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WO2000003054A1 - Procede de galvanoplastie ionique d'une resine synthetique, et article en resine synthetique moulee presentant un revetement realise par galvanoplastie ionique - Google Patents

Procede de galvanoplastie ionique d'une resine synthetique, et article en resine synthetique moulee presentant un revetement realise par galvanoplastie ionique Download PDF

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Publication number
WO2000003054A1
WO2000003054A1 PCT/JP1999/003607 JP9903607W WO0003054A1 WO 2000003054 A1 WO2000003054 A1 WO 2000003054A1 JP 9903607 W JP9903607 W JP 9903607W WO 0003054 A1 WO0003054 A1 WO 0003054A1
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WO
WIPO (PCT)
Prior art keywords
synthetic resin
resin
plating
metal
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1999/003607
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English (en)
Japanese (ja)
Inventor
Osamu Miyata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Seimitsu Co Ltd
Original Assignee
Nihon Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Seimitsu Co Ltd filed Critical Nihon Seimitsu Co Ltd
Publication of WO2000003054A1 publication Critical patent/WO2000003054A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Definitions

  • the present invention relates to an IP method for applying an IP coating to a synthetic resin surface by ion plating (hereinafter sometimes simply referred to as IP) and a synthetic resin product coated with the IP method.
  • IP IP
  • metal nitride coatings and metal carbides have been applied to the surface of metal exterior members to improve the surface strength of the exterior members of various products or to obtain a coloring effect to enhance the decorativeness of the products.
  • An ion plating method for forming a coating, a metal oxide coating, or a mixed coating thereof has been used in various fields. Ion plating method, well known as 1 X shown in FIG.
  • titanium vacuum chamber one inside 1 which is evacuated to a vacuum of (T i) of any metal component
  • the metal element is evaporated by irradiating an electron beam with an electron gun 4 in the presence of a gas such as nitrogen gas, acetylene gas, or oxygen gas introduced from a gas supply mechanism 3 to an evaporation source 2 composed of
  • the evaporated metal element is ionized by the ionization electrode 5 and deposited on the surface of the target substrate 6 to be treated, so that a metal nitride film, a metal carbide film, a metal oxide film or a metal oxide film is formed on the surface of the substrate 6 to be processed. This is a method of forming a mixed film.
  • the metal nitride film, metal carbide film, metal oxide film or mixed film obtained by the ion plating method usually has a thickness of about 0.2 to 3 microns and is a very thin film.
  • the hardness is about 60 ⁇ to 3,000 HV, which is very hard, so it is not easily scratched, and is also excellent in anti-corrosion properties. It is a good film.
  • the vacuum plating method includes a vapor deposition method and a sprinkling link method.
  • the vapor deposition method is a method in which the temperature inside the vacuum chamber is kept low to evaporate aluminum and attach it to a resin or the like, but the metal film formed by this vapor deposition method has poor hardness and adhesion, so it is used for general cargo. It is used in the manufacture of decorative coatings for cosmetic containers.
  • the sputtering method is a method in which a metal is sputtered in a vacuum chamber and the metal is deposited on a substrate to be processed.
  • the ionization rate is lower and the reactivity with gas is poor, so that the metal is not used.
  • Aluminum is used as a coating for interior parts in automobiles.
  • the IP method is characterized in that the film is coated on the substrate under the most severe conditions, but has good reactivity with gas and has a high surface hardness. Utilizing the characteristics of the hard surface obtained by the IP method, it is used not only as a coating on cutting tools such as surface coatings on cutting tools, but also on coatings that require abrasion resistance. It is also used as a color surface coating with a beautiful appearance that is hard to scratch.
  • the IP treatment of the substrate to be treated is performed in a vacuum, and depending on the target film by radiant heat for vaporizing the energy carried by the ions and metals such as titanium.
  • the substrate to be treated is made of metal, and the substrate must be hard to adhere to in order to ensure adhesion to the IP treatment film.
