[go: up one dir, main page]

WO2000062302A1 - Computer cooling device - Google Patents

Computer cooling device Download PDF

Info

Publication number
WO2000062302A1
WO2000062302A1 PCT/SE2000/000655 SE0000655W WO0062302A1 WO 2000062302 A1 WO2000062302 A1 WO 2000062302A1 SE 0000655 W SE0000655 W SE 0000655W WO 0062302 A1 WO0062302 A1 WO 0062302A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
cover
cooling
component
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SE2000/000655
Other languages
French (fr)
Inventor
Helge Fabricius-Hansen
Niklas Jonce Olsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MULTIQ PRODUCTS AB
Original Assignee
MULTIQ PRODUCTS AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MULTIQ PRODUCTS AB filed Critical MULTIQ PRODUCTS AB
Priority to AU43224/00A priority Critical patent/AU4322400A/en
Publication of WO2000062302A1 publication Critical patent/WO2000062302A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

Definitions

  • the invention relates to a computer cooling device comprising a cover having a bottom plate, an upper part, a rear side and an opposite front side covered essentially by a flat display, at least one a large amount of heat emitting component being provided within said cover.
  • the invention relates first of all to flat electronic devices with electronic components in a compact design.
  • One embodiment includes flat display units having an embedded computer.
  • An object of the invention is to provide a cooling device that operates with a good efficiency also at a low sound level. This object is achieved by an invention having the characteristic features of claim 1. Further objects and advantages with the invention are apparent from the following description, drawings and dependent claims.
  • the invention relates to a cooling device preferably for use in connec- tion with compact computers.
  • Such computers include a cover having a bottom plate, an upper part, a rear side and an opposite front side mainly covered by a flat display, at least one component emitting a high level of heat being provided within the cover.
  • At least one section of the rear side of the cover is formed as a cooling fin.
  • a first end of a heat-conducting pipe is arranged in a heat conducting contact with the component and a second end of the heat-conducting pipe is arranged in a heat conducting contact with the cooling element.
  • a heat-conducting pipe also referred to as a heat pipe, is a completely sealed tube made of a heat conducting material, such as copper or an alloy.
  • a heat conducting material such as copper or an alloy.
  • One or a plurality of apertures or channels extend axially in the tube.
  • a wick or another material or other means that is able to transport a liquid by the capillary effect also extends axially.
  • the tube is evacuated and then filled with a liquid to such a level that vapor inside is at saturation conditions and that liquid is close to condensation. The ends of the tube are sealed.
  • One of the ends of the tube is arranged in a heat conducting contact with the object that is to be cooled and cooling of some type is provided at the other end of the tube.
  • liquid will vaporize.
  • the vapor pressure and temperature potential gradient that will de- velop in the tube vapor will flow against the cooler end of the tube where the vapor is condensed into liquid.
  • the liquid is transported through the capillary effect or a corresponding way back to the hotter end of the tube where it is evaporated again.
  • the heat transfer between the ends of the tube is very rapid and efficient. As a result of the strong forces on the liquid and the vapor within the tube the tube is essentially not influenced by gravity.
  • heat is transported away from heat generating components, mainly the processor of the computer, to a cooling element and the exterior of the computer.
  • heat is not conducted to a cooling apparatus, such a fan within the computer.
  • FIG. 1 is cross sectional view of a cooling device in accordance with the invention
  • Fig. 2 is an elevation sectional view from the line ll-ll of the cooling device in Fig. 1
  • Fig. 3 is a schematic prospective view in an inclined angle from behind of an alternative embodiment of a cooling device in accordance with the invention.
  • Fig. 1 shows schematically a so called "flat panel computer", that is a computer integrated with a flat display.
  • the computer includes a plurality of electric and electronic components, many of which generating a lot of heat.
