[go: up one dir, main page]

WO2000004394A1 - Support pour mesure de dispositif et procede de mesure de dispositif - Google Patents

Support pour mesure de dispositif et procede de mesure de dispositif Download PDF

Info

Publication number
WO2000004394A1
WO2000004394A1 PCT/JP1999/003811 JP9903811W WO0004394A1 WO 2000004394 A1 WO2000004394 A1 WO 2000004394A1 JP 9903811 W JP9903811 W JP 9903811W WO 0004394 A1 WO0004394 A1 WO 0004394A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
measuring
measurement
terminals
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1999/003811
Other languages
English (en)
Japanese (ja)
Inventor
Satoru Nagumo
Tsunehito Yokoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of WO2000004394A1 publication Critical patent/WO2000004394A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing

Definitions

  • the present invention relates to a device measuring socket for mounting a device for measuring various characteristics using a measuring instrument.
  • a filter or an amplifier as a high-frequency device is frequently used in an antenna input portion of a mobile phone that transmits and receives radio waves having a frequency of 800 MHz and 5 GHz.
  • these high-frequency devices have also been miniaturized, and are often formed as so-called surface-mounted devices.
  • FIG. 14 is a diagram showing a specific example of a conventional high-frequency device measuring jig.
  • the high-frequency device measuring jig 100 shown in FIG. 14 is an external connection terminal 100 connected via a coaxial cable or the like to a measuring instrument such as a network analyzer or a spectrum analyzer for measuring high-frequency characteristics. 2 and 104, and a conductive rubber 120 inserted between the high-frequency device 200 to be measured and the microstrip substrate 110.
  • a measuring instrument such as a network analyzer or a spectrum analyzer for measuring high-frequency characteristics. 2 and 104
  • a conductive rubber 120 inserted between the high-frequency device 200 to be measured and the microstrip substrate 110.
  • conductive pins penetrating between the front surface and the back surface are arranged at predetermined intervals, and formed on the front surface of the high-frequency device 200 through the conductive pins. Electrical connection is made between the device-side terminals and the measurement terminals formed on the microstrip substrate 110 surface.
  • FIG. 15 is a diagram showing another specific example of the conventional high-frequency device measuring jig.
  • the high-frequency device measurement jig 13 0 shown in FIG. 15 has external connection terminals 13 2 and 13 4 as well as a plurality of measurement terminals for making an electrical connection with the high-frequency device 200.
  • a microstrip substrate 140 provided with the movable pins 1336 of FIG. When the high-frequency device 200 is pressed against the surface of the microstrip substrate 140, the device-side terminals formed on the surface of the high-frequency device 200 have movable pins 13 6 provided on the microstrip substrate 140. Therefore, an electrical connection is made between the device side terminal and the measurement terminal.
  • the conventional high-frequency device measuring jig described above has a problem that the durability and the reliability are low and the high-frequency characteristics are poor even when any kind of the jig is used.
  • an electrical connection between the high-frequency device 200 and the measuring terminal is made by a conductive pin included in the conductive rubber 120. Therefore, if the tip of the conductive pin is bent by repeated use, a connection failure may occur. Also, a good connection state cannot be obtained unless the entire conductive rubber 120 is pressed with a large force.
  • the conductive pins of each are connected by a capacitor, so the device-side terminals of the high-frequency device 200 or the measurement terminals of the microstrip substrate 110 are short-circuited. As a result, the high frequency characteristics were not considered to be good.
  • the movable pin 13 36 may be caught and go to the device side terminal. Contact becomes insufficient.
  • the movable pins 13 6 are realized by using a panel.However, since equivalently includes a coil and a large contact resistance, it becomes a complicated equivalent circuit especially for signals in the high frequency range, and This hinders the intrinsic property measurement of device 200.
  • the present invention has been made in view of the above points, and its purpose is to provide durability, An object of the present invention is to provide a high-frequency device measuring jig having excellent reliability and excellent frequency characteristics.
  • the substrate on which the measuring terminals are formed is formed of a flexible sheet-shaped member, the measuring terminals are provided on a plurality of device-side terminals provided on the device. It can be easily contacted with it.
