WO2001004384A1 - Method for producing micro stamping tools - Google Patents

Abstract

The invention relates to a method for producing micro stamping tools which is designed to achieve a highly accurate reproductible match between said micro stamping tools, such as a force plate with stamps and a cutting plate, and to achieve a homogeneous distribution of die clearance. According to the first alternative for producing a cutting plate, a force place consisting of stamps with micro cutting structures in the sub-millimeter range is provided with a separating layer and the force plate is galvanically reproduced using a hard alloy. In another alternative for the production of a force plate with stamps, a cutting plate is used as an initial or master mould. According to the inventive method, a direct galvanic shaping process is performed, whereby reproduction errors and manufacturing tolerances are reduced substantially and a highly accurate match is achieved between the force and cutting plate, in addition to achieving a homogeneous distribution of die clearance. By using standardized microtechnical production methods, it is possible to produce large numbers of matching force and cutting plates in a simple, reproductible manner at low cost.

Description

 Process for the production of micro punching tools

description

The invention relates to a method for producing micro punching tools according to the preambles of claims 1, 2 and 3.

Stamping processes are used on a large scale for the production of various small components with web widths of <0.2 mm, e.g. in the watch and electronics industry. In general, many applications, such as Small relays or lead frames show a clear tendency towards advancing miniaturization.

In the case of webs of small width, punching structures are usually manufactured in several stations using sequential cutting tools. This largely prevents deformation of the workpiece. The production of lead frames, for example, requires the cutting processes to be broken down into many individual steps, so that the tool length and the demands on the tool tolerances increase considerably. In the present case, the tool has a total length of 2.4 m. The leadframe must therefore be manufactured in succession on three punching machines. The accuracy that can currently be achieved with punch structures is decisively limited by the high number of positioning steps in the tool and the resulting uneven cutting gap distribution.

When cutting sheet metal with a thickness of less than 1 mm, so-called hold-down plates are also used, which serve to fix the punched strip during the cutting process and to guide the cutting punches. This further reduces unwanted deformations of the stamped parts. The metal hold-down plate is usually guided over the columns of the tool frame and supported on the upper tool via coil springs. In addition to the deformation of the punching tape, the contour and shape accuracy of the active cutting elements is decisive for the dimensional accuracy of the punching structures. Typically, inserts with simple geometries are manufactured by wire EDM with a shape and dimension deviation down to 1 μm, with ground carbide inserts being inserted into the insert to increase the service life of the tool. Cutting punches can also be produced with the same precision by means of eroding processes, but also by contour grinding. One of the main disadvantages of conventional punching tools is that only cutting gaps in the range of 2 to 4 μm can be achieved. In the case of uneven cutting gaps, which can be caused by deviations in shape and size, the punches in particular wear out more on one side.

In addition, the precision of the cutting egg in the secondary cutting tool is also determined by the accuracy of the machine-controlled belt feed. The most commonly used method for exact band positioning in the tool is the so-called catch pin method.

Another major disadvantage of conventionally manufactured secondary cutting tools is their size. On the one hand, the tool length is often very long due to the large number of subsequent cutting stations. On the other hand, the height of the tools is largely determined by the metal hold-down. Due to these specifications, the tools are very heavy, the mass to be moved during the cutting process is high and it is necessary to punch with a large stroke in relation to the height of the punching structure. The demands placed on the punching machines with regard to tool installation space and movement accuracy are very high.

The choice of materials for punching tools depends crucially on the type and thickness of the materials to be cut and on the required service life. Cold tool steels, hard metals and powder metallurgy are preferred as tool materials for the active elements of cutting tools High-speed steels with a hardness of 60 to 70 HRC or 1000 to 1800 HV are used. Hard metals are characterized by less wear than cold work steels. The development of tougher hard metals also made it possible to manufacture very fine cutting elements. For this reason, cutting parts are often made of hard metals, especially in areas with a high demand for components with ever smaller critical dimensions, such as in electronics. In addition to ordinary tool steels and hard metals, tool steels produced using powder metallurgy are also used. They have a very fine-grained structure with an extremely even distribution of the alloy components, which enable very long tool life.

A coating of the active cutting elements increases the service life considerably and is widely used in industrial practice. With a hard material coating, e.g. Titanium nitride, titanium carbonitride or chrome nitride, wear resistance and surface hardness are increased. Processes from the group of CVD (Chemical Vapor Deposition) and PVD (Physical Vapor Deposition) processes are used as coating processes, whereby the PVD process is suitable for a larger number of materials due to the process-related lower substrate temperatures. With standard processes, all metallic materials can be coated with layer thicknesses of 1 to 4 μm.

