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WO2000059644A1 - Systeme et procede de preparation de plaques a commande modulaire - Google Patents

Systeme et procede de preparation de plaques a commande modulaire Download PDF

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Publication number
WO2000059644A1
WO2000059644A1 PCT/US2000/008616 US0008616W WO0059644A1 WO 2000059644 A1 WO2000059644 A1 WO 2000059644A1 US 0008616 W US0008616 W US 0008616W WO 0059644 A1 WO0059644 A1 WO 0059644A1
Authority
WO
WIPO (PCT)
Prior art keywords
platen
lapping surface
lapping
tool
texturizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2000/008616
Other languages
English (en)
Inventor
Stephen Griffin
David Diaz
Douglas Seitz
Robert Passeri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Engis Corp
Original Assignee
Engis Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engis Corp filed Critical Engis Corp
Priority to AU40584/00A priority Critical patent/AU4058400A/en
Priority to KR1020017012561A priority patent/KR20020000158A/ko
Priority to HK02107476.6A priority patent/HK1046252B/zh
Priority to JP2000609196A priority patent/JP3706306B2/ja
Publication of WO2000059644A1 publication Critical patent/WO2000059644A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/08—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels controlled by information means, e.g. patterns, templets, punched tapes or the like

Definitions

  • the present invention relates to platen preparation systems and, more particularly, to a system for texturizing and charging a platen that includes the ability to accurately control various system parameters.
  • Lapping machines are commonly used to perform lapping operations on various work materials such as semiconductor wafers, magnetic disk substrates, magnetic head units, etc. Such lapping machines utilize a lapping plate that performs grinding and/or polishing operations on the work material.
  • Current trends for miniaturization and increased capacity of hard disk drives has resulted in the need for materials having a high degree of planarity, while maintaining close tolerances. Consequently, lapping plates used to grind and polish such materials must be constructed with a high degree of precision.
  • Lapping plates are typically constructed such that one, or both, surfaces contain predetermined concentrations of abrasive materials.
  • the lapping plate is sometimes used in conjunction with a slurry containing abrasive material during the grinding, or lapping, operations. Over time, the abrasive contained in the lapping plate becomes worn, and reduces the effectiveness of the lapping plate. Accordingly, the material and design of the lapping plate are important for improving its useful life, and reducing manufacturing costs.
  • the abrasive surface of lapping plates is often formed by embedding diamond particles into the lapping plate in a process known as charging.
  • Diamond particles tend to provide superior resistance to wear due to their hardness properties.
  • the procedure for embedding diamond particles into lapping plates ranges from hand charging with a tool to charging on a lapping machine with various tools.
  • metal bonded diamond plated conditioning rings have been used to texturize lapping plates.
  • the conditioning ring typically consists of a metallic ring having one face coated with a monolayer of diamond that is held in place by an electroplated nickel deposit.
  • U.S. Patent 5,107,626 issued to Mucci describes a method of providing a patterned surface on a substrate using an abrasive article having a specified pattern.
  • the abrasive article includes a backing having at least one abrasive composite bonded thereto.
  • the abrasive composite is in the form of abrasive grains dispersed in a binder and are disposed in a predetermined array consisting of a plurality of peaks and valleys.
  • U.S. Patents 4,866,886 and 4,821 ,461 issued to Holmstrand both describe a lapping plate that is selectively textured for improved useful life and greater abrading consistency. Glass beads are serially propelled onto a lapping surface of the lapping plate to form spherical cavities of uniform size and distribution, as well as a desired density. The cavities provide discontinuity in the lapping surface which substantially prevents hydroplaning. The cavities also receive loose abrading grit, workpiece fragments, and other contaminants that result in more smoothly machined workpiece surfaces.
  • An advantage of the present invention is a platen preparation system that is specifically designed to prepare a platen for performing lapping operations.
  • a system for preparing a platen for lapping operations includes a monitor that monitors various operational parameters in order to maintain substantially constant conditions while performing selected operations.
  • an apparatus for preparing platens for lapping operations comprises: a base, a platter, a main drive motor, at least one pressure arm, an actuator coupled to each pressure arm, and a monitor.
  • the platter is rotatably mounted on the base and designed to receive the platen thereon.
  • the main drive motor is attached to the base and operatively coupled to the platter so that the platter, and platen disposed thereon, can be rotated.
  • the pressure arms are disposed on the base and include a tool receiving portion that can be positioned in alignment with the lapping surface of the platen. A tool is attached to each tool receiving portion so that predetermined operations can be performed on the lapping surface of the platen.
  • the actuators place the pressure arms in contact with the lapping surface of the platen at prescribed pressure levels to perform various operations.
  • the monitor monitors predetermined criteria to maintain substantially constant conditions. According to such a system, a high quality lapping plate can be prepared using a single device. Further, by monitoring certain criteria to maintain constant conditions, lapping plates can be prepared with repeated consistency and quality.
  • a method of using a platen preparation apparatus to prepare a platen for lapping operations comprises the steps: abrasively finishing a lapping surface of the platen; micro-texturizing the lapping surface of the platen; charging the lapping surface of the platen with diamond particles to form a charged lapping surface; monitoring the step of charging in real-time to maintain substantially constant conditions on the platen; and polishing the charged lapping surface to uniformly expose the diamond particles.
  • FIG. 1 is an illustration of a platen preparation system constructed in accordance with the present invention
  • Figure 2 is a top plan view of the platen preparation system
  • Figure 3 is a cutaway of Figure 2 illustrating internal components
  • Figure 4 is front elevational view of the platen preparation system
  • Figure 5 is a block diagram illustrating the monitor and its operation
  • Figure 6 is a process chart illustrating the steps performed in preparing a platen for performing lapping operations.
  • Figure 7 is an illustration of a modular controlled platen preparation system constructed in accordance with the present invention.
  • the platen preparation system 100 includes a base 110 constructed of rigid or high strength materials. As illustrated in Figure 1 , the base 110 can be mounted on stands, or appropriate support members. A platter 112 is rotatably mounted on the base 110. The platter 112 is designed to receive a platen 114 that will be prepared for performing lapping operations. More particularly, the platen 114 includes one or more lapping surfaces 116 (only one shown) that will be used to perform the actual lapping operations.
  • a main drive motor 118 is attached to the base 110, as shown in Figure 4, and provides the force necessary to rotate the platter 112 during operation of the platen preparation system 100.
  • a spindle assembly 120 is coupled to the main drive motor 118 in order to rotate the platter 112.
  • the spindle assembly 120 includes a first spindle 122 that is attached to the main drive motor 118.
  • a second spindle 124 is connected to the platter 112.
  • a connector 126 such as a closed loop belt is used to transfer rotational motion from the first spindle 122 to the second spindle 124, thereby rotating the platter 112.
  • the platen preparation system 100 includes a pair of pressure arms 128 disposed on the base 110. Although only two pressure arms 128 are illustrated in the Figures, it should be appreciated that various other configurations are possible. For example, only one pressure arm 128 may be provided, or more than two pressure arms 128 can be provided.
  • Each pressure arm 128 includes a tool receiving portion 130.
  • a tool 132 is attached to each tool receiving portion 130 for performing operations on the lapping surface 116 of the platen 114.
  • Each tool receiving portion 130 is rotatably mounted to its respective pressure arm 128.
  • Each pressure arm 128 further includes a spindle motor 134 that controls rotation of the tool receiving portion 130.
  • the tool receiving portion 130 can be configured with a quick change arrangement that easily accepts a variety of texturizing and charging tools.
  • the pressure arms 128 are used (in conjunction with the tools 132) to perform texturizing and charging operations on the platen 114 in preparation for lapping operations.
  • an actuator 136 is coupled to each pressure arm 128.
  • the actuators 136 function to place the tools 132 in contact with the lapping surface 116 of the platen 114. More particularly, the actuators 136 are capable of placing the pressure arms 128 in various operating positions. As shown in Figure 2, the tool receiving portion 130 can be placed in a first position wherein the tool 132 is in contact with the lapping surface 116 of the platen 114. A second position is also shown wherein the tool 132 has been raised and placed out of alignment with the platen 114. It should be appreciated that the actuators 136 are also capable of placing the tools 132 in any intermediate positions between the two positions illustrated in Figure 2. By virtue of its mode of operation, the actuators 136 are controllable for placing the tools 132 in contact with the lapping surface 116 of the platen 114 at prescribed pressure levels. As will be discussed in greater detail below, such an ability provides improved results during certain operations.
  • the platen preparation system 100 includes a slurry dispensing unit 138 mounted on the base 110.
  • the slurry dispensing unit 138 is used for dispensing controlled quantities of slurry onto the lapping surface 116 of the platen 114.
