を反映する。 Here, if the signal generation electrode 102, the signal detection electrode 103, and the high-frequency signal are designed so that C2 >> C1, the amount of charge applied to the signal detection electrode 103 is almost electrostatic. It is proportional to the capacity C1. Since the capacitance C 1 is determined by the undulation of the finger F near the signal detection electrode 103, that is, the ridges and valleys, the output of the signal detection circuit 110 is the output of the finger F in the first row. The undulation information, that is, the information of the ridges and valleys of the finger F is reflected.
このようにして第 1行の薄膜トランジスタ T rにより得られた指紋情報を外部
メモリに記録した後、 第 2行目以降の薄膜トランジスタ T rについて同様の操作 を繰り返すことにより、 指 Fの指紋画像を得ることができる。 The fingerprint information obtained by the thin-film transistor Tr in the first row in this manner is externally stored. After recording in the memory, the same operation is repeated for the thin film transistors Tr in the second and subsequent rows, whereby a fingerprint image of the finger F can be obtained.
指紋画像入力装置を携帯電話や携帯情報端末などの携帯機器に搭載する場合、 指紋画像入力装置の体積、 すなわち、 面積および厚さはできる限り小さいことが 望ましい。 When the fingerprint image input device is mounted on a portable device such as a mobile phone or a portable information terminal, it is desirable that the volume, that is, the area and the thickness of the fingerprint image input device be as small as possible.
ところが、 静電型の指紋画像入力装置は少なくとも指 Fを押し当てることがで きる程度の大きさの面積が必要であり、 さらに、 指 Fを押し当てる行為の容易さ を考慮すると、 指紋画像入力装置の面積は入力すべき指紋の面積よりも十分に大 きいことが望ましい。 However, an electrostatic fingerprint image input device requires at least an area large enough to press the finger F. Furthermore, considering the ease of pressing the finger F, the fingerprint image input device It is desirable that the area of the device is sufficiently larger than the area of the fingerprint to be input.
このように互いに矛盾する要求に対する解決策として、 液晶ディスプレイその 他の表示装置の表面に指紋画像入力装置を積層して形成する方法が提案されてい る。 これは、 表示装置の表面に表示された指の図形に実際の指を重ねるという動 作により、 指紋入力の動作を確実にするという利点があり、 使い勝手の面も優れ ている。 図 1 7に示した静電型指紋画像入力装置の絶縁性基板 1 0 1をガラスそ の他の透明材料からなる透明基板とすることにより、 このような積層型の表示/ 画像入力装置を実現することができる。 As a solution to such contradictory requirements, a method has been proposed in which a fingerprint image input device is formed by stacking it on the surface of a liquid crystal display or other display device. This has the advantage that the operation of superimposing the actual finger on the figure of the finger displayed on the surface of the display device ensures the fingerprint input operation, and is excellent in usability. By using an insulating substrate 101 of the electrostatic fingerprint image input device shown in Fig. 17 as a transparent substrate made of glass or other transparent material, such a stacked display / image input device is realized. can do.
しかしながら、 この積層型の表示ノ画像入力装置には以下に述べるような問題 点があった。 However, this stacked display image input device has the following problems.
第 1の問題点は光の利用効率が低いという点である。 The first problem is that the light use efficiency is low.
例えば、 図 1 8に示すように、 たとえ信号発生電極 1 0 2及び信号検出電極 1 0 3を透明材料で形成したとしても、 ゲート電極用配線 1 0 4及びドレイン電極 用配線 1 0 5は不透明な金属材料で形成されるため、 画像入力装置の光の透過率 を 1 0 0 %とすることは困難である。 For example, as shown in FIG. 18, even if the signal generating electrode 102 and the signal detecting electrode 103 are formed of a transparent material, the gate electrode wiring 104 and the drain electrode wiring 105 are opaque. It is difficult to make the light transmittance of the image input device 100% because it is formed of a simple metal material.
従って、 光源から発せられた光の一部は画像入力装置のゲート電極用配線 1 0 4及びドレイン電極用配線 1 0 5などの不透明な構成要素に遮られて、 観察者に 至らない。 そのため、 表示画像が暗いのを容認するか、 あるいは、 光源の出力を 上げて消費電力の増大を容認するかの 2者択一に迫られる。 Therefore, part of the light emitted from the light source is blocked by opaque components such as the gate electrode wiring 104 and the drain electrode wiring 105 of the image input device, and does not reach the observer. For this reason, it is necessary to choose between accepting that the displayed image is dark or accepting an increase in power consumption by increasing the output of the light source.
このように、 積層型の表示/画像入力装置には、 光の利用効率が低いという問 題点があった。
第 2の問題点は、表示ノ画像入力装置の薄型化が不可能であるという点である。 積層型の表示/画像入力装置の厚さは積層されている各構成要素の厚さの和に なり、 それ以上の薄型化は不可能である。 例えば、 液晶ディスプレイが 1 . 4 m m、 指紋入力装置が l mmの厚さである場合、 表示 画像入力装置の厚さは 2. 4 mmとなり、 これ以上の薄型化は不可能である。 As described above, the stacked display / image input device has a problem that the light use efficiency is low. The second problem is that it is impossible to reduce the thickness of the display image input device. The thickness of the stacked display / image input device is the sum of the thicknesses of the stacked components, and it is impossible to further reduce the thickness. For example, if the thickness of a liquid crystal display is 1.4 mm and the thickness of a fingerprint input device is l mm, the thickness of the display image input device will be 2.4 mm, and further reduction in thickness is impossible.
第 3の問題点は、 製造工程の増加を回避することができないという点である。 高画質の画像表示が可能な T F T方式の液晶ディスプレイを採用する場合、 液 晶ディスプレイと指紋画像入力装置の双方に対して T F Tを多数配列した透明基 板が必要となるため、 T F Tの製造工程を経た基板が合計 2枚必要となる。 従つ て、 T F T製作に起因する製造工程及び製造時間の増加、 ひいては、 製造コスト の上昇を回避することができない。 The third problem is that an increase in the number of manufacturing processes cannot be avoided. If a TFT-type liquid crystal display capable of displaying high-quality images is used, a transparent substrate in which many TFTs are arranged for both the liquid crystal display and the fingerprint image input device is required. A total of 2 boards are required. Therefore, it is not possible to avoid an increase in the manufacturing process and manufacturing time due to the TFT manufacturing, and an increase in the manufacturing cost.
上記の特許第 2 9 5 9 5 3 2号公報の他に、 特許第 2 9 3 7 0 4 6号公報は、 ( a )平面状光源と、 (b )前記平面状光源の上方に配置され、前記平面状光源か らの光に応答して光電信号を出力する光電変換素子と、 前記光電変換素子の近傍 に設けられ、 走査信号に応答して、 前記光電信号をオンオフし、 光電データ信号 を出力するスイツチ素子と、 前記光電変化素子の各々にバイァス電圧を供給する バイアス線と、 前記光電データ信号及び前記走査信号をそれぞれ伝達するデータ 線及び走査線とを含む画素接続線と、 前記走査信号を供給する走査手段と、 前記 光電データ信号を検出する光電データ検出手段と、 を有する 2次元イメージセン ザと、 (c )前記光電変換素子と前記スィツチ素子と前記バイアス線及び前記デー タ線以外の透明部分である開口部を透過した光を導いて指紋画像入力対象の指を 照射し、 この指からの反射光を前記光電変換素子に導く光学手段と、 (d )前記 2 次元イメージセンサの表面に対する前記指の接触検出用の指検出信号を供給する 指信号発生手段と、 (e )前記指の接触に応答した前記指検出信号の変化を検出す る指接触検出手段と、 を備え、 前記 2次元イメージセンサが、 制御信号の供給に 応答して前記画素接続線の一つの一端及び他端の各々に前記指信号発生手段及び 前記指接触検出手段の各々を選択的に接続する第一及び第二スィツチ手段と、 前 記指接触検出時と指紋画像入力時とに対応する前記制御信号を出力するスィッチ 制御手段と、 を備える指紋画像入力装置を提案している。
特開平 8— 3 0 5 8 3 2号公報は、 表面に配列された電極と、 これらの電極の 各々に接続され、 各電極の静電容量を検出する検出回路とを備え、 前記表面に指 を接触させ、 または、 近づけたときに検出された各電極毎の静電容量の大小によ つて、 前記指の指紋の隆線と谷線との画像パターンを得ることを特徴とする指紋 入力装置を提案している。 In addition to the above-mentioned Japanese Patent No. 29595332, Japanese Patent No. 2939570/2006 discloses (a) a planar light source, and (b) disposed above the planar light source. A photoelectric conversion element that outputs a photoelectric signal in response to light from the planar light source; and a photoelectric conversion element that is provided near the photoelectric conversion element and that turns on and off the photoelectric signal in response to a scanning signal; A bias line for supplying a bias voltage to each of the photoelectric change elements, a pixel connection line including a data line and a scan line for transmitting the photoelectric data signal and the scan signal, respectively, and the scan. A two-dimensional image sensor comprising: a scanning unit that supplies a signal; and a photoelectric data detecting unit that detects the photoelectric data signal; and (c) the photoelectric conversion element, the switch element, the bias line, and the data line. Transparent parts other than Optical means for guiding light transmitted through a certain opening to irradiate a finger to be subjected to a fingerprint image input, and guiding reflected light from the finger to the photoelectric conversion element; and (d) the finger with respect to the surface of the two-dimensional image sensor. Finger signal generating means for supplying a finger detection signal for detecting the contact of the finger, and (e) finger contact detection means for detecting a change in the finger detection signal in response to the contact of the finger, the two-dimensional image First and second switches for selectively connecting each of the finger signal generation means and the finger contact detection means to one end and the other end of one of the pixel connection lines in response to supply of a control signal; And a switch control means for outputting the control signal corresponding to the detection of the finger contact and the input of the fingerprint image. Japanese Patent Application Laid-Open No. H08-305832 discloses an electrode provided on a surface, a detection circuit connected to each of these electrodes and detecting the capacitance of each electrode, and a finger on the surface. A fingerprint input device for obtaining an image pattern of ridges and valleys of the fingerprint of the finger according to the magnitude of the capacitance of each electrode detected when the finger is brought into contact with or close to the finger. Has been proposed.
また、 特開平 1 0 _ 1 4 9 4 4 6号公報は、 指紋検出部から取り込まれた画像 情報の特徴を抽出するデータ処理回路と、 このデータ処理回路で処理された特徴 量と記憶装置内に記憶され、 予め特徴が抽出されたデータとを比較する比較器を 備えた指紋照合装置を提案している。 Also, Japanese Patent Application Laid-Open No. H10_1494446 discloses a data processing circuit for extracting features of image information taken in from a fingerprint detection unit, a feature amount processed by the data processing circuit, and a storage device. Proposed a fingerprint collation device equipped with a comparator for comparing data stored in a device with data whose features have been extracted in advance.
また、 特開平 1 0— 3 2 6 8 9号公報は、 透光性基板と、 この透光性基板を透 過し、 前記透光性基板に押しつけられた被写体を照射する光を発光する発光部材 と、 前記透光性基板に縦横の方向に間隔をおいて設けられ、 前記被写体を照射し た光の反射光を受光する複数の受光部材と、 この受光部材の受光量に基づき、 前 記被写体の画像を読み取る読み取り手段と、 を備える画像読み取り装置を提案し ている。 Japanese Patent Application Laid-Open No. H10-32689 discloses a light-transmitting substrate, a light-emitting substrate that transmits the light-transmitting substrate, and emits light for irradiating an object pressed against the light-transmitting substrate. A plurality of light-receiving members provided on the light-transmitting substrate at intervals in the vertical and horizontal directions, for receiving reflected light of light illuminating the subject; There has been proposed an image reading apparatus including: reading means for reading an image of a subject;
特開平 1 1一 2 5 3 4 2 8号公報は、 走査型指紋検知システムにおいて、 容量 性検知要素からあるアレイが設けられており、 前記アレイは指紋の幅程度の第 1 寸法と、 指紋の長さより短い第 2寸法とを有しており、 かつ、 前記容量性検知要 素の各々が指紋の山の幅よりも小さな寸法を有しており、 指紋の一部のイメージ を取り込むために前記アレイを走査する手段が設けられており、 指紋が前記ァレ ィ上を移動される場合に取り込んだイメージを指紋イメージに組み立てる手段が 設けられている走査型指紋検知システムを提案している。 Japanese Patent Application Laid-Open No. H11-12553-428 discloses a scanning fingerprint detection system in which an array including capacitive detection elements is provided, wherein the array has a first dimension about the width of a fingerprint, and a fingerprint. A second dimension that is shorter than the length, and each of the capacitive sensing elements has a dimension that is smaller than the width of a fingerprint ridge, and the capacitative sensing element is configured to capture an image of a portion of the fingerprint. A scanning fingerprint detection system is proposed in which means are provided for scanning the array, and wherein means are provided for assembling the captured image into a fingerprint image as the fingerprint is moved over the array.
しかしながら、 上記の公報に提案されている装置においても、 上述のような問 題は解決されていない。 However, even with the device proposed in the above publication, the above-mentioned problem has not been solved.
本発明は、 上述した従来の画像入力装置における問題点に鑑みてなされたもの であり、 光の利用効率が高く、 低消費電力で駆動でき、 さらに、 製造工程の増加 をもたらさない薄型の表示機能を内蔵した画像入力装置を提供することを目的と する。
発明の開示 The present invention has been made in view of the above-described problems of the conventional image input device, and has a thin display function that can be driven with high light use efficiency, consumes low power consumption, and does not cause an increase in the number of manufacturing processes. It is an object of the present invention to provide an image input device incorporating a personal computer. Disclosure of the invention
上記の目的を達成するため、 本発明は、 基板と、 前記基板の一平面上に配列さ れた複数の信号検出電極と、 前記信号検出電極が配列された平面と同一平面上に 配列された複数の発光素子と、 を備え、 前記信号検出電極と指との間に形成され る静電容量を検出することにより、 指紋画像を得る指紋画像入力モードと、 前記 静電容量に応じて前記発光素子を発光させることにより、 前記指紋画像を表示す る指紋画像表示モードとが切り替え可能な指紋画像入力装置を提供する。 In order to achieve the above object, the present invention provides a substrate, a plurality of signal detection electrodes arranged on one plane of the substrate, and an arrangement on the same plane as the plane on which the signal detection electrodes are arranged. A plurality of light emitting elements; a fingerprint image input mode for obtaining a fingerprint image by detecting a capacitance formed between the signal detection electrode and a finger; and the light emission according to the capacitance. Provided is a fingerprint image input device capable of switching a fingerprint image display mode for displaying the fingerprint image by causing the element to emit light.
上記の指紋画像入力装置は、 指を接触させることのできる保護層であって、 前 記信号検出電極及び前記発光素子を被覆する保護層を備えていることが好ましい。 上記の指紋画像入力装置においては、 前記指紋画像を入力する際には、 前記発 光素子を駆動するための配線の一部が前記静電容量を検出するための信号用配線 として用いられるが好ましい。 It is preferable that the above fingerprint image input device is provided with a protective layer that can be brought into contact with a finger and that covers the signal detection electrode and the light emitting element. In the above fingerprint image input device, when inputting the fingerprint image, it is preferable that a part of a wiring for driving the light emitting element is used as a signal wiring for detecting the capacitance. .
上記の指紋画像入力装置においては、 前記発光素子は前記信号検出電極と 1対 1に対応してマトリクス状に配置されていることが好ましい。 In the above fingerprint image input device, it is preferable that the light emitting elements are arranged in a matrix in a one-to-one correspondence with the signal detection electrodes.
上記の指紋画像入力装置は、 前記基板上に配置された複数の走査信号配線と、 前記基板上において前記走査信号配線に直交して配置された複数のデータ信号配 線と、 前記走查信号配線と前記データ信号配線とに接続され、 かつ、 前記信号検 出電極に接続された第 1のスィツチ素子と、 前記走査信号配線と前記データ信号 配線とに接続された第 2のスィツチ素子と、 前記第 2のスィッチ素子に接続され た電流制御素子と、 を備え、 前記発光素子は前記電流制御素子に直列に接続され ていることが好ましい。 The fingerprint image input device may include: a plurality of scanning signal wirings arranged on the substrate; a plurality of data signal wirings arranged on the substrate at right angles to the scanning signal wirings; A first switch element connected to the data signal wiring and connected to the signal detection electrode; a second switch element connected to the scanning signal wiring and the data signal wiring; And a current control element connected to the second switch element, wherein the light emitting element is preferably connected in series to the current control element.
上記の指紋画像入力装置は、 前記基板上に配置された電源配線と、 前記基板上 に配置された接地配線と、 を備え、 直列に接続された前記発光素子及び前記電流 制御素子は何れか一方の側において前記電源配線に接続され、 他方の側において 前記接地配線に接続されていることが好ましい。 The fingerprint image input device includes: a power supply line disposed on the substrate; and a ground line disposed on the substrate. The light emitting element and the current control element are connected in series. And the other side is preferably connected to the ground wiring.
上記の指紋画像入力装置は、 前記指紋画像を入力する際に、 前記電源配線また は前記接地配線の何れかが接続される信号発生電極をさらに備えており、 前記信 号発生電極には高周波信号が印加されることが好ましい。 The fingerprint image input device further includes a signal generation electrode to which either the power supply wiring or the ground wiring is connected when the fingerprint image is input, and the signal generation electrode includes a high-frequency signal. Is preferably applied.
上記の指紋画像入力装置においては、 前記指紋画像を入力する際には、 前記走
査信号配線の各々には、 その走査信号配線に隣接する他の走査信号配線と所定時 間重複する走査信号が順次印加されることが好ましい。 In the above fingerprint image input device, when inputting the fingerprint image, It is preferable that a scanning signal overlapping with another scanning signal wiring adjacent to the scanning signal wiring for a predetermined time is sequentially applied to each of the inspection signal wirings.
上記の指紋画像入力装置は、 モード切替用スィッチ素子と、 前記データ信号配 線の一端が前記モード切替用スィツチ素子を介して接続される表示用駆動回路と、 前記データ信号配線の他端が前記モード切替用スィツチ素子を介して接続される 画像入力用検出回路と、 前記走査信号配線の一端が接続される表示/画像入力用 駆動回路と、 を備えていることが好ましい。 The above fingerprint image input device may include a mode switching switch element, a display driving circuit to which one end of the data signal wiring is connected via the mode switching switch element, and the other end of the data signal wiring. It is preferable to include an image input detection circuit connected via a mode switching switch element, and a display / image input drive circuit connected to one end of the scanning signal wiring.
上記の指紋画像入力装置においては、 前記表示用駆動回路、 前記画像入力用検 出回路および前記表示ノ画像入力用駆動回路は、 前記基板上に形成された薄膜ト ランジス夕からなるものであることが好ましい。 In the above fingerprint image input device, the display drive circuit, the image input detection circuit, and the display image input drive circuit are formed of a thin film transistor formed on the substrate. Is preferred.
上記の指紋画像入力装置においては、 前記発光素子は有機のエレクトロルミネ センス材料を用いて形成されていることが好ましい。 In the above fingerprint image input device, it is preferable that the light emitting element is formed using an organic electroluminescent material.
上記の指紋画像入力装置においては、 前記基板は透明基板であり、 前記発光素 子の下部電極は透明導電膜によって形成されており、 前記発光素子から発せられ た光は前記基板の裏面から放射されることが好ましい。 In the above fingerprint image input device, the substrate is a transparent substrate, the lower electrode of the light emitting element is formed of a transparent conductive film, and light emitted from the light emitting element is radiated from the back surface of the substrate. Preferably.
上記の指紋画像入力装置においては、 前記発光素子の上部電極は透明導電膜に よって形成されており、 前記発光素子から発せられた光は前記基板の上方に放射 されることが好ましい。 ' In the above fingerprint image input device, it is preferable that an upper electrode of the light emitting element is formed of a transparent conductive film, and that light emitted from the light emitting element is emitted above the substrate. '
前記下部電極または前記上部電極と反対側の電極は、 光の反射率が高い金属材 料によって形成されていることが好ましい。 It is preferable that the lower electrode or the electrode opposite to the upper electrode is formed of a metal material having a high light reflectance.
上述の本発明に係る指紋画像入力装置は種々の機器に適用することができる。 本発明は、 第 1の筐体と、 前記第 1の筐体とヒンジ機構を介して相互に折り畳 み可能に連結されている第 2の筐体と、 上述の指紋画像入力装置と、 からなり、 前記指紋画像入力装置は、 前記第 1の筐体及び前記第 2の筐体を相互に折り畳ん だときに、 前記基板の指紋画像入力面が前記第 1の筐体または前記第 2の筐体の 外側及び内側の何れか一方を向き、 かつ、 前記基板の指紋画像表示面が他方を向 くように、 前記第 1の筐体及び前記第 2の筐体の何れか一方に組み込まれている 機器を提供する。 The fingerprint image input device according to the present invention described above can be applied to various devices. The invention provides a first housing, a second housing connected to the first housing via a hinge mechanism so as to be foldable, and the fingerprint image input device described above. Wherein the fingerprint image input device is configured such that when the first housing and the second housing are folded together, the fingerprint image input surface of the substrate is the first housing or the second housing. It is incorporated in one of the first housing and the second housing so that either one of the outside and the inside of the body faces and the fingerprint image display surface of the substrate faces the other. Provide equipment.
さらに、 本発明は、 第 1の筐体と、 前記第 1の筐体とヒンジ機構を介して相互
に折り畳み可能に連結されている第 2の筐体と、 上述の指紋画像入力装置と、 か らなり、 前記指紋画像入力装置は、 前記第 1の筐体及び前記第 2の筐体を相互に 折り畳んだときに、 前記基板の指紋画像入力面及び指紋画像表示面が前記第 1の 筐体または前記第 2の筐体の外側及び内側の何れか一方を向くように、 前記第 1 の筐体及び前記第 2の筐体の何れか一方に組み込まれている機器を提供する。 このような機器としては、 例えば、 携帯電話装置を選択することができる。 本発明は、 さらに、 基板の一平面上に複数の信号検出電極が配列された指紋画 像入力装置の前記一平面に指を触れる過程と、 前記信号検出電極と前記指との間 に形成される静電容量を検出することにより、 指紋画像を得る過程と、 を備える 指紋画像入力方法を提供する。 Further, the present invention provides a first housing, and the first housing, the first housing being interconnected via a hinge mechanism. And a fingerprint image input device as described above, wherein the fingerprint image input device connects the first housing and the second housing to each other. The first housing so that when folded, the fingerprint image input surface and the fingerprint image display surface of the substrate face either the outside or the inside of the first housing or the second housing. And a device incorporated in any one of the second housings. As such a device, for example, a mobile phone device can be selected. The present invention further includes a step of touching a finger on the one plane of the fingerprint image input device in which a plurality of signal detection electrodes are arranged on one plane of a substrate; and forming between the signal detection electrode and the finger. Providing a fingerprint image by detecting a capacitance of the fingerprint image.
前記指紋画像入力装置が、 前記信号検出電極が配列された平面と同一平面上に 配列された複数の発光素子をさらに備えるものである場合、 本指紋画像入力方法 は、 前記静電容量に応じて前記発光素子を発光させることにより、 前記指紋画像 を表示する過程をさらに備えることが好ましい。 図面の簡単な説明 When the fingerprint image input apparatus further includes a plurality of light emitting elements arranged on the same plane as the plane on which the signal detection electrodes are arranged, the present fingerprint image input method may be configured according to the capacitance. Preferably, the method further includes the step of displaying the fingerprint image by causing the light emitting element to emit light. BRIEF DESCRIPTION OF THE FIGURES
図 1は、 本発明の第 1の実施例に係る画像入力装置の斜視図である。 FIG. 1 is a perspective view of an image input device according to a first embodiment of the present invention.
図 2は、 本発明の第 1の実施例に係る画像入力装置における単位画素の平面図 (図 2 (A) ) とその等価回路図 (図 2 (B)) である。 FIG. 2 is a plan view (FIG. 2A) of a unit pixel and an equivalent circuit diagram thereof (FIG. 2B) in the image input device according to the first embodiment of the present invention.
図 3は、 本発明の第 1の実施例に係る画像入力装置における単位画素の断面図 である。 FIG. 3 is a sectional view of a unit pixel in the image input device according to the first embodiment of the present invention.
図 4は、 本発明の第 1の実施例に係る画像入力装置において形成される静電容 量を説明する断面図 (図 4 (A)) とその等価回路図 (図 4 (B)) である。 図 5は、 本発明の第 1の実施例に係る画像入力装置の動作を説明するためのタ ィミングチヤ一トである。 FIG. 4 is a sectional view (FIG. 4 (A)) and an equivalent circuit diagram (FIG. 4 (B)) for explaining the capacitance formed in the image input device according to the first embodiment of the present invention. . FIG. 5 is a timing chart for explaining the operation of the image input apparatus according to the first embodiment of the present invention.
図 6は、 本発明の第 1の実施例に係る画像入力装置の一製造工程段階を示す断 面図 (図 6 (A)) と平面図 (図 6 (B)) である。 FIG. 6 is a cross-sectional view (FIG. 6 (A)) and a plan view (FIG. 6 (B)) showing one manufacturing process stage of the image input device according to the first embodiment of the present invention.
図 7は、 本発明の第 1の実施例に係る画像入力装置の一製造工程段階を示す断 面図 (図 7 (A) ) と平面図 (図 7 (B)) である。
図 8は、 本発明の第 1の実施例に係る画像入力装置の一製造工程段階を示す断 面図 (図 8 (A)) と平面図 (図 8 (B)) である。 FIG. 7 is a cross-sectional view (FIG. 7 (A)) and a plan view (FIG. 7 (B)) showing one manufacturing process stage of the image input device according to the first embodiment of the present invention. FIG. 8 is a cross-sectional view (FIG. 8 (A)) and a plan view (FIG. 8 (B)) showing one manufacturing process stage of the image input device according to the first embodiment of the present invention.
図 9は、 本発明の第 1の実施例に係る画像入力装置の一製造工程段階を示す断 面図 (図 9 (A)) と平面図 (図 9 (B)) である。 FIG. 9 is a cross-sectional view (FIG. 9 (A)) and a plan view (FIG. 9 (B)) showing one manufacturing process stage of the image input device according to the first embodiment of the present invention.
図 1 0は、 本発明の第 2の実施例に係る画像入力装置において形成される静電 容量を説明する断面図 (図 1 0 (A)) とその等価回路図 (図 1 0 (B)) である。 図 1 1は、 本発明の第 3の実施例に係る画像入力装置において形成される静電 容量を説明する断面図 (図 1 1 (A)) とその等価回路図 (図 1 1 (B)) である。 図 1 2は、 本発明の第 3の実施例に係る画像入力装置の動作を説明するための 夕イミングチャートである。 FIG. 10 is a sectional view (FIG. 10 (A)) for explaining the capacitance formed in the image input device according to the second embodiment of the present invention and an equivalent circuit diagram thereof (FIG. 10 (B)). ). FIG. 11 is a cross-sectional view (FIG. 11 (A)) for explaining the capacitance formed in the image input device according to the third embodiment of the present invention and its equivalent circuit diagram (FIG. 11 (B)). ). FIG. 12 is an evening timing chart for explaining the operation of the image input device according to the third embodiment of the present invention.
図 1 3は、 本発明の第 4の実施例に係る画像入力装置における単位画素の平面 図 (図 1 3 (A)) と断面図 (図 1 3 (B)) である。 FIG. 13 is a plan view (FIG. 13 (A)) and a sectional view (FIG. 13 (B)) of a unit pixel in the image input device according to the fourth embodiment of the present invention.
図 1 4は、 本発明の第 5の実施例に係る画像入力装置における単位画素の平面 図 (図 1 4 (A)) と等価回路図 (図 1 4 (B)) と断面図 (図 1 4 (C)) である。 図 1 5は、 本発明の第 6の実施例に係る携帯電話の斜視図である。 FIG. 14 is a plan view (FIG. 14 (A)), an equivalent circuit diagram (FIG. 14 (B)), and a sectional view (FIG. 1) of a unit pixel in the image input device according to the fifth embodiment of the present invention. 4 (C)). FIG. 15 is a perspective view of a mobile phone according to a sixth embodiment of the present invention.
図 1 6は、 本発明の第 7の実施例に係る携帯電話の斜視図である。 FIG. 16 is a perspective view of a mobile phone according to a seventh embodiment of the present invention.
図 1 7は、 従来の静電容量検出方式の指紋画像入力装置の斜視図である。 FIG. 17 is a perspective view of a conventional fingerprint image input device of the capacitance detection type.
図 1 8は、 図 1 7に示した従来の静電容量検出方式の指紋画像入力装置の構成 図である。 FIG. 18 is a configuration diagram of the conventional electrostatic capacitance detection type fingerprint image input device shown in FIG.
図 1 9は、 図 1 7に示した従来の静電容量検出方式の指紋画像入力装置におい て形成される静電容量を説明する断面図である。 好ましい実施例の詳細な説明 FIG. 19 is a cross-sectional view illustrating the capacitance formed in the conventional capacitance detection type fingerprint image input device shown in FIG. Detailed Description of the Preferred Embodiment
次に、 図面を参照して本発明の実施例について説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
(第 1の実施例) (First embodiment)
図 1は、 本発明の第 1の実施例に係る表示機能を備えた指紋画像入力装置の斜 視図である。 FIG. 1 is a perspective view of a fingerprint image input device having a display function according to a first embodiment of the present invention.
本実施例に係る指紋画像入力装置 1 0は、 透明基板 1 1と、 透明基板 1 1上に マトリクス状に配列された複数の信号検出電極 2 8と、 透明基板 1 1上にマトリ
クス状に配列された複数の発光素子 1と、 透明基板 1 1の周囲の 3辺に沿って形 成された表示用駆動回路 2と、 表示 Z画像入力用駆動回路 3と、 画像入力用検出 回路 4と、 信号検出電極 2 8と発光素子 1の形成領域を区画するように表示用駆 動回路 2及び画像入力用検出回路 4の間に延びるゲート線 1 8と、 表示用駆動回 路 2からゲート線 1 8と直交して延びるデータ線 2 3と、 信号検出電極 2 8、 発 光素子 1、 表示用駆動回路 2、 表示/画像入力用駆動回路 3、 画像入力用検出回 路 4、 ゲート線 1 8及びデータ線 2 3を覆うように透明基板 1 1上に被覆されて いる保護層 2 9と、 からなつている。 The fingerprint image input device 10 according to the present embodiment includes a transparent substrate 11, a plurality of signal detection electrodes 28 arranged in a matrix on the transparent substrate 11, and a matrix on the transparent substrate 11. A plurality of light emitting elements 1 arranged in a matrix, a display drive circuit 2 formed along three sides around the transparent substrate 1, a display Z image input drive circuit 3, and an image input detection A circuit 4, a gate line 18 extending between the display drive circuit 2 and the image input detection circuit 4 so as to partition the formation region of the signal detection electrode 28 and the light emitting element 1, and a display drive circuit 2 , A data line 23 extending perpendicular to the gate line 18, a signal detection electrode 28, a light emitting element 1, a display drive circuit 2, a display / image input drive circuit 3, an image input detection circuit 4, A protective layer 29 covering the transparent substrate 11 so as to cover the gate line 18 and the data line 23.
図 2 (A) に示すように、 発光素子 1上には GND線 2 7が形成され、 また、 データ線 2 3に並んで信号発生電極兼用電源線 2 0が形成されている。 As shown in FIG. 2 (A), a GND line 27 is formed on the light emitting element 1, and a signal generating electrode / power supply line 20 is formed alongside the data line 23.
図 1において、 表示装置としての 1画素は、 赤色 1素子、 緑色 1素子、 青色 2 素子の発光素子を正方形状に配列して構成される。 図 1において、 参照番号の 1 の後に括弧付きで R、 G、 Bを付すことにより発光素子の発する色を表す。 すな わち、 R、 G、 Bはそれぞれ赤、 緑、 青を表している。 In FIG. 1, one pixel as a display device is configured by arranging one red, one green, and two blue light emitting elements in a square shape. In FIG. 1, R, G, and B are added in parentheses after the reference number 1 to indicate the color emitted from the light emitting device. That is, R, G, and B represent red, green, and blue, respectively.
ここで、 青色素子を 2素子にする理由は、 青色は他の赤色、 緑色に比較して光 量あるいは輝度が低いため、 他の色とのバランスをとるためである。 Here, the reason for using two blue elements is to balance blue with other colors because blue has a lower light quantity or luminance than other red and green elements.
また、 信号検出電極 2 8は一つの発光素子 1に対して一つ配置されている。 透明基板 1 1の周辺部に形成される表示用駆動回路 2、 表示/画像入力用駆動 回路 3および画像入力用検出回路 4は、 多結晶シリコン (p o l y— S i ) T F Tを用いて形成されるが、 特に、 n型 T F Tと p型 T F Tの両者を用いて C MO S回路に構成されることが望ましい。 Also, one signal detection electrode 28 is arranged for one light emitting element 1. The display drive circuit 2, display / image input drive circuit 3, and image input detection circuit 4 formed in the peripheral portion of the transparent substrate 1 are formed using a polycrystalline silicon (poly-Si) TFT. However, it is particularly desirable that the CMOS circuit be configured using both an n-type TFT and a p-type TFT.
図 2 (A) は、 図 1に示される画素の 1発光素子単位を示したレイアウト図で あり、 図 2 (B) はその等価回路図である。 FIG. 2A is a layout diagram showing one light emitting element unit of the pixel shown in FIG. 1, and FIG. 2B is an equivalent circuit diagram thereof.
図 2 (A) に示すように、 画素の 1発光素子単位内には第 1薄膜トランジスタ T r 1、 第 2薄膜トランジスタ T r 2、 第 3薄膜トランジスタ T r 3の 3つの薄 膜トランジスタが形成されている。 第 2薄膜トランジスタ T r 2のソースに接続 され、 第 3薄膜トランジスタ T r 3のゲート電極となるゲート配線 1 7は、 信号 発生電極兼用電源線 2 0と、 一部で重なるように形成されており、 その重なり合 つている部分においてキャパシタ Cが形成されている。
また、 発光素子 1は、 透明電極 25と、 発光材料層 26と、 GND線27のー 部により構成されている (図 3参照)。 As shown in FIG. 2A, three thin film transistors of a first thin film transistor Tr1, a second thin film transistor Tr2, and a third thin film transistor Tr3 are formed in one light emitting element unit of a pixel. . The gate wiring 17 connected to the source of the second thin film transistor Tr 2 and serving as the gate electrode of the third thin film transistor Tr 3 is formed so as to partially overlap the signal generating electrode and power supply line 20, A capacitor C is formed in the overlapping portion. Further, the light emitting element 1 includes a transparent electrode 25, a light emitting material layer 26, and a portion of a GND line 27 (see FIG. 3).
信号検出電極 28に投入される電荷を検出するための第 1薄膜トランジスタ T r 1のゲートはゲート線 18に、 そのドレインはデータ線 23に、 そのソースは 信号検出電極 28にそれぞれ接続されている。 The gate of the first thin film transistor Tr1 for detecting the electric charge applied to the signal detection electrode 28 is connected to the gate line 18, the drain is connected to the data line 23, and the source is connected to the signal detection electrode 28, respectively.
また、 キャパシタ Cを充電するための第 2薄膜トランジスタ Tr 2のゲートは ゲート線 18に、 そのドレインはデータ線 23にそれぞれ接続されており、 その ソースは上述したように、 キャパシタ Cの一方の端子と第 3薄膜トランジスタ T r 3のゲートとに接続されている。 Further, the gate of the second thin film transistor Tr 2 for charging the capacitor C is connected to the gate line 18, the drain is connected to the data line 23, and the source is connected to one terminal of the capacitor C as described above. It is connected to the gate of the third thin film transistor Tr3.
キャパシタ Cの他方の端子と第 3薄膜トランジスタ Tr 3のソースとは信号発 生電極兼用電源線 20に接続され、 第 3薄膜トランジスタ Tr 3のドレインは発 光素子 1の陽極に接続されている。 The other terminal of the capacitor C and the source of the third thin film transistor Tr 3 are connected to the signal generation electrode / power supply line 20, and the drain of the third thin film transistor Tr 3 is connected to the anode of the light emitting element 1.
また、 発光素子 1の陰極は GND線 27に接続されている。 The cathode of the light emitting element 1 is connected to the GND line 27.
図 2 (B) に示すように、 画素を構成している回路は、 4種類の配線、 すなわ ち、 GND線 27、 ゲート線 18、 信号発生電極兼用電源線 20及びデータ線 2 3に接続されている。 このうちの一部の配線、 すなわち、 ゲート線 18とデータ 線 23は、 発光素子 1により表示を行わせる表示モード時と信号検出電極 28の 電荷を検出する画像入力モード時の両方のモードにおいて共通に用いられる。 また、 信号発生電極兼用電源線 20は、 表示モード時には電源線として、 画像 入力モード時においては信号発生電極として用いられる。 As shown in Fig. 2 (B), the circuit that constitutes the pixel is connected to four types of wiring, namely, GND line 27, gate line 18, power supply line 20 also serving as signal generating electrode, and data line 23. Have been. Some of these wires, that is, the gate line 18 and the data line 23, are common in both the display mode in which display is performed by the light emitting element 1 and the image input mode in which the charge of the signal detection electrode 28 is detected. Used for Further, the signal generation electrode / power supply line 20 is used as a power supply line in the display mode and as a signal generation electrode in the image input mode.
このように一つの配線を表示モード時と画像入力モード時の双方に用いるよう にレイアウトするのは、 配線の占める面積を低減して、 信号検出電極 28及び発 光素子 1の面積を大きくとることを可能にするためである。 The layout in which one wiring is used in both the display mode and the image input mode in this way is to reduce the area occupied by the wiring and increase the area of the signal detection electrode 28 and the light emitting element 1. This is to make it possible.
表示解像度を 200 pp i (p i xe 1/i nc h、 すなわち、 赤色、 緑色、 青 色の 3色の発光素子を一画素と見るときの 1ィンチ当りの画素数)(200 p i X e 1 / i n c h= 7. 87 p i x e 1ノ mm)、指紋入力の解像度を 400 d p i (d o t / i n c h、 すなわち、 1ィンチ当りの画像入力素子数) (400 d o t / i n c h= 15. 75 d o t /mm) にそれぞれ設定する場合、 図 2 (A) の レイァゥトの横方向および縦方向の配列ピッチは 63. 5 mとなる。
図 3は、 本発明の第 1の実施例に係る画像入力装置 10の主要構成部を示す断 面図である。 ただし、 図 3は、 発光素子 1および信号検出電極 28とそれらに接 続された薄膜トランジスタの状態を分かりやすく示すための図であって、 図 2 (A) に示したレイァゥト図の構成とは必ずしも一致はしていない。 The display resolution is 200 pp i (pi xe 1 / i n ch, that is, the number of pixels per inch when three color light emitting elements of red, green, and blue are regarded as one pixel) (200 pi X e 1 / inch = 7.87 pixe 1 mm) and the resolution of fingerprint input is set to 400 dpi (dot / inch, that is, the number of image input devices per inch) (400 dot / inch = 15.75 dot / mm). In this case, the layout pitch in the horizontal and vertical directions in Fig. 2 (A) is 63.5 m. FIG. 3 is a cross-sectional view showing main components of the image input device 10 according to the first embodiment of the present invention. However, FIG. 3 is a diagram for easily illustrating the state of the light emitting element 1 and the signal detection electrode 28 and the thin film transistor connected to them, and is not necessarily the configuration of the layout diagram shown in FIG. No match.
以下においては、発光素子 1として、有機エレクトロルミネセンス(E l e d r o l um i n e s c e nc e: E L)材料を用いた構成を例に挙げて説明する。 図 3に示すように、 発光素子 1は、 有機 EL材料で形成される発光材料層 26 を発光層とし、 この発光材料層 26の下部電極である透明電極 25を一方の電極 (陽極)、発光材料層 26を覆って形成されている GND線 27を他方の電極(陰 極) として構成されている。 ' In the following, a configuration using an organic electroluminescent (Electroluminumsenecse: EL) material as the light emitting element 1 will be described as an example. As shown in FIG. 3, the light emitting element 1 has a light emitting material layer 26 formed of an organic EL material as a light emitting layer, and a transparent electrode 25 as a lower electrode of the light emitting material layer 26 as one electrode (anode). The GND line 27 formed so as to cover the material layer 26 is configured as the other electrode (negative electrode). '
透明電極 25と GND線 27との間に陽極側が正となる電位差を印加すると、 両方の電極 25、 27で挟まれた領域において発光材料層 26に電流が流れ、 こ の領域から透明電極 25、 第 2層間絶縁膜 24、 第 1層間絶縁膜 19および透明 基板 1 1を通して光が放射される。 ' 発光素子 1の下部電極である透明電極 25は、 ソース電極 21を介して、 第 3 薄膜トランジスタ Tr 3の一方のソース · ドレイン領域 15に接続されている。 また、 信号検出電極 28は、 ソース電極 22を介して、 第 1薄膜トランジスタ T r 1の一方のソース · ドレイン領域 15に接続されている。 第 3薄膜トランジス 夕 Tr 3及ぴ第 1薄膜トランジスタ Tr 1の他方のソース · ドレイン領域 15は 信号発生電極兼用電源線 20及びデータ線に 23それぞれに接続されている。 本実施例においては、 薄膜トランジスタとして、 ゲート電極がチャネル領域の 上に形成されるトップゲ一ト型の多結晶シリコン(p o 1 y-S i)TFTの構造 を採用している。 When a positive potential difference is applied between the transparent electrode 25 and the GND line 27 so that the anode side is positive, a current flows through the luminescent material layer 26 in a region sandwiched between the electrodes 25 and 27, and the transparent electrode 25 and Light is emitted through the second interlayer insulating film 24, the first interlayer insulating film 19, and the transparent substrate 11. ′ The transparent electrode 25, which is the lower electrode of the light emitting element 1, is connected to one of the source / drain regions 15 of the third thin film transistor Tr 3 via the source electrode 21. The signal detection electrode 28 is connected to one of the source / drain regions 15 of the first thin film transistor Tr 1 via the source electrode 22. The other source / drain region 15 of the third thin film transistor Tr 3 and the first thin film transistor Tr 1 is connected to a signal generation electrode / power supply line 20 and a data line 23, respectively. In the present embodiment, a thin film transistor adopts a top gate type polycrystalline silicon (p0y-Si) TFT structure in which a gate electrode is formed on a channel region.
図 3には示されていないが、 本実施例においては、 ゲート配線 17と信号発生 電極兼用電源線 20とが図 2 (A) に示す領域において第 1層間絶縁膜 19を間 に挟んで重なることにより、 キャパシタ Cを形成している。 Although not shown in FIG. 3, in the present embodiment, the gate wiring 17 and the power supply line 20 also serving as a signal generating electrode overlap with the first interlayer insulating film 19 interposed therebetween in the region shown in FIG. 2A. Thus, the capacitor C is formed.
TFT、 発光素子等の主要な構成要素の詳細な構成と製造方法については後述 する。 The detailed configuration and manufacturing method of the main components such as the TFT and the light emitting element will be described later.
図 4 (B) は、 本発明の第 1の実施例に係る画像入力装置の回路構成を示す回
路図である。 FIG. 4B is a circuit diagram showing a circuit configuration of the image input device according to the first embodiment of the present invention. It is a road map.
ゲート線 18は、 表示 Z画像入力用駆動回路 3から導出されており、 データ線 23の一端は表示用駆動回路 2内の第六薄膜トランジスタ Tr 6に、 その他端は 画像入力用検出回路 4内の第七薄膜トランジスタ Tr 7に接続されている。なお、 説明の便のために、 ゲート線 18には #2 n乃至 #2 (n+ 1)、 データ線 23及 ぴ各データ線に対応する回路には # 2m乃至 #2 (m+1) の番号が付されてい る。 The gate line 18 is derived from the display Z image input drive circuit 3, and one end of the data line 23 is connected to the sixth thin film transistor Tr 6 in the display drive circuit 2 and the other end is connected to the image input detection circuit 4. It is connected to the seventh thin film transistor Tr7. For convenience of explanation, # 2 n to # 2 (n + 1) are assigned to the gate line 18, and # 2m to # 2 (m + 1) are assigned to the data line 23 and the circuit corresponding to each data line. Numbered.
表示用駆動回路 2と画像入力用検出回路 4にそれぞれ設けられた第六薄膜トラ ンジスタ Tr 6及び第七薄膜トランジスタ Tr 7は、 表示モードと画像入力モー ドとを切り替えるためのスィッチであって、 モード切り替え信号 D I SP、 D I SPb a rにより、 いずれか一方の回路のみがデータ線 23に電気的に接続され る構成となっている。 The sixth thin-film transistor Tr 6 and the seventh thin-film transistor Tr 7 provided in the display driving circuit 2 and the image input detection circuit 4 are switches for switching between the display mode and the image input mode, respectively. Only one of the circuits is electrically connected to the data line 23 by the switching signals DI SP and DI SPbar.
例えば、 表示モードを選択する場合には、 モード切り替え信号 D I SPを Hレ ベルとし、 全てのデータ線 23を表示用駆動回路 2に接続した上で表示用駆動回 路 2から表示すべき映像信号を 1行分ずつデータ線 23 # 2m乃至 # 2 (m+ 1 ) に供給する。 For example, when selecting the display mode, the mode switching signal DI SP is set to the H level, all the data lines 23 are connected to the display drive circuit 2, and then the video signal to be displayed from the display drive circuit 2 is displayed. Are supplied to the data lines 23 # 2m to # 2 (m + 1) one row at a time.
一方、 画像入力モード時には、 モード切り替え信号 D I SPb a rが Hレベル となり、 全てのデータ線 23が画像入力用検出回路 4に電気的に接続される。 画 像入力用検出回路 4には、 個々のデータ線 23に接続しているアンプ AMP 2m 乃至 #2 (m+1) が設けられている。 これらのアンプ 2m乃至 #2 (m+1) の出力は、 走查信号 CLM2m乃至 #2 (m+1) により、 順に外部へ出力でき るように構成されている。 On the other hand, in the image input mode, the mode switching signal DISPbar becomes H level, and all the data lines 23 are electrically connected to the image input detection circuit 4. The image input detection circuit 4 includes amplifiers AMP 2m to # 2 (m + 1) connected to the individual data lines 23. The outputs of these amplifiers 2m to # 2 (m + 1) are configured to be sequentially output to the outside by running signals CLM2m to # 2 (m + 1).
また、 表示 Z画像入力用駆動回路 3は、 表示モードと画像入力モードのいずれ のモ一ドにおいても、 ゲート線を共有する第 1薄膜トランジスタ Tr 1及び第 2 薄膜トランジスタ T r 2を 1行ずつ順番に選択することができるように構成され ている。 In addition, the display Z image input driving circuit 3 sequentially switches the first thin film transistor Tr1 and the second thin film transistor Tr2 sharing the gate line one row at a time in both the display mode and the image input mode. It is configured to be selectable.
本実施例に係る画像入力装置において特徴的な点は、 POWER (電源電圧) と CHARGE (高周波信号) の 2種類の電圧を第 4薄膜トランジスタ Tr 4及 び第 5薄膜トランジスタ Tr 5で切り替えて、 信号発生電極兼用電源線 20に印
加する構成になっている点である。 A characteristic point of the image input device according to the present embodiment is that two kinds of voltages, POWER (power supply voltage) and CHARGE (high-frequency signal), are switched by the fourth thin film transistor Tr 4 and the fifth thin film transistor Tr 5 to generate a signal. Marked on electrode / power line 20 This is the point that the configuration is added.
図 4 (A) は、 本実施例に係る画像入力装置において形成される静電容量を説 明するための断面図であり、 図 5は、 本発明の第 1の実施例に係る画像入力装置 の動作を説明するためのタイミングチャートである。 FIG. 4A is a cross-sectional view for explaining the capacitance formed in the image input device according to the present embodiment, and FIG. 5 is an image input device according to the first embodiment of the present invention. 3 is a timing chart for explaining the operation of FIG.
以下、 図 4及び図 5を参照して、 本実施例に係る指紋画像入力装置 10の動作 を説明する。 . 本実施例においては、 表示モードが選択されている場合には、 信号発生電極兼 用電源線 20には電源電圧 POWERが印加され、 画像入力モードが選択されて いる場合には、 信号発生電極兼用電源線 20には高周波信号 CHARGEが印加 される。 Hereinafter, the operation of the fingerprint image input device 10 according to the present embodiment will be described with reference to FIGS. In this embodiment, when the display mode is selected, the power supply voltage POWER is applied to the signal generating electrode / power supply line 20, and when the image input mode is selected, the signal generating electrode is used. A high-frequency signal CHARGE is applied to the dual-purpose power line 20.
まず、 本実施例に係る指紋画像入力装置 10の表示動作について説明する。 図 4 (B) のモード切り替え信号 D I SPを Hレベルに設定して表示モードを 選択すると、 第 4薄膜トランジスタ Tr 4が〇N、 第 5薄膜トランジスタ Tr 5 が 0 F Fとなり、 全ての信号発生電極兼用電源線 20には P〇 W E Rが印加され る。 POWERは全ての発光素子 1 (R)、 1 (G)、 1 (B) に対する電源電圧 となる。 通常は 5 V乃至 10V程度の一定の DC電圧である。 First, a display operation of the fingerprint image input device 10 according to the present embodiment will be described. When the display mode is selected by setting the mode switching signal DI SP in Fig. 4 (B) to the H level, the fourth thin film transistor Tr 4 becomes 〇N, the fifth thin film transistor Tr 5 becomes 0 FF, and all the power sources that also serve as signal generating electrodes P〇 WER is applied to line 20. POWER is the power supply voltage for all light emitting elements 1 (R), 1 (G), and 1 (B). Usually, it is a constant DC voltage of about 5 V to 10 V.
また、 表示用駆動回路 2の全ての出力回路は、 それぞれに対応するデータ線 2 3に電気的に接続される。 All output circuits of the display drive circuit 2 are electrically connected to the corresponding data lines 23.
図 5のタイミングチャートに示すように、 まず、 表示 画像入力用駆動回路 3 により、 ゲート線 18に順に行走査信号 ROWを供給し、 ゲート線 18を共有す る全ての画素の第 2薄膜トランジスタ Tr 2を導通させる。 図 5のタイミングチ ヤートにおいては、 行走査信号 R〇W#2 n乃至 #2 (n+ 1) を選択する前後 の信号を示している。 As shown in the timing chart of FIG. 5, first, the display image input driving circuit 3 sequentially supplies the row scanning signals ROW to the gate lines 18 and the second thin film transistors Tr 2 of all the pixels sharing the gate lines 18. Is made conductive. The timing chart of FIG. 5 shows signals before and after selecting the row scanning signals R〇W # 2 n to # 2 (n + 1).
これに同期して、 表示すべき映像信号をそれぞれのデータ線 23 # 2m乃至 # 2 (m+ 1) に与えると、 それぞれのキャパシタ Cに映像信号が記憶される。 こ のようにして、 ゲート線 18#2 n乃至 #2 (n+ 1) で選択された全ての画素 のキャパシタ Cに映像信号が記憶されると、 キャパシタ Cの両端の電圧により、 第 3薄膜トランジスタ Tr 3が一定の抵抗値を有する素子として動作する。 行走査信号 ROWが Lレベルになると、 これらの画素の発光素子に、 それぞれ
の第 3薄膜トランジスタ T r 3の抵抗値(映像信号に対応した抵抗値)に応じて、 信号発生電極兼用電源線 20から電流が供給されて、 発光素子 1 (R)、 1 (G)、 1 (B) から光が発せられる。 In synchronization with this, when a video signal to be displayed is given to each of the data lines 23 # 2m to # 2 (m + 1), the video signal is stored in each capacitor C. In this way, when the video signal is stored in the capacitors C of all the pixels selected by the gate lines 18 # 2 n to # 2 (n + 1), the voltage across the capacitor C causes the third thin film transistor Tr 3 operates as an element having a constant resistance value. When the row scanning signal ROW becomes L level, the light emitting elements of these pixels According to the resistance value of the third thin film transistor Tr 3 (the resistance value corresponding to the video signal), a current is supplied from the power line 20 also serving as the signal generation electrode, and the light emitting elements 1 (R), 1 (G), and 1 Light is emitted from (B).
全てのゲート線 18について上述の操作を繰り返すことにより、 所望の画像が 表示される。 By repeating the above operation for all the gate lines 18, a desired image is displayed.
次に、 本実施例に係る画像入力装置 10に指紋画像を入力する指紋画像入力の 動作について説明する。 Next, an operation of inputting a fingerprint image to the image input device 10 according to the present embodiment will be described.
回路動作の説明の前に、 図 4 (A) を参照し、 指と画素の構成要素との間に形 成される静電容量について説明する。 Before describing the circuit operation, the capacitance formed between a finger and a pixel component will be described with reference to FIG.
図 4 (A) に示すように、 信号発生電極兼用電源線 20と指 Fとの間には静電 容量 C 2、 指 Fと信号検出電極 28との間には静電容量 C 1がそれぞれ形成され る。 また、 信号発生電極兼用電源線 20と信号検出電極 28との間にも静電容量 C dが形成される。 As shown in FIG. 4 (A), a capacitance C 2 is provided between the signal generating electrode and power supply line 20 and the finger F, and a capacitance C 1 is provided between the finger F and the signal detection electrode 28. It is formed. Further, a capacitance C d is also formed between the signal generating electrode power supply line 20 and the signal detecting electrode 28.
仮に、 信号発生電極兼用電源線 20の電位を Δνだけ瞬間的に変化させると、 これら 3つの静電容量 C 1、 C2、 Cdの合成容量 [(1/C 1 + 1/C2) 一1 + Cd] に AVを乗じた電荷量が信号検出電極 28に投入される。 ここで、 信号 発生電極兼用電源線 20は入力面のほぼ全域に渡って形成されているが、 信号検 出電極 28は画素 1箇所に存在するのみである。 従って、 C 1《C2となり、 信 号検出電極 28と信号発生電極兼用電源線 20との間の合成容量は、 ほぼ (C 1 + Cd) に等しくなる。 Assuming that changes the potential of the signal generating electrode combined power supply line 20 only momentarily .DELTA..nu, these three capacitances C 1, C2, Cd combined capacitance of [(1 / C 1 + 1 / C2) one 1 + The charge amount obtained by multiplying Cd] by AV is supplied to the signal detection electrode 28. Here, the signal generation electrode / power supply line 20 is formed over almost the entire area of the input surface, but the signal detection electrode 28 is present only at one pixel. Therefore, C1 << C2, and the combined capacitance between the signal detection electrode 28 and the signal generation electrode / power source line 20 is substantially equal to (C1 + Cd).
以上の静電容量に関する考察を踏まえて、 指紋画像入力時の回路動作を以下に 説明する。 Based on the above considerations on capacitance, the circuit operation at the time of fingerprint image input will be described below.
図 4 (B) のモード切り替え信号 D I S Pを Lレベルに設定して画像入力モー ドを選択すると、 第 4薄膜トランジスタ Tr 4が OFF、 第 5薄膜トランジスタ Tr 5が ONとなり、 全ての信号発生電極兼用電源線 20にほ CHARGEが印 加される。 また同時に、 第 7薄膜トランジスタ Tr 7が ONとなって、 画像入力 用検出回路 4の全てのアンプ AMP 2m乃至 #2 (m+1) がそれぞれに対応す るデータ線 23 # 2m乃至 #2 (m+1) に電気的に接続される。 When the image input mode is selected by setting the mode switching signal DISP in Fig. 4 (B) to L level, the fourth thin film transistor Tr4 is turned off, the fifth thin film transistor Tr5 is turned on, and all the power supply lines also serve as signal generating electrodes. CHARGE is added to 20. At the same time, the seventh thin film transistor Tr7 is turned on, and all the amplifiers AMP 2m to # 2 (m + 1) of the image input detection circuit 4 have corresponding data lines 23 # 2m to # 2 (m +1).
ここで図 5の夕イミングチャートに示すように、 高周波信号 CHARGEとし
て矩形波が全ての信号発生電極兼用電源線 20に印加される。 ゲート線 18#2 n乃至 #2 (n+ 1) の走査信号に同期して、 リセット信号 RSTが Hレベル、 第 8薄膜トランジスタ Tr 8が ONとなり、 画像入力用検出回路 4のアンプ AM P#2m乃至 #2 (m+1) の出力がリセットされる。 Here, as shown in the evening timing chart of FIG. Thus, a rectangular wave is applied to all of the signal generating electrode and power lines 20. In synchronization with the scanning signals of the gate lines 18 # 2 n to # 2 (n + 1), the reset signal RST is at the H level, the eighth thin film transistor Tr8 is turned on, and the amplifiers AM P # 2m to # 2 (m + 1) output is reset.
まず、 図 5のタイミングチャートにおいて、 行走査信号 R〇W#2 n+ 1が H レベルになった瞬間に、 画像入力用検出回路 4の中のアンプ AMPは全てゲート 線 18#2n+ lによつて選択された信号検出電極 28に電気的に接続される。 次の瞬間にリセット信号 RSTが Lレベルになり、 さらにその次の瞬間に高周波 信号 CHARGEが Δνだけ上昇する。 このとき、個々のアンプ AMPの出力は、 ゲート線 18#2 n+ 1によって選択された信号検出電極 28に投入される電荷 量(C 1 +Cd)AVに比例した電圧値となる。 First, in the timing chart of FIG. 5, at the moment when the row scanning signal R2W # 2 n + 1 becomes H level, all the amplifiers AMP in the image input detection circuit 4 are turned on by the gate line 18 # 2n + l. It is electrically connected to the selected signal detection electrode 28. At the next moment, the reset signal RST goes low, and at the next moment, the high-frequency signal CHARGE rises by Δν. At this time, the output of each amplifier AMP has a voltage value proportional to the amount of charge (C 1 + Cd) AV supplied to the signal detection electrode 28 selected by the gate line 18 # 2 n + 1.
従って、 入力画像データを得るには、 これらのアンプ AMPの出力を外部の回 路へ転送すればよいことになる。 Therefore, in order to obtain input image data, the outputs of these amplifiers AMP need only be transferred to an external circuit.
これは、 図 5のタイミングチャートに示すように、 画像入力用検出回路 4の内 部に備えたシフトレジスタ回路によって生成された読み出し走査信号 CLM# 2 m乃至 #2 (m+ 1) を、 アンプ AMPの出力端に接続された第 9薄膜トランジ スタ Tr 9に順に与えることにより実現される。 その結果、 図 5に示すように、 ゲート線 #2 n乃至 #2 (n+ 1) が選択されたときの画像入力用検出回路 4の 出力 OUTは、 ゲート線 #2n乃至 #2 (n+ 1) に近接した領域の指 Fの凹凸 情報を反映することになる。 As shown in the timing chart of FIG. 5, the read scanning signals CLM # 2 m to # 2 (m + 1) generated by the shift register circuit provided inside the image input detection circuit 4 are supplied to the amplifier AMP. This is realized by sequentially providing the ninth thin-film transistor Tr9 connected to the output terminal of the ninth thin film transistor. As a result, as shown in FIG. 5, when the gate lines # 2 n to # 2 (n + 1) are selected, the output OUT of the image input detection circuit 4 becomes the gate lines # 2n to # 2 (n + 1) This reflects the unevenness information of the finger F in the area close to.
全てのゲート線 18についてこの動作を繰り返すことにより、指 Fの凹凸情報、 すなわち、 指紋画像が得られる。 By repeating this operation for all the gate lines 18, the unevenness information of the finger F, that is, a fingerprint image can be obtained.
次に、 本実施例に係る指紋画像入力装置 10の製造方法について説明する。 図 6乃至図 9は、 本発明の第 1の実施例に係る画像入力装置 10の画素部の主 な構成要素の製造工程を工程順に示す断面図 〔各図において (A) にて示す〕 と 平面図 〔各図において (B) にて示す〕 である。 なお、 断面図 (B) は第 1薄膜 トランジスタ Tr 1及び第 3薄膜トランジスタ Tr 3の付近の状態を分かりやす く図示したものであり、 必ずしも実際のレイアウトに合致するようには描かれて いない。
製造工程は、 薄膜トランジスタ (TFT) と検出素子とを形成する前工程と、 有機 EL材料を用いて発光素子を形成する後工程とに大別される。 Next, a method for manufacturing the fingerprint image input device 10 according to the present embodiment will be described. 6 to 9 are cross-sectional views (shown by (A) in each drawing) showing the manufacturing steps of the main components of the pixel portion of the image input device 10 according to the first embodiment of the present invention in the order of steps. It is a top view [in each figure, it shows by (B)]. Note that the cross-sectional view (B) shows a state near the first thin-film transistor Tr1 and the third thin-film transistor Tr3 in an easily understandable manner, and is not necessarily drawn to match an actual layout. The manufacturing process is broadly divided into a pre-process for forming a thin film transistor (TFT) and a detection device, and a post-process for forming a light-emitting device using an organic EL material.
前工程としての薄膜トランジスタ (TFT) 及び検出素子の製造工程において は、 種々の薄膜トランジスタを採用することができる。 本実施例においては、 ト ップゲ一ト型の多結晶シリコン(p 01 y-S i)TFTを例として説明する。 先ず、 タングステンシリサイ ド(WS i )その他の高融点金属シリサイ ド材料か らなる層をガラスその他の透明基板 1 1上にスパック法により形成する。 この高 融点金属シリサイド材料層をフォトリソグラフィ法によりパターニングし、 図 6 (A) に示すように、 透明基板 1 1上に遮光層 12を形成する。 遮光層 12をタ ングステンシリサイ ド(WS i )から形成する場合には、 遮光層 12の厚さは 10 0乃至 200 nmの範囲に設定する。 Various thin film transistors can be employed in the manufacturing process of the thin film transistor (TFT) and the detection element as a pre-process. In this embodiment, a top gate type polycrystalline silicon (p 01 y-Si) TFT will be described as an example. First, a layer made of tungsten silicide (WS i) or another refractory metal silicide material is formed on a glass or other transparent substrate 11 by the Spack method. This refractory metal silicide material layer is patterned by photolithography, and a light-shielding layer 12 is formed on the transparent substrate 11 as shown in FIG. When the light-shielding layer 12 is formed from tungsten silicide (WSi), the thickness of the light-shielding layer 12 is set in the range of 100 to 200 nm.
次いで、 酸素とシリコン含有ガス (例えば、 シラン(S i H4)) とをプラズマ 中で分解して基板上に堆積する CVD法により、 二酸化シリコン (S i 02) か らなるパリア層 13を一面に形成する。 ノ リア層 13は、 後続のプロセス中にお いて、 透明基板 1 1の中に含まれる不純物元素が透明基板 1 1よりも上の層に拡 散することを防止する。 バリァ層 13の厚さは 300乃至 500 nmとする。 次いで リァ層 13上に p 01 y-S i層の前駆膜であるアモルファスシリコ ン(a-S i)層を、 プラズマ CVD法、減圧 CVD法、 スパッタ法のいずれかの成 膜方法により、 厚さ 100 nm程度に形成する。 このアモルファスシリコン(a- S i)層にエキシマレ一ザ一からの数十ナノ秒の非常に短いパルス光を照射して 瞬間的に溶融することにより、アモルファスシリコン(a-S i)層をポリシリコン (P 01 y-S i )層に改質する。 このときの照射エネルギー密度を 40 OmJ/ cm2前後に設定すると、 特性の良い p o 1 y-S i TFTが得られることが知 られている。 Then, oxygen and silicon-containing gas (e.g., silane (S i H 4)) by a CVD method to deposit onto a substrate and then decomposed in a plasma, silicon dioxide (S i 0 2) or Ranaru Paglia layer 13 Form on one side. Noria layer 13 prevents an impurity element contained in transparent substrate 11 from diffusing into a layer above transparent substrate 11 during a subsequent process. The thickness of the barrier layer 13 is 300 to 500 nm. Next, an amorphous silicon (aSi) layer, which is a precursor of the p01ySi layer, is formed on the layer 13 by a plasma CVD method, a low pressure CVD method, or a sputtering method to a thickness of about 100 nm. Formed. The amorphous silicon (aSi) layer is irradiated with a very short pulse light of several tens of nanoseconds from the excimer laser to instantaneously melt the amorphous silicon (a-Si) layer, thereby converting the amorphous silicon (aSi) layer to polysilicon ( Reform to P 01 yS i) layer. It is known that when the irradiation energy density at this time is set to around 40 OmJ / cm 2 , a po 1 yS i TFT with good characteristics can be obtained.
この p o l y- S i層をフォ トリソグラフィ法によりパタ一ニングして T FT 形成領域に島状 P 01 y-S i層を形成する。 The poly-Si layer is patterned by photolithography to form an island-shaped P 01 y-Si layer in the TFT forming region.
次に、 厚さ 50 nm程度の二酸化シリコン (S i〇2) 膜を堆積してゲート絶 縁膜 16を形成し、 ゲート絶縁膜 16の上に厚さ 20 Onm程度のタングステン シリサイ ド (WS i) 層をスパッタ法等により形成し、 フォ トリソグラフィ法に
よりタングステンシリサイ ド (W S i ) 層をパタ一ニングすることにより、 ゲー ト配線 1 7とゲート線 1 8を形成する。 Next, a silicon dioxide (Si 2 ) film having a thickness of about 50 nm is deposited to form a gate insulating film 16, and a tungsten silicide (WS i) having a thickness of about 20 Onm is formed on the gate insulating film 16. ) A layer is formed by sputtering, etc. The gate wiring 17 and the gate line 18 are formed by patterning a tungsten silicide (WS i) layer.
次に、イオンドーピング法により、島状 p 0 1 y - S i層に選択的に高濃度のリ ン(P )またはボロン(B)を導入する。 Next, high-concentration phosphorus (P) or boron (B) is selectively introduced into the island-shaped p 0 1 y-Si layer by ion doping.
その後、 透明基板 1 1を摂氏 5 0 0度程度の温度に加熱して、 導入した不純物 元素を活性化する。 このときの不純物元素の濃度、 加熱時間、 温度その他のプロ セス条件は重要であり、 後に形成される配線材料との間にォ一ミックコンタク ト が得られるように、 これらのプロセス条件を決定する。 Thereafter, the transparent substrate 11 is heated to a temperature of about 500 degrees Celsius to activate the introduced impurity elements. At this time, the concentration of the impurity element, the heating time, the temperature, and other process conditions are important, and these process conditions are determined so that an atomic contact with the wiring material to be formed later is obtained. .
こうして、 高濃度に不純物がドーピングされた領域がソース ' ドレイン領域 1 5となり、不純物元素がドーピングされていない領域はチャネル領域 1 4となる。 以上の工程を経て、 図 6の断面図 (図 6 (A)) 及び平面図 (図 6 (B)) に示 した構造が形成される。 ここで、 図 6 (B) の平面図においては、 T F T下にあ る遮光層 1 2と絶縁膜 1 6は図示されていない。 ここで、 第 3薄膜トランジスタ T r 3のゲート電極となるゲート配線 1 7は、 後にキャパシタ Cの下部電極とな る領域にまで引き延ばされている。 Thus, the region doped with the impurity at a high concentration becomes the source / drain region 15, and the region not doped with the impurity element becomes the channel region 14. Through the above steps, the structure shown in the cross-sectional view of FIG. 6 (FIG. 6A) and the plan view of FIG. 6B is formed. Here, in the plan view of FIG. 6B, the light-shielding layer 12 and the insulating film 16 below the TFT are not shown. Here, the gate wiring 17 serving as the gate electrode of the third thin film transistor Tr3 is extended to a region which will later serve as the lower electrode of the capacitor C.
その後、 二酸化シリコン (S i 02) からなる第 1の層間絶縁膜 1 9をプラズ マ C V D法により全面に形成する。 Thereafter, a first interlayer insulating film 1-9 composed of silicon dioxide (S i 0 2) on the entire surface by plasma CVD method.
次に、 図 7 (A) に示すように、 第 1の層間絶縁膜 1 9およびゲート絶縁膜 1 6にコンタク トホールを開けて、 クロム (C r ) その他の低抵抗の金属材料を堆 積し、 この金属材料をパターニングして、 信号発生電極兼用電源線 2 0、 ソース 電極 2 1、 2 2およびデータ線 2 3を形成する。 また、 このとき第 2薄膜トラン ジスタ T r 2のソース領域とゲート配線 1 7との接続が達成される。 Next, as shown in FIG. 7A, contact holes are made in the first interlayer insulating film 19 and the gate insulating film 16 to deposit chromium (Cr) and other low-resistance metal materials. The metal material is patterned to form a power supply line 20 also serving as a signal generation electrode, source electrodes 21 and 22 and a data line 23. At this time, the connection between the source region of the second thin film transistor Tr2 and the gate wiring 17 is achieved.
以上の工程により、 前工程の T F T製造工程が完了し、 図 7 (A) 断面図及 ぴ図 7 (B) の平面図に示した構造が形成される。 Through the above steps, the previous TFT manufacturing process is completed, and the structure shown in the cross-sectional view of FIG. 7A and the plan view of FIG. 7B is formed.
後工程の製造工程では、 まず、 図 8 (A) に示すように、 全面に第 2の層間絶 縁膜 2 4を形成した後に、 リソグラフィとエッチングにより、 ソース電極 2 1、 2 2上にコンタクトホールを開口し、 ィンジゥム錫酸化物(I T O)を全面にスパ ッタする。 ついで、 再ぴ、 リソグラフィとエッチングにより I T Oをパターン化 して発光素子 1の下部電極 (陽極)となる領域に透明電極 2 5を形成する。
ここで透明電極 2 5として使用する I T Oは、 シート抵抗 2 Ο Ω/ロ程度、 厚 さは 1 0 0 n m程度とする。 In the subsequent manufacturing process, first, as shown in FIG. 8 (A), a second interlayer insulating film 24 is formed on the entire surface, and then contact is made on the source electrodes 21 and 22 by lithography and etching. Open a hole and sputter indium tin oxide (ITO) over the entire surface. Next, the ITO is patterned by lithography and etching to form a transparent electrode 25 in a region to be a lower electrode (anode) of the light emitting device 1. Here, the ITO used as the transparent electrode 25 has a sheet resistance of about 2ΟΩ / b and a thickness of about 100 nm.
次に、 有機 E L材料からなる発光材料層 2 6を形成する。 Next, a light emitting material layer 26 made of an organic EL material is formed.
発光材料層 2 6としては、 発光層と正孔注入輸送層からなる 2層構成、 これに 電子注入輸送層を加えた 3層構成、 あるいは、 金属電極との界面に薄い絶縁膜を 配置した構成を採用することができる。 すなわち、 図 8 (A) では単に発光材料 層 2 6として示してあるが、 発光材料層 2 6は多層膜によつて構成されることが 可能な有機膜である。 The light-emitting material layer 26 has a two-layer structure including a light-emitting layer and a hole injection / transport layer, a three-layer structure including an electron injection / transport layer, or a structure in which a thin insulating film is disposed at the interface with a metal electrode Can be adopted. That is, in FIG. 8A, the light-emitting material layer 26 is simply shown as the light-emitting material layer 26, but the light-emitting material layer 26 is an organic film that can be formed by a multilayer film.
発光材料層 2 6の製造方法としては、 スピン塗布法、 真空蒸着法あるいはイン クジェット印刷法を用いることができ、 それぞれの製造方法に対応して、 高分子 系または低分子系の有機 E L材料の選択、 下地の構造、 上部電極の製造方法その 他の製造条件が決められる。 As a method for manufacturing the light emitting material layer 26, a spin coating method, a vacuum evaporation method, or an ink jet printing method can be used. Depending on each manufacturing method, a polymer or low molecular organic EL material is used. Selection, base structure, method of manufacturing upper electrode, and other manufacturing conditions are determined.
本実施例においては、 発光材料層 2 6は発光層と正孔輸送層との 2層構造を有 しており、 正孔注入輸送層の材料としては、 例えば、 トリアリールァミン誘導体 、 ォキサジァゾール誘導体あるいはポルフィリン誘導体を選択することができ、 発光層の材料としては、例えば、 8 -ヒドロキシキノリン及ぴその誘導体の金属錯 体、 テトラフ: ニルブタジエン誘導体あるいはジスチリルァリ一ル誘導体を選択 することができる。 発光層及ぴ正孔輸送層はそれぞれ真空蒸着法により各々 5 0 n m程度の厚さに積層して形成される。 In this embodiment, the light-emitting material layer 26 has a two-layer structure of a light-emitting layer and a hole transport layer. Examples of the material of the hole injection / transport layer include a triarylamine derivative and an oxaziazole derivative. Alternatively, a porphyrin derivative can be selected. As a material of the light emitting layer, for example, a metal complex of 8-hydroxyquinoline and its derivative, a tetrafu: nilbutadiene derivative or a distyraryl derivative can be selected. Each of the light emitting layer and the hole transport layer is formed by laminating each to a thickness of about 50 nm by a vacuum evaporation method.
なお、 図 8 (A) においては、 発光材料層 2 6が透明電極 2 5をほぼ覆うよう にパターン化されて描かれているが、 発光材料層 2 6は絶縁材料からなる層であ るので、 必ずしもパターン化は必要ではなく、 透明基板 1 1の全面を覆うものと して形成することも可能である。 ただし、 本実施例に係る画像入力装置 1 0を力 ラ一ディスプレイに応用する場合には、 少なくとも 3種類の発光材料層とその分 離が必要であるので、 発光材料層 2 6のパターン化が必要である。 In FIG. 8A, the light-emitting material layer 26 is patterned so as to substantially cover the transparent electrode 25. However, since the light-emitting material layer 26 is a layer made of an insulating material, However, patterning is not necessarily required, and the transparent substrate 11 may be formed so as to cover the entire surface. However, when the image input device 10 according to the present embodiment is applied to a color display, at least three types of light emitting material layers and their separation are necessary, so that the patterning of the light emitting material layer 26 is required. is necessary.
次に、 発光素子 1の陰極として、 アルミニウム一リチウム合金 A 1 L iその他 の仕事関数が低い材料を、 金属のシャ ドウマスクを介して、 厚さ 2 0 0 n m程度 に真空蒸着することにより、 発光素子 1の陰極となる G N D線 2 7を形成する。 このとき、 同時に第 1薄膜トランジスタ T r 1側には信号検出電極 2 8が形成
される。 Next, as a cathode of the light-emitting element 1, aluminum-lithium alloy A1Li or another material having a low work function is vacuum-deposited to a thickness of about 200 nm through a metal shadow mask to emit light. A GND line 27 serving as a cathode of the element 1 is formed. At this time, a signal detection electrode 28 is simultaneously formed on the first thin film transistor Tr1 side. Is done.
発光素子 1の陰極に用いられる材料としては、 仕事関数が低いことに加えて、 光の反射率が高い材料がより好ましい。 As a material used for the cathode of the light emitting element 1, a material having a high work function and a high light reflectance is more preferable.
最後に、 図 9 (A) に示すように、 プラズマ C V D法そのたの成膜方法により、 全面に S i O N、 S i N x、 S i〇2その他の無機材料を約 1 mの厚さに堆積 して保護層 2 9を形成する。 これらの無機材料に加えて、 エチレン ' ビニルアル コール ' コポリマー、 シラン変性フッ素樹脂などの酸素透過度の低い有機材料を 用いて保護層 2 9を形成することもできる。 Finally, as shown in Fig. 9 (A), a plasma CVD method and other film-forming methods are used to deposit Si ON, Si N x, Si 2 and other inorganic materials to a thickness of about 1 m on the entire surface. To form a protective layer 29. In addition to these inorganic materials, the protective layer 29 can be formed using an organic material having low oxygen permeability such as an ethylene 'vinyl alcohol' copolymer or a silane-modified fluororesin.
以上に説明したように、 本実施例に係る画像入力装置 1 0によれば、 発光素子 1から放射された光のほぼ 1 0 0 %を表示に用いることができる。 従って、 液晶 ディスプレイその他の表示装置に積層して構成された従来の積層型表示ノ画像入 力装置と比較して、 ガラスその他の透明基板 1 1を用いて形成した本実施例に係 る指紋画像入力装置 1 0は光の利用効率が高く、 その結果として、 消費電力を低 減することができるという効果が得られる。 As described above, according to the image input device 10 according to the present embodiment, approximately 100% of the light emitted from the light emitting element 1 can be used for display. Therefore, the fingerprint image according to the present embodiment formed using a glass or other transparent substrate 11 is compared with a conventional multi-layer display image input device configured to be stacked on a liquid crystal display or other display device. The input device 10 has a high light use efficiency, and as a result, an effect of reducing power consumption can be obtained.
さらに、 前述のように、 本実施例に係る画像入力装置 1 0においては、 指紋画 像入力に必要な構成要素と画像表示に必要な構成要素との間で配線の一部を共有 させることにより、 配線の占める面積を低減している。 その結果、 発光素子 1の 面積を大きくすることができ、 明るい表示を実現することが可能になっている。 また、 本実施例に係る画像入力装置 1 0の厚さは殆ど基板の厚さで決まる。 こ のため、 通常の T F T工程で用いられるガラス基板を用いる場合には約 0. 7 m mの厚さになる。 すなわち、 図 1 7に示した従来の積層型表示/画像入力装置の 厚さが 2. 4 mm程度であるのに比べて、 大幅な薄型化が達成されている。 これ は、 本実施例に係る画像入力装置を携帯機器などに内蔵する場合に大きな利点に なる。 Further, as described above, in the image input device 10 according to the present embodiment, a part of the wiring is shared between components necessary for inputting a fingerprint image and components required for image display. The area occupied by wiring is reduced. As a result, the area of the light emitting element 1 can be increased, and a bright display can be realized. Further, the thickness of the image input device 10 according to the present embodiment is almost determined by the thickness of the substrate. Therefore, when a glass substrate used in a normal TFT process is used, the thickness is about 0.7 mm. In other words, the thickness of the conventional multi-layer display / image input device shown in FIG. 17 is much thinner than the thickness of about 2.4 mm. This is a great advantage when the image input device according to the present embodiment is built in a portable device or the like.
また、 図 1 7に示した従来の積層型表示/画像入力装置では、 T F T方式の液 晶ディスプレイを採用する場合、 指紋画像入力装置のためにも T F Tを多数配列 した透明基板が必要となるため、 T F Tの製造工程を経た基板が合計 2枚必要と なる。 これに対して、 本実施例に係る画像入力装置 1 0では T F T製造工程を経 た基板は 1枚のみで足りる。従って、本実施例に係る画像入力装置 1 0によれば、
TFT—枚分の製造工程及び製造時間を削減することができ、 ひいては、 製造コ ストを削減することができる。 Also, in the conventional stacked display / image input device shown in Fig. 17, when a TFT-type liquid crystal display is adopted, a transparent substrate on which a large number of TFTs are arranged is also required for a fingerprint image input device. Therefore, a total of two substrates that have undergone the TFT manufacturing process are required. On the other hand, in the image input device 10 according to the present embodiment, only one substrate having undergone the TFT manufacturing process is sufficient. Therefore, according to the image input device 10 according to the present embodiment, The manufacturing process and manufacturing time for TFTs can be reduced, and the manufacturing cost can be reduced.
(第 2の実施例) (Second embodiment)
上述した第 1の実施例においては、 信号発生電極として電源線を用いたが、 画 像入力装置のほぼ全面に形成された配線としては、 電源線の他に、 0 0線27 とゲート線 18とがある。 以下に述べる第 2の実施例においては、 電源線に代え て GND線を信号発生電極として兼用する。 In the first embodiment described above, the power supply line was used as the signal generating electrode. However, as the wiring formed on almost the entire surface of the image input device, in addition to the power supply line, the 0 line 27 and the gate line 18 were used. There is. In the second embodiment described below, a GND line is also used as a signal generation electrode instead of a power supply line.
図 10 (A) は、 本発明の第 2の実施例に係る画像入力装置において形成され る静電容量を説明する断面図である。 FIG. 10A is a cross-sectional view illustrating a capacitance formed in the image input device according to the second embodiment of the present invention.
図 10 (A) に示すように、 本実施例においては、 指 Fと信号検出電極 28と の間には静電容量 C 1が、 指 Fと信号発生電極兼用 GND線 27 aとの間には静 電容量 C 2が、 信号発生電極兼用 GND線 27 と信号検出電極 28との間には 静電容量 C dがそれぞれ形成される。 As shown in FIG. 10A, in this embodiment, a capacitance C 1 is provided between the finger F and the signal detection electrode 28, and a capacitance C 1 is provided between the finger F and the signal generation electrode / GND line 27a. Represents a capacitance C 2, and a capacitance C d is formed between the signal generating electrode and GND line 27 and the signal detecting electrode 28.
図 10 (B) は、 本発明の第 2の実施例に係る画像入力装置の回路構成を示す 回路図である。 FIG. 10B is a circuit diagram illustrating a circuit configuration of the image input device according to the second embodiment of the present invention.
上述の第 1の実施例の回路構成と異なる点は、 電源線 20 aには常に電源電圧' POWERが印加され、 信号発生電極兼用 GND線 27 aには、 表示モードまた は画像入力モードの何れかに応じてグランド電圧 GNDまたは高周波信号 CHA RGEの何れかが印加されるという点だけであり、 他の回路構成に関しては、 第 1の実施例の回路構成と同じである。 The difference from the circuit configuration of the first embodiment is that the power supply voltage 'POWER is always applied to the power supply line 20a, and the display mode or the image input mode is applied to the signal generation electrode / GND line 27a. The only difference is that either the ground voltage GND or the high-frequency signal CHA RGE is applied, and the other circuit configuration is the same as the circuit configuration of the first embodiment.
従って、本実施例に係る画像入力装置の動作は第 1の実施例とほぼ同様であり、 第 1の実施例に係る画像入力装置の動作の説明において信号発生電極兼用電源線 20を信号発生電極兼用 GND線 27 aと読み変えればよい。 Therefore, the operation of the image input device according to the present embodiment is substantially the same as that of the first embodiment. In the description of the operation of the image input device according to the first embodiment, the signal generation electrode / power supply line 20 is connected to the signal generation electrode. It can be read as a combined GND line 27a.
(第 3の実施例) (Third embodiment)
上述した第 1の実施例においては、 信号発生電極として電源線を、 第 2の実施 例においては、 信号発生電極として GND線をそれぞれ用いたが、 第 3の実施例 においては、 信号発生電極としてゲート線を使用する。 In the above-described first embodiment, the power supply line is used as the signal generating electrode, and in the second embodiment, the GND line is used as the signal generating electrode. In the third embodiment, the signal generating electrode is used as the signal generating electrode. Use gate lines.
図 1 1 (A) は、 本発明の第 3の実施例に係る画像入力装置において形成され る静電容量を説明する断面図である。
図 1 1 (A) に示すように、 本実施例においては、 指 Fと信号検出電極 28と の間には静電容量 C 1が、 指 Fと特定のゲート線 18 Aとの間には静電容量 C2 が、 この特定のゲート線 18 Aと信号検出電極 28との間には静電容量 Cdがそ れぞれ形成される。 FIG. 11A is a cross-sectional view illustrating a capacitance formed in the image input device according to the third embodiment of the present invention. As shown in FIG. 11A, in this embodiment, a capacitance C 1 is provided between the finger F and the signal detection electrode 28, and a capacitance C 1 is provided between the finger F and the specific gate line 18A. The capacitance C2 is formed between the specific gate line 18A and the signal detection electrode 28, respectively.
図 1 1 (B) は、本実施例に係る画像入力装置の回路構成を示す回路図である。 本実施例に係る画像入力装置における回路は、 第 1の実施例と異なり、 電源線 20 aと GND線 27には常に一定の電位が印加されている。 本実施例において は、 ゲート線 18 Aに印加される行走査信号の波形に特徴があり、 図 12のタイ ミングチヤ一トに示すように、 相互に隣り合うゲート線には互いにパルス幅の 1 Z 2ずつ重なり合う走査信号 ROWが印加される。 FIG. 11B is a circuit diagram illustrating a circuit configuration of the image input device according to the present embodiment. The circuit in the image input device according to the present embodiment differs from the first embodiment in that a constant potential is always applied to the power supply line 20a and the GND line 27. This embodiment is characterized by the waveform of the row scanning signal applied to the gate line 18A. As shown in the timing chart of FIG. 12, the gate lines adjacent to each other have a pulse width of 1Z. A scanning signal ROW overlapping by two is applied.
図 12は、 本発明の第 3の実施例に係る画像入力装置の動作を説明するための タイミングチャートである。 以下、 図 12を参照して、 第 3の実施例に係る画像 入力装置の動作を説明する。 FIG. 12 is a timing chart for explaining the operation of the image input device according to the third embodiment of the present invention. Hereinafter, the operation of the image input device according to the third embodiment will be described with reference to FIG.
ゲート線 18#2 nが Hレベルのときには、 画像入力用検出回路 4のアンプ A MPは全てゲート線 18# 2 nによって選択された信号検出電極 28に電気的に 接続されている。 次のゲート線 18A#2 n+ 1が Hレベルになった瞬間に、 ゲ ート線 18A#2n+lと指 Fとの間の静電容量 C 2と、 指 Fと信号検出電極 2 8との間の静電容量 C 1と、 ゲート線 18A#2 n+ 1と信号検出電極 28との 間の静電容量 Cdとの合成容量を介して、 ゲート線 18 #2 nによって選択され た信号検出電極 28にゲート線 18A#2 n+ 1から電荷が投入される。 When the gate line 18 # 2 n is at the H level, all the amplifiers AMP of the image input detection circuit 4 are electrically connected to the signal detection electrode 28 selected by the gate line 18 # 2 n. At the moment when the next gate line 18A # 2 n + 1 goes to the H level, the capacitance C 2 between the gate line 18A # 2n + l and the finger F, the finger F and the signal detection electrode 28 Signal detected by the gate line 18 # 2 n via the combined capacitance of the capacitance C 1 between the gate line 18 A # 2 n + 1 and the capacitance Cd between the signal detection electrode 28 Charge is applied to the electrode 28 from the gate line 18A # 2 n + 1.
第 1及び第 2の実施例の場合と同様に、 C 1《C2であるので、 個々のアンプ AMPの出力は電荷量(C 1 +Cd)AVに比例した電圧値となる。 従って、 前述 の実施例と同様にして、 これらのアンプ AMPの出力を外部の回路へ転送するこ とにより、 ゲート線 18# 2 nに近接した領域の指 Fの凹凸情報が得られる。 全てのゲート線 18についてこの動作を繰り返すことにより指 Fの凹凸情報、 すなわち、 指紋画像が得られる。 As in the first and second embodiments, since C1 << C2, the output of each amplifier AMP has a voltage value proportional to the charge amount (C1 + Cd) AV. Accordingly, by transferring the outputs of these amplifiers AMP to an external circuit in the same manner as in the above-described embodiment, the unevenness information of the finger F in the region close to the gate line 18 # 2n can be obtained. By repeating this operation for all the gate lines 18, the unevenness information of the finger F, that is, a fingerprint image is obtained.
本実施例においては、 高周波信号 CHARGEを省略するとともに、 CHAR GEと定電位との選択を行うためのスィツチングトランジスタ (第 4薄膜トラン ジスタ Tr 4及び第 5薄膜トランジスタ Tr 5) を省略し、 隣り合うゲート線 1
8に印加される走査信号 R OWが互いにパルス幅の 1 Z2ずつ重なるようにして、 その切り替わりのタイミングにおいて、 信号検出電極 2 8の合成容量に応じた電 圧を読むようにしたものである。従って、本実施例に係る画像入力装置によれば、 第 1の実施例に係る画像入力装置よりも簡素な構成により、 表示機能付き指紋画 像入力装置を実現することができる。 In this embodiment, the high-frequency signal CHARGE is omitted, and the switching transistors (the fourth thin film transistor Tr 4 and the fifth thin film transistor Tr 5) for selecting between the CHAR GE and the constant potential are omitted. Gate line 1 The scanning signals ROW applied to the signal 8 overlap each other with a pulse width of 1 Z2, and the voltage corresponding to the combined capacitance of the signal detection electrodes 28 is read at the switching timing. Therefore, according to the image input device according to the present embodiment, a fingerprint image input device with a display function can be realized with a simpler configuration than the image input device according to the first embodiment.
(第 4の実施例) (Fourth embodiment)
これまで説明した第 1乃至第 3の実施例においては、 発光素子 1は透明基板 1 1を透過する方向に光を発するように構成されていた。 従って、 画像を表示する 面は指紋を入力する面とは反対側の面になる。 後述するように、 応用形態によつ ては同じ面で画像表示と指紋画像入力を実現したい場合がある。 有機 E L材料を 挟む透明電極と金属電極の配置を入れ替えて上面発光型の素子を形成すれば、 そ のような装置を実現することができる。 In the first to third embodiments described so far, the light emitting element 1 is configured to emit light in a direction transmitting the transparent substrate 11. Therefore, the surface on which the image is displayed is the surface opposite to the surface on which the fingerprint is input. As described later, there are cases where it is desired to realize image display and fingerprint image input on the same surface depending on the application form. Such a device can be realized by forming the top emission type element by exchanging the arrangement of the transparent electrode and the metal electrode sandwiching the organic EL material.
図 1 3は、 本発明の第 4の実施例に係る画像入力装置の平面図 (図 1 3 (A)) と断面図 (図 1 3 (B)) である。 ここで、 第 1の実施例と同一の機能を有するも のには同一の参照番号が付されている。 FIG. 13 is a plan view (FIG. 13 (A)) and a cross-sectional view (FIG. 13 (B)) of an image input device according to a fourth embodiment of the present invention. Here, components having the same functions as those of the first embodiment are denoted by the same reference numerals.
図 1 3 (B ) において、 絶縁性基板 1 1 a上に形成される発光素子 1は、 金属 電極 3 0、有機 E L材料層 2 6、透明電極 2 5の順に積層されて形成されている。 ここで光は透明電極 2 5に向かって発せられるので、 絶縁性基板 1 1 aは透明で ある必要はない。 · In FIG. 13 (B), the light emitting element 1 formed on the insulating substrate 11a is formed by laminating a metal electrode 30, an organic EL material layer 26, and a transparent electrode 25 in this order. Here, since light is emitted toward the transparent electrode 25, the insulating substrate 11a does not need to be transparent. ·
また、 透明電極 2 5は G N D線を兼ねている。 従って、 回路的には前述の第 2 の実施例の場合と同様の構成である。 Further, the transparent electrode 25 also serves as a GND line. Therefore, the circuit configuration is the same as that of the second embodiment.
(第 5の実施例) (Fifth embodiment)
これまでに説明した実施例においては、 発光素子 1は G N D線側に接続される 構成となっていたが、 電源線側に接続することもできる。 この第 5の実施例にお いては、 第 4の実施例と同様に、 画像表示面と指紋画像入力面とを一致させた構 成を、 発光素子を電源線側に接続するものにおいて、 実現している。 In the embodiments described so far, the light emitting element 1 is configured to be connected to the GND line side, but may be connected to the power supply line side. In the fifth embodiment, similarly to the fourth embodiment, a configuration in which the image display surface and the fingerprint image input surface are matched is realized by connecting the light emitting element to the power supply line side. are doing.
図 1 4 (A)、 (B)、 ( c ) は、 それぞれ本発明の第 5の実施例に係る画像入力 装置の主要部を示す平面図と回路図と断面図である。 ここで、 第 4の実施例と同 —の構成要素には同一の番号が付されている。
図 1 4に示されるように、 第 5の実施例においては、 第 3薄膜トランジスタ T r 3のソースには信号発生電極兼用 GN D線 2 7 bが接続されている。 そして、 この信号発生電極兼用 G N D線 2 7 bとゲート配線 1 7とが重なり合っている領 域において、 第 1層間絶縁膜 1 9を誘電体層としてキャパシタ Cが形成されてい る。 FIGS. 14A, 14B, and 14C are a plan view, a circuit diagram, and a cross-sectional view, respectively, showing a main part of an image input device according to a fifth embodiment of the present invention. Here, the same components as those of the fourth embodiment are denoted by the same reference numerals. As shown in FIG. 14, in the fifth embodiment, the source of the third thin film transistor Tr3 is connected to the GND line 27b also serving as a signal generation electrode. Then, in a region where the signal generating electrode / common GND line 27b and the gate wiring 17 overlap, a capacitor C is formed using the first interlayer insulating film 19 as a dielectric layer.
また、 発光材料層 2 6の下層には陰極となる金属電極 3 0が形成され、 発光材 料層 2 6の上層には陽極となる透明電極 2 5が形成されている。 この透明電極 2 5は行方向に延びて電源線 2 0 aとなっている。すなわち、本実施例においては、 G N D線 2 7 bが列方向に延びており、 電源線 2 0 aが行方向に延びている。 本実施例に係る画像入力装置の動作は、 第 2の実施例のそれと同様である。 本実施例においては、 G N D線 2 7 bが信号発生電極を兼ねていたが、 電源線 2 0 a (透明電極 2 5 ) が信号発生電極を兼ねるように構成することもできる。 また、 電源線 2 0 aと G N D線 2 7 bとにモード切り替えに関係なく一定電位 を印加するようにし、 画像入力モードにおいては、 図 1 2に示されるように、 隣 り合うゲート線 1 8に印加される走查信号が互いにパルス幅の 1 Z2ずつ重なる ようにして、 指紋画像を得るようにしてもよい。 ., A metal electrode 30 serving as a cathode is formed below the light emitting material layer 26, and a transparent electrode 25 serving as an anode is formed above the light emitting material layer 26. The transparent electrode 25 extends in the row direction to form a power line 20a. That is, in the present embodiment, the GND line 27 b extends in the column direction, and the power supply line 20 a extends in the row direction. The operation of the image input device according to the present embodiment is the same as that of the second embodiment. In the present embodiment, the GND line 27b also serves as a signal generating electrode, but the power supply line 20a (transparent electrode 25) may be configured to also serve as a signal generating electrode. Also, a constant potential is applied to the power supply line 20a and the GND line 27b regardless of the mode switching. In the image input mode, as shown in FIG. The fingerprint signals may be obtained by making the scan signals applied to the scans overlap each other by a pulse width of 1 Z2. .,
また、 発光素子 1が電源線側に接続される場合においても、 上部電極 2 5を金 属電極、 下部電極 3 0を透明電極として基板 1 1 aの裏面側へ表示光が放出され るようにすることも可能である。 この場合、 基板 1 1 aとしては透明基板を用い る。 In addition, even when the light emitting element 1 is connected to the power supply line side, the display light is emitted to the back side of the substrate 11a using the upper electrode 25 as a metal electrode and the lower electrode 30 as a transparent electrode. It is also possible. In this case, a transparent substrate is used as the substrate 11a.
(第 6の実施例) (Sixth embodiment)
以上の第 1乃至第 5の実施例に係る表示機能を内蔵した画像入力装置は薄型で 光の利用効率が高いので、 携帯電話のような携帯機器への搭載に有利である。 図 1 5は、 本発明の第 6の実施例に係る携帯電話 3 1の斜視図であり、 本携帯電話 3 1には上述の第 1乃至第 5の実施例に係る画像入力装置の何れか一つが搭載さ れている。 The image input device having a built-in display function according to the first to fifth embodiments described above is thin and has high light use efficiency, and thus is advantageous for mounting on a portable device such as a mobile phone. FIG. 15 is a perspective view of a mobile phone 31 according to a sixth embodiment of the present invention. The mobile phone 31 includes one of the image input devices according to the first to fifth embodiments. One is installed.
本実施例に係る携帯電話 3 1は、 図 1 5に示すように、 第 1の筐体 3 5と、 第 2の筐体 3 6と、 第 1の筐体 3 5と第 2の筐体 3 6とをそれらの端部において相 互に回動可能に連結するヒンジ機構 3 7と、 からなつている。
第 1の筐体 3 5には、 例えば、 第 1の実施例に係る画像入力装置 1 0が、 携帯 電話 3 1を折り畳んだ状態で指紋の画像入力面 3 2が外側に、 表示面 3 3が内側 になるように、 実装されている。 As shown in FIG. 15, the mobile phone 31 according to the present embodiment includes a first housing 35, a second housing 36, a first housing 35, and a second housing. And a hinge mechanism 37 that rotatably connects the end portions 36 with each other at their ends. In the first housing 35, for example, the image input device 10 according to the first embodiment includes the image input surface 32 of the fingerprint in the state where the mobile phone 31 is folded, and the display surface 3 3 Is implemented so that is inside.
本実施例に係る携帯電話 3 1は以下のように使用することができる。 The mobile phone 31 according to the present embodiment can be used as follows.
例えば、 携帯電話 3 1を折り畳んだ状態で画像入力面 3 2に指を密着させて指 紋画像を入力し、 携帯電話 3 1の正当な所有者であると認証された場合に限り、 携帯電話 2 1を使用可能とするようにすることができる。 For example, when a mobile phone 31 is folded and a finger is brought into close contact with the image input surface 32 to input a fingerprint image, and the mobile phone 31 is authenticated as a valid owner, the mobile phone 31 2 1 can be made available.
あるいは、 携帯電話 3 1を通して各種のサービスの提供を受けるときに、 サー ビス提供者が課金する際の個人の認証を行う際に、 本携帯電話 3 1を介して指紋 の確認を行うことができる。 Alternatively, when various services are provided through the mobile phone 31, the fingerprint can be confirmed through the mobile phone 31 when the service provider authenticates the individual when charging. .
さらに、 指紋を様々な決済の手段として用いることも可能である。 また、 本携 帯電話 3 1においては、 画像入力面 3 2と表示面 3 3とが別になつているので、 表示面 3 3に指を密着させる必要がない。 従って、 表示面 3 3に付着した残留指 紋により表示の画質が劣化するという問題を回避することができる。 In addition, fingerprints can be used as various payment methods. Further, in the mobile phone 31, since the image input surface 32 and the display surface 33 are separately provided, there is no need to bring a finger into close contact with the display surface 33. Therefore, it is possible to avoid the problem that the image quality of display is deteriorated due to the remaining fingerprints attached to the display surface 33.
(第 7の実施例) (Seventh embodiment)
図 1 6は、 本発明の第 7の実施例に係る携帯電話 3 1 Aの斜視図であり、 本携 帯電話 3 1 Aには上述の第 1乃至第 5の実施例に係る画像入力装置の何れか一つ が搭載されている。 FIG. 16 is a perspective view of a mobile phone 31A according to a seventh embodiment of the present invention. The mobile phone 31A has image input devices according to the first to fifth embodiments. Either one is installed.
本実施例に係る携帯電話 3 1 Aは、第 6の実施例に係る携帯電話 3 1と同様に、 第 1の筐体 3 5と、 第 2の筐体 3 6と、 第 1の筐体 3 5と第 2の筐体 3 6とをそ れらの端部において相互に回動可能に連結するヒンジ機構 3 7と、 からなる折り 畳み式の携帯電話である。 The mobile phone 31A according to the present embodiment includes a first housing 35, a second housing 36, and a first housing, similarly to the mobile phone 31 according to the sixth embodiment. And a hinge mechanism 37 for rotatably connecting the end 35 and the second housing 36 to each other at their ends.
第 7の実施例に係る携帯電話 3 1 Aにおいては、 指紋画像表示面と指紋画像入 力面とがー致している表示機能付き指紋画像入力装置が実装されている。 具体的 には、 図 1 6に示すように、 第 1の筐体 3 5に、 携帯電話 3 1 Aを折り畳んだ状 態で画像入力面兼用表示面 3 4が内側になるように、 指紋画像入力装置が実装さ れている。 In the mobile phone 31A according to the seventh embodiment, a fingerprint image input device with a display function in which the fingerprint image display surface and the fingerprint image input surface match each other is mounted. Specifically, as shown in FIG. 16, the fingerprint image is placed on the first housing 35 so that the image input surface and display surface 34 is in the folded state of the mobile phone 31A. Input device is mounted.
このように、 指紋画像表示面と指紋画像入力面が一致している場合には、 画像 入力面兼用表示面 3 4に表示した指の図形に実際の指を重ねるという動作により
指紋入力の動作を確実に行うことができる。 従って、 指紋画像入力の安定性が増 し、 個人認証の精度を向上させることができる。 In this way, when the fingerprint image display surface and the fingerprint image input surface match, the operation of superimposing the actual finger on the finger figure displayed on the image input surface and display surface 34 is performed by the operation. The fingerprint input operation can be performed reliably. Therefore, the stability of fingerprint image input is increased, and the accuracy of personal authentication can be improved.
本実施例においては、 携帯電話 31 Aを折り畳んだ状態で画像入力面兼用表示 面 34が内側になるように、 画像入力面兼用表示面 34を配置しているが、 画像 入力面兼用表示面 34が携帯電話 31 Aの外側を向くように配置することも可能 である。 In the present embodiment, the image input / shared display surface 34 is arranged such that the image input / shared display surface 34 is inside when the mobile phone 31A is folded. However, it is also possible to arrange the mobile phone 31A so as to face the outside of the mobile phone 31A.
なお、 このような機能は、 表示された指の図形に実際の指を重ねた状態で画像 モードに切り替えることにより、 または、 表示モードと画像入力モードとを交互 に高速に切り替えることによって実現することができる。 Note that such a function can be realized by switching to the image mode with the actual finger superimposed on the displayed finger figure, or by alternately switching the display mode and the image input mode at high speed. Can be.
以上説明した実施例においては、 適宜の変更が可能である。 In the embodiments described above, appropriate changes can be made.
例えば、 第 1の実施例においては、 200 p p i (7. 87 p i X e 1 /mm) のカラー表示と 400 dpi (15. 75 d o t /mm) の指紋画像入力を実現する 例を挙げたが、 表示と画像入力の解像度および画素レイアウトはこれらの例に限 られるものではなく、 画素レイアウトを変更することにより、 様々な解像度の組 み合せを実現することができる。 For example, in the first embodiment, an example of realizing a color display of 200 ppi (7.87 pi Xe 1 / mm) and a fingerprint image input of 400 dpi (15.75 dots / mm) has been described. The resolution and pixel layout for display and image input are not limited to these examples, and various combinations of resolutions can be realized by changing the pixel layout.
また、 以上の実施例においては、 トップゲート型の p o 1 y— S i TFTの 例を挙げて説明したが、 ボトムゲート型 p 0 1 y— S i TFTを用いて回路を 構成することもできる。 Further, in the above embodiments, the example of the top gate type po 1 y-Si TFT has been described. However, the circuit can be configured using the bottom gate type p 0 1 y-Si TFT. .
あるいは、 液晶ディスプレイに多用されている a— S i TFTを用いること もできる。 ただし、 a— S iにおけるキャリア移動度は p o 1 y— S iの 1Z1 00程度であるので、 特に、 発光素子に電流を供給する TFTとして用いる場合 には、 その抵抗を十分に低くすることが必要になる。 例えば、 TFTの幅を大き く設定したり、 あるいは、 ゲート絶縁膜の厚さを低減することにより、 a— S i TFTの抵抗を下げることができる。 Alternatively, an a-Si TFT, which is widely used in liquid crystal displays, can be used. However, since the carrier mobility in a—Si is about 1Z100 of po 1 y—Si, the resistance must be sufficiently low especially when used as a TFT for supplying current to a light emitting element. Will be needed. For example, by setting the width of the TFT large or reducing the thickness of the gate insulating film, the resistance of the a-Si TFT can be reduced.
また、 上記の実施例においては、 表示用駆動回路 2や画像入力用検出回路 4を p o l y-S i TFTを用いて透明基板 1 1上に形成する構成を説明したが、 駆動回路及び検出回路の構成はこれに限るものではない。 Further, in the above-described embodiment, the configuration in which the display driving circuit 2 and the image input detection circuit 4 are formed on the transparent substrate 11 by using a polySi TFT has been described. Is not limited to this.
例えば、 TAB (Tap e Au t oma t e d Bo nd i ng) 接続、 C OG (Ch i On G 1 a s s) 接続として、 液晶ディスプレイの製造工程
において一般的に実施されているように、 同様の機能を結晶半導体で形成した集 積回路により実現し、 この集積回路を透明基板 1 1上に固定し、 電気的に接続す ることもできる。 For example, TAB (Tape Automated Bonding) connection and COG (Chi On G 1 ass) connection As generally practiced in, a similar function can be realized by an integrated circuit formed of a crystal semiconductor, and this integrated circuit can be fixed on the transparent substrate 11 and electrically connected.
また、 上述の実施例においては、 3色 (R G B) の発光材料を正方配置する構 成を示したが、 各色をストライプ状に配置する構成も採用することができる。 ま た、 カラ一フィルタと白色発光材料とを組み合わせることにより、 あるいは、 青 色発光材料と色変換材料とを組み合わせることによつても、 カラ一表示を実現す ることができる。 産業上の利用可能性 Further, in the above-described embodiment, the configuration in which the light-emitting materials of three colors (R, G, and B) are arranged in a square shape has been described, but a configuration in which the respective colors are arranged in a stripe shape may be employed. Also, a color display can be realized by combining a color filter and a white light-emitting material, or by combining a blue light-emitting material and a color conversion material. Industrial applicability
以上説明したように、 本発明に係る指紋画像入力装置によれば、 発光素子から 放射された光のほぼ 1 0 0 %を表示に用いることができるので、 光利用効率が高 く、 その結果として、 消費電力を低く抑えることができる。 As described above, according to the fingerprint image input device of the present invention, almost 100% of the light emitted from the light emitting element can be used for display, so that the light use efficiency is high, and as a result, However, power consumption can be kept low.
さらに、 指紋画像入力に必要な構成要素と画像表示に必要な構成要素とに共通 に必要な配線の一部を共有させることにより、 配線の占める面積を低減すること が可能になり、 その結果、 発光素子の面積を大きくすることができ、 明るい表示 を実現することができる。 Furthermore, by sharing a part of the wiring required for the components required for fingerprint image input and the components required for image display, the area occupied by the wiring can be reduced. The area of the light-emitting element can be increased, and a bright display can be realized.
また、 本発明に係る指紋画像入力装置の厚さはほとんど基板の厚さで決まり、 通常の T F T工程で用いられるガラス基板を基板として用いる場合には約 0. 7 mmの厚さにすることが可能であり、 大幅な薄型化を達成することができる。 こ の薄型化は、 本発明に係る指紋画像入力装置を携帯機器などに内蔵する場合に大 きな利点になる。 Further, the thickness of the fingerprint image input device according to the present invention is almost determined by the thickness of the substrate, and when a glass substrate used in a normal TFT process is used as the substrate, the thickness may be about 0.7 mm. It is possible, and a significant reduction in thickness can be achieved. This thinning is a great advantage when the fingerprint image input device according to the present invention is incorporated in a portable device or the like.
また、 高画質の画像表示が可能な TF T方式のディスプレイを採用する場合、 本発明に係る指紋画像入力装置によれば、 T F T製造工程を 1枚の基板に対して 行うのみで足りるため、 製造コストを低く抑えることができる。
In addition, when a TFT display capable of displaying high-quality images is adopted, according to the fingerprint image input device of the present invention, it is sufficient to perform the TFT manufacturing process on only one substrate. Costs can be kept low.
Claims
1 . 基板と、 1. The substrate and
前記基板の一平面上に配列された複数の信号検出電極と、 A plurality of signal detection electrodes arranged on one plane of the substrate,
前記信号検出電極が配列された平面と同一平面上に配列された複数の発光素子 と、 A plurality of light emitting elements arranged on the same plane as the plane on which the signal detection electrodes are arranged;
を備え、 ' With the '
前記信号検出電極と指との間に形成される静電容量を検出することにより、 指 紋画像を得る指紋画像入力モードと、 前記静電容量に応じて前記発光素子を発光 させることにより、 前記指紋画像を表示する指紋画像表示モ一ドとが切り替え可 能な指紋画像入力装置。 By detecting a capacitance formed between the signal detection electrode and the finger, a fingerprint image input mode for obtaining a fingerprint image, and causing the light emitting element to emit light in accordance with the capacitance, A fingerprint image input device that can be switched to a fingerprint image display mode for displaying fingerprint images.
2. 指を接触させることのできる保護層であって、 前記信号検出電極及び前記 発光素子を被覆する保護層を備えていることを特徴とする請求項 1に記載の指紋 画像入力装置。 2. The fingerprint image input device according to claim 1, wherein the fingerprint image input device is a protective layer that can be brought into contact with a finger, the protective layer covering the signal detection electrode and the light emitting element.
3. 前記指紋画像を入力する際には、 前記発光素子を駆動するための配線の一 部が前記静電容量を検出するための信号用配線として用いられることを特徴とす る請求項 1または 2に記載の指紋画像入力装置。 3. When inputting the fingerprint image, a part of a wiring for driving the light emitting element is used as a signal wiring for detecting the capacitance. 3. The fingerprint image input device according to 2.
4. 前記発光素子は前記信号検出電極と 1対 1に対応してマトリクス状に配置 されていることを特徴とする請求項 1乃至 3の何れか一項に記載の指紋画像入力 4. The fingerprint image input device according to claim 1, wherein the light emitting elements are arranged in a matrix in a one-to-one correspondence with the signal detection electrodes.
5. 前記基板上に配置された複数の走査信号配線と、 5. a plurality of scanning signal wirings arranged on the substrate;
前記基板上において前記走査信号配線に直交して配置された複数のデータ信号 配線と、 A plurality of data signal wirings arranged on the substrate at right angles to the scanning signal wirings;
前記走査信号配線と前記データ信号配線とに接続され、 かつ、 前記信号検出電 極に接続された第 1のスィッチ素子と、
前記走査信号配線と前記データ信号配線とに接続された第 2のスィッチ素子と、 前記第 2のスィッチ素子に接続された電流制御素子と、 A first switch element connected to the scanning signal wiring and the data signal wiring, and connected to the signal detection electrode; A second switch element connected to the scanning signal wiring and the data signal wiring, a current control element connected to the second switch element,
を備え、 With
前記発光素子は前記電流制御素子に直列に接続されていることを特徴とする請 求項 1乃至 4の何れか一項に記載の指紋画像入力装置。 The fingerprint image input device according to any one of claims 1 to 4, wherein the light emitting element is connected to the current control element in series.
6. 前記基板上に配置された電源配線と、 6. power supply wiring arranged on the board;
前記基板上に配置された接地配線と、 を備え、 Ground wiring arranged on the substrate,
直列に接続された前記発光素子及び前記電流制御素子は何れか一方の側におい て前記電源配線に接続され、 他方の側において前記接地配線に接続されているこ とを特徴とする請求項 5に記載の指紋画像入力装置。 The light emitting element and the current control element connected in series are connected to the power supply wiring on one side, and are connected to the ground wiring on the other side. The fingerprint image input device described in the above.
7. 前記指紋画像を入力する際に、 前記電源配線または前記接地配線の何れか が接続される信号発生電極をさらに備えており、 前記信号発生電極には高周波信 号が印加されることを特徴とする請求項 6に記載の指紋画像入力装置。 7. The apparatus further comprises a signal generating electrode to which either the power supply wiring or the ground wiring is connected when the fingerprint image is input, wherein a high-frequency signal is applied to the signal generating electrode. 7. The fingerprint image input device according to claim 6, wherein:
8. 前記指紋画像を入力する際には、 前記走査信号配線の各々には、 その走査 信号配線に隣接する他の走査信号配線と所定時間重複する走査信号が順次印加さ れることを特徴とする請求項 5乃至 7の何れか一項に記載の指紋画像入力装置。 8. When inputting the fingerprint image, a scanning signal overlapping with another scanning signal wiring adjacent to the scanning signal wiring for a predetermined time is sequentially applied to each of the scanning signal wirings. The fingerprint image input device according to claim 5.
9. モード切替用スィッチ素子と、 9. A mode switching switch element,
前記データ信号配線の一端が前記モード切替用スィツチ素子を介して接続され る表示用駆動回路と、 A display driving circuit to which one end of the data signal wiring is connected via the mode switching switch element;
前記データ信号配線の他端が前記モード切替用スィツチ素子を介して接続され る画像入力用検出回路と、 An image input detection circuit to which the other end of the data signal wiring is connected via the mode switching switch element;
前記走査信号配線の一端が接続される表示ノ画像入力用駆動回路と、 A display image input drive circuit to which one end of the scanning signal wiring is connected,
を備えていることを特徴とする請求項 5乃至 8の何れか一項に記載の指紋画像 入力装置。
The fingerprint image input device according to any one of claims 5 to 8, further comprising:
1 0. 前記表示用駆動回路、 前記画像入力用検出回路および前記表示ノ画像入 力用駆動回路は、 前記基板上に形成された薄膜トランジスタからなるものである ことを特徴とする請求項 9に記載の指紋画像入力装置。 10. The display drive circuit, the image input detection circuit, and the display image input drive circuit are formed of a thin film transistor formed on the substrate. Fingerprint image input device.
1 1 . 前記発光素子は有機のエレクトロルミネセンス材料を用いて形成されて いることを特徴とする請求項 1乃至 1 0の何れか一項に記載の指紋画像入力装置。 11. The fingerprint image input device according to claim 1, wherein the light emitting element is formed using an organic electroluminescent material.
1 2. 前記基板は透明基板であり、 前記発光素子の下部電極は透明導電膜に よつて形成されており、 前記発光素子から発せられた光は前記基板の裏面から放 射されることを特徴とする請求項 1 1に記載の指紋画像入力装置。 1 2. The substrate is a transparent substrate, the lower electrode of the light emitting element is formed of a transparent conductive film, and light emitted from the light emitting element is emitted from the back surface of the substrate. 11. The fingerprint image input device according to claim 11, wherein:
1 3. 前記発光素子の上部電極は透明導電膜によって形成されており、 前記発 光素子から発せられた光は前記基板の上方に放射されることを特徴とする請求項 1 1に記載指紋画像入力装置。 13. The fingerprint image according to claim 11, wherein an upper electrode of the light emitting device is formed of a transparent conductive film, and light emitted from the light emitting device is emitted above the substrate. Input device.
1 4. 前記下部電極または前記上部電極と反対側の電極は、 光の反射率が高い 金属材料によって形成されていることを特徴とする請求項 1 2または 1 3に記載 の指紋画像入力装置。 14. The fingerprint image input device according to claim 12, wherein the lower electrode or the electrode opposite to the upper electrode is formed of a metal material having a high light reflectance. 15.
1 5. 第 1の筐体と、 1 5. a first housing;
前記第 1の筐体とヒンジ機構を介して相互に折り畳み可能に連結されている第 2の筐体と、 A second housing that is foldably connected to the first housing via a hinge mechanism,
請求項 1乃至 1 4の何れか一項に記載の指紋画像入力装置と、 A fingerprint image input device according to any one of claims 1 to 14,
からなり、 Consisting of
前記指紋画像入力装置は、 前記第 1の筐体及び前記第 2の筐体を相互に折り畳 んだときに、 前記基板の指紋画像入力面が前記第 1の筐体または前記第 2の筐体 の外側及び内側の何れか一方を向き、 かつ、 前記基板の指紋画像表示面が他方を 向くように、 前記第 1の筐体及び前記第 2の筐体の何れか一方に組み込まれてい る機器。
The fingerprint image input device may be configured such that when the first housing and the second housing are folded together, the fingerprint image input surface of the substrate is the first housing or the second housing. It is incorporated in one of the first housing and the second housing so that either one of the outside and the inside of the body faces and the fingerprint image display surface of the substrate faces the other. machine.
1 6. 第 1の筐体と、 1 6. a first housing;
前記第 1の筐体とヒンジ機構を介して相互に折り畳み可能に連結されている第 2の筐体と、 A second housing that is foldably connected to the first housing via a hinge mechanism,
請求項 1乃至 1 4の何れか一項に記載の指紋画像入力装置と、 A fingerprint image input device according to any one of claims 1 to 14,
からなり、 Consisting of
前記指紋画像入力装置は、 前記第 1の筐体及び前記第 2の筐体を相互に折り畳 んだときに、 前記基板の指紋画像入力面及び指紋画像表示面が前記第 1の筐体ま たは前記第 2の筐体の外側及び内側の何れか一方を向くように、 前記第 1の筐体 及び前記第 2の筐体の何れか一方に組み込まれている機器。 The fingerprint image input device may be configured such that when the first housing and the second housing are folded together, the fingerprint image input surface and the fingerprint image display surface of the substrate are the same as the first housing. Or a device incorporated in one of the first housing and the second housing so as to face either the outside or the inside of the second housing.
1 7. 前記機器は携帯電話装置であることを特徴とする請求項 1 5または' 1 6 に記載の機器。 17. The device according to claim 15, wherein the device is a mobile phone device.
1 8. 基板の一平面上に複数の信号検出電極が配列された指紋画像入力装置の 前記一平面に指を触れる過程と、 1 8. a process of touching a finger on the one plane of the fingerprint image input device in which a plurality of signal detection electrodes are arranged on one plane of the substrate;
前記信号検出電極と前記指との間に形成される静電容量を検出することにより、 指紋画像を得る過程と、 Detecting a capacitance formed between the signal detection electrode and the finger to obtain a fingerprint image;
を備える指紋画像入力方法。 A fingerprint image input method comprising:
1 9. 前記指紋画像入力装置は前記信号検出電極が配列された平面と同一平面 上に配列された複数の発光素子をさらに備えており、 前記静電容量に応じて前記 発光素子を発光させることにより、 前記指紋画像を表示する過程を備えることを 特徴とする請求項 1 8に記載の指紋画像入力方法。
1 9. The fingerprint image input device further includes a plurality of light emitting elements arranged on the same plane as the plane on which the signal detection electrodes are arranged, and the light emitting elements emit light according to the capacitance. 19. The fingerprint image input method according to claim 18, further comprising: displaying the fingerprint image.
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JP2001037971A JP4487430B2 (en) | 2001-02-15 | 2001-02-15 | Fingerprint image input device with display function |
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