[go: up one dir, main page]

WO2001088473A1 - Inspection d"une structure superficielle tridimensionnelle et etalonnage de la resolution (application de pate de brasage) a l"aide d"une camera. d"un capteur optique et d"un repere d"etalonnage independant - Google Patents

Inspection d"une structure superficielle tridimensionnelle et etalonnage de la resolution (application de pate de brasage) a l"aide d"une camera. d"un capteur optique et d"un repere d"etalonnage independant Download PDF

Info

Publication number
WO2001088473A1
WO2001088473A1 PCT/DE2000/001563 DE0001563W WO0188473A1 WO 2001088473 A1 WO2001088473 A1 WO 2001088473A1 DE 0001563 W DE0001563 W DE 0001563W WO 0188473 A1 WO0188473 A1 WO 0188473A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical sensor
camera
calibration mark
resolution
images
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2000/001563
Other languages
German (de)
English (en)
Inventor
Hubert Bellm
Ludwig Listl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to PCT/DE2000/001563 priority Critical patent/WO2001088473A1/fr
Publication of WO2001088473A1 publication Critical patent/WO2001088473A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts

Definitions

  • the invention relates to a device for the inspection of a three-dimensional surface structure of an essentially flat test object according to the preamble of claim 1 and to a method for calibrating such an inspection device according to the preamble of claim 4.
  • Fine pitch range the distance between two adjacent connections of a component is about 1 / 40th Inch. This also makes the pads on the printed circuit boards smaller and denser. About 80% of the soldering errors in the fine pitch area are caused by the solder paste printing. Examples of such errors are insufficient solder paste application or short circuits between adjacent pads due to inaccurate placement of the stencil during solder paste printing. In order to find these defects and to identify weaknesses in the manufacturing process, an optical inspection of the circuit board is carried out after the solder paste application. For this purpose, the above-mentioned American patent describes a device with a camera for taking an image of a solder deposit to be inspected. With the help of a neural network, three-dimensional features of the solder deposit are extracted from the two-dimensional image recorded during inclined lighting and cross-polarization of the light.
  • the position of the printed circuit board must first be recorded in the inspection device.
  • the camera is moved with a positioning device in succession over two alignment marks.
  • the alignment marks can be designed, for example, as round metallic pads or as printed cross marks. They are expediently arranged in the region of the corners of the printed circuit board.
  • the images of the marks recorded with the camera are evaluated in a computer with a suitable image evaluation program and the position of the marks is calculated. Information about a possible shift or rotation of the circuit board is obtained from the position of the marks.
  • the camera can be positioned over the desired group of solder paste depots, which corresponds, for example, to the connections of a component, and an image can be recorded for further assessment of the quality of the solder paste application.
  • the two-dimensional image processing method has the disadvantage that, in particular, deviations in the height of the solder deposits from a predetermined target value are only inaccurately can be averaged. This can result in a connection of a component not resting on the solder paste, for example if the solder paste application is too low, and in the subsequent soldering process no electrical connection between the component connection and the pad on the printed circuit board being established.
  • An optical sensor for three-dimensional detection of surfaces is known from DE 196 08 468 C2.
  • the optical sensor described there which works as a distance sensor based on the confocal optical imaging principle, enables automatic surface inspection with a high data rate at low system costs.
  • the object of the invention is to create a device for inspecting a three-dimensional surface structure and to find a method for calibrating such an inspection device, by means of which the accuracy of the measurement of the three-dimensional surface structure is further improved.
  • the new device for inspecting a three-dimensional surface structure of the type mentioned at the outset has the features specified in the characterizing part of claim 1.
  • the new method for calibrating such an inspection device comprises the steps mentioned in the characterizing part of claim 4.
  • the invention has the advantage that the volume and position of the solder paste application can be measured exactly.
  • the solder volume is a very important process parameter, with the knowledge of which systematic process weaknesses can be eliminated.
  • measurement results are determined with the optical sensor on the geometric shape of the solder paste application. This data can be used directly for process improvement and is therefore of great benefit to the user.
  • a calibration mark that is permanently connected to the inspection device has the advantage that it is independent of the test object. The calibration therefore does not impose any additional requirements on the quality of the marks on the test object, which are provided for example on printed circuit boards for determining the printed circuit board position with a camera.