  • At least one specifically heat emitting component 10 is provided inside a cover enclosing the computer. Normally a processor circuit constitutes the most heat emitting component.
  • the cover comprises a backside 11 and a front side 12.
  • the front side 12 is essentially covered by a display 13.
  • the cover comprises also a bottom plate and an upper part, see Fig. 1.
  • the rear side 11 comprises at least one section formed by a fined cooling plate 15. In the embodiment shown said cooling plate 15 covers the complete backside but also other embodiments are possible.
  • a vertical central section of the backside can for instance be covered by or constitute a cooling plate.
  • the heat emitting component 10 is connected to the cooling plate 15 through a heat conducting tube 14 of the type described above.
  • the heat conducting tube 14 is connected through connecting sections 20 so as to accomplish a good heat transfer from the heat conducting tube 14 to the cooling plate 15 and from the component 10 to the heat conducting tube, respectively.
  • the heat conducting tube 14 can in some em- bodiments be replaced by a block or a bar made of an extremely well heat conducting material, such as aluminum.
  • circuit board 21 In the space between the display 13 and the backside of the computer a circuit board 21 is provided.
  • the circuit board 21 is provided with a plurality of electronic and electric components 22. Also these components require cooling and in accordance with one aspect of the invention such a cooling is provided by providing an air intake section 18 in the bottom plate of the cover.
  • the air intake section 18 is formed as one larger opening, but it is possible also to provide a plurality of smaller openings.
  • the air intake section 18 extends to the backside to make an air flow formed by natural draft to pass by along the cooling plate 15 and to cool this off.
  • An air outlet section 19 is provided in the upper part 17, see Fig. 2, so as to allow the natural draft to develop.
  • Fig. 2 shows schematically the inner side of the cooling plate 15 and the connection section 20 connected to the cooling plate 15.
  • the heat- conducting tube 14 to some extent is bent down towards the connection against the heat emitting component 10. In this way the return flow of liquid after condensation in the cooler end of the heat-conducting pipe 14 will be facilitated.
  • a bottom plate 16 covers the complete lower side of the computer and is provided with apertures 18 forming the air intake section 18.
  • apertures 23 are formed in an upper part 17 covering the upper side of the computer. These apertures form the air outlet section 19.
  • the air flow passing through between said air intake section 18 and said air outlet section 19 is comparatively large and will produce a good cooling effect.
  • the total area of the air intake section 18 and the air outlet section 19, respectively, also should be comparatively large.
  • Fig. 3 shows schematically one embodiment of a computer being provided with a cooling device in accordance with the invention.
  • the entire rear side 11 of the computer is covered by a cooling plate 15.
  • the upper part 17 is made from plastic or a similar material and a plurality of apertures 23 are formed therein, said apertures forming the air outlet section 19.
  • the air intake section 18 in the bottom plate 16 is indicated by dashed lines.
  • the bottom plate 16 can be formed of plastic or a similar material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Cooling device in an electric apparatus comprising a cover having a bottom plate (16), an upper part (17), a rear side (11), and an opposite front side (12) essentially covered by a flat display (13), at least one a large amount of heat emitting component (10) being provided within said cover, at least a section of said cover being formed as a cooling plate (15). A first end of said heat-conducting pipe (14) is in heat-conducting contact with said component (10), and a second end of said heat-conducting pipe (14) is in heat-conducting contact with said cooling plate (15). The invention also relates to a method for cooling an electric apparatus, wherein heat from a component (10) arranged within a cover is transported from said component (10) through a heat-conducting duct (14) to the exterior of the cover. The transport of heat is made without any addition of energy. In a computer according to the invention at least a section of a cover is formed as a cooling plate (15). A heat-conducting duct (14) is provided between said component (10) and said cooling plate (15), so as to cool off said component (10) without any contribution from a fan means.