  • the terminals are brought into direct contact with each other, the structure is simple, and the durability and reliability can be improved.
  • good frequency characteristics can be obtained.
  • the external connection terminal connected to the measuring instrument and the measuring terminal are connected by a coplanar single line or a microstrip line.
  • a coplanar line By using a coplanar line, a conductor layer can be formed only on one surface of the substrate, and the substrate can have sufficient flexibility, and the measurement terminals and device-side terminals can be securely connected. Can be contacted. Also, by using a coplanar line or microstrip line, it is possible to reduce the loss and reflection when a high-frequency signal is input and output between the device and the measuring instrument. In doing so, accurate measurement becomes possible.
  • the contact between the measurement terminals and the device-side terminals can be further ensured.
  • the projections using bumps commonly used for device connection, etc., it becomes easy to manufacture a substrate including the projections.
  • a flexible supporting member having a predetermined thickness on one surface of the substrate opposite to the surface on which the measuring terminals are formed.
  • the support member and the board are housed in a case, the connection to the measuring instrument is performed using the external connection terminal fixed to the case, and the wiring between the measurement terminal and the external connection terminal is provided on the board. It is preferable to use the formed pattern electrode. By using pattern electrodes, wide wiring can be easily formed and transmission lines Can be easily reduced in impedance.
  • the external connection terminal and the pattern electrode on the substrate are partially pressed by a pressing means to make an electrical connection therebetween. Since the electrical connection is made by pressing, the substrate can be easily attached and detached, and if the substrate needs to be replaced due to wear of the measurement terminals, the labor required for the replacement can be reduced. .
  • the periphery of the measurement terminal is easily deformed, and the unevenness of the device surface shape is more easily absorbed by the flexibility of the substrate. A good contact state between terminals can be realized with a small pressing force.
  • the plurality of measurement terminals formed on the surface of the substrate are preferably formed by photoetching. An unnecessary portion of the metal film or the like can be removed by photoetching to form a terminal having a desired shape, and fine processing can be performed, so that the distance between the terminals can be reduced.
  • FIG. 1 is a perspective view showing a configuration of a device measurement socket according to an embodiment.
  • FIG. 2 is an enlarged cross-sectional view including a conductor and conductors arranged on both sides of the conductor.
  • FIG. 3 is a cross-sectional view showing a contact state when devices with different terminal heights are attached to the device measuring socket of the present embodiment.
  • FIG. 4 is a diagram showing a modification of the device measurement socket.
  • FIG. 5 is a view showing a modification in which a groove is added to the substrate shown in FIG. 4
  • FIG. 6 is a view showing another modification of the device measuring socket
  • FIG. 7 is a perspective view showing another modification of the device measuring socket.
  • FIG. 8 is a diagram showing an example of use of the device measuring socket shown in FIG. 7,
  • FIG. 9 is a perspective view showing a partial configuration of the device measuring socket
  • FIG. 10 is a partial cross-sectional view of the device measuring socket including the coaxial connector.
  • FIG. 11 is a cross-sectional view taken along the line A—A of FIG.
  • FIG. 12 is a diagram showing the internal structure of the pogo pin
  • FIG. 13 is a perspective view of a substrate on which a microstrip line is formed
  • FIG. 14 is a diagram showing a specific example of a conventional high-frequency device measurement jig
  • -FIG. 15 is a diagram of a conventional high-frequency device measurement jig It is a figure showing a specific example.
  • FIG. 1 is a perspective view showing a configuration of a device measuring socket according to an embodiment.
  • the device measurement socket 10 shown in the figure includes a board 16 on which coaxial connectors 12 and 14 as external connection terminals connected to a measuring instrument (not shown) via a coaxial line are attached. And a supporting member silicon rubber 18 as a supporting member disposed adjacent to the substrate 16.
  • the substrate 16 is a flexible sheet-like member, and has on its surface a conductor 20 having a predetermined width extending from one coaxial connector 12 and a conductor 2 having a predetermined width extending from the other coaxial connector 14. 2 and a conductor 24 surrounding the conductors 20 and 22 over a wide area.
  • the conductor 20 and the conductor 24 adjacent thereto form a coplanar line connecting the coaxial connector 12 and one of the device-side terminals formed on the surface of the high-frequency device 30.
  • the conductor 22 and the conductor 24 adjacent thereto form a coplanar line connecting the coaxial connector 14 and another device side terminal formed on the surface of the high-frequency device 30 c.
  • the substrate 16 is, for example, a flexible substrate using polyimide resin, and conductors 20, 22, 24 are formed on the surface of the substrate 16 by a Cu thin film.
  • the various conductors 20, 22, 24 formed on the surface of the substrate 16 described above are preferably formed by photoetching. By removing unnecessary portions of the metal film or the like by photoetching, a measuring terminal (described later) having a desired shape can be formed, and fine processing can be performed. It can be easily narrowed.
  • the device to be combined with the device measuring socket 10 is a surface-mounted element in which various device-side terminals are formed on the surface facing the substrate 16.
  • various device-side terminals are formed on the surface facing the substrate 16.
  • the high-frequency device 30 is combined with the device measuring socket 10.
  • a passive element such as a filter
  • input / output terminals 32, 34, and a ground terminal 36 as device-side terminals are formed on one surface of the high-frequency device 30.
  • an active element such as an amplifier
  • a bias terminal is added in addition to these terminals.
  • measurement terminals for electrically connecting to the various device-side terminals described above when the high-frequency device 30 is pressed are formed on the surface of the substrate 16.
  • the tips of the conductors 20 and 22 are used as the board-side input / output terminals 42 and 44 corresponding to the input / output terminals 32 and 34 of the high-frequency device 30, respectively.
  • a part of the body 24 is used as a board-side ground terminal 46 corresponding to the ground terminal 36 of the high-frequency device 30.
  • one device-side input / output terminal 32 is connected to the board-side input / output terminal 42, and the other device-side input / output terminal 34 is set to the board-side input / output terminal.
  • These measurement terminals formed on the surface of the substrate 16 are arranged on the substrate 44 such that the device-side ground terminal 36 contacts the substrate-side ground terminal 46.
  • a silicon rubber 18 for supporting the substrate having a predetermined thickness (for example, 5 mm) is disposed so as to contact almost the entire surface.
  • FIG. 2 is an enlarged cross-sectional view including the conductor 20 and the conductors 24 arranged on both sides thereof.
  • the width A of the conductor 20 is set to 2.2 mm, and the distances B and C between the conductors 24 on both sides thereof are set to 10.
  • the thickness D of the substrate 16 is 3 5
  • the thickness E of the conductors 20, 22, 24 is set to 35 m, respectively.
  • a coplanar line is formed by forming the conductors 20, 22, 24 as a thin film on the surface of the extremely thin substrate 16, and the entire structure is formed in the thickness direction of the substrate 16. It is easy to deform.
  • the device measurement socket 10 of the present embodiment has such a configuration. Next, details of the case where the high-frequency device 30 is actually set will be described.
  • Figure 3 shows two input / output terminals 32, 34 and one grounding terminal 36 on the underside of the high-frequency device 30.
  • FIG. 9 is a cross-sectional view showing a contact state of each terminal when the terminal is formed and only the surface on which the ground terminal 36 is formed is lower than the surface on which the other two terminals are formed.
  • the input / output terminals 32, 34 and the grounding terminal 36 of the high-frequency device 30 are connected to the substrate 1
  • the high-frequency device 30 is placed at a predetermined position on the substrate 16 so as to correspond to the input / output terminals 42, 44 of 6 and those of the ground terminal 46.
  • the lower surface of the substrate supporting silicon rubber 18 disposed on the lower side of the substrate 16 or the upper surface of the high-frequency device 30 is pressed. Since the substrate supporting silicon rubber 18 is flexible, and the substrate 16 is also formed of a flexible and flexible polyimide resin, the input / output terminals 32, 3 4 of the high-frequency device 30 are provided.
  • the ground terminal 46 of the substrate 16 Even when the surfaces of the ground terminal 36 and the ground terminal 36 are not formed at the same height, the ground terminal 46 of the substrate 16 partially pressed by the substrate As a result, the ground terminal 36 of the high-frequency device 30 and the ground terminal 46 of the substrate 16 can be reliably brought into contact with each other.
  • the structure is simple, and the durability and reliability can be improved.
  • the terminals are in direct contact with each other for electrical connection, excess inductance and resistance components can be reduced, and good frequency characteristics (particularly high-frequency characteristics) can be obtained.
  • the conductors 20 and the like constituting the coplanar line on the substrate 16 with pattern electrodes, the electrodes for grounding or the power supply line can be formed in an arbitrary wide shape. It is easy to reduce the impedance of the line.
  • FIG. 4 is a view showing a modification of the [high frequency] device measuring socket, showing a structure in which the conductor 24 on the substrate 16 facing the high frequency device 30 is partially removed. Have been.
  • the area surrounded by the two-dot chain line indicated by F is the area facing the high-frequency device 30, and the conductors around the input / output terminals 42, 44 at the tips of the conductors 20, 22 are shown. 24 has been removed, and the polyimide resin forming the substrate 16 has been exposed.
  • the flexibility of this portion can be increased. Therefore, the input / output terminals 42, 44 and the ground terminal 46 formed around the periphery are easily deformed according to the shape of the high-frequency device 30, and the electrical connection with the corresponding device-side terminal is ensured. Can be performed.
  • FIG. 5 is a view showing a modification in which a groove is added to the substrate shown in FIG.
  • grooves 50, 52 penetrating between the front and back are formed along the outer shape of the conductors 20, 22 around the input / output terminals 42, 44.
  • FIG. 6 is a view showing another modification of the device measuring socket.
  • the position corresponding to each terminal A projection 54 is formed at the bottom.
  • These projections 54 are formed by forming bumps of gold, solder, or the like at predetermined positions on the conductor 20, and then covering the surface with a hard protective metal having excellent wear resistance.
  • the protrusion 54 may be formed by soldering a Cu ball, the surface of which is plated with Ni or the like, to a predetermined position of the conductor 20 or the like.
  • the input / output terminals 42, 44 of the substrate 16 and the ground terminal 46 By forming the input / output terminals 42, 44 of the substrate 16 and the ground terminal 46 using the high-frequency device 30 having a complicated surface shape, the input / output terminals The input / output terminals 42 and 44 on the substrate 16 can be reliably brought into contact with the input / output terminals 32 and 34 of the high-frequency device 30 also for the formed high-frequency device 30. Also, by using bumps and balls commonly used for wiring and mounting of various ICs, the protrusions 54 can be easily formed. Cut.
  • FIG. 7 is a perspective view showing another modified example of the device measuring socket.
  • the metal lid portion 82 made of aluminum or the like is housed in the case 80 so as to press the entire board 16 and the mounting holes 8 4
  • the lid 82 is fixed to the case 80 with the metal screw 86 passed through the case 80.
  • the cover portion 82 has a groove formed in a portion corresponding to the conductors 20 and 22 on the substrate 16, and when the cover 16 is attached so as to press down the entire substrate 16, the conductor for grounding 2 is formed. Only 4 is almost in contact.
  • a large device setting through hole 88 for setting a high-frequency device later is formed substantially at the center.
  • the grounding conductor 24 on the board 16 is connected to the coaxial connectors 12 and 14 via the lid 82, screws 86, and case 80. It is electrically connected to the external conductor, and the conductor 24 on the board 16 is grounded.
  • various terminals on the device side and various terminals on the substrate side can be reliably contacted.
  • FIG. 8 is a diagram showing an example of use of the device measuring socket shown in FIG. As described above, the coaxial connectors 12 and 14 are attached to the case 80 accommodating the device measuring socket 10, and the input / output terminals 1 provided on the measuring instrument 100.
  • the coaxial connectors 12 and 14 are connected to the coaxial connectors 12 and 14 using coaxial lines 120 and 122, respectively.
  • the high-frequency device 30 is mounted at the position of the device set through hole 88 formed in the center of the lid portion 82, and the high-frequency device 30 is pressed downward from above to obtain a device.
  • An electrical connection is made between the measuring socket 10 and the high-frequency device 30.
  • the input / output terminals 42, 44 and the ground terminal 46 on the surface of the substrate 16 are partially worn or deformed. It is necessary to replace the entire board 16 on which the terminals are formed.
  • the fixation of the substrate 16 in the device measurement socket 10 is performed by attaching the lid portion 82 from above the case 80. Since the lid 80 is attached with four screws 86 passed through the attachment holes 84, the lid 80 can be easily removed by removing the screws.
  • the coaxial cables 120 and 122 are attached to the case 80 or the case 80 is connected to another device (for example, an automatic tester or a handler). The board 16 can be replaced even in the state where the board is fixed to), and the work of the replacement work can be reduced.
  • FIG. 9 is a perspective view showing a partial configuration of the device measuring socket, showing details of the vicinity of the center conductor of the coaxial connectors 12 and 14.
  • FIG. 10 is a partial cross-sectional view including a coaxial connector.
  • FIG. 11 is a sectional view taken along line AA of FIG. Note that the two coaxial connectors 12 and 14 and their peripheral parts have basically the same structure, and the following description will focus on one coaxial connector 12.
  • the center conductor 200 of the coaxial connector 12 is exposed inside the case 80 so as to penetrate the side wall of the case 80, and the conductor formed on the surface of the substrate 16 These electrical connections are made by contacting the ends of the cores 20 c.
  • the substrate 16 is disposed below the center conductor 200, and the center conductor 20 By pressing the position corresponding to 0 by the pressing means, these contacts are reliably performed.
  • the pressing means can be realized by using a pogo pin 210 as shown in FIGS.
  • FIG. 12 is a diagram showing the internal structure of the pogo pin 210.
  • the pogo pin 210 accommodates the panel 222 and a part of the movable part 224 in a cylindrical accommodation part 220.
  • the distal end portion 226 of the movable portion 224 presses the substrate 16 toward the center conductor 200 in the direction of expansion and contraction of the panel 222.
  • the tip portion 226 is preferably formed of a material having a low dielectric constant, such as a rubber port.
  • a coplanar line composed of the conductors 20, 22 and 24 was formed on the surface of the substrate 16, but as shown in FIG.
  • a microstrip substrate 16A formed on the entire surface opposite to the surface on which 0 and 22 are formed may be used.
  • a microstrip line is formed by the conductors 20 and 24 or by the conductors 22 and 24.
  • the conductor layers are formed on both sides of the substrate, which reduces the flexibility of the substrate.However, since a flexible substrate formed of polyimide resin or the like is used, a certain degree of flexibility must be secured. This makes it possible to reliably contact various types of measurement terminals formed on the surface of the substrate with device terminals formed on one surface of the high-frequency device.
  • the high-frequency device 30 is attached to the device measurement socket 10, but a device other than the high-frequency device 30 may be attached.
  • a device other than the high-frequency device 30 may be attached.
  • it may be used by connecting to a semiconductor test apparatus for testing various semiconductor devices such as a semiconductor memory and a logic LSI.
  • the substrate on which the measurement terminals are formed is formed of a flexible sheet-shaped member, so that the substrate is provided in the high-frequency device.
  • a conductor layer is formed only on one surface of the substrate, so that the substrate can have sufficient flexibility, and the measurement terminals and The device terminals can be reliably contacted.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un outil durable et fiable présentant de bonnes caractéristiques haute fréquence, qui sert à mesurer des dispositifs haute fréquence. L'outil (10) de mesure de dispositifs haute fréquence comporte un substrat (16) sur lequel un circuit coplanaire se connecte entre des bornes (42, 44) d'E/S et des connecteurs (12, 14) coaxiaux. Le substrat (16) est composé d'une matière flexible telle qu'une résine de polyimide, et un renfort (18) en caoutchouc de silicone situé sur le substrat sert à presser un dispositif (30) haute fréquence fixé sur la surface. Par conséquent, le substrat est déformé de manière à s'adapter à la forme de la surface du dispositif (30) haute fréquence, et les bornes correspondantes se mettent en contact fiable.
PCT/JP1999/003811 1998-07-16 1999-07-15 Support pour mesure de dispositif et procede de mesure de dispositif Ceased WO2000004394A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10/218531 1998-07-16
JP21853198 1998-07-16

Publications (1)

Publication Number Publication Date
WO2000004394A1 true WO2000004394A1 (fr) 2000-01-27

Family

ID=16721395

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/003811 Ceased WO2000004394A1 (fr) 1998-07-16 1999-07-15 Support pour mesure de dispositif et procede de mesure de dispositif

Country Status (2)

Country Link
TW (1) TW436631B (fr)
WO (1) WO2000004394A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1510826A1 (fr) * 2003-08-25 2005-03-02 Delaware Capital Formation, Inc. Plaque de circuit imprimé, intégré et contacteur d'essai pour tester un semi-conducteur à haute vitesse
WO2006115110A1 (fr) * 2005-04-20 2006-11-02 Matsushita Electric Industrial Co., Ltd. Dispositif d'inspection de condensateur electrolytique solide et procede d'inspection
WO2009101801A1 (fr) * 2008-02-15 2009-08-20 Panasonic Corporation Appareil d'inspection de condensateur et procédé d'inspection l'utilisant
JP2020153947A (ja) * 2019-03-22 2020-09-24 株式会社ヨコオ 検査装置
CN115175468A (zh) * 2022-06-02 2022-10-11 迦连科技(上海)有限公司 一种芯片连接装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101146525B1 (ko) * 2005-06-30 2012-05-25 엘지디스플레이 주식회사 기판 고정 지그 및 그 제조방법
CN103344795A (zh) * 2013-06-25 2013-10-09 苏州速腾电子科技有限公司 射频谐振器选频夹具

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6375876U (fr) * 1986-11-06 1988-05-20
JPH04233480A (ja) * 1990-09-14 1992-08-21 Internatl Business Mach Corp <Ibm> 電子デバイスの試験装置
JPH0536772A (ja) * 1991-07-29 1993-02-12 Murata Mfg Co Ltd 高周波特性測定用治具
JPH0566243A (ja) * 1991-09-06 1993-03-19 Nec Corp Ｌｓｉ評価用治具
JPH05196686A (ja) * 1992-01-20 1993-08-06 Nec Yamagata Ltd 半導体測定治具
JPH07211416A (ja) * 1994-01-10 1995-08-11 Texas Instr Japan Ltd ソケット

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6375876U (fr) * 1986-11-06 1988-05-20
JPH04233480A (ja) * 1990-09-14 1992-08-21 Internatl Business Mach Corp <Ibm> 電子デバイスの試験装置
JPH0536772A (ja) * 1991-07-29 1993-02-12 Murata Mfg Co Ltd 高周波特性測定用治具
JPH0566243A (ja) * 1991-09-06 1993-03-19 Nec Corp Ｌｓｉ評価用治具
JPH05196686A (ja) * 1992-01-20 1993-08-06 Nec Yamagata Ltd 半導体測定治具
JPH07211416A (ja) * 1994-01-10 1995-08-11 Texas Instr Japan Ltd ソケット

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1510826A1 (fr) * 2003-08-25 2005-03-02 Delaware Capital Formation, Inc. Plaque de circuit imprimé, intégré et contacteur d'essai pour tester un semi-conducteur à haute vitesse
JP2005070050A (ja) * 2003-08-25 2005-03-17 Delaware Capital Formation Inc 半導体回路のための検査インタフェースシステムと半導体パッケージを検査するためのコンタクタ
US7173442B2 (en) 2003-08-25 2007-02-06 Delaware Capital Formation, Inc. Integrated printed circuit board and test contactor for high speed semiconductor testing
KR100749431B1 (ko) * 2003-08-25 2007-08-14 델라웨어 캐피탈 포메이션, 인코포레이티드 고속 반도체 테스팅용 집적 인쇄회로기판 및 테스트 접촉기
WO2006115110A1 (fr) * 2005-04-20 2006-11-02 Matsushita Electric Industrial Co., Ltd. Dispositif d'inspection de condensateur electrolytique solide et procede d'inspection
US7839151B2 (en) 2005-04-20 2010-11-23 Panasonic Corporation Solid electrolytic capacitor inspection device and inspection method
WO2009101801A1 (fr) * 2008-02-15 2009-08-20 Panasonic Corporation Appareil d'inspection de condensateur et procédé d'inspection l'utilisant
JP2009194193A (ja) * 2008-02-15 2009-08-27 Panasonic Corp コンデンサの検査装置及びこれを用いた検査方法
JP2020153947A (ja) * 2019-03-22 2020-09-24 株式会社ヨコオ 検査装置
JP7206140B2 (ja) 2019-03-22 2023-01-17 株式会社ヨコオ 検査装置
CN115175468A (zh) * 2022-06-02 2022-10-11 迦连科技(上海)有限公司 一种芯片连接装置

Also Published As

Publication number Publication date
TW436631B (en) 2001-05-28

Similar Documents

Publication Publication Date Title
US7663387B2 (en) Test socket
US7656175B2 (en) Inspection unit
JP4535828B2 (ja) 検査ユニットの製法
US7990168B2 (en) Probe card including a sub-plate with a main supporter and a sub-supporter with the sub-supporter having probe needles
US7825676B2 (en) Contactor and test method using contactor
JP2004170182A (ja) 高周波・高速用デバイスの検査治具およびコンタクトプローブ
JPH11329648A (ja) Ｉｃデバイスソケット
JPH0517705B2 (fr)
EP0304868A2 (fr) Sonde multiple pour circuits intégrés en forme de galette
US12345760B2 (en) Apparatus for probing device-under-test
JP2004177400A (ja) プローブのインターフェース装置
JP2734412B2 (ja) 半導体装置のソケット
EP3669196B1 (fr) Dispositif de test
US10024883B2 (en) Contact unit and inspection jig
WO2000004394A1 (fr) Support pour mesure de dispositif et procede de mesure de dispositif
JP2002098736A (ja) 半導体デバイス試験装置
US6498299B2 (en) Connection structure of coaxial cable to electric circuit substrate
US7126364B2 (en) Interface comprising a thin PCB with protrusions for testing an integrated circuit
JP3458705B2 (ja) 高周波用プローブ装置
JPWO2000004394A1 (ja) デバイス測定用ソケットおよびデバイス測定方法
JPH0750324A (ja) プローブ装置
JP2002190506A (ja) プローブカード
JPH06260568A (ja) Ｉｃソケット
JPH0541416A (ja) プローブカード及びフロツグリング
JP2003346998A (ja) Ｉｃソケット

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

Ref document number: 2000560461

Format of ref document f/p: F