  • the slurry dispensed on the platen 114 is in the form of a fluid containing predetermined concentrations of abrasive particles.
  • the slurry dispensing unit 138 of the present invention can be configured to dispense the slurry in various manners depending on the specific operation being performed.
  • the slurry dispensing unit 138 can be configured to dispense the slurry in a drip fashion onto the lapping surface 116.
  • the slurry can be dispensed in the form of a spray.
  • a spray Such a feature has an advantage of uniformly distributing slurry onto the platen 114 in situations where dripping would cause the slurry to flow off the lapping surface 116.
  • the slurry dispensing unit 138 can be further controlled to either dispense or not dispense slurry for predetermined intervals of time depending on the specific requirements of the operation being performed.
  • the platen preparation system 100 also includes a monitor 140 (see Figure 5) that continually monitors and controls various functions in order to maintain substantially constant conditions during operations on the platen 114.
  • the monitor 140 includes a plurality of sensors 142 coupled to various components of the platen preparation system 100. Referring to Figures 1-5, sensors 142 are coupled to the main drive motor 118, pressure arms 128, actuators 136, and slurry dispensing unit 138.
  • the sensors 142 monitor and control a variety of functions including, but not limited to: the amount of torque generated by the main drive motor 118, rotational velocity of the platter 112, amount of slurry being dispensed, rotational velocity and torque of the spindle motors 134, and amount of pressure generated by the pressure arms 128 on the lapping surface 116. It should be appreciated that additional sensors 142 can be provided to monitor different parameters of the platen preparation system 100.
  • the monitor 140 also includes a control unit 144 that receives and analyzes data collected by the sensors 142.
  • the control unit 144 outputs one or more control signals to control the main drive motor 118, the spindle motors 134, the actuators 136, and the slurry dispensing unit 138.
  • the control unit 144 can include, for example, a processing unit that allows analysis of the data based on preprogrammed conditions in the form of information stored in a data storage portion (not shown). As suggested by the dashed lines shown in Figure 5, the control signals from the control unit 144 can be routed through different paths depending on the type of sensors 142 used and the manner in which the sensors 142 are connected to individual components.
  • the control unit 144 will output the one or more control signals directly to the individual components.
  • the control unit 144 can output the control signals either to the sensors 142 or directly to the individual components.
  • a computer system 146 can be coupled either directly to the sensors 142 or to the control unit 144.
  • the computer system 146 receives and analyzes data in order to control operational parameters of the platen preparation system 100.
  • the computer system 146 can also store data for analysis at a later point in time.
  • the computer system 146 can be used to store data for later analysis, or it can be used in conjunction with the control unit 144 to control operational parameters of the platen preparation system 100.
  • the monitor 140 operates in a feedback manner. In other words, information is received from the sensors 142 in real-time, and control signals are output responsive to the information received.
  • FIG. 6 a process chart is shown for illustrating the steps performed in preparing a platen 114 for lapping operations, according to an exemplary embodiment of the present invention. While not specifically illustrated, it should be appreciated that the platen 114 must be machined in a pre-step to obtain a desired surface geometry for the lapping surface 116.
  • the pre-step can be performed using the disclosed platen preparation system 110, or it can be performed using specialized machinery. Regardless of how the lapping surface 116 is prepared in the pre-step, the platen 114 must be subsequently placed on the platter 112 for processing.
  • the lapping surface 116 is abrasively finished using one of the pressure arms 128.
  • the abrasive finishing step (S610) corresponds to a conditioning/macro texturizing that removes surface damage and deformation resulting from the pre-step of machining the lapping surface 116.
  • Step S610 utilizes a diamond composite tool to reduce surface area deformation of the lapping surface 116.
  • the diamond composite tool can contain diamond particles having an average size of approximately 3-6 microns. Such tools are manufactured by, and can be easily obtained from, the assignee of the present invention (ENGIS Corporation). Additionally, specialized lubricants can be used depending on the type of tool 132 being used, the material from which the platen 114 is constructed, or both.
  • the abrasive finishing can be performed in two steps, namely a first and second texturizing step.
  • the first texturizing step utilizes a diamond composite tool containing diamond particles having an average size of approximately 6 microns.
  • the second texturizing step is performed using a diamond composite tool containing diamond particles having an average size of approximately 3 microns.
  • the second texturizing step can be performed using a diamond composite tool containing diamond particles having an average size of approximately 1 micron.
  • a third texturizing step can be performed using the 1 micron diamond composite tool. In operation, each tool is allowed to run for a predetermined amount of time.
  • step S610 if step S610 is performed in a single step, then the tool can be allowed to run for approximately 5-15 minutes. If step S610 is performed in multiple steps, then each tool is allowed to run for approximately five minutes and then replaced with the next tool of a finer diamond size: 4 micron, 3 micron, or 1 micron. Between each tool exchange, the lapping surface 116 is lightly cleaned to remove residue and prevent damaging surface integrity. A lubricant and/or slurry can be dispensed during step S610. The dosing of a lubricant during the texturizing stage is critical and should be monitored to achieve the best results. If too much lubricant is used the tool 132 will hydroplane, and will not cut efficiently.
  • the tool 132 will introduce more deformation to the lapping surface 116.
  • the monitor 140 is used to control the amount and manner in which the lubricant is dispensed.
  • the slurry dispensing unit 138 can be used to dispense the lubricant under the control of the monitor 140.
  • an OS type IV lubricant (obtainable from ENGIS Corporation) is used.
  • Other types of lubricants such as L6364-1V (also obtainable from ENGIS Corporation), can also be used at different dosages. The optimum dosing level is specific for a given lubricant, and must be specifically determined.
  • the lapping surface 116 is micro-texturized.
  • Step S612 creates, in a controlled manner, cavities and raised land areas of generally uniform size, distribution, and density on the lapping surface 116. This can be achieved in several ways.
  • a diamond composite tool containing diamond particles having an average size ranging from approximately 0.1 micron to 1 micron can be used in conjunction with appropriate lubricants. Additionally, slurry can be dispensed on the lapping surface 116.
  • a composite tool can be used in conjunction with a high quality abrasive slurry containing diamond particles having an average size ranging from approximately 0.1 micron to 1 micron. Such slurries can be obtained from the ENGIS Corporation.
  • the lapping surface 116 is charged with diamond particles to form a charged lapping surface.
  • Charging can be defined as the process of embedding a free abrasive (i.e., the diamond particles) suspended in a liquid into the lapping surface 116.
  • Step S614 is performed using a composite diamond tool in combination with a diamond abrasive charging slurry. Specifically, the pressure arms 128 exert pressure on the platen 114 and embed the diamond particles contained in the slurry into the lapping surface 116.
  • Step S614 is preferably performed under constant conditions. Accordingly, rotational velocity of the charging tool, pressure, and slurry concentration must be accurately controlled. It should be appreciated that performance of step S614 need not be limited to the use of a composite diamond tool. Various other tools, such as a ceramic conditioning ring, that are commonly used in texturizing operations can be used in place of the composite diamond tool.
  • Step S616 monitors various parameters during the charging step (S614) in order to maintain substantially constant conditions on the platen.
  • the monitor 140 monitors and controls these parameter and, as suggested by Figure 6, performs step S616 substantially simultaneously with step S614. More particularly, the control unit 144 collects data representative of parameters such as the rotational velocity of the tool 132 and platter 112, and pressure and slurry concentration on the lapping surface 116 using the sensors 142. The data is analyzed in real-time and control signals are output to the sensors 142 to control their respective components and maintain substantially constant rotational velocity and pressure on the platen 114.
  • step S614 is performed for approximately 15 minutes and utilizes the free abrasive slurry as the only source of diamond particles for charging the lapping surface 116. Further, it is not necessary to provide any additional lubricant beyond that contained in the slurry.
  • the rotational speed of the tool is preferably maintained at a slow speed of, for example, about 30 RPM, to allow the diamond particles to become fully embedded within the lapping surface 116. It should be noted, however, that other values may be selected for the rotational velocity based on other real-time conditions such as the pressure exerted by the pressure arms 128.
  • the lapping surface 116 is polished to uniformly expose the diamond particles that were embedded during the step S614. Specifically, a fine abrasive is used to remove deformation resulting from charging, and fully expose the diamond abrasive for subsequent lapping operations.
  • Step S618 is performed in two parts using a chemical mechanical polishing (CMP) process in combination with a special chemical solution.
  • the chemical solution preferably has a high pH concentration.
  • the chemical solution is dispensed on the lapping surface 116 in a drip fashion.