Description

COMPUTER COOLING DEVICE
TECHNICAL ART
The invention relates to a computer cooling device comprising a cover having a bottom plate, an upper part, a rear side and an opposite front side covered essentially by a flat display, at least one a large amount of heat emitting component being provided within said cover. The invention relates first of all to flat electronic devices with electronic components in a compact design. One embodiment includes flat display units having an embedded computer.
BACKGROUND ART
Electronic devices are available in more and more compact design resulting in a cooling problem. Personal computers and similar devices are normally provided with ventilation apertures in the cover of the computer and a fan producing a desired flow of air within the cover. Modern processors working at ever increasing operating frequencies sometimes require further cooling, for instance by an arrangement with a fan directly over the processor. The processor and several other components included in a computer are normally provided on a circuit board or similar device.
In computers and other electronic devices that are in flat form there are problems related to the cooling of heat emitting electronic components. Thus, there is a demand for an improvement of the cooling performance in these types of electronic products in the first place. In the field of electronics it is normal that such components that emit large amounts of heat, such as processors and power semiconductors, are provided with finned cooling elements. In such embodiments the cooling element is in direct contact with the component which in for instance computer devices means that a fan is required so as to cool the cooling element within a cover. The fan that is required for the cooling will produce an undesired sound. Fans that are ever more silent have been developed so as to decrease the sound level. It is also more common that the fan is temperature controlled, so as to be active only when the temperature in a measured ob- ject extends over a certain value.
In some office environments and also in other connections there is an increased interest for and a demand for computers that are even more silent. At the same time the processor frequency and the data capacity increase and the size of the computers decreases making the possibilities to cool more difficult.
An object of the invention is to provide a cooling device that operates with a good efficiency also at a low sound level. This object is achieved by an invention having the characteristic features of claim 1. Further objects and advantages with the invention are apparent from the following description, drawings and dependent claims.
DISCLOSURE OF INVENTION
The invention relates to a cooling device preferably for use in connec- tion with compact computers. Such computers include a cover having a bottom plate, an upper part, a rear side and an opposite front side mainly covered by a flat display, at least one component emitting a high level of heat being provided within the cover.
According to the invention at least one section of the rear side of the cover is formed as a cooling fin. A first end of a heat-conducting pipe is arranged in a heat conducting contact with the component and a second end of the heat-conducting pipe is arranged in a heat conducting contact with the cooling element.
A heat-conducting pipe, also referred to as a heat pipe, is a completely sealed tube made of a heat conducting material, such as copper or an alloy. One or a plurality of apertures or channels extend axially in the tube. A wick or another material or other means that is able to transport a liquid by the capillary effect also extends axially. The tube is evacuated and then filled with a liquid to such a level that vapor inside is at saturation conditions and that liquid is close to condensation. The ends of the tube are sealed.
One of the ends of the tube is arranged in a heat conducting contact with the object that is to be cooled and cooling of some type is provided at the other end of the tube. In the hot end of the tube liquid will vaporize. As a result of the vapor pressure and temperature potential gradient that will de- velop in the tube vapor will flow against the cooler end of the tube where the vapor is condensed into liquid. The liquid is transported through the capillary effect or a corresponding way back to the hotter end of the tube where it is evaporated again. The heat transfer between the ends of the tube is very rapid and efficient. As a result of the strong forces on the liquid and the vapor within the tube the tube is essentially not influenced by gravity.
According to the invention heat is transported away from heat generating components, mainly the processor of the computer, to a cooling element and the exterior of the computer. Thus, heat is not conducted to a cooling apparatus, such a fan within the computer.
BRIEF DESCRIPTION OF DRAWINGS
The invention will now be described in more detail by means of embodiments, reference being made to the accompanying drawings, in which Fig. 1 is cross sectional view of a cooling device in accordance with the invention,
Fig. 2 is an elevation sectional view from the line ll-ll of the cooling device in Fig. 1 , and Fig. 3 is a schematic prospective view in an inclined angle from behind of an alternative embodiment of a cooling device in accordance with the invention.
DETAILED DESCRIPTION
Fig. 1 shows schematically a so called "flat panel computer", that is a computer integrated with a flat display. The computer includes a plurality of electric and electronic components, many of which generating a lot of heat. At least one specifically heat emitting component 10 is provided inside a cover enclosing the computer. Normally a processor circuit constitutes the most heat emitting component. The cover comprises a backside 11 and a front side 12. The front side 12 is essentially covered by a display 13. The cover comprises also a bottom plate and an upper part, see Fig. 1. The rear side 11 comprises at least one section formed by a fined cooling plate 15. In the embodiment shown said cooling plate 15 covers the complete backside but also other embodiments are possible. A vertical central section of the backside can for instance be covered by or constitute a cooling plate. The heat emitting component 10 is connected to the cooling plate 15 through a heat conducting tube 14 of the type described above.
Preferably the heat conducting tube 14 is connected through connecting sections 20 so as to accomplish a good heat transfer from the heat conducting tube 14 to the cooling plate 15 and from the component 10 to the heat conducting tube, respectively. The heat conducting tube 14 can in some em- bodiments be replaced by a block or a bar made of an extremely well heat conducting material, such as aluminum.
In the space between the display 13 and the backside of the computer a circuit board 21 is provided. In a conventional manner the circuit board 21 is provided with a plurality of electronic and electric components 22. Also these components require cooling and in accordance with one aspect of the invention such a cooling is provided by providing an air intake section 18 in the bottom plate of the cover. In the embodiment shown the air intake section 18 is formed as one larger opening, but it is possible also to provide a plurality of smaller openings.
Preferably the air intake section 18 extends to the backside to make an air flow formed by natural draft to pass by along the cooling plate 15 and to cool this off. An air outlet section 19 is provided in the upper part 17, see Fig. 2, so as to allow the natural draft to develop.
Fig. 2 shows schematically the inner side of the cooling plate 15 and the connection section 20 connected to the cooling plate 15. The heat- conducting tube 14 to some extent is bent down towards the connection against the heat emitting component 10. In this way the return flow of liquid after condensation in the cooler end of the heat-conducting pipe 14 will be facilitated.
A bottom plate 16 covers the complete lower side of the computer and is provided with apertures 18 forming the air intake section 18. In a corresponding way apertures 23 are formed in an upper part 17 covering the upper side of the computer. These apertures form the air outlet section 19. The air flow passing through between said air intake section 18 and said air outlet section 19 is comparatively large and will produce a good cooling effect. The total area of the air intake section 18 and the air outlet section 19, respectively, also should be comparatively large.
Fig. 3 shows schematically one embodiment of a computer being provided with a cooling device in accordance with the invention. The entire rear side 11 of the computer is covered by a cooling plate 15. The upper part 17 is made from plastic or a similar material and a plurality of apertures 23 are formed therein, said apertures forming the air outlet section 19. The air intake section 18 in the bottom plate 16 is indicated by dashed lines. Also the bottom plate 16 can be formed of plastic or a similar material.