In summary, further miniaturization of conventionally punched components is essentially hampered by the following disadvantages of the processes currently used for the manufacture of punching tools:

the lack of accuracy of the cutting tools due to the manufacturing tolerances of the processes used,

the tolerances of the relative positioning of two stamps to one another,

the lack of accuracy of the relative positioning of the cutting and stamping plate within a subsequent cutting station, for example due to the im Compared to the height of the punching structure due to the hold-down device, large tool stroke and a large tool mass,

the lack of possibility to manufacture complex cutting structures requires a very large number of subsequent cutting stations,

and the lack of accuracy in the relative positioning of the cutting tools between successive cutting stations.

DE 19542 658 A1 and US Pat. No. 5,645,977 disclose the use of the LIGA method for producing one-piece micro-punching tools which consist of a stamp plate with stamps, hold-down devices and cutting plate. The LIGA process enables the production of complex cutting structures and thus a reduction in the number of subsequent cutting stations.

According to the application of the LIGA method from DE 19542 658 A1, a mask is first produced in accordance with the micro punching tool to be manufactured. In order to subsequently produce a plastic negative mold corresponding to the micro-punching tool to be produced, a resist layer is first applied to a substrate and then the resist layer is exposed through the mask with high-energy radiation, such as X-ray radiation or ultraviolet radiation, and then developed. In a further step, a first galvanic impression of the plastic negative mold is carried out using an electroforming metal, a metal injection mold being obtained by removing the plastic. The molded plastic parts are then replicated using injection molding. Finally, a second galvanic impression of the plastic molded parts is carried out using an electroforming metal, resulting in one-piece micro-punching tools, such as a stamping plate with stamps, hold-down device and cutting plate. US Pat. No. 5,645,977 describes a method which is modified in comparison to DE 19542 658 A1, the last two method steps, namely replication of the plastic molded parts and second galvanic impression, being omitted. A disadvantage of both methods is that two independent LIGA process runs for the production of two matching micro punching tools, such as stamp plate with stamps and cutting plate, have to be carried out, each of the two LIGA processes being associated with corresponding imaging errors and manufacturing tolerances. This means that the two known methods can neither ensure a high fidelity of the punch and cutting plate to each other, nor can a resulting uniform cutting gap distribution be ensured.

The invention is therefore based on the object of providing a method for producing micro-punching tools which does not have the disadvantages of the prior art and enables both high imaging accuracy of the stamping and cutting plate to one another and also a uniform distribution of the cutting gap.

According to a first alternative, this object is achieved with a method for producing a cutting plate, in which a stamp plate with stamps, which has micro-cutting structures in the submillimeter range, is provided with a separating layer and the stamp plate is electroplated using a hard alloy.

The stamp plate is preferably produced by a further process for the production of one-piece micro-punching tools, which will be described below.

A particular advantage of the invention is that for the production of one-piece and matching micro punching tools, such as stamp plate with stamps and cutting plate, a direct galvanic impression process is carried out, with a positive form of a micro punching tool, such as a stamp plate with stamps, as a metal starting or Master mold is used to manufacture a cutting insert. As a result, the imaging errors and the manufacturing tolerances are compared to the prior art considerably reduced and thus both a higher image fidelity of the punch and cutting plate to each other and a uniform cutting gap distribution.

A uniform cutting gap distribution is generated by using standardized and precisely controllable microtechnical manufacturing processes, such as thin-film processes or immersion processes, in the method according to the invention for applying the separating layer. In addition, the use of standardized microtechnical manufacturing processes enables the matching stamping and cutting inserts to be produced easily and reproducibly and, above all, inexpensively in large quantities. A particular advantage of the induction is that the master mold can continue to be used after the direct electroplating.

Of course, a stamping plate with stamps can also be produced by a corresponding method according to the invention, with a cutting plate serving as the master mold.

The object according to the invention is therefore also achieved according to a further alternative with a method for producing a stamping plate, in which a cutting plate which has micro breakthroughs in the submillimeter range is provided with a separating layer and is connected to a base plate in such a way that the micro breakthroughs on the underside of the cutting plate be covered, and that the cutting plate is electroplated using a hard alloy.

In this first method according to the invention for producing a stamp plate, the cutting plate is first provided with a separating layer, preferably by means of an immersion method or a vacuum coating process. As a result, a separating layer can be applied uniformly to the entire surface of the cutting insert in a simple manner. Subsequently, the cutting plate provided with the separating layer is provided with a base plate, which is either made of a conductive material, such as a metal plate, or of a Non-conductive material can be connected on the underside so that the micro openings on the underside of the insert are covered.

Covering the micro breakthroughs on the underside of the cutting plate with the plate consisting of a conductive material serves to produce a starting layer or starting electrode in the area of the micro breakthroughs for the electroplating.

In the event that a base plate made of a conductive material is used, this plate can form the starting electrode on the basis of the micro-openings for the subsequent electroplating. In this case, both an electrically conductive separation layer and an electrically non-conductive separation layer can be applied to the surface of the cutting insert. If a non-conductive base plate is used, an electrically conductive separating layer is preferably applied to the surface of the cutting plate, which can then form the starting layer or starting electrode on the flanks or side walls of the micro openings. A starting layer on the base of the micro breakthroughs can, however, also be produced in that the cutting plate provided with the separating layer is connected to the base plate, for example with a conductive adhesive or by means of another suitable conductive intermediate layer, in such a way that this conductive intermediate layer can form the starting electrode. The insert is electroplated using a hard alloy.

The object according to the invention is also achieved according to a further alternative with a method for producing a stamping plate, in which a cutting plate which has micro breakthroughs in the submillimeter range is connected to a base plate in such a way that the micro breakthroughs on the underside of the cutting plate are covered, and the top the cutting insert is provided with a separating layer, and that the cutting insert is electroplated using a hard alloy. In this further method according to the invention for producing a stamp plate, in contrast to the first method described above, the cutting plate is first connected to the base plate, which can either consist of a conductive or a non-conductive material. This covers the micro breakthroughs on the underside of the insert. Only then is a separating layer applied to the still exposed top of the cutting insert, the side walls and the bottom of the micro-openings preferably also being covered with a separating layer. As already described, in the event that a conductive base plate is used, this plate can form the starting layer or starting electrode necessary for the subsequent galvanic molding. In the event that a non-conductive base plate is used, an electrically conductive separating layer is preferably applied to the upper side of the cutting plate, which then forms the starting layer or starting electrode both on the base and on the flanks or side walls of the micro-openings. Finally, the insert is electroplated using a hard alloy. In this alternative, of course, the starting layer can also be formed by a conductive adhesive or a conductive intermediate layer.

The cutting gap can be adjusted via the thickness of the separating layer. However, the cutting gap must not be so small that the punch and cutting plate can no longer be separated. According to a particular concept of the invention, separable separating layers are used which ensure that the stamp and the cutting plate can separate from one another after the galvanic molding. If necessary, the conductive adhesive or the conductive intermediate layer can also be dissolved when the separation layer is dissolved.

If the micro-cutting structures of the punches or micro breakthroughs of the cutting plates have small aspect ratios, for example an aspect ratio of less than 5, an electrically conductive separating layer is preferably used. The aspect ratio is the size ratio the height of the micro-cutting structures of the punches or the height of the micro-openings of the cutting plate in comparison with the respective widths.

To form the electrically conductive separating layer, the stamp plate or the cutting plate is preferably anodically oxidized. This creates a separation layer in the nanometer range.

On the other hand, in order to form the electrically conductive separating layer, the stamping plate or the cutting plate is coated on the surface with a metallic sacrificial layer, a conductive carbon layer or a conductive dip lacquer layer. These layers can be applied, for example, by means of a dipping process or a vacuum coating process. Furthermore, these layers can be dissolved after the galvanic molding.

If the micro-cutting structures of the punches or micro-perforations of the cutting inserts have high aspect ratios, which should preferably be understood to mean ratios greater than 5, non-conductive separating layers are advantageous. A wax or polymer layer or a silicon dioxide layer is preferably applied to the stamping plate or the cutting plate in order to form the non-conductive separating layer. The silicon dioxide layer is applied by sputtering. The wax and polymer layers can be applied, for example, by means of immersion processes, by spraying or in the form of shrink films. An applied wax film is preferably solidified by evaporation.

Since these materials are not suitable as a starting layer for the subsequent electroplating process, according to a first preferred variant, a metal layer is applied to this wax or polymer or silicon dioxide layer as a starting layer for the electroplating process. This application can be done by vapor deposition, sputtering or spraying. The metal layer is preferably made of nickel, copper, silver or gold.

According to a further preferred variant, the non-conductive separating layer is at least partially removed from the bottom of the micro breakthroughs in order to produce the starting layer before the galvanic molding. To remove the non-conductive separating layer, for example electromagnetic radiation or particle beams or other possibilities can be used, which have already been described in DE 197 53 948 A1. Since the present invention also at least partially applies the subject matter of DE 197 53 948 A1, namely a method for producing metallic microstructure bodies by direct galvanic molding, the methods and materials described therein are also considered as possible solutions for the present invention and are therefore explicitly described in the description added. The methods and materials described therein are also regarded as possible solutions for the present invention for removing the non-conductive separating layer and are hereby explicitly included in the description.

Another alternative to the production of one-piece micro-punching tools, such as cutting plate and stamping plate with stamps, is that a positive shape of the punching tool with micro-cutting structures or micro-perforations in the submillimeter range is produced from resist material by means of a deep structuring process, that this positive shape is electroplated to produce a countersink electrode, and that openings or recesses for forming the punching tool are introduced into a semifinished product by means of the erosion by means of EDM.

Although this process includes a further process step, it enables the punching tool to be made from materials that cannot be used in a galvanic impression. A semi-finished product made of hard metal or steel is therefore preferably used. A depth lithography method is preferably used as the depth structuring process.

The positive mold for producing the lowering electrode is preferably electroplated using copper.

The following variants can be used for all the alternatives described above:

In the case of galvanic molding, a layer made of a hard alloy is preferably applied first and then this layer is backfilled by electrodeposition of a softer material, such as Cu and / or Ni.

Nickel-iron, nickel-tungsten, cobalt-tungsten or nickel-cobalt is preferably used as the hard alloy.

After the galvanic molding, it is recommended to heat the composite of the cutting plate and stamp / stamp plate for easier separation or to treat them with solvent or ultrasound. This can also be achieved that the separating layer is dissolved or at least damaged so that an easier separation of the cutting and stamping plate is made possible.

After the galvanic molding and separation of the cutting and stamping plates, it is advantageous to subject the punching tool to a grinding process, in which case excess material can be removed. The main purpose, however, is to sharpen the cutting edges on the punches or on the cutting plate.

The punching tool or at least the micro cutting structures can additionally be provided with a hard material alloy in order to minimize the wear of the cutting edges on punches and cutting plates. Suitable for this are titanium nitride (TiN), titanium carbon nitrite (TiCN), chrome nitrite (CrN), titanium carbide (TiC), titanium aluminonitrite (TiAIN).

The advantage of the one-piece design is that on the one hand the positioning accuracy of the punches relative to one another and on the other hand the density of the cutting structures is much higher than is the case with conventional punching tools. This is due to the fact that no space-consuming fasteners are required to fasten the stamp in the stamp plate. This makes it possible to arrange cutting structures close to one another in almost any direction in both spatial directions. In addition, the total weight of the stamp plate and stamp of the one-piece design is lower, so that the energy expenditure for moving the micro-punching tool is lower and the accuracy of the relative positioning of the cutting and stamping plate is increased.

The micro-cutting structures can be manufactured with higher accuracy because microtechnical processes are used in which shape and dimensional deviations are in the submicrometer range.

According to the invention, at least some of the micro-cutting structures have free-form surfaces and / or undercuts in the stamp plate plane. Until now, such complex structures had to be subdivided into structures without an undercut or into simpler structures, which in turn had to be distributed over several subsequent cutting stations. This measure according to the invention also contributes to a high density of cutting structures and thus to a downsizing of the entire micro-punching device.

A micro-punching device according to the invention is characterized in that both the stamp and the stamping plate and the cutting plate are in one piece, the stamp, the stamping plate and the cutting plate being produced by microtechnical processes and the stamps having micro-cutting structures and the cutting plate having micro-openings in the submillimeter range. With the one-piece cutting plate, the usual cutting inserts are not required. The stamp / stamp plate and the cutting plate are preferably produced using the same microtechnical method, which increases the accuracy of the two interacting stamping tools. The width of the cutting gap and the cutting gap distribution can thereby be further reduced, which in turn improves the quality of the punched structures.

A cutting station preferably has at least one stamp plate. This also makes it possible to set up a modular system with micro-cutting structures, the stamp plates only having to be assembled in the desired arrangement. This is advantageous for simple structures in terms of flexibility, but this modular structure is purchased by impairing the positioning accuracy.

For highly complicated structures, it is therefore advantageous if the stamp plate carries several groups of stamps for several cutting stations. The positioning accuracy is significantly increased in this embodiment.

Micro-cutting structures in the submillimeter range produced with microtechnical processes are only a small height due to the process, which was previously considered a disadvantage. However, the low overall height also has the advantage that the masses to be moved are significantly smaller and that the stroke length is shorter, which in turn increases the cutting accuracy.

The low height of the stamp or micro-cutting structures requires special hold-down devices. Conventional hold-downs, which consist for example of metal plates, cannot be used because they must have a minimum thickness and therefore the punches cannot penetrate the hold-down.

The hold-down device to be used preferably in this invention has elastic polymer material. In a preferred embodiment, the hold-down device is made entirely of elastic polymer material. The hold-down device preferably consists of an elastic polymer layer applied to the stamp plate. The elastic polymer layer can be applied by various known methods, for example by dipping or spraying. In particular, elastomers are suitable as elastic polymers.

According to a further embodiment, the hold-down consists of an elastic polymer plate, which can also be thicker than the height of the stamp. When punching out, this polymer material is compressed, whereby the cutting path predetermined by the height of the stamp is only slightly reduced.

According to a further embodiment, the hold-down consists of an elastic polymer plate, which is preferably glued, for example, on the underside opposite the stamp plate with a metal layer, for example a steel sheet of 0.2 mm to 1 mm in height.

The elastic polymer plate is preferably attached to the stamp plate. However, there is also the possibility of attaching the polymer plate to other components of the punching device, e.g. on the base plate carrying the stamp plate or on the guide columns. The polymer plate can be glued, screwed or clamped. Other mounting options are also conceivable.

The hold-down device can have the same micro openings as the cutting insert. In this case, it is advantageous to punch out the elastic polymer plate by means of a stamp plate provided with stamps and a cutting plate.

According to a further embodiment, an elastic polymer can be applied directly to the stamp plate by means of immersion, spraying or pouring. In this case, the hold-down device can remain on the stamp plate. However, it is not absolutely necessary for the elastic polymer plate to have openings which belong to the micro-cutting structures. Simplified breakthroughs can also be provided in the elastic polymer plate.

The use of polymers for the hold-down device advantageously reduces the weight of the moving masses in a micro-punching device, so that this also increases the accuracy of the relative positioning of the cutting and stamping plate. Thermoplastic elastomers, rubbers or flexible foams are possible as preferred materials. The thermoplastic elastomers include e.g. Styrene-butadiene copolymers, polyamides, polyetheramides, polyetheresteramides or polyether block amides and polyurethanes.

Preferred rubbers are chloroprene rubber, natural rubber, fluororubber, silicone rubber or polyurethane rubber.

As soft elastic foams e.g. Foams with components made of polyethylene (PE), polyvinyl chloride (PVC) or polyurethane (PU) are used.

Exemplary embodiments of the invention are explained in more detail below with reference to the drawings.

Show it:

Figures 1a-c a micro-punching device in cross-section during various

Phases of the punching process, FIG. 2 shows a punched-out component from the electronics area,

Figure 3a shows the bottom view of a stamp plate with stamps for three

3b shows a representation of the cutting sequence with that shown in FIG. 3a

Punch plate, Figure 4 is an illustration of the sequence of cuts with a stamp plate after

State of the art, Figure 5a-c is a representation of the entire cutting sequence with conventional

Tool technology for producing the component from FIG. 2, FIG. 6 shows the entire cutting sequence with an inventive one

Micro punching device for producing the component from FIG. 2, FIG. 7 shows a stamp plate and a hold-down device in perspective

Representation, Figure 8 is a bottom perspective view of a stamp plate, which according to a first embodiment of a method for producing a

9 is a schematic illustration of the method steps for explaining the method shown in FIG. 8, FIG. 10 is a schematic illustration of a method for producing a cutting insert

Stamp plate according to a further embodiment, Figure 11 is a schematic representation of a method for producing a

Stamp plate according to a further embodiment, Figure 12 is a schematic representation of a method for producing a

Stamp plate according to a further embodiment, Figure 13 is a schematic representation of a method for producing a

Stamp plate according to a further embodiment, and Figure 14 is a schematic representation of a method for producing a

Cutting insert according to a further embodiment.

A micro-punching device is shown in vertical section in FIG. The micro-punching device has an upper tool 9a and a lower tool 9b, which are connected to one another via guide columns 3. The band 10 to be punched out is located between the two tools 9a, 9b.

The upper tool 9a has an upper adapter plate 1 and an upper base plate 2, in which the guide columns 3 are fastened. The guide columns 3 are guided in ball guides 4. Arranged on the underside of the upper base plate 2 is a one-piece stamp plate 40 with stamps 41 which have micro-cutting structures in the submillimeter range. Furthermore, a hold-down 20 made of an elastic polymer material is glued to the stamp plate 40. The thickness of the hold-down device 20 can be greater than the height of the stamp structures 41 because the hold-down device is compressed during the punching process.

The lower tool 9b of the micro-punching device is constructed in accordance with the upper tool 9a and has a lower adapter plate 8 and a lower base plate 7 which is fastened on the lower adapter plate. The base plate 7 carries a cutting plate receptacle 31 on which the cutting plate 30 is fastened. The stamp plate and cutting plate are fastened using upper and lower fastening screws 5 and 6.

The cutting plate 30 has micro breakthroughs 32. The insert holder 31, the lower base plate 7 and the lower adapter plate 8 also have conically shaped or enlarged openings in order to be able to remove the slug, that is to say the part cut out from the band 10.

In Figure 1 b, the micro punching device can be seen in the lowered position at the beginning of the punching process. The hold-down device 20 is already slightly compressed. In FIG. 1c, the punches 41 are immersed in the band 10 for cutting out.

FIG. 2 shows a punched-out component 11, as is used, for example, in the electronics sector. In order to achieve the structure shown, a plurality of punches 41 are necessary, which have so far been distributed over a total of 18 cutting stations according to FIGS. 5a-c using conventional tool technology and only 6 cutting stations according to the inventive tool technology according to FIG. The first three cutting stations of the tool technology according to the invention for producing the first three cutting sequences in FIG. 6 are shown in FIG. 3a and FIG. 3b shows the cutting sequence punched hereby. In FIG. 3a, the stamps 41 are a total of three stamp groups 42a, b and c corresponding to the three provided cutting stations summarized. 3b, the surfaces 43, 43 ', 43 "of the respective stamps of groups 42a, b and c are shown hatched and the surfaces 11' punched out by the preceding cutting station are shown without hatching. It can clearly be seen that the Micro-cutting structures can also have undercuts 72 formed perpendicular to the cutting direction, and the micro-cutting structures can also be designed as free-form surfaces.

The stamp density is significantly higher compared to a conventional arrangement of stamps shown in FIG. 4. The areas corresponding to the stamps are also hatched.

In FIGS. 5a-c, this is once again fully illustrated using the specific example of FIG. 2. 5a-c, the entire cutting sequence can be seen with a conventional tool, the free areas representing the areas which have already been punched out and the hatched areas identifying the stamping areas of the respective sequential cutting stations. While the cutting sequence according to FIG. 5 has a length of 508 mm, the cutting sequence with a micro-punching device according to the invention according to FIG. 6 is significantly shortened and is only 172 mm. This is due to the increased stamp density that can be achieved due to the one-piece design of the stamp plate and stamp. Only two punching operations with the stamp plate shown in FIG. 3a are required.

FIG. 7 shows a bottom view of a stamp plate 40 with the stamps 41 and the associated micro-cutting structures 70. The associated hold-down 20 in the form of an elastomer plate 22 has openings 21 which correspond to the micro openings 32 of the associated insert. Such an elastomer plate 22 can e.g. be produced by punching by means of the stamp plate 40 with the stamps 41 and the cutting plate.

FIGS. 8 and 9 show a first embodiment of the manufacturing method of a micro punching tool in the form of a cutting plate 30. With this A stamping plate 40 is used to produce a cutting plate 30 as a starting or master mold. First, a stamp plate 40 with stamps 41 is produced according to a method to be described, to which a separating layer 33 is subsequently applied, as shown in FIG. 9. A galvanic body 55 is then produced by means of galvanic molding. By dissolving the separating layer 33, the electroplating body 55 is separated from the stamp plate 40, so that a positive shape 56 of the cutting plate 30 is obtained. Further processing of this positive form 56 then leads to a cutting plate 30 with openings 32, as can be seen in FIG. 9. With this method, precise imaging of the punch and cutting plate is achieved. The uniform cutting gap distribution is ensured in this case by using thin-layer processes, such as plasma deposition and immersion processes, for producing the separating layer.

FIG. 10 shows a further production method that is used to produce a stamp plate 40 with stamps 41. A cutting plate 30 with micro breakthroughs 32 is produced, for example, using the previously described method, on the entire surface 78 of which a separating layer 33 with a uniform thickness is first applied, preferably by means of a dipping method or a vacuum coating process. In this production method, both an electrically conductive and an electrically non-conductive separation layer 33 can be used as the separation layer 33. The cutting plate 30 provided with the separating layer 33 is then connected to a base plate 75 on the underside 73, for example by means of an adhesive and electrically conductive intermediate layer 74, such as, for example, with a conductive adhesive 74 ^′ , as a result of which the micro openings 32 of the cutting plate 30 on the underside 73 thereof be covered by the base plate 75. In the event that the base plate 75 is made of a conductive material, such as a metal plate, the plate provided with the conductive adhesive 74 ^' on the base 76 of the micro-openings 32 preferably forms the starting electrodes 77 necessary for the subsequent electroplating, as is the case here can be seen in FIG. In the event that the base plate 75 is made of an electrically non- conductive material, an electrically conductive separating layer 33 is preferably applied to the surface 78 of the cutting plate 30, which then forms the starting electrode 77 or starting layer on the flanks or side walls 79 of the micro openings 32 for the subsequent galvanic molding. The starting electrode 77 can be formed on the base 76 of the micro openings 32 by the electrically conductive intermediate layer 74 and the conductive adhesive 74 ^' . A galvanic body 55 ^' is then produced by means of galvanic molding. Finally, the base plate 75 is removed, for example, by dissolving the conductive adhesive 74 ^' . Thereafter, the separation layer 33 is dissolved, as will be described. This leads to a micro-punching tool that precisely matches one another and comprises a stamping plate 40 with stamps 41 and a cutting plate 30 with micro openings 32, as shown in FIG.

FIG. 11 shows a further production method that is used to produce a stamp plate 40 with stamps 41. In this method, the cutting plate 30 is first connected to the base plate 75, for example by means of the electrically conductive adhesive 74 ^′ , and then a separating layer 33 is applied to the exposed upper side 80 of the cutting plate 30. In this embodiment, an electrically conductive separating layer 33 is preferably used, since this can directly form the starting electrode 77 on the base 76 in the micro-openings 32 of the cutting plate 30 for the subsequent galvanic impression. A galvanic body 55 'is then produced by means of galvanic molding, which then leads to a stamp plate 40 with stamps 41, as shown in FIG. 11.

FIG. 12 shows a further production method that is used to produce a stamp plate 40 with stamps 41. In this method, the base plate 75 is made of a conductive material. In contrast to the method according to FIG. 11, an electrically non-conductive separating layer 33 is preferably applied to the exposed upper side 80 of the cutting plate 30. In order to produce the starting electrode 77 on the base 76 of the micro openings 32 of the cutting plate 30, the non-conductive separating layer 33 is at least partially removed. According to FIG. 12 uses an irradiation of a mask 51 ', which has openings in the area of the micro-openings 32 of the cutting plate 30, with either particle or electromagnetic radiation. As a result, either the conductive intermediate layer 74, as shown in FIG. 12, or in the event that this was also removed by the particle radiation in the area of the micro-openings 32, the base plate 75 can form the starting electrode 77 for the subsequent galvanic impression. A galvanic body 55 ^' is then produced by means of galvanic molding, which then leads to a stamp plate 40 with stamps 41, as shown in FIG. 11.

A further method is shown in FIG. 13, in which a lowering electrode 60 is first produced in an intermediate step. Starting from a substrate 53 with resist material 52 and a mask 51 arranged above it and the irradiation by X-ray or UV radiation 50, a positive mold 59 of the stamp plate is first produced, which is electroplated to produce a galvanic body 60. After the resist material 52 has been removed, a lowering electrode 60 is obtained, by means of which the stamp plate 40 with the stamps 41 is produced from a semifinished product 62 by EDM. The spark gap is identified by the reference number 61.

FIG. 14 shows a further production method with which a cutting insert 30 is produced by means of die sinking and a sinking electrode 60 '. The method corresponds to the method according to FIG. 13.

LIST OF REFERENCE NUMBERS

1 upper adapter plate

2 upper base plate

3 guide pillar

4 ball guide

5 upper fastening screw

6 lower fastening screw

7 lower base plate

8 lower adapter plate

9a upper tool

9b lower tool

10 volume

11 punched component

11 'punched out areas

20 hold-down devices

21 breakthroughs

22 elastomer sheet

30 insert

31 insert holder

32 micro breakthrough

33 separation layer

34 cutting edge

40 stamp plate

41 stamps

42 a, b, c stamp group

43 Area of the stamp of the respective sequential cutting station

43 ', 43 "area of the stamp of the respective sequential cutting station

50 UV or X-rays

51, 51 'mask

52 resist material

53 substrate , 55 'electroplating body

Positive form, 57 'micro structure

Positive form, 60 'lower electrode

spark gap

Workpiece

Micro cutting structure

undercut

bottom

Interlayer ^' glue

baseplate

reason

starting electrode

surface

Side wall

top

Claims

claims: 1. A method for producing a cutting insert (30), characterized in that that a stamp plate (40) with stamps (41) has micro-cutting structures (70) in the submillimeter range, is provided with a separating layer (33), and that the stamp plate (40) is electroplated using a hard alloy. 2. A method for producing a stamp plate (40), characterized in that that a cutting plate (30), which has micro-openings (32) in the submillimeter range, is provided with a separating layer (33), and is connected to a base plate (75) so that the micro-openings (32) on the underside (73) of the cutting plate (30) are covered, and that the cutting plate (30) is electroplated using a hard alloy. 3. A method for producing a stamp plate (40), characterized in that that a cutting plate (30) which has micro openings (32) in the submillimeter range, is connected to a base plate (75) so that the micro-openings (32) on the underside (73) of the cutting plate (30) are covered, and the top (80) of the cutting plate (30) is provided with a separating layer (33), and that the cutting plate (30) is electroplated using a hard alloy. 4. The method according to claim 2 or 3, characterized in that a plate made of a conductive material is used as the base plate (75). 5. The method according to claim 2 or 3, characterized in that an existing plate made of a non-conductive material is used as the base plate (75). 6. The method according to any one of claims 1 to 5, characterized in that an electrically conductive separating layer is used as the separating layer (33). 7. The method according to claim 6, characterized in that the stamping plate (40) or the cutting plate (30) is coated on the surface by anodic oxidation with nickel oxide to form the separating layer (33). 8. The method according to claim 6, characterized in that the stamping plate (40) or the cutting plate (30) is coated on the surface with a metallic sacrificial layer, a conductive carbon layer or a conductive dip lacquer layer to form the separating layer (33). 9. The method according to any one of claims 1 to 4, characterized in that an electrically non-conductive separating layer is used as the separating layer (33). 10. The method according to claim 9, characterized in that a wax or a polymer layer or a silicon dioxide layer is applied to form the separating layer (33) on the stamp plate (40) or the cutting plate (30). 11. The method according to claim 9 or 10, characterized in that a metal layer is applied as a starting layer for the galvanic impression on the non-conductive separating layer. 12. The method according to claim 9 or 10, characterized in that the non-conductive separating layer from the base (76) of the micro-openings (32) is at least partially removed before the galvanic molding. 13. A method for producing one-piece micro punching tools, such as cutting plate (30) and stamping plate (40) with stamps (41), characterized in that that a positive shape (56, 59) of the punching tool (30, 40) with micro-cutting structures (70) or micro breakthroughs (32) in the submillimeter range is produced from resist material by means of a deep structuring process, that the positive mold (56, 59) is electroplated to produce a lowering electrode (60, 60 ^' ), that by means of the sinking electrode (60, 60 ^' ) by means of die sinking EDM into a Semi-finished product (62) openings or depressions to form the punching tool (30, 40) can be introduced. 14. The method according to claim 13, characterized in that a depth lithography process is used as the depth structuring process. 15. The method according to claim 13 or 14, characterized in that a semi-finished product (62) made of hard metal or steel is used. 16. The method according to any one of claims 1 to 15, characterized in that a layer made of a hard alloy is first applied during the galvanic molding and then this layer is backfilled by electrodeposition of a softer material. 17. The method according to claim 16, characterized in that NiFe, NiW, CoW or NiCo is used as the hard alloy. 18. The method according to any one of claims 1 to 17, characterized in that after the galvanic molding for separating the cutting plate (30) and stamp / stamp plate (41, 40) the composite is heated or treated with solvent or ultrasound. 9. The method according to any one of claims 1 to 18, characterized in that at least the micro-cutting structures (70) are provided with a hard material layer.