WO2000036558A1 - Chip card with glued-in module and method of its manufacturing - Google Patents
Chip card with glued-in module and method of its manufacturing Download PDFInfo
- Publication number
- WO2000036558A1 WO2000036558A1 PCT/CZ1998/000052 CZ9800052W WO0036558A1 WO 2000036558 A1 WO2000036558 A1 WO 2000036558A1 CZ 9800052 W CZ9800052 W CZ 9800052W WO 0036558 A1 WO0036558 A1 WO 0036558A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- card
- module
- chip module
- supporting core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Definitions
- Invention is related to contact chip card, where new method of the chip module attachment into card body is designed and simultaneously, method of manufacturing the designed contact card is proposed.
- chip cards for application in numerous fields are commonly manufactured, for example as credit cards, permanent tickets, company pass- checks, telephone cards etc.
- type of electronic circuits included, by which their functional possibilities are determined these are contact, contactless, and combined chip cards.
- Method of manufacturing chip cards differs according to type of the card and conforms especially to the method of mounting of the chip module.
- Contact cards consist of card body and of the chip module.
- the card body consists of supporting core provided with foil on its surface, as the case may be,.
- Chip module consists of encapsulated chip, supporting substrate, electrically conducting surface foil creating contacting areas, and from connecting contacts.
- Supporting core is usually made from one or more layers of plastic material, as exception from wood.
- Supporting core is provided with recess, whereas surface foil is provided with opening, jointly creating a pocket into which chip module is embedded. It is always fixed in the pocket by means of adhesive preparation. This is usually either glue, most often liquid adhesive based on cyanoacrylate, or adhesive foil.
- Adhesive preparation is usually applied under substrate module and simultaneously on bottom of the core recess, which is considered to be assurance of relatively the most reliable attachment of the chip module, preventing undesirable release of the chip module and its drop out from the card.
- complete card body is made at first. This is made either in that way, that at first, supporting core, as the case may be, multilayer, is laminated with surface foils under high temperature and under pressure, whereupon pocket for chip module is milled, or the card body and recess of the pocket are created simultaneously by injection of plastic material under high temperature into suitable mould in the shape of the card provided with pocket, where the pocket shape is determined by the mould shape.
- the chip module is glued into the card body.
- Contactless chip cards have more complex construction because they contain internal antenna, which is connected with the chip module.
- Encapsulated chip of the chip module is mounted in the seating opening effected in the supporting core of the card, antenna is seated on supporting core of the card, and surface is provided with foil.
- chip module and antenna are mounted together at first, whereupon antenna is seated on supporting core of the card, while encapsulated chip of the chip module is seated, without application of binding preparation, into seating opening of the core, whereupon this assembly is laminated between surface foils, or, as the case may be, also other layers of the supporting core are laminated simultaneously.
- Combined chip cards are combination of both types of cards, they comprise either two chip modules from which one is provided with antenna, or one chip module. Their process of manufacture is combination of both methods mentioned above, when for contact part of the card, method of manufacturing contact card is used, and for contactless part, method of manufacturing contactless card is used.
- Contact chip card with glued-in module is designed, which has solved attachment of the chip module by a new method and simultaneously method of manufacturing of this card is resolved.
- Contact chip card consists of supporting card body and of the chip module, where supporting card body consists of , at least single-layer, supporting core fitted with at least one surface foil, while the surface foil on contact side of the card is provided with access opening for chip module adequate to its shape and size.
- Chip module contains electrically conducting foil, supporting substrate, encapsulated chip and necessary contacts and is mounted in the access opening of the surface foil.
- Essence of the invention consists in that , that the card of the construction described hereinbefore has supporting core provided with seating opening, into which case of the chip of the chip module fits, while chip module is attached to supporting core by means of adhesive preparation, fixed between lower plane of the chip module substrate and upper plane of supporting core.
- adhesive preparation is placed in a new way on the upper plane of supporting core, in the surroundings of seating opening for encapsulated chip, rather than inside the pocket of the plastic core, and encapsulated chip is not mounted in the inaccurately shaped pocket, instead it fits into seating opening.
- the seating area for chip module is created from core layer under the substrate of the chip module, seating opening in the core, and access opening in the surface foil, and during application of the method described below according to the invention, it is finally shaped exactly according to the shape of the chip module in the course of lamination process.
- Such attachment of the chip module is reliable enough and enables radical simplification of the technology of manufacturing contact chip cards so that necessity of manipulation demanding milling of pocket in the supporting core or casting into mould is eliminated.
- Seating openings can be punched into supporting core simultaneously for more cards at once, which allows serial production of chip cards at once at whole plates.
- PVC polyvinylchloride
- PET polyethylene
- PC polycarbonate
- PI polyimide
- ABS polyacrylonitrilebutadienestyrene
- glue or adhesive foil can be favourably used as adhesive preparation.
- any adhesive is understood here, applied in order to paste together module with the core between upper area of the supporting core and lower area of the chip module substrate.
- This alternative is suitable for cards with plastic core or core from fabric saturated with plastic as well as for cards with for example plastic saturated wooden core.
- glue or adhesive foil is used, it is applied before seating of the chip module, namely either on core or on substrate of the chip module.
- Method can be modified with conservation of the above-mentioned sequence of operations even so that layer of suitable adhesive is applied directly onto supporting core around seating opening, or on substrate of the chip module for example by silk-screen printing or spraying.
- the invention can be used in the course of manufacturing contact chip cards of all types. It allows significant increase of manufacturing productivity and economic effectiveness of manufacturing. Cards according to the invention can be manufactured in the amount as high as several tens of pieces on one plate simultaneously.
- the preferable embodiment of the invention is a plastic contact chip card according to Fig.1 , where essence of the invention is clearly demonstrated on detail cross-section.
- Basic constructional elements of this card are chip module 1 and supporting core 2.
- Supporting core 2 is provided on its upper side with upper surface foil 3, on the lower side with lower surface foil 4, both made of ABS.
- Upper surface foil 3 is printed on its surface and has access opening 5 cut out at the place for access to the chip module 1 Chip module 1 .
- Connecting openings 8 are filled with embedding encasing material, ABS in this particular case, which covers also chip 10 and contacting wires 9, and thus creates case 1 _ .
- Encapsulated chip 10 fits into seating opening 12 in the plastic supporting core 2, which is single-layer in this particular case, and is made from mixture of PVC and ABS.
- Chip module 1 is strongly fixed in the card, because substrate 7 of the chip module 1_, made in this particular case from ABS, is firm connected with plastic supporting core 2 by layer of material created by laminating them together. Layer of material consisting of ABS and PVC thus represents adhesive preparation 13, thanks to which, chip module 1 can be considered to be glued-in in the card, according to title of the invention.
- Card has been manufactured by method according to the invention.
- the supporting core 2 in the shape of plate for manufacturing of 30 cards at a time, one seating opening 12 has been punched for each future card.
- Upper surface foil 3 with punched access openings 5 has been laid onto upper side 2 of the supporting core
- lower surface foil 4 has been laid onto its lower side.
- chip modules 1 has been seated into access openings 5 so they fitted into them exactly with outer perimeter as well as height, while cases V ⁇ _ of chips 1_0 fitted into seating openings 12 of smaller dimensions than the access openings 5.
- This constructional unit has been than laminated together under temperature and pressure conventional for lamination. Action of increased temperature and pressure resulted in smelting and bonding not only of surface foils 3,4 with supporting core 2, but also of substrate 7 with supporting core 2.
- FIG. 3 Other exemplary embodiment of the invention is contact card with glued-in chip module 1_ according to Fig. 2 and Fig. 3. Individual parts of the card prepared for its manufacturing in a process according to the invention are graphically demonstrated on Fig. 2. Essence of the invention is clearly demonstrated on detail cross-section of the card on Fig. 3.
- Basic constructional elements of this card are also chip module 1_ and supporting core 2.
- Supporting core 2 is on its upper side provided with upper surface foil 3, on its lower side with lower surface foil 4, both made of PVC.
- Upper surface foil 3 is printed on its surface and it has access opening 5 cut out in the place for access to the chip module Chip module 1_ is mounted in the access opening 5 so that at the top, its electrically conducting foil 6 creating contacting areas is located, below it is the substrate 7 fitted with connecting openings 8 with contacting wires 9 led out to the chip 1_0.
- Connecting openings 8 are filled with embedding plastic material, in this particular case based on epoxide resin, which covers also the chip 10 and contacting wires 9 and thus creates case 1_ Encapsulated chip 10 fits into seating opening 12 in the plastic supporting core 2, which is in this particular case made from fabric saturated with PI.
- Chip module 1 is in the cards strongly fixed by means of acrylate adhesive, which represents adhesive preparation 1 . 3 and is situated between upper plane of the supporting core 2 around seating opening 12 and peripheral part of lower face of substrate 7 of the chip module 1
- Card has been manufactured in a process according to the invention.
- one seating opening 12 has been punched for each future card.
- adhesive preparation 13 in the shape of five drops of liquid adhesive around each seating opening 12 has been than applied onto upper side of the supporting core 2, as it is illustrated on Fig. 2B.
- chip modules were glued-in onto supporting core 2 so that case V ⁇ _ of the chip Ifj of the chip module 1 fitted into seating opening 12. Glue reached full effectiveness immediately after glueing operation.
- upper surface foil 3 Onto supporting core 2 provided with chip modules 1, upper surface foil 3 has been laid with access openings 5 punched as illustrated on Fig. 2A.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Contact chip card with glued-in module has supporting core (2) provided with seating opening (12), into which the case (11) of the chip (10) of the chip module (1) fits, while the chip module (1) is fixed to supporting core (2) by adhesive preparation (13), fixed between lower surface of the substrate (7) of the chip module (1) and upper surface of the supporting core (2). Adhesive preparation (13) consists of melt, glue or adhesive foil. Card is made so that supporting core (2) is provided with seating opening (12), possibly adhesive preparation (13) is applied, chip module (1) is seated and upper surface foil (3) and lower surface foil (4) are added, whereupon this constructional unit is laminated together and finally machined by common method.
Description
Chip card with glued-in module and method of its manufacturing
Field of the invention
Invention is related to contact chip card, where new method of the chip module attachment into card body is designed and simultaneously, method of manufacturing the designed contact card is proposed.
Present state of the art
At present, chip cards for application in numerous fields are commonly manufactured, for example as credit cards, permanent tickets, company pass- checks, telephone cards etc. According to type of electronic circuits included, by which their functional possibilities are determined, these are contact, contactless, and combined chip cards. Method of manufacturing chip cards differs according to type of the card and conforms especially to the method of mounting of the chip module.
Contact cards consist of card body and of the chip module. The card body consists of supporting core provided with foil on its surface, as the case may be,. Chip module consists of encapsulated chip, supporting substrate, electrically conducting surface foil creating contacting areas, and from connecting contacts. Supporting core is usually made from one or more layers of plastic material, as exception from wood. Supporting core is provided with recess, whereas surface foil is provided with opening, jointly creating a pocket into which chip module is embedded. It is always fixed in the pocket by means of adhesive preparation. This is usually either glue, most often liquid adhesive based on cyanoacrylate, or adhesive foil. Adhesive preparation is usually applied under substrate module and simultaneously on bottom of the core recess, which is considered to be assurance of relatively the most reliable attachment of the chip module, preventing undesirable release of the chip module and its drop out from the card. During manufacturing of these contact cards, complete card body is made at first. This is
made either in that way, that at first, supporting core, as the case may be, multilayer, is laminated with surface foils under high temperature and under pressure, whereupon pocket for chip module is milled, or the card body and recess of the pocket are created simultaneously by injection of plastic material under high temperature into suitable mould in the shape of the card provided with pocket, where the pocket shape is determined by the mould shape. Than, the chip module is glued into the card body. During gluing with adhesive, process of glueing under cold conditions is performed. Glueing by adhesive foil is performed under high temperature and pressure, when adhesive foil in the needed shape is inserted between substrate on lower side of the chip module, and adequate pocket area. Manufacturing methods are described by Christine Lesher (Advanced Smatr Card Manufacturing Techniques and Methods, Conference Proceedings - Card Tech '97, 1997, vol.1 , 139-148).
Both said methods have significant drawbacks. Milling of pockets is relatively slow and manipulation demanding, casting into mould requires special manufacturing equipment and precisely shaped moulds. In both cases, it is necessary to produce cards in a card by card process, which means, that manufacturing equipment executes given operation only on one, maximum two, cards simultaneously.
Contactless chip cards have more complex construction because they contain internal antenna, which is connected with the chip module. Encapsulated chip of the chip module is mounted in the seating opening effected in the supporting core of the card, antenna is seated on supporting core of the card, and surface is provided with foil. During manufacture of contactless cards, chip module and antenna are mounted together at first, whereupon antenna is seated on supporting core of the card, while encapsulated chip of the chip module is seated, without application of binding preparation, into seating opening of the core, whereupon this assembly is laminated between surface foils, or, as the case may be, also other layers of the supporting core are laminated simultaneously.
Combined chip cards are combination of both types of cards, they comprise either two chip modules from which one is provided with antenna, or one chip
module. Their process of manufacture is combination of both methods mentioned above, when for contact part of the card, method of manufacturing contact card is used, and for contactless part, method of manufacturing contactless card is used.
Essence of the invention
Contact chip card with glued-in module is designed, which has solved attachment of the chip module by a new method and simultaneously method of manufacturing of this card is resolved. Contact chip card consists of supporting card body and of the chip module, where supporting card body consists of , at least single-layer, supporting core fitted with at least one surface foil, while the surface foil on contact side of the card is provided with access opening for chip module adequate to its shape and size. Chip module contains electrically conducting foil, supporting substrate, encapsulated chip and necessary contacts and is mounted in the access opening of the surface foil. Essence of the invention consists in that , that the card of the construction described hereinbefore has supporting core provided with seating opening, into which case of the chip of the chip module fits, while chip module is attached to supporting core by means of adhesive preparation, fixed between lower plane of the chip module substrate and upper plane of supporting core. Thus, adhesive preparation is placed in a new way on the upper plane of supporting core, in the surroundings of seating opening for encapsulated chip, rather than inside the pocket of the plastic core, and encapsulated chip is not mounted in the inaccurately shaped pocket, instead it fits into seating opening. So the seating area for chip module is created from core layer under the substrate of the chip module, seating opening in the core, and access opening in the surface foil, and during application of the method described below according to the invention, it is finally shaped exactly according to the shape of the chip module in the course of lamination process. Such attachment of the chip module is reliable enough and enables radical simplification of the technology of manufacturing contact chip cards so that necessity of manipulation demanding milling of pocket in the supporting core or casting into mould is
eliminated. Seating openings can be punched into supporting core simultaneously for more cards at once, which allows serial production of chip cards at once at whole plates.
Hereat, the fact that materials at present commonly used for manufacturing contact chip cards, are softened and shaped under high temperature and pressure can be utilised. Combination of suitable choice of these materials with laminating technology allows that layer created by laminating together of substrate of the chip module and supporting core is sufficient as an adhesive preparation, without need to use specific means to paste together chip module and supporting core. It can be accomplished if the substrate of module as well as supporting core of the card are made from material based on polymeric compounds. As suitable materials may be used plastics common in the course of manufacturing existing cards, e.g. polyvinylchloride (PVC), polyethylene (PET), polycarbonate (PC), polyimide (PI), or polyacrylonitrilebutadienestyrene (ABS), while supporting core can, but doesn't need to be made from material identical with material of the chip module substrate. This alternative solution is applicable for contact chip cards with plastic core, or for cards with core made of fabric saturated with plastics.
For achievement of firm bonding, preventing release of the chip module and its drop out from card during even greater mechanic stress, e.g. during bending and abrasion, glue or adhesive foil can be favourably used as adhesive preparation. Under the concept glue, any adhesive is understood here, applied in order to paste together module with the core between upper area of the supporting core and lower area of the chip module substrate. This alternative is suitable for cards with plastic core or core from fabric saturated with plastic as well as for cards with for example plastic saturated wooden core.
Above-mentioned constructional solution of the contact chip card allows simplification of technology of manufacturing and serial manufacturing of greater number of cards by one machine at once. Supporting core of the card is provided with seating opening, whereupon chip module is seated on it so that its encapsulated chip fits into seating opening, and upper surface foil is enclosed
with its access opening located adequately to the chip module, and lower surface foil is enclosed, than this constructional unit is laminated under high temperature and pressure, and finally it is machined by common method. Surface foils are attached according to this method either before seating of the chip module onto core or after it, but always before laminating process.
If glue or adhesive foil is used, it is applied before seating of the chip module, namely either on core or on substrate of the chip module. Method can be modified with conservation of the above-mentioned sequence of operations even so that layer of suitable adhesive is applied directly onto supporting core around seating opening, or on substrate of the chip module for example by silk-screen printing or spraying.
The invention can be used in the course of manufacturing contact chip cards of all types. It allows significant increase of manufacturing productivity and economic effectiveness of manufacturing. Cards according to the invention can be manufactured in the amount as high as several tens of pieces on one plate simultaneously.
Review of figures on drawing
Invention is explained in details by drawings, where attachment of the chip module without application of glue or adhesive foil is illustrated on Fig . 1 on detail cross-section of the card, on Fig. 2, individual basic parts of the card prepared for manufacturing of the card in a process according to the invention are shown, namely upper surface foil on 2A, supporting core on 2B, and chip module on 2C, and Fig. 3 illustrates attachment of the chip module with application of adhesive in detail cross-section of the card.
Examples of embodiment of the invention Example 1
The preferable embodiment of the invention is a plastic contact chip card
according to Fig.1 , where essence of the invention is clearly demonstrated on detail cross-section.
Basic constructional elements of this card are chip module 1 and supporting core 2. Supporting core 2 is provided on its upper side with upper surface foil 3, on the lower side with lower surface foil 4, both made of ABS. Upper surface foil 3 is printed on its surface and has access opening 5 cut out at the place for access to the chip module 1 Chip module 1. is mounted in the access opening 5 so that its electrically conducting foil 6 creating contacting areas is found at the top, below it is the substrate 7, fitted with connecting openings 8 with contacting wires 9, leading to the chip 10 located below. Connecting openings 8 are filled with embedding encasing material, ABS in this particular case, which covers also chip 10 and contacting wires 9, and thus creates case 1 _ . Encapsulated chip 10 fits into seating opening 12 in the plastic supporting core 2, which is single-layer in this particular case, and is made from mixture of PVC and ABS. Chip module 1 is strongly fixed in the card, because substrate 7 of the chip module 1_, made in this particular case from ABS, is firm connected with plastic supporting core 2 by layer of material created by laminating them together. Layer of material consisting of ABS and PVC thus represents adhesive preparation 13, thanks to which, chip module 1 can be considered to be glued-in in the card, according to title of the invention.
Card has been manufactured by method according to the invention. Into the supporting core 2 in the shape of plate for manufacturing of 30 cards at a time, one seating opening 12 has been punched for each future card., Upper surface foil 3 with punched access openings 5 has been laid onto upper side 2 of the supporting core, lower surface foil 4 has been laid onto its lower side. Than, chip modules 1 has been seated into access openings 5 so they fitted into them exactly with outer perimeter as well as height, while cases V\_ of chips 1_0 fitted into seating openings 12 of smaller dimensions than the access openings 5. This constructional unit has been than laminated together under temperature and pressure conventional for lamination. Action of increased temperature and pressure resulted in smelting and bonding not only of surface foils 3,4 with
supporting core 2, but also of substrate 7 with supporting core 2. From the point of view of stability of fixation of the chip module 1_ in the card, especially creation of the layer consisting of ABS and PVC as the adhesive preparation 13 between lower plane of peripheral part of substrate 7 and upper plane of the supporting core 2 has been significant. Machining with common method followed, when individual cards were cut off from the plate, packed and given for distribution.
Example 2
Other exemplary embodiment of the invention is contact card with glued-in chip module 1_ according to Fig. 2 and Fig. 3. Individual parts of the card prepared for its manufacturing in a process according to the invention are graphically demonstrated on Fig. 2. Essence of the invention is clearly demonstrated on detail cross-section of the card on Fig. 3.
Basic constructional elements of this card are also chip module 1_ and supporting core 2. Supporting core 2 is on its upper side provided with upper surface foil 3, on its lower side with lower surface foil 4, both made of PVC. Upper surface foil 3 is printed on its surface and it has access opening 5 cut out in the place for access to the chip module Chip module 1_ is mounted in the access opening 5 so that at the top, its electrically conducting foil 6 creating contacting areas is located, below it is the substrate 7 fitted with connecting openings 8 with contacting wires 9 led out to the chip 1_0. Connecting openings 8 are filled with embedding plastic material, in this particular case based on epoxide resin, which covers also the chip 10 and contacting wires 9 and thus creates case 1_ Encapsulated chip 10 fits into seating opening 12 in the plastic supporting core 2, which is in this particular case made from fabric saturated with PI. Chip module 1 is in the cards strongly fixed by means of acrylate adhesive, which represents adhesive preparation 1.3 and is situated between upper plane of the supporting core 2 around seating opening 12 and peripheral part of lower face of substrate 7 of the chip module 1
Card has been manufactured in a process according to the invention. Into
supporting core 2 in the shape of plate for manufacturing of 30 cards at once, one seating opening 12 has been punched for each future card. Around seating openings 12, adhesive preparation 13 in the shape of five drops of liquid adhesive around each seating opening 12 has been than applied onto upper side of the supporting core 2, as it is illustrated on Fig. 2B. Afterwards, chip modules were glued-in onto supporting core 2 so that case V\_ of the chip Ifj of the chip module 1 fitted into seating opening 12. Glue reached full effectiveness immediately after glueing operation. Onto supporting core 2 provided with chip modules 1, upper surface foil 3 has been laid with access openings 5 punched as illustrated on Fig. 2A. It has been laid so that the chip modules 1_ fitted exactly into access openings 5 by its outer perimeter as well as height. Printed lower surface foil 4 has been laid onto lower side of the supporting core 2. This constructional unit has been than laminated together under temperature and pressure common for lamination. Action of increased temperature and pressure resulted in smelting and bonding of surface foils 3^4 with supporting core 2 and creation of one compact plate. Machining with common method followed, when individual cards were cut off from the plate, packed and passed for distribution.
Note: On Fig. 2A, 2B, and 2C , parts corresponding to individual card are illustrated namely by virtue of clarity.
Example 3
Other exemplary embodiment of the invention is contact card with chip module 1 glued-in by adhesive foil. This solution also constructionally corresponds to representation on Fig. 2.
Card is identical with previous one with that difference that instead of layer of glue, adhesive double-sided sticking foil in the shape of chip module is used as the adhesive preparation 3, which is fitted with central opening for encapsulated chip 10.
Card has been manufactured by the same method as stated in the previous example, with that difference, that pasting preparation 3 has been placed on
supporting core 2 around seating opening 12, chip module 1 has been placed on it, surface foils 3, 4 were enclosed, and the adhesive preparation 1_3 reached full sticking efficacy as lately as during process of lamination.
Claims
1. Chip card with glued-in module, which is contact chip card and consists of supporting card body and of the chip module, where supporting card body consists of at least single-layer supporting core fitted with at least one surface foil, while surface foil on contact side of the card is provided with access opening for chip module adequate to its shape, and where chip module contains electrically conducting foil, supporting substrate, encapsulated chip and necessary contacts, while the chip module is embedded in the access opening of the surface foil, distinguished by that supporting core 121 is provided with seating opening /12/, into which the case /11 / of the chip /10/ of chip module /1 / fits, while chip module /1 / is fixed to the supporting core 121 by adhesive preparation /13/, fixed between substrate 111 of the chip module IM and upper surface of the supporting core 121.
2. Chip card with glued-in module as claimed in claim 1 , distinguished by that adhesive preparation /13/ is a layer created from material of substrate 111 of the chip module IM and from material of the supporting core 121, while substrate 111, as well as supporting core 121 are made from material based on polymeric compounds.
3. Chip card with glued-in module as claimed in claim 1 , distinguished by that adhesive preparation /13/ is a layer of glue or adhesive foil.
4. Method of manufacturing chip card with glued-in module as claimed in claim 1 , distinguished by that supporting core 121 of the card is provided with seating opening /12/, whereupon the chip module IM is seated on them so, that its encapsulated chip /10/ fitted into seating opening /12/, and upper surface foil 131 is applied by its access opening /5/ adequately to the chip module IM and lower surface foil 141, than this constructional unit is laminated together and finally it is machined by common method .
5. Method of manufacturing chip card with glued-in module as claimed in claim , distinguished by that before seating of the chip module IM, glue or adhesive foil applied between supporting core 121 and substrate 111 of the chip module IM.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU14322/99A AU1432299A (en) | 1998-12-11 | 1998-12-11 | Chip card with glued-in module and method of its manufacturing |
| PCT/CZ1998/000052 WO2000036558A1 (en) | 1998-12-11 | 1998-12-11 | Chip card with glued-in module and method of its manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CZ1998/000052 WO2000036558A1 (en) | 1998-12-11 | 1998-12-11 | Chip card with glued-in module and method of its manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2000036558A1 true WO2000036558A1 (en) | 2000-06-22 |
Family
ID=5469146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CZ1998/000052 Ceased WO2000036558A1 (en) | 1998-12-11 | 1998-12-11 | Chip card with glued-in module and method of its manufacturing |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU1432299A (en) |
| WO (1) | WO2000036558A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025218547A1 (en) * | 2024-04-15 | 2025-10-23 | 捷德(中国)科技有限公司 | Environment-friendly smart card |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19500925A1 (en) * | 1995-01-16 | 1996-07-18 | Orga Kartensysteme Gmbh | Integrated circuit (I.C) card or "chip" card |
-
1998
- 1998-12-11 AU AU14322/99A patent/AU1432299A/en not_active Abandoned
- 1998-12-11 WO PCT/CZ1998/000052 patent/WO2000036558A1/en not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19500925A1 (en) * | 1995-01-16 | 1996-07-18 | Orga Kartensysteme Gmbh | Integrated circuit (I.C) card or "chip" card |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025218547A1 (en) * | 2024-04-15 | 2025-10-23 | 捷德(中国)科技有限公司 | Environment-friendly smart card |
Also Published As
| Publication number | Publication date |
|---|---|
| AU1432299A (en) | 2000-07-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8038831B2 (en) | Radio frequency identification device support for passport and its manufacturing method | |
| KR101033013B1 (en) | How to make a smart card antenna on a thermoplastic support and the resulting smart card | |
| US6886246B2 (en) | Method for making an article having an embedded electronic device | |
| US6659355B1 (en) | Method for producing a multi-layer chip card | |
| US7714724B2 (en) | Radio frequency identification device support and its manufacturing method | |
| EP3151167B1 (en) | Dual-interface ic card module | |
| KR20170066486A (en) | Chip card manufacturing method, and chip card obtained by said method | |
| JPH11510626A (en) | Data carrier having module and coil including components, and method of manufacturing such data carrier | |
| US20070279232A1 (en) | Radio frequency identification device support and its manufacturing method | |
| US6081025A (en) | Data carrier with a component-containing module and with a coil, method of producing such a data carrier and module therefor | |
| GB2279612A (en) | Integrated circuit or smart card. | |
| US5856912A (en) | Microelectronic assembly for connection to an embedded electrical element, and method for forming same | |
| WO2000036558A1 (en) | Chip card with glued-in module and method of its manufacturing | |
| JP4286945B2 (en) | Contact-type non-contact type common IC card and manufacturing method thereof | |
| US20040099745A1 (en) | Method of producing a module | |
| JPH0324383Y2 (en) | ||
| JP2510669B2 (en) | IC card | |
| WO2000036559A1 (en) | Chip card with soldered chip module and method of its manufacturing | |
| WO2000036557A1 (en) | Chip card with a shaped lead frame module and mehtod of its manufacturing | |
| EP4276687A1 (en) | Rsim stand alone manufacturing at microelectronic step | |
| CZ287059B6 (en) | Chip contact card with adhesive bonded module and process for producing thereof | |
| IL195386A (en) | Radio frequency identification device medium and method for making same | |
| KR20040083735A (en) | Method for Adhering Hot-melt Sheet in Manufacturing Combination-Type IC Card | |
| JPS61242897A (en) | Ic memory card | |
| JPH0381199A (en) | Ic card |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): AT AU BG BR BY CA CH CN DE DK EE ES FI GB HU IL JP KR LT LV MK NO NZ PL PT RO RU SE SG SI SK TR UA US |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
| REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
| 122 | Ep: pct application non-entry in european phase |