  • the first part of the polishing step (S618) is performed using a perforated polishing pad (not shown) attached to the tool receiving portion 130 in a first CMP process.
  • a second CMP process is performed using a low nap cloth attached to the tool receiving portion 130.
  • the chemical solution is preferably selected to be product number MECH CHEM 6391-1 , which can be obtained from the ENGIS Corporation. Further, the chemical solution is applied at a rate of about 1.33 oz. per minute. In operation, each CMP process (i.e., using the perforated polishing pad and the nap cloth) is preferably performed for about five minutes.
  • the lapping surface 116 is then immediately cleaned, at step S620, to prevent formation of insoluble oxides or glassy phases that commonly form during the drying of the closing silicon. At this point, the platen 114 is ready to perform lapping operations.
  • the platen preparation system of the present invention can be configured to automatically prepare one or more platens for performing lapping operations.
  • Figure 7, illustrates a modular controlled platen preparation system 200 constructed in accordance with an embodiment of the present invention.
  • the modular platen preparation system 200 includes a storage unit 210, a plurality of platen preparation apparatus 220A - 220E (collectively 220), and an automatic loader 230.
  • the modular platen preparation system 200 illustrated in Figure 7 is designed to automatically prepare multiple platens for lapping operations.
  • the storage unit 210 is configured for storing one or more platens 114 that will be prepared for lapping operations.
  • Each platen preparation apparatus 220 is constructed similar to the platen preparation system 100 described with respect to Figures 1 - 6. However, each of the platen preparation apparatus 220 is equipped with only one specific tool, and restricted to performing a dedicated operation such as, for example, texturizing, charging, etc.
  • the modular platen preparation system 200 includes five platen preparation apparatus 220.
  • Apparatus 220A is configured for machining the lapping surface of the platen 114. This corresponds to the pre-step previously described.
  • Apparatus 220B is configured for texturizing the lapping surface of the platen. This can, under certain embodiments, include both abrasive finishing and micro-texturizing.
  • one platen apparatus 220 can be provided to abrasively finish the platen 114, while another platen preparation apparatus 220 can be provided to micro-texturize the platen 114.
  • Apparatus 220C - 220E are configured for charging the lapping surface of the platen 114.
  • three platen preparation apparatus 220C - 220E are not necessary for charging the lapping surface of the platen 114. Depending on the specific implementation of the invention, only one platen preparation apparatus 220 may be provided to charge the lapping surface platen 114.
  • the automatic loader 230 is operatively coupled to the storage unit 210 and the plurality of platen preparation apparatus 220. According to the disclosed embodiment of the invention, the automatic loader 230 physically moves the platens 114 from the storage unit 210 to each platen preparation apparatus 220, and back to the storage unit 210. More particularly, the storage unit 210 initially stores all of the platens 114 that will be prepared. During normal operations, the automatic loader 230 moves a first platen from the storage unit 210 onto the first platen preparation apparatus 220A for machining. Next, the automatic loader 230 moves the first platen from the first platen preparation apparatus 220A onto the second platen preparation apparatus 220B for texturizing.
  • the modular platen preparation system 200 is optimized by simultaneously operating each of the platen preparation apparatus 220.
  • the automatic loader 230 retrieves a subsequent platen for placement on the first platen preparation apparatus 220A.
  • the remaining platens are also moved to subsequent platen preparation apparatus 220.
  • the first platen preparation apparatus 220A becomes available, and an additional platen can be retrieved from the storage unit by the automatic loader 230 and placed on the first platen preparation apparatus 220A.
  • the modular platen preparation system 200 includes the ability to track the number of platens initially stored in the storage unit 210, as well as the number of platens that have been returned to the storage unit 210. Such an ability advantageously prevents the platens that have been returned to the storage unit 210 from being moved back to the first platen preparation apparatus and unnecessarily operated on. Such an ability also eliminates the requirement of having to manually input the number of platens stored in the storage unit 210 for tracking purposes.
  • the platen preparation system of the present invention automates the process of embedding diamond particles, (including sub micron particles) in a controlled manner that will produce repeatable and consistent lapping performance characteristics, but can also be controlled to be stopped at any step or stage for preparing a consistent quality controlled macro/micro texture or surface roughness on a lapping surface of the platen.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)

Abstract

La présente invention concerne un système et un procédé de préparation de plaques (114) permettant de mener des opérations de rodage. Le système comporte un plateau (120) est monté rotatif sur une base, et conçu pour recevoir sur sa surface la plaque. Un moteur d'entraînement principal (118) assure la rotation du plateau (120) et des plaques qui y sont déposées. Plusieurs bras applicateurs (128) disposés sur la base (110) sont configurés de façon à comporter un élément porte-outil pouvant se placer dans l'alignement d'une surface de rodage (116) de la plaque (114). Un outil (132) est monté sur chacun des éléments porte-outil de façon à pouvoir mener des opérations sur la surface de rodage de la plaque. Un écran de contrôle (138) permet de surveiller des paramètres définis, et de conserver des conditions sensiblement constantes pendant la préparation de la plaque.
PCT/US2000/008616 1999-04-02 2000-03-31 Systeme et procede de preparation de plaques a commande modulaire Ceased WO2000059644A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU40584/00A AU4058400A (en) 1999-04-02 2000-03-31 Modular controlled platen preparation system and method
KR1020017012561A KR20020000158A (ko) 1999-04-02 2000-03-31 모듈 제어 플래튼 준비 시스템 및 그 방법
HK02107476.6A HK1046252B (zh) 1999-04-02 2000-03-31 组合式可控工作台预制系统和方法
JP2000609196A JP3706306B2 (ja) 1999-04-02 2000-03-31 モジュール制御プラテン製作システム及び方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12747699P 1999-04-02 1999-04-02
US60/127,476 1999-04-02

Publications (1)

Publication Number Publication Date
WO2000059644A1 true WO2000059644A1 (fr) 2000-10-12

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PCT/US2000/008616 Ceased WO2000059644A1 (fr) 1999-04-02 2000-03-31 Systeme et procede de preparation de plaques a commande modulaire

Country Status (6)

Country Link
JP (1) JP3706306B2 (fr)
KR (1) KR20020000158A (fr)
CN (1) CN1313216C (fr)
AU (1) AU4058400A (fr)
HK (1) HK1046252B (fr)
WO (1) WO2000059644A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009129765A3 (fr) * 2008-02-15 2009-12-17 Gunter Effgen Gmbh Procédé et dispositif pour l'usinage de surface de matériaux extrêmement durs

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120289131A1 (en) * 2011-05-13 2012-11-15 Li-Chung Liu Cmp apparatus and method
JP5764031B2 (ja) * 2011-10-06 2015-08-12 株式会社ディスコ 切削装置
CN103481174B (zh) * 2013-09-03 2015-09-23 宇环数控机床股份有限公司 一种多边形或曲面工件的抛光方法
JP6192525B2 (ja) * 2013-12-13 2017-09-06 株式会社ディスコ 砥材埋め込み方法
KR102257002B1 (ko) * 2019-09-27 2021-05-27 (주)에스티아이 연마 압력 제어 기능을 구비한 cmp 장치
KR102260655B1 (ko) * 2019-09-27 2021-06-04 (주)에스티아이 연마율 제어 기능을 구비한 cmp 장치
CN112658981B (zh) * 2020-12-28 2022-11-25 郑州铁路职业技术学院 一种零部件表面处理用化学抛光机

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JP3706306B2 (ja) 2005-10-12
KR20020000158A (ko) 2002-01-04
JP2002540955A (ja) 2002-12-03
CN1346300A (zh) 2002-04-24
HK1046252A1 (en) 2003-01-03
HK1046252B (zh) 2007-10-05
CN1313216C (zh) 2007-05-02

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