  • the substrate to be processed is exposed to a high temperature state of 200 to 300 as described above, or for the purpose of improving the adhesion of the coating to the substrate to be processed. Since a bias voltage is applied to accelerate metal ions, if the substrate to be processed does not have characteristics that can handle the processing environment, it will cause defects such as deformation, and as a real product Can not be used. For this reason, metal materials have conventionally been used as the workpieces for ion plating. However, even when metal materials are used, there is a tendency that only uniform designs and designs can be obtained for each product due to the restrictions on the metal materials that can be used for the product and the manufacturing restrictions. Was.
  • the synthetic resin material has a complicated shape compared to the metal material, it has excellent workability, such as being easily formed into the shape, and has a wide range of materials. It is widely used because it can be selected according to the needs.
  • Various measures have been taken to increase the commercial value of the synthetic resin by applying a metal plating to the molding surface by various methods such as immersion and vapor deposition.
  • the metal plating film has considerably reduced properties such as mechanical strength as compared with a metal nitride film, a metal carbide film, a metal oxide film or a mixed film obtained by ion plating (IP).
  • IP processing can be easily softened by heat like synthetic resin, and even if it is applied to a material that may generate gas and contaminate the inside of the vacuum chamber, a product with commercial value is obtained. It was virtually impossible.
  • an object of the present invention is to establish a method of performing ion plating on a synthetic resin member, provide a coating by ion plating, and provide a durability and surface state that can be sufficiently evaluated as a practical product.
  • the goal is to obtain a synthetic resin product with an IP coating.
  • the present inventors have developed a method capable of stably applying a high-quality IP coating to a synthetic resin member.
  • the temperature of the base material becomes 200 to 300 ° C due to radiant heat for vaporizing the energy carried by the ions and metals such as titanium during the IP processing.
  • Materials with high heat resistance, such as materials can be sufficiently IP-treated at this temperature, but most synthetic resins are thermally deformed. No processed product is obtained.
  • the synthetic resin base material is heated to around 200 to 300 ° C. during the IP treatment process, gas is generated inside the synthetic resin as described above, and it is easy to expand. It is necessary to perform IP processing at low temperature.
  • the synthetic resin base material having high water absorption is subjected to the IP treatment, it is inevitable that the water absorbed by the synthetic resin vaporizes and expands at a high temperature of about 200 to 300 ° C.
  • IP processing is possible, but IP processing is actually performed using heat-resistant engineering plastic or super engineering plastic.
  • the IP coating sometimes swelled or peeled off. This is considered to be due to the difference in the coefficient of thermal expansion between the resin and the metal plating layer, etc., and the type and physical properties of the resin and the metal plating must be properly selected, or between the metal plating and the IP coating. A proper relationship It was foreseen that finding it would be indispensable to complete the resin IP processing technology.
  • a multilayer metal plating is often performed using a metal composed of copper (Cu), nickel (Ni), and chromium (Cr).
  • the metal plating used for the outermost layer is replaced with Cr in accordance with the application, and gold (Au) plating, palladium (Pd) plating or alloy plating thereof are commonly used. Used for exterior parts, handles, bumpers, etc.
  • IP-processable resins polyphthalamide resin and syndiotactic polystyrene resin
  • polyphthalamide resin may be a mineral-reinforced polyphthalamide resin
  • syndiotactic polystyrene resin may be a glass fiber-reinforced syndiotactic resin
  • the quality of the IP-treated product may not be stable, and the IP-treated film surface may have a small swelling of about 20%.
  • One of the causes of the above-mentioned defective products is that the synthetic resin base material is placed in a high-temperature environment that is easily deformed by heat at approximately 2 ° C to 300 ° C during IP processing, and the gas in the synthetic resin is It is considered that the metal plating film swells due to the difference between the generation and its expansion, the thermal expansion coefficient of the synthetic resin, and the thermal expansion coefficient of the metal plating layer.
  • As a countermeasure shorten the IP processing time to keep the temperature near the synthetic resin low during IP processing. As a result of study, if the IP processing time was shortened, a sufficient film suitable for practical use could not be obtained.
  • degassing heat treatment If gas other than water is likely to be generated from the synthetic resin, perform degassing heat treatment. Normally, before applying metal plating to a resin molded product, a heat treatment called anneal is performed to remove molding distortion of the synthetic resin in order to improve the adhesion of the metal plating. This is a heat treatment at 150 ° C for about 30 minutes. However, when IP treatment is applied to a metal-coated synthetic resin, in addition to removing the molding distortion of the synthetic resin, the purpose of degassing is to prevent the generation of gas from the synthetic resin when processed at vacuum and high temperature. It is necessary to perform degassing heat treatment at a high temperature for a long time.
  • the metal plating layer swells and causes poor appearance.
  • the heat resistance changes depending on the resin and even with the same resin due to the strengthening of glass fiber and minerals.
  • a resin that does not have heat resistance process at a low temperature for a long time, and for a heat resistant resin, process at a high temperature for a short time. Is economical.
  • the degassing treatment of the synthetic resin is performed, for example, by heat treatment at 200 ° C for 1 to 2 hours, or 180 ° C for 1.5 to 3 hours, or 150 ° C for 2 to 4 hours. .
  • the synthetic resin is degassed, and at the same time, the annealing treatment and the dehydration treatment are performed.
  • IP processing can be performed by appropriately pre-treating ABS resin, polyamide resin, polyphenylene sulfide resin, and liquid crystal polymer resin. That there is The inventor has found out.
  • metal plating is applied to a non-conductive substrate to apply a bias voltage to the substrate during IP processing, but a metal plating with a film thickness sufficient to suppress the thermal expansion of the synthetic resin is applied. .
  • the metal plated together with the synthetic resin expands, however, the expansion ratio of the synthetic resin and the plated metal film differs, and In general, the synthetic resin has a higher coefficient of thermal expansion than the plated metal film, so that the synthetic resin generates a force to spread the plated metal film. However, if expanded beyond the coefficient of thermal expansion of the metal, the metal film will stretch and in some cases break.
  • the metal film that has grown at a high temperature contracts when the temperature returns to room temperature, but the metal film and the synthetic resin separate from each other or swell due to the difference in the shrinkage between the synthetic resin and the metal film.
  • a metal plating film having a thickness of 20 to 50 ⁇ m such as Cu (2 O m) + N i (10 zm to 30 ⁇ m) + (P dN i) (1 jm) is formed on a synthetic resin. It is desirable to apply
  • Providing a plating metal film with a thickness of 50 m or more is expensive and uneconomical in plating treatment cost.
  • a metal metal film having a thickness of 20 m or less cannot suppress the thermal expansion of the synthetic resin.
  • a film having the following composition is used as a film obtained by the IP treatment.
  • Examples include titanium nitride, titanium carbide, titanium oxide, and a mixed film thereof.
  • the products obtained by the resin IP treatment of the present invention include, for example, Side parts (cases, watch bands, decorative rings), fishing equipment peripheral parts (parts such as reel bobbins, handles, bodies, guides for fishing rods), camera-related parts (power camera bodies), home appliance peripheral parts (body , Phone, switch, mobile phone, MD player, CD player, etc.), daily necessities, daily necessities (tableware, garbage frames), ornaments (pendants, key chains), automobiles (emblems, interior parts), housing-related It is used for other resin parts, such as products (exterior and interior decorations), office supplies (stationery, writing tools), fasteners for garments, and buttons for clothes. BRIEF DESCRIPTION OF THE FIGURES
  • FIG. 1 is a schematic diagram of an IP processing apparatus of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
  • Syndiotactic polystyrene resin (trade name: Zarek (Idemitsu Petrochemicals Co., Ltd.)
  • polyphthalamide resin (trade name: Amodel (Tijinamoco)
  • IP ion plating
  • ABS resin (trade name: Diat ABS (Mitsubishi Rayon Co., Ltd.)
  • MD represents the flow direction
  • TD represents the direction perpendicular to the flow
  • ABS resin (trade name: Diamond ABS (Mitsubishi Rayon Co., Ltd.)
  • Liquid crystal polymer resin brand name Vectra (Polyplastics Co., Ltd.)
  • First step A resin molded product is formed as a product by injection molding or the like using the resin material.
  • Second step Degas, anneal or dehydrate the obtained resin molded product to prevent the coating film from peeling off from the substrate during the metal plating and IP processing in the subsequent steps.
  • heat treatment was performed at 200 ° C. for 1 to 2 hours as a degassing treatment, an annealing treatment, or a dehydration treatment.
  • a method was used in which the temperature of the drying oven was raised to 200 ° C, and the resin molded product was left in the oven for 1 to 2 hours.
  • Third step A large number of micropores are formed by etching on the surface of the resin molded product, and a part of the underlying metal film generated by the metal plating in the subsequent process is prevented from entering the micropores and peeling off.
  • Fourth step After the etching, metal plating using Cu, Ni, Pd-Ni, or the like is performed as a conductivity imparting treatment for performing a subsequent IP treatment.
  • Fifth step The resin molded product after metal plating is put into the IP vacuum chamber and subjected to ion plating. This ion plating is performed by a known method.
  • the resin surface is degreased with a solution containing 20 g / L of sodium borate, 20 g / L of sodium phosphate, and 2 g / L of a higher fatty acid surfactant at 50 ° C for 3 to 5 minutes, and then washed with water.
  • concentrated sulfuric acid 400/1 0 0 3 400 / in 6 5 ° C of the etching 97 wt% performed 15-20 minutes, the resin surface to form a fine roughness, hydrophilicity enhances the adhesion of the plated To
  • the etching solvent is removed and neutralized with 1 Oml / L of 36 wt% concentrated hydrochloric acid and 10 ml / L of 30 wt% hydrogen peroxide at 25 ° C for 0.5 to 2 minutes.
  • polarity is imparted to the resin surface in order to improve the adsorbability of the catalyst described below.
  • treatment with a 1 Oml / L polyethyleneimine aqueous solution is performed at 50 ° C for 5 minutes, and The Pd and Sn complex compounds are adsorbed to form the catalyst nuclei necessary for the first deposition of electroless plating.
  • 2 g / L of palladium chloride as a Pd compound and 5 to 20 g / L of stannous chloride as a Sn complex compound were mixed with 100 to 200 ml / L of concentrated hydrochloric acid and subjected to a catalyst treatment at 25 ° C for 4 minutes. .
  • the solution is treated with 10 Oml of concentrated sulfuric acid at 30 to 50 ° C for 3 to 4 minutes to remove tin components, metallize the palladium component, and wash with water.
  • the outermost plating portion can be replaced with the following plating layer.
  • the procedure for forming the plating layer will be described with reference to the plating layer to be formed.
  • Potassium gold cyanide 1.23 g / L, free potassium cyanide 7.5 g / L, potassium phosphate 15 g / L at 70 ° C. 1-2 min, A at a current density of 1. OA / dm 2 u Flash the electrode to 0.5 ⁇ m.
  • Rhodium sulfate 2 g / L sulfuric acid 3 Oml / L, 50 ° C, 1-2 minutes, current density 2 A / dm 2 Flash Rh electrode 0.5 ⁇ 0.5m electrodeposit.
  • Titanium carbide and titanium nitride are applied to the resin whose surface is subjected to the metal plating treatment.
  • the procedure for forming an IP coating of a synthetic film will be described.
  • the base material to be processed was attached to the IP jig, and pre-processing and IP processing were performed as follows.
  • a degreasing treatment to remove fingerprints, oil, dust, etc. adhering to the substrate to be treated is performed by an ultrasonic bath. Incubate at 40 ° C for 3 minutes.
  • the jig with the substrate to be processed attached is set in the vacuum chamber 1 (Fig. 1) of the IP device, and a titanium block is set in the evaporation source 2 of the IP device as a vapor deposition material.
  • the chamber 11 is closed and a vacuum is drawn for several tens minutes.
  • the final pressure value varies depending on the type of the IP membrane, but is set to about l to 9 xl 0 to 5 torr.
  • titanium is applied to the processed surface of the substrate 6 to be processed, but the substrate of the substrate 6 to be processed is minus 10 to 120 V, the ionization electrode 5 is plus 20 to 40 V, 20 to 60 A, and an electron gun.
  • the reason for applying titanium here is to improve the reactivity by raising the temperature to some extent while adding titanium, because sufficient reaction cannot be obtained at room temperature even if gas is introduced from the beginning.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemically Coating (AREA)