  • the duration of a calibration process is only about 10 s.
  • the relative position of the optical sensor to the camera can be calculated exactly.
  • the camera be positioned exactly over the features to be inspected after measuring alignment marks on the test object, but also the optical sensor.
  • the calibration mark Since the calibration mark is firmly connected to the inspection device, its position changes when the DUT or a conversion to another DUT not.
  • the mark can thus be approached automatically in any case and the individual steps of the calibration can be carried out automatically with the aid of a control computer which evaluates the image signals of the CCD camera and the optical sensor using image evaluation software.
  • the same control computer can also be used to control the travel axes of a positioning device.
  • the alignment marks on a printed circuit board as a test object only have to be recorded in the image area.
  • the position of the marks in the coordinate system of the inspection device can be calculated from the offset in the recorded image and the resolution of the image.
  • the calibration mark which is firmly connected to the inspection device, is such that it provides both a contrast in the gray-scale image of the camera and in the height image of the optical sensor, then advantageously only one mark is sufficient to calibrate both recording systems.
  • the relative position of the optical sensor to the camera can be measured exactly. Compared to a separate measurement with different marks, falsification of the measurement result due to inaccuracies in the relative position of the marks to one another is advantageously avoided.
  • a calibration mark which is designed as a circular cylinder standing on a plane, the base of which is aligned essentially parallel to the surface of the test specimen and the upper circular surface of which is treated in such a way that its gray value differs significantly from the gray value of the plane, has the advantage that it can be produced with little effort and represents a simple shape primitive, which can be measured with little computing effort using a stored model is correlated and, because of the contrasting edges, allows precise measurement both by the CCD camera and by the optical sensor.
  • An additional improvement in the accuracy in the measurement of the resolution of the CCD camera and the optical sensor can advantageously be achieved by taking at least two images each time, the respective recording positions being offset from one another in a plane parallel to the plane of the test object.
  • the resolution of the CCD camera or the optical sensor is calculated exactly on the basis of the offset of the images of the calibration mark.
  • FIG. 1 shows a basic illustration of an inspection device
  • FIG. 2 shows a plan view of the working area of an inspection device
  • Figures 3A and 3B images of the CCD camera to determine the
  • FIGS. 4A and 4B images of the optical sensor for determining the resolution in the X direction
  • Figures 5A and 5B images of the optical sensor for determining the resolution in the Y direction.
  • Figure 1 is an inspection device for optical
  • the unchecked circuit boards are fed to the inspection device with a conveyor belt 1.
  • the circuit board to be inspected is held in an inspection position with a tiltable stopper 2, the hidden parts of which are drawn with broken lines. After the inspection (-0 CO t to P 1 1
  • Working segment 24 is a panel 25 on which circuit boards, not shown in FIG. 2, are arranged as test specimens.
  • a panel coordinate system with axes XN and YN, which are also marked as arrows, is defined by the position of the layout of the circuit board on the panel.
  • the user coordinate system is shifted in position with respect to the machine coordinate system.
  • the offset of the panel has the coordinates XMO and YMO. With the width dimension X and the length dimension Y of the panel, the panel coordinates XN and YN of a point P can be converted into machine coordinates using the following formulas:
  • the sensor unit 21 in the inspection device is moved in the direction of the axis XM, the panel 25 in the direction of the axis YM. Overall, the sensor unit 21 can thus be positioned relative to the panel 25 in the X and Y directions.
  • the optical sensor 22 is just above a calibration mark 27. If the calibration mark 27 is exactly centered in the image of the optical sensor 22, the coordinates SensPosX and SensPosY are determined.
  • the machine coordinates XM and YM are converted into the axis coordinates X-axis and Y-axis of the positioning device according to the formulas:
  • the camera 23 is positioned over the calibration mark 27 in a corresponding manner. Coordinates CamPosX and CamPosY of the camera 23 with a centered image of the calibration mark 27 and the respective conversion formulas for the conversion into the co CO to to P 1 P 1
  • ⁇ P- er ⁇ PO TJ ⁇ ⁇ PP 1 P 1 P ⁇ ⁇ P ⁇ P P- ⁇ ⁇ P rt ⁇ ⁇ P 03 TJ 3 ii P- the P ⁇ ⁇ -i PL PPH "P rt li oi P 1 3 03 ⁇ q P ii 3 1-1 P ⁇ ⁇ PP ⁇ p- oi tr H rt rt P ⁇ -i P
  • the images recorded with the optical sensor 7 and the CCD camera 8 can be evaluated by correlation with a previously defined pattern of the calibration mark 16.
  • This pattern can be created, for example, in terms of program technology or can be generated from a previously recorded image using image processing software.
  • the pattern is stored in a file in the memory of the control computer 14 so that it is available to the image evaluation software during the X / Y calibration.
  • An operating unit 29 is provided for making the operating inputs required for calibration X / Y and for displaying the results or the status of the inspection device. It is also used for operation during the actual inspection process.
  • FIGS. 3A and 3B show basic representations of the images taken.
  • a circle 31 and 32 respectively marks the position of the calibration mark 16 in FIGS. 3A and 3B.
  • the axes XM and YM of the machine coordinate system are additionally shown in FIGS. 3A and 3B.
  • the position of the center of the image is in Figure 3A on the machine coordinates (XMP1, YMP1), in Figure 3B on the machine coordinates (XMP2, YMP2).
  • the center of the image of the calibration mark 16 is located in FIG.
  • FIG. 3A at the coordinates XI ', Yl' of an image coordinate system with the axes X 'and Y', in FIG. 3B at the coordinates X2 ', Y2'.
  • the position of the center point can be determined in a simple manner using suitable image evaluation software.
  • the scale of the axes X 'and Y' corresponds to the number of pixels in the image. From the so determined
  • a pixel resolution CamPX in the direction of the X axis and a pixel resolution Ca PY in the direction of the Y axis can be determined using the following formulas:
  • the coordinates of the center of the image of the CCD camera 8 can also be calculated with this:
  • the values XMAX 'and YMAX' represent the total number of pixels in the direction of the X 'and Y' axes.
  • the optical sensor 7 is then positioned over the calibration mark 16 and scanned with a first scan area in the X direction, so that a height image is recorded, as shown in FIG. 4A.
  • the image according to FIG. 4B is recorded with the optical sensor 7 via a second scan area in the X direction.
  • Axes XM and YM of the machine coordinate system and axes X ' 1 and Y' ⁇ of the coordinate system of the optical sensor 7 are shown in FIGS. 4A and 4B.
  • the center of the recorded image of the calibration mark 16 is located in FIG. 4A at the machine coordinate XM1, in FIG. 4B at the machine coordinate XM2.
  • the two values XM1 and XM2 are, of course, the same, since the position of the calibration mark 16 within the inspection device has not changed in the period between the taking of the two images.
  • the origin of the image coordinate system lies on the machine coordinate XMS1, in FIG. 4B on the machine coordinate coordinate XMS2.
  • the center of the image of the calibration mark 16 is located in FIG. 4A at the coordinate Y1 ′′ of the image coordinate system, in FIG. 4B at the coordinate Y2 ′′.
  • a pixel resolution SensPX of the optical sensor 7 in the X direction is calculated with these values:
  • FIGS. 5A and 5B show images recorded with the optical sensor 7 for a third and a fourth scan area in the Y direction. Axes XM and YM of the machine coordinate system and axes X '' 'and Y' "of the image coordinate system of the optical sensor 7 are again shown.
  • the origin of the image coordinate system for the third scan area lies on the Y coordinate YMS3 of the machine coordinate system, for the fourth scan area on the Y coordinate YMS4.
  • the center of the image of the calibration mark 16 lies in the image coordinate system on the coordinate Y3 "" for the third scan area in FIG. 5A and on the coordinate Y4 "" for the fourth scan 5B, from which a pixel resolution SensPY is determined to:
  • the coordinates SensPosX and SensPosY of the theoretical center of the calibration mark 16 can be calculated, for example:
  • SensPosX XMSl - SensPX ⁇ YMAX '' / 2
  • SensPosY YMS3 + SensPY ⁇ YMAX "'12.
  • YMAX '' and YMAX ''' are the maximum number of pixels in the direction of the Y''axis and in the direction of the Y''' axis of the image coordinate systems.
  • the position of the origin of the image coordinate system can of course be calculated and displayed in a simple manner.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un dispositif permettant d'inspecter une structure superficielle tridimensionnelle, ainsi qu'un procédé d'étalonnage à l'aide d'une caméra (8) pour prendre une image en deux dimensions et d'un capteur optique (8) pour mesurer en trois dimensions une caractéristique à inspecter. La caméra (8) et le capteur optique (7) sont regroupés dans une unité de détection (6). Un repère d'étalonnage (16) fixé sur le dispositif d'inspection, indépendamment de l'ébauche (3), sert à étalonner la position et/ou la résolution de la caméra (8), ainsi que du capteur optique (7). Ce système permet d'effectuer des étalonnages contrôlés par programme, sans avoir à adapter l'ébauche ou le dispositif d'inspection.
PCT/DE2000/001563 2000-05-17 2000-05-17 Inspection d"une structure superficielle tridimensionnelle et etalonnage de la resolution (application de pate de brasage) a l"aide d"une camera. d"un capteur optique et d"un repere d"etalonnage independant Ceased WO2001088473A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/DE2000/001563 WO2001088473A1 (fr) 2000-05-17 2000-05-17 Inspection d"une structure superficielle tridimensionnelle et etalonnage de la resolution (application de pate de brasage) a l"aide d"une camera. d"un capteur optique et d"un repere d"etalonnage independant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2000/001563 WO2001088473A1 (fr) 2000-05-17 2000-05-17 Inspection d"une structure superficielle tridimensionnelle et etalonnage de la resolution (application de pate de brasage) a l"aide d"une camera. d"un capteur optique et d"un repere d"etalonnage independant

Publications (1)

Publication Number Publication Date
WO2001088473A1 true WO2001088473A1 (fr) 2001-11-22

Family

ID=5647668

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/001563 Ceased WO2001088473A1 (fr) 2000-05-17 2000-05-17 Inspection d"une structure superficielle tridimensionnelle et etalonnage de la resolution (application de pate de brasage) a l"aide d"une camera. d"un capteur optique et d"un repere d"etalonnage independant

Country Status (1)

Country Link
WO (1) WO2001088473A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005091695A1 (fr) * 2004-03-17 2005-09-29 Siemens Aktiengesellschaft Dispositif de verification et procede pour controler des dispositifs d'exploration optique pour des pieces a usiner se trouvant dans une installation de montage pour des blocs electriques
WO2007116848A1 (fr) * 2006-03-29 2007-10-18 Matsushita Electric Industrial Co., Ltd. Système de montage d'un composant électronique, appareil de placement d'un composant électronique, et procédé de montage d'un composant électronique
WO2008032756A1 (fr) * 2006-09-11 2008-03-20 Panasonic Corporation Système de montage de composant électronique et procédé de montage de composant électronique
WO2016177369A1 (fr) * 2015-05-05 2016-11-10 Micro-Epsilon Messtechnik Gmbh & Co. Kg Dispositif et procédé de mesure de la largeur et de l'épaisseur d'un objet plan
WO2018037327A1 (fr) * 2016-08-23 2018-03-01 Tyco Electronics (Shanghai) Co. Ltd. Plate-forme de détection de qualité de brasage

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0471196A2 (fr) * 1990-08-13 1992-02-19 Siemens Aktiengesellschaft Méthode d'analyse d'image
US5118192A (en) * 1990-07-11 1992-06-02 Robotic Vision Systems, Inc. System for 3-D inspection of objects
US5134665A (en) * 1990-03-08 1992-07-28 Mitsubishi Denki Kabushiki Kaisha Apparatus and method of inspecting solder printing
US5686994A (en) * 1993-06-25 1997-11-11 Matsushita Electric Industrial Co., Ltd. Appearance inspection apparatus and appearance inspection method of electronic components
WO1999000661A1 (fr) * 1997-06-30 1999-01-07 Semiconductor Technologies & Instruments, Inc. Procede et appareil d'inspection de pieces
DE19915052A1 (de) * 1999-04-01 2000-10-05 Siemens Ag Einrichtung zur Inspektion einer dreidimensionalen Oberflächenstruktur sowie Verfahren zur Kalibrierung einer derartigen Einrichtung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5134665A (en) * 1990-03-08 1992-07-28 Mitsubishi Denki Kabushiki Kaisha Apparatus and method of inspecting solder printing
US5118192A (en) * 1990-07-11 1992-06-02 Robotic Vision Systems, Inc. System for 3-D inspection of objects
EP0471196A2 (fr) * 1990-08-13 1992-02-19 Siemens Aktiengesellschaft Méthode d'analyse d'image
US5686994A (en) * 1993-06-25 1997-11-11 Matsushita Electric Industrial Co., Ltd. Appearance inspection apparatus and appearance inspection method of electronic components
WO1999000661A1 (fr) * 1997-06-30 1999-01-07 Semiconductor Technologies & Instruments, Inc. Procede et appareil d'inspection de pieces
DE19915052A1 (de) * 1999-04-01 2000-10-05 Siemens Ag Einrichtung zur Inspektion einer dreidimensionalen Oberflächenstruktur sowie Verfahren zur Kalibrierung einer derartigen Einrichtung

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005091695A1 (fr) * 2004-03-17 2005-09-29 Siemens Aktiengesellschaft Dispositif de verification et procede pour controler des dispositifs d'exploration optique pour des pieces a usiner se trouvant dans une installation de montage pour des blocs electriques
WO2007116848A1 (fr) * 2006-03-29 2007-10-18 Matsushita Electric Industrial Co., Ltd. Système de montage d'un composant électronique, appareil de placement d'un composant électronique, et procédé de montage d'un composant électronique
US8240543B2 (en) 2006-03-29 2012-08-14 Panasonic Corporation Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method
WO2008032756A1 (fr) * 2006-09-11 2008-03-20 Panasonic Corporation Système de montage de composant électronique et procédé de montage de composant électronique
US7870991B2 (en) 2006-09-11 2011-01-18 Panasonic Corporation Electronic component mounting system and electronic component mounting method
WO2016177369A1 (fr) * 2015-05-05 2016-11-10 Micro-Epsilon Messtechnik Gmbh & Co. Kg Dispositif et procédé de mesure de la largeur et de l'épaisseur d'un objet plan
US10184784B2 (en) 2015-05-05 2019-01-22 Micro-Epsilon Messtechnik Gmbh & Co. Kg Device and method for measuring the width and thickness of a flat object
WO2018037327A1 (fr) * 2016-08-23 2018-03-01 Tyco Electronics (Shanghai) Co. Ltd. Plate-forme de détection de qualité de brasage
US10955363B2 (en) 2016-08-23 2021-03-23 Tyco Electronics (Shanghai) Co. Ltd. Soldering quality detection platform
DE112017004207B4 (de) 2016-08-23 2023-11-16 Te Connectivity Corporation Einrichtung zur erfassung der lötqualität

Similar Documents

Publication Publication Date Title
DE69331505T2 (de) Vorrichtung zur Kontrolle gedruckten Pastenlots
DE69011361T2 (de) Verfahren und Einrichtung zur Untersuchung von gedruckten Schaltungen.
DE69735240T2 (de) Elektronisches bauteil und bestückungsverfahren und -vorrichtung
DE68908752T2 (de) Ausgleichsanordnung zur Untersuchung von möglicherweise gekrümmten Leiterplatten.
DE69711043T2 (de) Vorrichtung und verfahren zum siebdrucken
EP1212583B1 (fr) Dispositif pour inspecter une structure superficielle tridimensionnelle
DE3785978T2 (de) Gerät zum Feststellen der räumlichen Anordnung eines elektronischen Bauteils.
DE2939396C2 (de) Lagenabtastvorrichtung
DE19515154A1 (de) Tastkopf-Meßhantiergerät, Verfahren zum Prüfen integrierter Schaltungen und integrierter Schaltungsbaustein
DE112004002140T5 (de) Bestückungsmaschine mit Bildaufnahmevorrichtung
DE60015966T2 (de) Messung der lagen oder koplanarität von kontaktelementen eines elektronischen bauteils mit flacher beleuchtung und zwei kameras
DE10043728C2 (de) Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens
DE112017007435T5 (de) Komponentenbestückungssystem und klebemitteluntersuchungsvorrichtung
DE10296416T5 (de) Verfahren und Vorrichtung zur Registrierungssteuerung in der Produktion durch Belichten
WO2018077356A1 (fr) Plaque de référence et procédé pour calibrer et/ou vérifier un système de détection par déflectométrie
DE2951943A1 (de) Verfahren zum erzielen der ausrichtung zwischen gegenstaenden
DE68927532T2 (de) Gerät zur Inspektion von gedruckten Schaltungen mit Bauteilen, die auf der Oberfläche montiert sind.
EP0980520B1 (fr) Procede et agencement de circuits pour controler des points de soudure
DE19728144C2 (de) Verfahren und Vorrichtung zum Erzeugen von Testmustern
DE68919268T2 (de) Leiterplatte und Verfahren zum Erkennen der Position von oberflächenmontierten Bauteilen.
DE112020002626T5 (de) Dreidimensionale Messvorrichtung und dreidimensionales Messverfahren
DE112004002123T5 (de) Bestückungsmaschine mit verbesserter Einstellung und Betriebsverfahren
EP0355377B1 (fr) Méthode d'essai optique d'assemblages plats de composants électroniques
WO2001088473A1 (fr) Inspection d"une structure superficielle tridimensionnelle et etalonnage de la resolution (application de pate de brasage) a l"aide d"une camera. d"un capteur optique et d"un repere d"etalonnage independant
DE102013017878A1 (de) Durchbiegungskompensation zur Beschriftung platten- oder stabförmiger Objekte

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN JP KR SG US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP