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WO2001045039A1 - Method for producing a chip card with flush contacts - Google Patents

Method for producing a chip card with flush contacts Download PDF

Info

Publication number
WO2001045039A1
WO2001045039A1 PCT/FR2000/003512 FR0003512W WO0145039A1 WO 2001045039 A1 WO2001045039 A1 WO 2001045039A1 FR 0003512 W FR0003512 W FR 0003512W WO 0145039 A1 WO0145039 A1 WO 0145039A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit sheet
module
card
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FR2000/003512
Other languages
French (fr)
Inventor
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to AU21851/01A priority Critical patent/AU2185101A/en
Publication of WO2001045039A1 publication Critical patent/WO2001045039A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Definitions

  • the present invention relates to a method of manufacturing a smart card with contacts flush with the surface of the card.
  • the invention applies very particularly to smart cards capable of ensuring a contact operating mode as well as at least one other function such as a contactless function and / or a data display function for example.
  • Such smart cards are said to be mixed because they have several operating modes.
  • Chip cards are intended to perform various operations which can be carried out either by inserting the card into a reader for contact operation, or by electromagnetic coupling with a transceiver terminal for contactless operation.
  • Chip cards must have standardized dimensions in order to be compatible with card readers. These dimensions are defined by ISO 7810 as a card 85 mm long, 54 mm wide, and 0.76 mm thick. The location of the contacts on the surface of the card is also precisely defined by ISO 7816. These standards impose severe constraints for manufacturing. The very small thickness of the card is in particular a major constraint, even more severe for mixed cards than for cards simply provided with contacts, since it is necessary to provide for the incorporation of an antenna and / or a battery into the card.
  • the antenna generally consists of a conductive element deposited in a thin layer on a plastic support sheet. There are connection pads at the ends of the antenna which must be updated in order to be able to connect them to the contacts of the electronic module.
  • antenna wire The conductive element forming the antenna will hereinafter be referred to as antenna wire since it may be, depending on the technology used, either a wire embedded in the manufacturing support sheet, or printed tracks.
  • a recommended solution for manufacturing mixed smart cards consists of using plastic sheets pre-drilled at the antenna connection pads formed by the two ends of the antenna wire, to superimpose them on the sheet supporting the antenna. and to assemble them by hot or cold rolling.
  • the position of the antenna connection pads is limited by the position of the electronic module, which is itself defined by ISO standards. It is then necessary to machine a cavity in the card body, between the antenna connection areas and above the perforations provided in the plastic sheets covering the antenna, to place the electronic module there, then connect the module contacts electronics to the antenna connection pads by depositing a conductive adhesive in the perforations.
  • the antenna wire generally comprises several turns. These turns pass between the connection pads, so that they can be connected to these connection pads which are located in the micromodule region.
  • the present invention aims to achieve a contact module insertion in a card body and its electrical connections economically.
  • the invention proposes to produce a printed circuit sheet on which the components necessary for the operation of the card are arranged, in particular an antenna.
  • Printed circuit technology is well mastered by those skilled in the art.
  • the invention then proposes to make a connection between the printed circuit sheet integrated in the body of the card, and the contact pads of the module produced separately.
  • the invention advantageously uses interconnection pads fixed on the printed circuit sheet to make this electrical connection with the contact module.
  • the present invention relates more specifically to a method of manufacturing a smart card comprising a module with contacts flush with the surface of the card comprising the following steps: the manufacture of a printed circuit sheet on which electronic components are fixed and / or electric; - integration of the printed circuit sheet into the card body; the connection of the contact module with the printed circuit sheet, Characterized in that the connection of module with contacts to the printed circuit sheet is carried out by means of interconnection pads implanted on the printed circuit sheet. According to one characteristic, the interconnection pads are made of an electrically conductive and deformable material.
  • the printed circuit sheet is produced on a fiberglass substrate. According to another embodiment, the printed circuit sheet is produced on an epoxy substrate.
  • the components fixed to the printed circuit sheet comprise at least in an integrated circuit chip and electrically conductive tracks.
  • the components fixed to the printed circuit sheet further comprise in an antenna and / or a battery.
  • the integration of the printed circuit sheet into the card body is carried out by overmolding.
  • the integration of the printed circuit sheet into the card body is carried out by lamination.
  • the bonding and the connection of the contact module to the printed circuit sheet are carried out by hot pressing.
  • the contact module further comprises a thin integrated circuit chip.
  • the present invention also relates to a smart card with flush contacts, characterized in that it comprises a contact module and a sheet of printed circuit on which electrical and / or electronic elements are arranged, and in that interconnection pads electrically connect the flush contacts to the tracks of the printed circuit.
  • the printed circuit sheet covers approximately the entire surface of the card.
  • the card has an antenna integrated on the printed circuit sheet.
  • the card has a battery integrated on the printed circuit sheet.
  • the present invention makes it possible to reduce the interconnection costs of the contact module of a mixed chip card and to increase the production rates.
  • the presence of the printed circuit sheet makes it possible to stiffen the card.
  • the method according to the invention advantageously makes it possible to keep the conventional steps of inserting the module in a card body, the operation even being facilitated by the presence of the interconnection pads.
  • Figure 1 is a schematic sectional view of the card body and the module carrying the card contacts
  • Figure 2 is a schematic sectional view of the connection of the module with the printed circuit sheet of the card.
  • the present invention consists in making a low cost and high speed connection of a module to contact with a printed circuit sheet integrated in a card body.
  • FIG. 1 is a sectional view of a card body 100 comprising a printed circuit sheet 30 and of a contact module 10 to be connected to the electronic components fixed on said sheet 30.
  • the contact module 10 is composed of a dielectric support 15, consisting of a thermoplastic sheet for example, on which are arranged contact pads 18 intended to establish an electrical connection between an electronic circuit and the connection pads of a reader.
  • a printed circuit sheet 30 has been produced and integrated into the body of the card 100 by molding or laminating for example.
  • the card body 100 also has a cavity 110 capable of receiving the module 10. This cavity is produced by any technique well known to those skilled in the art, either directly during overmolding or rolling, or by machining.
  • the printed circuit sheet in English terminology, consists of a substrate 32 on which are deposited electrical and / or electronic components electrically connected by conductive tracks 33.
  • the substrate 32 can be fiberglass or epoxy for example, and the conductive tracks 33 can be produced by screen printing, printing of an electrically conductive material, or any other known technique used to develop printed circuits.
  • the PCB can carry at least one integrated circuit chip.
  • an antenna can be deposited on the PCB according to any technique known to those skilled in the art; and for an application to cards with display, a battery can also be fixed on the PCB.
  • the PCB 30 further comprises interconnection pads 35 which have the function of allowing electrical connection between the tracks 33 of the PCB 30 and the contact pads 18 of the module 10. These pads 35 are located on the PCB 30 at the cavity 110 of the card body 100.
  • Such pads 35 are commonly used in the printed circuit industry and commonly called connection pins. They are produced during the normal PCB manufacturing process 30. In the embodiment, they cross the tracks 33 and are implanted in the PCB 30 up to half its thickness for example.
  • the thickness of the PCB is approximately 100 ⁇ m and that of the tracks 33 is 17 ⁇ m.
  • the pads 35 are advantageously made of an electrically conductive and deformable material in order to flatten when connected with the module 10, as illustrated in FIG. 2.
  • FIG. 2 indeed illustrates the interconnection between the module 10 and PCB 30 in board 100.
  • the interconnection can, for example, be carried out by hot pressing of the module 10 in the cavity 110 of the card body 100 provided at the location provided by the ISO standard.
  • the adhesive properties of the thermoplastic support 15 of the module 10 can thus be activated in order to ensure the fixing of the module 10 in the cavity 110 of the card body 100.
  • the interconnection pads 35 can be provided with an amalgam of gold wires which flatten during the pressing of the module 10.
  • the support 100 incurs no risk of deformation during compression, and the electrical connection is guaranteed between the contact pads 18 and the tracks 33 of the PCB 30 on which the components of the card are fixed.
  • the method according to the invention advantageously makes it possible to conserve the conventional steps of inserting the module 10 into a card body 100.
  • the electrical connection operation is facilitated since the connection pads are an integral part of the PCB.
  • the studs can be prepared in masked time during the implantation of components on the PCB and in the same way as the latter.
  • the module 10 can further comprise an integrated circuit chip, preferably ultra thin, for example in a cavity formed in the dielectric support 15.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a method for producing a chip card comprising a module (10) with contacts (18) that are flush with the surface of the body of a card (100). The inventive method comprises the following steps: manufacture of a printed circuit board (30) on which electronic and/or electric components are fixed; the integrated circuit board (30) is integrated into the body of the card (100), and the contact (18) module (10) is connected to the printed circuit board (30) with the aid of interconnecting blocks (35) implanted on the printed circuit board (30).

Description

PROCEDE DE FABRICATION D ' UNE CARTE A PUCE A CONTACTS AFFLEURANTSMETHOD FOR MANUFACTURING A CHIP CARD WITH FLUSHED CONTACTS

La présente invention concerne un procédé de fabrication d'une carte à puce à contacts affleurants la surface de la carte. L'invention s'applique tout particulièrement aux cartes à puce aptes à assurer un mode de fonctionnement à contact ainsi qu' au moins une autre fonction telle qu'une fonction sans contact et/ou une fonction d'affichage de données par exemple. De telles cartes à puce sont dites mixtes car elles présentent plusieurs modes de fonctionnement.The present invention relates to a method of manufacturing a smart card with contacts flush with the surface of the card. The invention applies very particularly to smart cards capable of ensuring a contact operating mode as well as at least one other function such as a contactless function and / or a data display function for example. Such smart cards are said to be mixed because they have several operating modes.

Les cartes à puces sont destinées à réaliser diverses opérations qui peuvent être effectuées soit en insérant la carte dans un lecteur pour un fonctionnement à contact, soit par couplage électromagnétique avec une borne d' émission-réception pour un fonctionnement sans contact.Chip cards are intended to perform various operations which can be carried out either by inserting the card into a reader for contact operation, or by electromagnetic coupling with a transceiver terminal for contactless operation.

Il peut en outre être avantageux de munir les cartes à puce d'une fonction afficheur, pour une application porte-monnaie électronique par exemple, qui permet de visualiser des informations contenues dans la carte .It may also be advantageous to provide smart cards with a display function, for an electronic purse application for example, which makes it possible to view information contained in the card.

Les cartes à puce doivent obligatoirement présenter des dimensions normalisées afin d' être compatible avec les lecteurs de carte. Ces dimensions sont définies par la norme ISO 7810 comme étant une carte de 85 mm de long, 54 mm de large, et 0.76 mm d'épaisseur. L' emplacement des contacts à la surface de la carte est en outre précisément défini par la norme ISO 7816. Ces normes imposent des contraintes sévères pour la fabrication. L'épaisseur très faible de la carte est en particulier une contrainte majeure, plus sévère encore pour les cartes mixtes que pour les cartes simplement munies de contacts, car il faut prévoir l'incorporation d'une antenne et/ou d'une pile dans la carte. L'antenne est généralement constituée d'un élément conducteur déposé en couche mince sur une feuille support en plastique. Aux extrémités de l'antenne sont prévues des plages de connexion qui doivent être mises à jour afin de pouvoir les connecter aux contacts du module électronique.Chip cards must have standardized dimensions in order to be compatible with card readers. These dimensions are defined by ISO 7810 as a card 85 mm long, 54 mm wide, and 0.76 mm thick. The location of the contacts on the surface of the card is also precisely defined by ISO 7816. These standards impose severe constraints for manufacturing. The very small thickness of the card is in particular a major constraint, even more severe for mixed cards than for cards simply provided with contacts, since it is necessary to provide for the incorporation of an antenna and / or a battery into the card. The antenna generally consists of a conductive element deposited in a thin layer on a plastic support sheet. There are connection pads at the ends of the antenna which must be updated in order to be able to connect them to the contacts of the electronic module.

L'élément conducteur formant l'antenne sera dénommé dans la suite fil d'antenne étant donné qu'il pourra s'agir selon la technologie employée soit d'un fil incrusté dans la feuille support de fabrication, soit de pistes imprimées.The conductive element forming the antenna will hereinafter be referred to as antenna wire since it may be, depending on the technology used, either a wire embedded in the manufacturing support sheet, or printed tracks.

Une solution préconisée pour fabriquer les cartes à puce mixtes consiste à utiliser des feuilles plastiques pré-percées au niveau des plages de connexion de l'antenne formées par les deux extrémités du fil d'antenne, à les superposer sur la feuille supportant l'antenne et à les assembler par laminage à chaud ou à froid. La position des plages de connexion de l'antenne est limitée par la position du module électronique qui est elle-même définie par les normes ISO. II faut ensuite usiner une cavité dans le corps de carte, entre les plages de connexion de l'antenne et au-dessus des perforations prévues dans les feuilles plastiques recouvrant l'antenne, pour y placer le module électronique, puis connecter les contacts du module électronique aux plages de connexion de l'antenne en déposant une colle conductrice dans les perforations. Le fil d'antenne comporte en général plusieurs spires. Ces spires passent entre les plages de connexion, de manière à pouvoir être reliées à ces plages de connexion qui se trouvent dans la région du micromodule .A recommended solution for manufacturing mixed smart cards consists of using plastic sheets pre-drilled at the antenna connection pads formed by the two ends of the antenna wire, to superimpose them on the sheet supporting the antenna. and to assemble them by hot or cold rolling. The position of the antenna connection pads is limited by the position of the electronic module, which is itself defined by ISO standards. It is then necessary to machine a cavity in the card body, between the antenna connection areas and above the perforations provided in the plastic sheets covering the antenna, to place the electronic module there, then connect the module contacts electronics to the antenna connection pads by depositing a conductive adhesive in the perforations. The antenna wire generally comprises several turns. These turns pass between the connection pads, so that they can be connected to these connection pads which are located in the micromodule region.

La présente invention a pour objectif de réaliser un encartage de module à contacts dans un corps de carte et ses connexions électriques de manière économique .The present invention aims to achieve a contact module insertion in a card body and its electrical connections economically.

A cet effet, l'invention propose de réaliser une feuille de circuit imprimé sur laquelle sont disposés les composants nécessaires au fonctionnement de la carte, en particulier une antenne. La technologie des circuits imprimés est bien maîtrisée par l'homme du métier.To this end, the invention proposes to produce a printed circuit sheet on which the components necessary for the operation of the card are arranged, in particular an antenna. Printed circuit technology is well mastered by those skilled in the art.

L' invention propose alors de réaliser une connexion entre la feuille de circuit imprimé intégrée dans le corps de la carte, et les plages de contact du module réalisé séparément.The invention then proposes to make a connection between the printed circuit sheet integrated in the body of the card, and the contact pads of the module produced separately.

L'invention utilise avantageusement des plots d' interconnexion fixés sur la feuille de circuit imprimé pour réaliser cette connexion électrique avec le module de contact.The invention advantageously uses interconnection pads fixed on the printed circuit sheet to make this electrical connection with the contact module.

La présente invention concerne plus spécifiquement un procédé de fabrication d'une carte à puce comprenant un module à contacts affleurants la surface de la carte comportant les étapes suivantes : la fabrication d'une feuille de circuit imprimé sur laquelle sont fixés des composants électroniques et/ou électriques; - l'intégration de la feuille de circuit imprimé dans le corps de carte; la connexion du module à contact avec la feuille de circuit imprimé, Caractérisé en ce que la connexion de module à contacts avec la feuille de circuit imprimé est réalisée au moyen de plots d' interconnexion implantés sur la feuille de circuit imprimé. Selon une caractéristique, les plots d'interconnexion sont composés d'un matériau électriquement conducteur et déformable.The present invention relates more specifically to a method of manufacturing a smart card comprising a module with contacts flush with the surface of the card comprising the following steps: the manufacture of a printed circuit sheet on which electronic components are fixed and / or electric; - integration of the printed circuit sheet into the card body; the connection of the contact module with the printed circuit sheet, Characterized in that the connection of module with contacts to the printed circuit sheet is carried out by means of interconnection pads implanted on the printed circuit sheet. According to one characteristic, the interconnection pads are made of an electrically conductive and deformable material.

Selon un mode de réalisation, la feuille de circuit imprimé est réalisée sur un substrat en fibre de verre. Selon un autre mode de réalisation, la feuille de circuit imprimé est réalisée sur un substrat en époxy.According to one embodiment, the printed circuit sheet is produced on a fiberglass substrate. According to another embodiment, the printed circuit sheet is produced on an epoxy substrate.

Selon une caractéristique, les composants fixés sur la feuille de circuit imprimé comportent au moins dans une puce de circuit intégré et des pistes électriquement conductrices.According to one characteristic, the components fixed to the printed circuit sheet comprise at least in an integrated circuit chip and electrically conductive tracks.

Selon une autre caractéristique, les composants fixés sur la feuille de circuit imprimé comportent en outre dans une antenne et/ou une pile.According to another characteristic, the components fixed to the printed circuit sheet further comprise in an antenna and / or a battery.

Selon un mode de réalisation, l'intégration de la feuille de circuit imprimé dans le corps de carte est réalisée par surmoulage.According to one embodiment, the integration of the printed circuit sheet into the card body is carried out by overmolding.

Selon un autre mode de réalisation, l'intégration de la feuille de circuit imprimé dans le corps de carte est réalisée par laminage. Selon un mode de réalisation, le collage et la connexion du module à contacts sur la feuille de circuit imprimé sont réalisés par pressage à chaud.According to another embodiment, the integration of the printed circuit sheet into the card body is carried out by lamination. According to one embodiment, the bonding and the connection of the contact module to the printed circuit sheet are carried out by hot pressing.

Selon une variante de réalisation, le module à contacts comprend un outre une puce de circuit intégré de faible épaisseur.According to an alternative embodiment, the contact module further comprises a thin integrated circuit chip.

La présente invention concerne également une carte à puce à contacts affleurants, caractérisée en ce qu' elle comprend un module à contacts et une feuille de circuit imprimé sur laquelle sont disposés des éléments électriques et/ou électroniques, et en ce que des plots d' interconnexion relient électriquement les contacts affleurants aux pistes du circuit imprimé. Selon une caractéristique, la feuille de circuit imprimée couvre environ toute la surface de la carte.The present invention also relates to a smart card with flush contacts, characterized in that it comprises a contact module and a sheet of printed circuit on which electrical and / or electronic elements are arranged, and in that interconnection pads electrically connect the flush contacts to the tracks of the printed circuit. According to one characteristic, the printed circuit sheet covers approximately the entire surface of the card.

Selon une application, la carte comporte une antenne intégrée sur la feuille de circuit imprimé.According to one application, the card has an antenna integrated on the printed circuit sheet.

Selon une autre application, la carte comporte une pile intégrée sur la feuille de circuit imprimée.According to another application, the card has a battery integrated on the printed circuit sheet.

La présente invention permet de réduire les coûts d'interconnexion du module à contact d'une carte à puce mixte et d'augmenter les cadences de fabrication. En outre, la présence de la feuille de circuit imprimé permet de rigidifier la carte.The present invention makes it possible to reduce the interconnection costs of the contact module of a mixed chip card and to increase the production rates. In addition, the presence of the printed circuit sheet makes it possible to stiffen the card.

Le procédé selon l'invention permet avantageusement de conserver les étapes classiques d' encartage du module dans un corps de carte, l'opération étant même facilitée par la présence des plots d'interconnexion.The method according to the invention advantageously makes it possible to keep the conventional steps of inserting the module in a card body, the operation even being facilitated by the presence of the interconnection pads.

Les particularités et avantages de la présente invention apparaîtront au cours de la description qui suit donnée à titre d'exemple illustratif et non limitatif, et faite en référence aux figures dans lesquelles:The features and advantages of the present invention will appear during the description which follows, given by way of illustrative and nonlimiting example, and made with reference to the figures in which:

La figure 1 est une vue schématique en coupe du corps de carte et du module portant les contacts de la carte ;Figure 1 is a schematic sectional view of the card body and the module carrying the card contacts;

La figure 2 est une vue schématique en coupe de la connexion du module avec la feuille de circuit imprime de la carte.Figure 2 is a schematic sectional view of the connection of the module with the printed circuit sheet of the card.

La présente invention consiste à réaliser une connexion bas coût et à haute cadence d'un module à contact avec une feuille de circuit imprimé intégrée dans un corps de carte.The present invention consists in making a low cost and high speed connection of a module to contact with a printed circuit sheet integrated in a card body.

La figure 1 est une vue en coupe d'un corps de carte 100 comprenant une feuille de circuit imprimé 30 et d'un module à contact 10 devant être connecté aux composants électroniques fixés sur ladite feuille 30.FIG. 1 is a sectional view of a card body 100 comprising a printed circuit sheet 30 and of a contact module 10 to be connected to the electronic components fixed on said sheet 30.

Le module à contact 10 est composé d'un support diélectrique 15, constitué d'une feuille thermoplastique par exemple, sur lequel sont disposées des plages de contact 18 destinées à établir une connexion électrique entre un circuit électronique et les plages de connexion d'un lecteur.The contact module 10 is composed of a dielectric support 15, consisting of a thermoplastic sheet for example, on which are arranged contact pads 18 intended to establish an electrical connection between an electronic circuit and the connection pads of a reader.

Selon une particularité de l'invention, une feuille de circuit imprimé 30 a été réalisée et intégrée dans le corps de la carte 100 par surmoulage ou laminage par exemple. Le corps de carte 100 présente en outre une cavité 110 apte à recevoir le module 10. Cette cavité est réalisée par une quelconque technique bien connue de l'homme du métier, soit directement lors du surmoulage ou du laminage, soit par usinage.According to a feature of the invention, a printed circuit sheet 30 has been produced and integrated into the body of the card 100 by molding or laminating for example. The card body 100 also has a cavity 110 capable of receiving the module 10. This cavity is produced by any technique well known to those skilled in the art, either directly during overmolding or rolling, or by machining.

La feuille de circuit imprimé, Printed Circuit Board (PCB) en terminologie anglo-saxonne, est constituée d'un substrat 32 sur lequel sont déposés des composants électriques et/ou électroniques reliés électriquement par des pistes conductrices 33. Le substrat 32 peut être en fibre de verre ou en époxy par exemple, et les pistes conductrices 33 peuvent être réalisées par sérigraphie, impression d'une matière électriquement conductrice, ou tout autre technique connue utilisée pour élaborer des circuits imprimés.The printed circuit sheet, Printed Circuit Board (PCB) in English terminology, consists of a substrate 32 on which are deposited electrical and / or electronic components electrically connected by conductive tracks 33. The substrate 32 can be fiberglass or epoxy for example, and the conductive tracks 33 can be produced by screen printing, printing of an electrically conductive material, or any other known technique used to develop printed circuits.

Des composants électroniques et ou électriques nécessaires au fonctionnement de la carte à puce peuvent être fixés sur le PCB. Ce dernier peut porter au moins une puce de circuit intégré. Pour une application aux cartes mixtes, une antenne peut être déposée sur le PCB selon une quelconque technique connue de l'homme du métier ; et pour une application aux cartes avec afficheur, une pile peut également être fixée sur le PCB.Electronic and / or electrical components necessary for the operation of the smart card can be attached to the PCB. The latter can carry at least one integrated circuit chip. For an application to mixed cards, an antenna can be deposited on the PCB according to any technique known to those skilled in the art; and for an application to cards with display, a battery can also be fixed on the PCB.

Selon une caractéristique essentielle de l'invention, le PCB 30 comprend en outre des plots d' interconnexion 35 qui ont pour fonction de permettre la connexion électrique entre les pistes 33 du PCB 30 et les plages de contact 18 du module 10. Ces plots 35 sont implantés sur le PCB 30 au niveau de la cavité 110 du corps de carte 100.According to an essential characteristic of the invention, the PCB 30 further comprises interconnection pads 35 which have the function of allowing electrical connection between the tracks 33 of the PCB 30 and the contact pads 18 of the module 10. These pads 35 are located on the PCB 30 at the cavity 110 of the card body 100.

De tels plots 35 sont couramment utilisés dans l'industrie des circuits imprimés et communément appelés pions de connexion. Ils sont réalisés lors du procédé normal de fabrication du PCB 30. Dans l'exemple de réalisation, ils traversent les pistes 33 et sont implantés dans le PCB 30 jusqu'à la moitié de son épaisseur par exemple. L'épaisseur du PCB est d'environ 100 μm et celle des pistes 33 de 17 μm.Such pads 35 are commonly used in the printed circuit industry and commonly called connection pins. They are produced during the normal PCB manufacturing process 30. In the embodiment, they cross the tracks 33 and are implanted in the PCB 30 up to half its thickness for example. The thickness of the PCB is approximately 100 μm and that of the tracks 33 is 17 μm.

Les plots 35 sont avantageusement constitués d'une matière électriquement conductrice et deformable afin de s'aplatir lors de la connexion avec le module 10, tel que cela est illustré sur la figure 2. La figure 2 illustre en effet l'interconnexion entre le module 10 et le PCB 30 dans la carte 100.The pads 35 are advantageously made of an electrically conductive and deformable material in order to flatten when connected with the module 10, as illustrated in FIG. 2. FIG. 2 indeed illustrates the interconnection between the module 10 and PCB 30 in board 100.

L'interconnexion peut, par exemple, être réalisée par pressage à chaud du module 10 dans la cavité 110 du corps de carte 100 ménagée à l'emplacement prévu par la norme ISO. Les propriétés adhésives du support thermoplastique 15 du module 10 peuvent ainsi être activées afin d'assurer la fixation du module 10 dans la cavité 110 du corps de carte 100. Les plots d' interconnexion 35 peuvent être munis d'un amalgame de fils d'or qui s'aplatissent lors du pressage du module 10. Ainsi, le support 100 n'encourt aucun risque de déformation lors de la compression, et la connexion électrique est garantie entre les plages de contact 18 et les pistes 33 du PCB 30 sur lequel sont fixés les composants de la carte.The interconnection can, for example, be carried out by hot pressing of the module 10 in the cavity 110 of the card body 100 provided at the location provided by the ISO standard. The adhesive properties of the thermoplastic support 15 of the module 10 can thus be activated in order to ensure the fixing of the module 10 in the cavity 110 of the card body 100. The interconnection pads 35 can be provided with an amalgam of gold wires which flatten during the pressing of the module 10. Thus, the support 100 incurs no risk of deformation during compression, and the electrical connection is guaranteed between the contact pads 18 and the tracks 33 of the PCB 30 on which the components of the card are fixed.

Le procédé selon l'invention permet avantageusement de conserver les étapes classiques d' encartage du module 10 dans un corps de carte 100. En outre, l'opération de connexion électrique est facilitée car les plots de connexion font partie intégrante du PCB. Les plots peuvent être préparés en temps masqué lors de l'implantation de composants sur le PCB et au même titre que ces derniers.The method according to the invention advantageously makes it possible to conserve the conventional steps of inserting the module 10 into a card body 100. In addition, the electrical connection operation is facilitated since the connection pads are an integral part of the PCB. The studs can be prepared in masked time during the implantation of components on the PCB and in the same way as the latter.

Selon une variante, non illustrée, le module 10 peut en outre comprendre une puce de circuit intégré, de préférence ultra mince, par exemple dans une cavité ménagée dans le support diélectrique 15. According to a variant, not illustrated, the module 10 can further comprise an integrated circuit chip, preferably ultra thin, for example in a cavity formed in the dielectric support 15.

Claims

REVENDICATIONS 1. Procédé de fabrication d'une carte à puce comprenant un module (10) à contacts (18) affleurants la surface d'un corps de carte (100) comportant les étapes suivantes : la fabrication d'une feuille de circuit imprimé (30) sur laquelle sont fixés des composants électroniques et/ou électriques; l'intégration de la feuille de circuit imprimé (30) dans le corps de carte (100); la connexion du module (10) à contact (18) avec la feuille de circuit imprimé (30) , caractérisé en ce que la connexion de module (10) à contacts (18) avec la feuille de circuit imprimé (30) est réalisée au moyen de plots d'interconnexion (35) implantés sur la feuille de circuit imprimé.1. A method of manufacturing a smart card comprising a module (10) with contacts (18) flush with the surface of a card body (100) comprising the following steps: the manufacture of a printed circuit sheet (30 ) to which electronic and / or electrical components are attached; integrating the printed circuit sheet (30) into the card body (100); the connection of the module (10) with contact (18) with the printed circuit sheet (30), characterized in that the connection of module (10) with contacts (18) with the printed circuit sheet (30) is made at means of interconnection pads (35) implanted on the printed circuit sheet. 2. Procédé selon la revendication 1, caractérisé en ce que les plots d'interconnexion (35) sont composés d'un matériau électriquement conducteur et deformable.2. Method according to claim 1, characterized in that the interconnection pads (35) are composed of an electrically conductive and deformable material. 3. Procédé selon l'une quelconque des revendications 1 à 2, caractérisé en ce que la feuille de circuit imprimé (30) est réalisée sur un substrat (32) en fibre de verre.3. Method according to any one of claims 1 to 2, characterized in that the printed circuit sheet (30) is produced on a fiberglass substrate (32). 4. Procédé selon l'une quelconque des revendications 1 à 2, caractérisé en ce que la feuille de circuit imprimé (30) est réalisée sur un substrat (32) en époxy. 4. Method according to any one of claims 1 to 2, characterized in that the printed circuit sheet (30) is produced on an epoxy substrate (32). 5. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que les composants fixés sur la feuille de circuit imprimé (30) comportent au moins dans une puce de circuit intégré et des pistes conductrices (33) .5. Method according to any one of the preceding claims, characterized in that the components fixed to the printed circuit sheet (30) comprise at least in an integrated circuit chip and conductive tracks (33). 6. Procédé selon la revendication 5, caractérisé en ce que les composants fixés sur la feuille de circuit imprimé (30) comportent en outre dans une antenne et/ou une pile.6. Method according to claim 5, characterized in that the components fixed to the printed circuit sheet (30) further comprise in an antenna and / or a battery. 7. Procédé selon l'une quelconque des revendications 1 à 6, caractérisé en ce que l'intégration de la feuille de circuit imprimé (30) dans le corps de carte (100) est réalisée par surmoulage .7. Method according to any one of claims 1 to 6, characterized in that the integration of the printed circuit sheet (30) in the card body (100) is carried out by overmolding. 8. Procédé selon l'une quelconque des revendications 1 à 6, caractérisé en ce que l'intégration de la feuille de circuit imprimé (30) dans le corps de carte (100) est réalisée par laminage.8. Method according to any one of claims 1 to 6, characterized in that the integration of the printed circuit sheet (30) in the card body (100) is carried out by lamination. 9. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que le collage et la connexion du module (10) à contacts (18) sur la feuille de circuit imprimé (30) sont réalisés par pressage à chaud.9. Method according to any one of the preceding claims, characterized in that the bonding and connection of the module (10) with contacts (18) on the printed circuit sheet (30) are carried out by hot pressing. 10. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que le module (10) à contacts (18) comprend un outre une puce de circuit intégré de faible épaisseur. 10. Method according to any one of the preceding claims, characterized in that the module (10) with contacts (18) further comprises an integrated circuit chip of small thickness. 11. Carte à puce à contacts affleurants, caractérisée en ce qu'elle comprend un module (10) à contacts (18) et une feuille de circuit imprimé (30) sur laquelle sont disposés des éléments électriques et/ou électroniques, et en ce que des plots d'interconnexion (35) relient électriquement les contacts (18) affleurants aux pistes (33) du circuit imprimé (30) .11. Smart card with flush contacts, characterized in that it comprises a module (10) with contacts (18) and a printed circuit sheet (30) on which electrical and / or electronic elements are arranged, and in that that interconnection pads (35) electrically connect the contacts (18) flush with the tracks (33) of the printed circuit (30). 12. Carte à puce selon la revendication 11, caractérisée en ce que lesdits plots d' interconnexion (35) sont directement en contact électrique avec lesdites pistes (33) dudit circuit imprimé (30) .12. Chip card according to claim 11, characterized in that said interconnection pads (35) are directly in electrical contact with said tracks (33) of said printed circuit (30). 13. Carte à puce selon l'une des revendications 11 et 12, caractérisée en ce que lesdits plots d'interconnexion (35) traversent lesdites pistes (33) dudit circuit imprimé (30) et sont implantés dans ledit circuit imprimé (30) .13. Chip card according to one of claims 11 and 12, characterized in that said interconnection pads (35) pass through said tracks (33) of said printed circuit (30) and are installed in said printed circuit (30). 14. Carte à puce selon la revendication 13, caractérisée en ce que lesdits plots d' interconnexion (35) sont implantés dans ledit circuit imprimé (30) jusqu'à la moitié de son épaisseur.14. Chip card according to claim 13, characterized in that said interconnection pads (35) are located in said printed circuit (30) to half its thickness. 15. Carte à puce selon l'une des revendications 11 à 14, caractérisée en ce que lesdits plots d'interconnexion (35) sont constitués d'une matière électriquement conductrice et deformable.15. Chip card according to one of claims 11 to 14, characterized in that said interconnection pads (35) are made of an electrically conductive and deformable material. 16. Carte à puce selon l'une des revendications 11 à 15, caractérisée en ce que lesdits plots d'interconnexion (35) sont munis d'un amalgame de fils d' or . 16. Chip card according to one of claims 11 to 15, characterized in that said interconnection pads (35) are provided with an amalgam of gold wires. 17. Carte à puce selon l'une des revendications 11 à 16, caractérisée en ce que ladite feuille de circuit imprimée (30) couvre environ toute la surface de ladite carte (100) .17. Chip card according to one of claims 11 to 16, characterized in that said printed circuit sheet (30) covers approximately the entire surface of said card (100). 18. Carte à puce selon l'une des revendications 11 à 17, caractérisée en ce qu'elle comporte une antenne intégrée sur ladite feuille de circuit imprimé (30). 18. Chip card according to one of claims 11 to 17, characterized in that it comprises an antenna integrated on said printed circuit sheet (30).
PCT/FR2000/003512 1999-12-16 2000-12-13 Method for producing a chip card with flush contacts Ceased WO2001045039A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU21851/01A AU2185101A (en) 1999-12-16 2000-12-13 Method for producing a chip card with flush contacts

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9915912A FR2802683B1 (en) 1999-12-16 1999-12-16 METHOD FOR MANUFACTURING A SMART CARD WITH FLUSH CONTACTS INCLUDING A PRINTED CIRCUIT SHEET PROVIDED WITH INTERCONNECTION PLUGS
FR99/15912 1999-12-16

Publications (1)

Publication Number Publication Date
WO2001045039A1 true WO2001045039A1 (en) 2001-06-21

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PCT/FR2000/003512 Ceased WO2001045039A1 (en) 1999-12-16 2000-12-13 Method for producing a chip card with flush contacts

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AU (1) AU2185101A (en)
FR (1) FR2802683B1 (en)
WO (1) WO2001045039A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2847365B1 (en) * 2002-11-15 2005-03-11 Gemplus Card Int SIMULTANEOUS CONNECTION / CONNECTION BY INHIBITING ADHESIVE DRILLING

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2634095A1 (en) * 1988-07-05 1990-01-12 Bull Cp8 FLEXIBLE PRINTED CIRCUIT, IN PARTICULAR FOR ELECTRONIC MICROCIRCUIT CARDS, AND CARD INCORPORATING SUCH A CIRCUIT
FR2716281A1 (en) * 1994-02-14 1995-08-18 Gemplus Card Int Method of manufacturing a contactless card.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2634095A1 (en) * 1988-07-05 1990-01-12 Bull Cp8 FLEXIBLE PRINTED CIRCUIT, IN PARTICULAR FOR ELECTRONIC MICROCIRCUIT CARDS, AND CARD INCORPORATING SUCH A CIRCUIT
FR2716281A1 (en) * 1994-02-14 1995-08-18 Gemplus Card Int Method of manufacturing a contactless card.

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FR2802683B1 (en) 2004-04-16
AU2185101A (en) 2001-06-25

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