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WO2002045168A1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

Info

Publication number
WO2002045168A1
WO2002045168A1 PCT/JP2000/008437 JP0008437W WO0245168A1 WO 2002045168 A1 WO2002045168 A1 WO 2002045168A1 JP 0008437 W JP0008437 W JP 0008437W WO 0245168 A1 WO0245168 A1 WO 0245168A1
Authority
WO
WIPO (PCT)
Prior art keywords
pads
semiconductor device
section
terminals
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2000/008437
Other languages
French (fr)
Japanese (ja)
Inventor
Ikuo Nishimoto
Shiro Kano
Shigeo Miyagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azbil Corp
Original Assignee
Azbil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azbil Corp filed Critical Azbil Corp
Priority to JP2002547232A priority Critical patent/JP4186186B2/en
Priority to AU2001216493A priority patent/AU2001216493A1/en
Priority to PCT/JP2000/008437 priority patent/WO2002045168A1/en
Publication of WO2002045168A1 publication Critical patent/WO2002045168A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W72/00—
    • H10W72/90—
    • H10W72/9415—
    • H10W90/20—
    • H10W90/722—

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Near-Field Transmission Systems (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A semiconductor device which has a pad section (2) and an electronic circuit (4) on the semiconductor, the pad section having a plurality of pads (3), the electronic circuit being connected to the plurality of pads of the pad section and to a plurality of terminals on the semiconductor, a switch section (41) for selectively electrically connecting the plurality of pads and the plurality of terminals, and a connection control section for controlling selective connection of the switch section on the basis of information about the plurality of connecting terminals of an external device respectively connected to the plurality of pads of the pad section. This semiconductor device is adapted to easily make a matched connection with such external device as another semiconductor device.
PCT/JP2000/008437 2000-11-29 2000-11-29 Semiconductor device Ceased WO2002045168A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002547232A JP4186186B2 (en) 2000-11-29 2000-11-29 Semiconductor device
AU2001216493A AU2001216493A1 (en) 2000-11-29 2000-11-29 Semiconductor device
PCT/JP2000/008437 WO2002045168A1 (en) 2000-11-29 2000-11-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/008437 WO2002045168A1 (en) 2000-11-29 2000-11-29 Semiconductor device

Publications (1)

Publication Number Publication Date
WO2002045168A1 true WO2002045168A1 (en) 2002-06-06

Family

ID=11736731

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/008437 Ceased WO2002045168A1 (en) 2000-11-29 2000-11-29 Semiconductor device

Country Status (3)

Country Link
JP (1) JP4186186B2 (en)
AU (1) AU2001216493A1 (en)
WO (1) WO2002045168A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006324648A (en) * 2005-04-21 2006-11-30 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit, electronic device using the same, and method for controlling semiconductor integrated circuit
JP2007520851A (en) * 2004-02-05 2007-07-26 マイクロン テクノロジー，インコーポレイテッド Dynamic command and / or address mirroring system and method for memory modules
JP2021068806A (en) * 2019-10-23 2021-04-30 ルネサスエレクトロニクス株式会社 Semiconductor device, semiconductor device connection processing method, and electronic device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61180995A (en) * 1986-02-07 1986-08-13 Nec Corp Semiconductor integrated circuit device
JPS6240833A (en) * 1985-08-16 1987-02-21 Omron Tateisi Electronics Co Setting system for code of transponder
JPH04119652A (en) * 1990-09-11 1992-04-21 Toshiba Corp Semiconductor integrated circuit device
JPH11211794A (en) * 1998-01-29 1999-08-06 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit and inspection method thereof
JP2000216329A (en) * 1999-01-25 2000-08-04 Seiko Epson Corp Spherical semiconductor and semiconductor device using the same
EP1030266A2 (en) * 1999-02-19 2000-08-23 Nippon Telegraph and Telephone Corporation Noncontact type IC card and system therefor
JP2000243907A (en) * 1999-02-17 2000-09-08 Sony Corp Semiconductor chips and packages

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240833A (en) * 1985-08-16 1987-02-21 Omron Tateisi Electronics Co Setting system for code of transponder
JPS61180995A (en) * 1986-02-07 1986-08-13 Nec Corp Semiconductor integrated circuit device
JPH04119652A (en) * 1990-09-11 1992-04-21 Toshiba Corp Semiconductor integrated circuit device
JPH11211794A (en) * 1998-01-29 1999-08-06 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit and inspection method thereof
JP2000216329A (en) * 1999-01-25 2000-08-04 Seiko Epson Corp Spherical semiconductor and semiconductor device using the same
JP2000243907A (en) * 1999-02-17 2000-09-08 Sony Corp Semiconductor chips and packages
EP1030266A2 (en) * 1999-02-19 2000-08-23 Nippon Telegraph and Telephone Corporation Noncontact type IC card and system therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007520851A (en) * 2004-02-05 2007-07-26 マイクロン テクノロジー，インコーポレイテッド Dynamic command and / or address mirroring system and method for memory modules
JP2006324648A (en) * 2005-04-21 2006-11-30 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit, electronic device using the same, and method for controlling semiconductor integrated circuit
JP2021068806A (en) * 2019-10-23 2021-04-30 ルネサスエレクトロニクス株式会社 Semiconductor device, semiconductor device connection processing method, and electronic device
JP7282654B2 (en) 2019-10-23 2023-05-29 ルネサスエレクトロニクス株式会社 Semiconductor device, connection processing method for semiconductor device, and electronic device

Also Published As

Publication number Publication date
JP4186186B2 (en) 2008-11-26
JPWO2002045168A1 (en) 2004-04-08
AU2001216493A1 (en) 2002-06-11

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