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WO2000011747A1 - Microwave dielectric material - Google Patents

Microwave dielectric material Download PDF

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Publication number
WO2000011747A1
WO2000011747A1 PCT/SE1999/001328 SE9901328W WO0011747A1 WO 2000011747 A1 WO2000011747 A1 WO 2000011747A1 SE 9901328 W SE9901328 W SE 9901328W WO 0011747 A1 WO0011747 A1 WO 0011747A1
Authority
WO
WIPO (PCT)
Prior art keywords
dielectric material
ghz
dissipation factor
laminate construction
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SE1999/001328
Other languages
French (fr)
Inventor
Leif Bergstedt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Priority to AU56620/99A priority Critical patent/AU5662099A/en
Priority to KR1020017001642A priority patent/KR20010072326A/en
Priority to EP99943549A priority patent/EP1110270A1/en
Priority to CA002340988A priority patent/CA2340988A1/en
Publication of WO2000011747A1 publication Critical patent/WO2000011747A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Definitions

  • the present invention relates to laminate constructions containing dielectric material for use in microwave electronics. They can be used for microwave applications in inter alia component carriers such as circuit boards and in microwave antennas. The invention also relates to a method of manufacturing such new dielectric laminate constructions.
  • the dielectric materials used in these designs can have a thickness of ca. 600 ⁇ m and dielectric materials having the desired or required properties can increase the cost of the board significantly In the GSM mobile radio systems, for example, an antenna having a large amount of material is used, which can be veiy expensive if high quality dielectric material must be used.
  • an object of this invention is to provide a dielectric microwave electronic component carrier or a dielectric microwave antenna, which is less expensive than hitherto known component carriers or antennas but which provide the same high quality properties as regards low total dissipation factor, that it to say essentially low heat generation and low variation in the dielectric constant. This is especially desirable in antennas using significant amounts of materials, such as those used in the new GSM 1.8 system. Tests on which the present invention is based have shown that for a frequency of 1 GHz only the top 200 ⁇ m of the board need be of top quality as regards its dissipation constant and the remaining underlying portion can be of lesser quality thus reduc- ing the total cost of the laminate.
  • Another object of the present invention is to provide a method of manufacturing such a component carrier or antenna.
  • the figure shows schematically a composite microwave board.
  • the figure shows one embodiment of the invention which is a composite microwave board.
  • a lower layer 2 of a less expensive dielectric material which in this case is an FR-4 material. It is also possible within the scope of the invention to use other materials having a dissipation factor at 1 GHz which is greater than 0.005 such as cyanate ester, BT/epoxy, polyimide thermount, or polyimide.
  • an upper layer 3 of a higher quality material such as PTFE/glass or Gore-ply®. This upper layer 3 has a dissipation factor D f at 1 GHz which is less than 0.005.
  • the dissipation factor D f is used as a measure of the energy lost (heat) in relation to energy stored at a certain microwave frequency (in this case 1 GHz).
  • This dissipation factor can be expressed as tan ⁇ where ⁇ is the angle formed by the vector components ⁇ ' and ⁇ " where ⁇ ' is a real component corresponding to the energy stored and ⁇ " is an imaginaiy component corresponding to the dissipated energy, called the loss factor.
  • z and ⁇ " are represented as 90° out of phase and therefore the ratio between them can be represented as tan ⁇ where ⁇ is the angle formed by the two vectors.
  • a lower layer 2 of less expensive dielectric material having a high dissipation factor (D f >0.005) is applied to an earth plane.
  • This lower layer may have a thickness of 400 ⁇ m of a total dielectric thickness of 600 ⁇ m.
  • An upper layer 3 (ca. 200 ⁇ m ) of a more expensive dielectric material (D f O.005) is then applied onto the lower layer 2.
  • a conductor layer 4 is then ap- plied to the upper layer 3.
  • ElectiOnic components may be mounted on the conductor layer 4.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Waveguide Aerials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Details Of Aerials (AREA)

Abstract

A laminate construction for use in microwave electronics, such as for circuit boards or antennas, has expensive dielectric material having a low dissipation factor (Df < 0.005 at 1 GHz), such as PTFE/glass or Gore-ply®, only in the upper 200 νm and less expensive dielectric material having a higher dissipation factor (Df > 0.005 at 1 GHz), such as FR-4, cyanate ester, BT/epoxy, polyimide thermount or polyimide, in the underlying 400 νm of the dielectric material, thereby reducing cost while maintaining the same performance as regards low energy loss and consistency of the dielectric constant over the temperature and frequency range of use.

Description

Microwave Dielectric Material
TECHNICAL FIELD OF THE INVENTION
The present invention relates to laminate constructions containing dielectric material for use in microwave electronics. They can be used for microwave applications in inter alia component carriers such as circuit boards and in microwave antennas. The invention also relates to a method of manufacturing such new dielectric laminate constructions.
RELATED ART
In such dielectrics it is important that there not be excessive variations in the dielectric constant (D^) over the temperature and frequency ranges of use. It is also important that the dissipation factor (tan δ) should be low, so that there will be a minimum energy loss (heat). This has been achieved previously by arranging a di- electric layer to support a microstrip conducting layer thereon. In order to achieve the just described desired effects, a dielectric material layer is applied which has the desired properties.
The dielectric materials used in these designs can have a thickness of ca. 600 μm and dielectric materials having the desired or required properties can increase the cost of the board significantly In the GSM mobile radio systems, for example, an antenna having a large amount of material is used, which can be veiy expensive if high quality dielectric material must be used.
SUMMARY OF THE INVENTION In accordance with the foregoing background discussion, an object of this invention is to provide a dielectric microwave electronic component carrier or a dielectric microwave antenna, which is less expensive than hitherto known component carriers or antennas but which provide the same high quality properties as regards low total dissipation factor, that it to say essentially low heat generation and low variation in the dielectric constant. This is especially desirable in antennas using significant amounts of materials, such as those used in the new GSM 1.8 system. Tests on which the present invention is based have shown that for a frequency of 1 GHz only the top 200 μm of the board need be of top quality as regards its dissipation constant and the remaining underlying portion can be of lesser quality thus reduc- ing the total cost of the laminate.
Another object of the present invention is to provide a method of manufacturing such a component carrier or antenna.
BRIEF DESCRIPTION OF THE DRAWINGS
The figure shows schematically a composite microwave board.
DETAILED DESCRIPTION OF EMBODIMENTS
The figure shows one embodiment of the invention which is a composite microwave board. To a ground plane 1 there is applied a lower layer 2 of a less expensive dielectric material which in this case is an FR-4 material. It is also possible within the scope of the invention to use other materials having a dissipation factor at 1 GHz which is greater than 0.005 such as cyanate ester, BT/epoxy, polyimide thermount, or polyimide. To this lower layer 2 there is applied an upper layer 3 of a higher quality material such as PTFE/glass or Gore-ply®. This upper layer 3 has a dissipation factor Df at 1 GHz which is less than 0.005.
The dissipation factor Df is used as a measure of the energy lost (heat) in relation to energy stored at a certain microwave frequency (in this case 1 GHz). This dissipation factor can be expressed as tanδ where δ is the angle formed by the vector components ε' and ε" where ε' is a real component corresponding to the energy stored and ε" is an imaginaiy component corresponding to the dissipated energy, called the loss factor. In a vector diagram z and ε" are represented as 90° out of phase and therefore the ratio between them can be represented as tan δ where δ is the angle formed by the two vectors.
In the method according to the invention, a lower layer 2 of less expensive dielectric material having a high dissipation factor (Df >0.005) is applied to an earth plane. This lower layer may have a thickness of 400 μm of a total dielectric thickness of 600 μm. An upper layer 3 (ca. 200 μm ) of a more expensive dielectric material (DfO.005) is then applied onto the lower layer 2. A conductor layer 4 is then ap- plied to the upper layer 3. ElectiOnic components may be mounted on the conductor layer 4.

Claims

1. Laminate construction for microwave electronics applications, comprising: at least one earth plane (1), a lower layer (2) of dielectric material having a dissipation factor D at 1 GHz of greater than 0.005, applied to said earth plane, an upper layer (3) of dielectiic material having a dissipation factor D at 1 GHz of less than 0.005 applied to said lower layer, a conductor layer (4) possibly including electi'onic components mounted on said up per layer.
2. Laminate construction according to Claim 1, wherein the upper layer (3) of dielectric material is approximately 200 μm thick.
3. Laminate construction according to Claim 1 or 2, wherein said laminate construction is a circuit board.
4. Laminate construction according to Claim 1 or 2, wherein said laminate construction is an antenna.
5. Method of manufacturing a laminate construction as defined in one of the preceding claims, comprising the following steps:
1. applying onto an earth plane (1) a lower layer (2) of dielectric material having a dissipation factor D at 1 GHz of greater than 0.005, 2. thereafter applying onto said lower layer (2) an upper layer (3) of dielectric material having a dissipation factor Df at 1 GHz of less than 0.005 applied to said lower layer (2),
3. thereafter applying a conductor layer (4) onto said upper layer (3).
PCT/SE1999/001328 1998-08-19 1999-07-30 Microwave dielectric material Ceased WO2000011747A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU56620/99A AU5662099A (en) 1998-08-19 1999-07-30 Microwave dielectric material
KR1020017001642A KR20010072326A (en) 1998-08-19 1999-07-30 Microwave dielectric material
EP99943549A EP1110270A1 (en) 1998-08-19 1999-07-30 Microwave dielectric material
CA002340988A CA2340988A1 (en) 1998-08-19 1999-07-30 Microwave dielectric material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9802769A SE513022C2 (en) 1998-08-19 1998-08-19 Dielectric material for microwaves
SE9802769-1 1998-08-19

Publications (1)

Publication Number Publication Date
WO2000011747A1 true WO2000011747A1 (en) 2000-03-02

Family

ID=20412284

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1999/001328 Ceased WO2000011747A1 (en) 1998-08-19 1999-07-30 Microwave dielectric material

Country Status (7)

Country Link
EP (1) EP1110270A1 (en)
KR (1) KR20010072326A (en)
CN (1) CN1178783C (en)
AU (1) AU5662099A (en)
CA (1) CA2340988A1 (en)
SE (1) SE513022C2 (en)
WO (1) WO2000011747A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1094692A3 (en) * 1999-10-20 2004-03-31 Nec Corporation Printed circuit board and manufacturing process thereof
WO2012069700A1 (en) * 2010-11-24 2012-05-31 Nokia Corporation Printed wiring board with dielectric material sections having different dissipation factors
US8199056B2 (en) 2005-10-13 2012-06-12 Nokia Corporation Antenna arrangement
US8344955B2 (en) 2010-01-08 2013-01-01 Nokia Corporation Integrated antenna with e-flex technology

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103458610B (en) * 2012-06-04 2017-12-29 联想(北京)有限公司 The substrate and printed circuit board of printed circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886699A (en) * 1987-10-26 1989-12-12 Rogers Corporation Glass fiber reinforced fluoropolymeric circuit laminate
US4914445A (en) * 1988-12-23 1990-04-03 Shoemaker Kevin O Microstrip antennas and multiple radiator array antennas
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4886699A (en) * 1987-10-26 1989-12-12 Rogers Corporation Glass fiber reinforced fluoropolymeric circuit laminate
US4914445A (en) * 1988-12-23 1990-04-03 Shoemaker Kevin O Microstrip antennas and multiple radiator array antennas
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1094692A3 (en) * 1999-10-20 2004-03-31 Nec Corporation Printed circuit board and manufacturing process thereof
US8199056B2 (en) 2005-10-13 2012-06-12 Nokia Corporation Antenna arrangement
US8344955B2 (en) 2010-01-08 2013-01-01 Nokia Corporation Integrated antenna with e-flex technology
WO2012069700A1 (en) * 2010-11-24 2012-05-31 Nokia Corporation Printed wiring board with dielectric material sections having different dissipation factors
US8716603B2 (en) 2010-11-24 2014-05-06 Nokia Corporation Printed wiring board with dielectric material sections having different dissipation factors

Also Published As

Publication number Publication date
SE513022C2 (en) 2000-06-19
KR20010072326A (en) 2001-07-31
SE9802769L (en) 2000-02-20
CN1178783C (en) 2004-12-08
CA2340988A1 (en) 2000-03-02
SE9802769D0 (en) 1998-08-19
CN1312962A (en) 2001-09-12
EP1110270A1 (en) 2001-06-27
AU5662099A (en) 2000-03-14

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