Abstract

L'invention concerne un procédé de galvanoplastie ionique d'une résine synthétique, qui consiste à soumettre une résine synthétique moulée à une galvanoplastie après dégazage et recuisson, puis à réaliser sur la surface de la résine moulée un dépôt électrolytique ionique, afin de former un revêtement de nitrure métallique, un revêtement de carbure métallique, un revêtement d'oxyde métallique ou un revêtement constitué d'un mélange desdits composés. L'invention concerne en outre un article en résine synthétique moulée présentant un revêtement réalisé par dépôt électrolytique ionique selon le procédé de l'invention. L'article en résine synthétique moulée ainsi obtenu présente une durabilité et un état de surface suffisamment bons pour conférer à l'article un usage pratique.
PCT/JP1999/003607 1998-07-10 1999-07-02 Procede de galvanoplastie ionique d'une resine synthetique, et article en resine synthetique moulee presentant un revetement realise par galvanoplastie ionique Ceased WO2000003054A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP22991698 1998-07-10
JP10/229916 1998-07-10
JP11/57697 1999-03-04
JP11057697A JP2000080482A (ja) 1998-07-10 1999-03-04 合成樹脂のイオンプレ―ティング方法とイオンプレ―ティング被膜を有する合成樹脂成型品

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Publication Number Publication Date
WO2000003054A1 true WO2000003054A1 (fr) 2000-01-20

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PCT/JP1999/003607 Ceased WO2000003054A1 (fr) 1998-07-10 1999-07-02 Procede de galvanoplastie ionique d'une resine synthetique, et article en resine synthetique moulee presentant un revetement realise par galvanoplastie ionique

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WO (1) WO2000003054A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3458252A4 (fr) * 2016-05-17 2020-04-01 Shamir Optical Industry Ltd. Revêtements antiréfléchissants de face arrière, formulations de revêtement et procédés de revêtement de verres ophtalmiques

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JP2007270276A (ja) * 2006-03-31 2007-10-18 Shimano Inc 屋外用部品
CN105568216A (zh) * 2016-01-27 2016-05-11 太仓捷公精密金属材料有限公司 一种金属制品的表面处理工艺
KR102502033B1 (ko) * 2022-03-11 2023-02-21 주식회사 앨피스 PPS 복합소재 (Polyphenylene Sulfide Composite) 사출물의 도금방법
US20250243347A1 (en) * 2022-03-25 2025-07-31 Toyobo Co., Ltd. Styrene-based resin molded body
KR20240168314A (ko) * 2022-03-25 2024-11-29 도요보 가부시키가이샤 스티렌계 수지 성형체
JPWO2024190085A1 (fr) * 2023-03-14 2024-09-19
WO2025041555A1 (fr) * 2023-08-21 2025-02-27 Ａｇｃ株式会社 Panneau de réflexion d'ondes électromagnétiques, dispositif de réflexion d'ondes électromagnétiques correspondant, barrière de réflexion d'ondes électromagnétiques, procédé de fabrication de panneau de réflexion d'ondes électromagnétiques et procédé d'évaluation de panneau de réflexion d'ondes électromagnétiques

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JPS61167903A (ja) * 1985-01-19 1986-07-29 Olympus Optical Co Ltd 合成樹脂製光学部品のコ−テイング方法
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JPS60177177A (ja) * 1984-02-24 1985-09-11 Hitachi Condenser Co Ltd シ−ト状材の脱水装置
JPS61167903A (ja) * 1985-01-19 1986-07-29 Olympus Optical Co Ltd 合成樹脂製光学部品のコ−テイング方法
JPS62262248A (ja) * 1986-05-08 1987-11-14 Nec Corp 光磁気記録媒体の製造方法
JPH0196364A (ja) * 1987-10-07 1989-04-14 Teijin Ltd 高分子樹脂基板の水分除去方法
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EP0539260A1 (fr) * 1991-10-22 1993-04-28 Thomson-Csf Procédé pour la métallisation de la surface de pièces en matériau plastique
EP0787762A1 (fr) * 1995-07-28 1997-08-06 Idemitsu Petrochemical Co., Ltd. Articles moules et plaques et procede de preparation de ces articles

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3458252A4 (fr) * 2016-05-17 2020-04-01 Shamir Optical Industry Ltd. Revêtements antiréfléchissants de face arrière, formulations de revêtement et procédés de revêtement de verres ophtalmiques

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