Claims

1. A cooling device in an electric apparatus comprising a cover having a bottom plate (16), an upper part (17), a rear side (11) and an opposite front side (12) essentially covered by a flat display (13), at least one a great quantity of heat emitting component (10) being provided within said cover, characterized in that at least one section of the cover is formed as a cooling plate (15), that a first end of a heat-conducting pipe (14) is provided in a heat- conducting contact with said component (10), and that a second end of said heat-conducting pipe (14) is provided in a heat- conducting contact with said cooling plate (15).
2. Cooling device according to claim 1 , wherein said cooling plate (15) is provided at the rear side (11 ).
3. Cooling device according to claim 1 , wherein said bottom plate (16) is formed with at least one air intake section (18) and said upper part (17) is formed with at least one air outlet section (19) arranged vertically above said air intake section (18).
4. Cooling device according to claim 1 , wherein said cooling plate (15) is provided with vertically extending external cooling fins.
5. Cooling device according to claim 1 , wherein said air intake section (19) is formed by a plurality of apertures (23) made in the upper part (17).
6. Cooling device according to claim 1 , wherein said heat-conducting pipe (14) is connected to the cooling plate (15) at a level above the connection of the heat-conducting pipe (14) to the component (10).
7. Cooling device according to claim 1 , wherein said cooling plate (15) is made of aluminum.
8. A computer comprising a cover having a bottom plate (16), an upper part (17), a rear side (11) and an opposite front side (12) essentially covered by a flat display (13), at least one a large amount of heat emitting component (10) being provided within said cover, characterized in that at least a section of said cover being formed as a cooling plate (15), and that a heat-conducting duct (14) is provided between said component (10) and said cooling plate (15), so as to cool said component (10) without contribution of any fan means.
9. A method for the cooling of an electric apparatus, characterized by transporting heat from a heat emitting component (10) arranged within a cover from said component (10) through a heat-conducting duct (14) to the exterior of said cover and by transporting said heat without an additional supply of energy.
10. A method according to claim 9, wherein the heat is transported without a contribution of a fan means.
PCT/SE2000/000655 1999-04-13 2000-04-06 Computer cooling device Ceased WO2000062302A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU43224/00A AU4322400A (en) 1999-04-13 2000-04-06 Computer cooling device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9901319A SE9901319D0 (en) 1999-04-13 1999-04-13 Cooling device at computer
SE9901319-5 1999-04-13

Publications (1)

Publication Number Publication Date
WO2000062302A1 true WO2000062302A1 (en) 2000-10-19

Family

ID=20415202

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2000/000655 Ceased WO2000062302A1 (en) 1999-04-13 2000-04-06 Computer cooling device

Country Status (3)

Country Link
AU (1) AU4322400A (en)
SE (1) SE9901319D0 (en)
WO (1) WO2000062302A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7042724B2 (en) 2002-11-22 2006-05-09 Contec Steuerungstechnik Und Automation Gesellschaft M.B.H. Cooled computer casing display frame
EP1962570A1 (en) * 2007-02-26 2008-08-27 Siemens Aktiengesellschaft Electrical device and cooling method for an electrical device
DE102014017914A1 (en) * 2014-12-04 2016-06-09 Audi Ag Instrument cluster for a motor vehicle and motor vehicle
CN111708415A (en) * 2020-05-29 2020-09-25 苏州浪潮智能科技有限公司 A method, system, equipment and medium for adjusting the air inlet diameter to reduce noise

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5781409A (en) * 1996-12-19 1998-07-14 Compaq Computer Corporation Heat dissipating lid hinge structure with laterally offset heat pipe end portions
US5875095A (en) * 1996-03-01 1999-02-23 Compaq Computer Corporation Computer having a heat sink structure incorporated therein

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5875095A (en) * 1996-03-01 1999-02-23 Compaq Computer Corporation Computer having a heat sink structure incorporated therein
US5781409A (en) * 1996-12-19 1998-07-14 Compaq Computer Corporation Heat dissipating lid hinge structure with laterally offset heat pipe end portions

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7042724B2 (en) 2002-11-22 2006-05-09 Contec Steuerungstechnik Und Automation Gesellschaft M.B.H. Cooled computer casing display frame
EP1962570A1 (en) * 2007-02-26 2008-08-27 Siemens Aktiengesellschaft Electrical device and cooling method for an electrical device
DE102014017914A1 (en) * 2014-12-04 2016-06-09 Audi Ag Instrument cluster for a motor vehicle and motor vehicle
DE102014017914B4 (en) * 2014-12-04 2021-06-24 Audi Ag Combination instrument for a motor vehicle and motor vehicle
CN111708415A (en) * 2020-05-29 2020-09-25 苏州浪潮智能科技有限公司 A method, system, equipment and medium for adjusting the air inlet diameter to reduce noise

Also Published As

Publication number Publication date
AU4322400A (en) 2000-11-14
SE9901319D0 (en) 1999-04-13

Similar Documents

Publication Publication Date Title
US6459576B1 (en) Fan based heat exchanger
US6288895B1 (en) Apparatus for cooling electronic components within a computer system enclosure
US5828549A (en) Combination heat sink and air duct for cooling processors with a series air flow
US7770630B2 (en) Modular capillary pumped loop cooling system
US6717811B2 (en) Heat dissipating apparatus for interface cards
EP1383170B1 (en) Thermosiphon for electronics cooling with nonuniform airflow
US6394175B1 (en) Top mounted cooling device using heat pipes
US5339214A (en) Multiple-fan microprocessor cooling through a finned heat pipe
US6377459B1 (en) Chip cooling management
JP2004116864A (en) Electronic equipment with cooling mechanism
US20090185349A1 (en) Electronic apparatus
CN101442894A (en) Electronic apparatus
JP6269478B2 (en) Electronic substrate cooling structure and electronic device using the same
US20100032141A1 (en) cooling system utilizing carbon nanotubes for cooling of electrical systems
JP2009192728A (en) Display device
WO2000062302A1 (en) Computer cooling device
JP2003188327A (en) Heat dissipation module
JPH118485A (en) Cooling structure of electronic equipment
JP4422390B2 (en) Electronic device cooling device
US20070097646A1 (en) Heat dissipating apparatus for computer add-on cards
JP2002271073A (en) Cooling device for electronic equipment housing
KR102232902B1 (en) Electronic equipment device having cooling module and electronic equipment device assembly
JP3487374B2 (en) Boiling cooling device
JP2001060788A (en) Flat type good heat transfer type heat sink
US20220330414A1 (en) Heat sinks with beyond-board fins

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP