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WO1999033119A3 - Power semiconductor devices - Google Patents

Power semiconductor devices Download PDF

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Publication number
WO1999033119A3
WO1999033119A3 PCT/IB1998/002027 IB9802027W WO9933119A3 WO 1999033119 A3 WO1999033119 A3 WO 1999033119A3 IB 9802027 W IB9802027 W IB 9802027W WO 9933119 A3 WO9933119 A3 WO 9933119A3
Authority
WO
WIPO (PCT)
Prior art keywords
insulating layer
gate electrode
cells
gate
elongate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB1998/002027
Other languages
French (fr)
Other versions
WO1999033119A2 (en
Inventor
John Roger Cutter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Philips AB
Philips Svenska AB
Original Assignee
Koninklijke Philips Electronics NV
Philips AB
Philips Svenska AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Philips AB, Philips Svenska AB filed Critical Koninklijke Philips Electronics NV
Priority to EP98957086A priority Critical patent/EP0970526A2/en
Priority to JP53353299A priority patent/JP2001512629A/en
Publication of WO1999033119A2 publication Critical patent/WO1999033119A2/en
Publication of WO1999033119A3 publication Critical patent/WO1999033119A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
    • H10D12/035—Etching a recess in the emitter region 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H10D12/441—Vertical IGBTs
    • H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393—Body regions of DMOS transistors or IGBTs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
    • H10D64/2527—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/514—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
    • H10D64/516—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers the thicknesses being non-uniform
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/519—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts

Landscapes

  • Thin Film Transistor (AREA)
  • Thyristors (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

A power semiconductor device comprises a multiple-cellular insulated-gate field-effect transistor structure with each cell (100) present at a corresponding opening (110) in a mesh-shaped gate electrode (11). The cells (100) and the openings (110) are of elongate shape having longitudinal sides (X) at which the channel areas (1) are present under a gate insulating layer (12) under longitudinal parts (11x) of the gate electrode (11). The channel areas (1) are absent at ends (Z) of the elongate cells (100). Preferably, the longitudinal parts (11x) of the gate electrode (11) are interconnected beyond the ends (Z) of the elongate cells (100) by interconnection parts (11z) of the gate electrode (11) which are located on a thicker insulating layer (13) than the gate insulating layer (12). This thicker insulating layer (13) is present at least between facing ends (Z) of neigbouring elongate cells (100) where the channel areas (11) are absent.
PCT/IB1998/002027 1997-12-19 1998-12-14 Power semiconductor devices Ceased WO1999033119A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP98957086A EP0970526A2 (en) 1997-12-19 1998-12-14 Power semiconductor devices
JP53353299A JP2001512629A (en) 1997-12-19 1998-12-14 Power semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9726829.6 1997-12-19
GBGB9726829.6A GB9726829D0 (en) 1997-12-19 1997-12-19 Power semiconductor devices

Publications (2)

Publication Number Publication Date
WO1999033119A2 WO1999033119A2 (en) 1999-07-01
WO1999033119A3 true WO1999033119A3 (en) 1999-08-26

Family

ID=10823875

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1998/002027 Ceased WO1999033119A2 (en) 1997-12-19 1998-12-14 Power semiconductor devices

Country Status (4)

Country Link
EP (1) EP0970526A2 (en)
JP (1) JP2001512629A (en)
GB (1) GB9726829D0 (en)
WO (1) WO1999033119A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4198302B2 (en) * 2000-06-07 2008-12-17 三菱電機株式会社 Semiconductor device
EP1450411A1 (en) * 2003-02-21 2004-08-25 STMicroelectronics S.r.l. MOS power device with high integration density and manufacturing process thereof
ITMI20042244A1 (en) 2004-11-19 2005-02-19 St Microelectronics Srl MOS POWER ELECTRONIC DEVICE AND RELATED REALIZATION METHOD
US7875936B2 (en) 2004-11-19 2011-01-25 Stmicroelectronics, S.R.L. Power MOS electronic device and corresponding realizing method
ITMI20042243A1 (en) 2004-11-19 2005-02-19 St Microelectronics Srl PROCESS FOR THE REALIZATION OF A HIGH DENSITY MOS INTENSION POWER DEVICE

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0665595A1 (en) * 1994-01-07 1995-08-02 Fuji Electric Co. Ltd. MOS type semiconductor device
EP0717449A2 (en) * 1994-11-21 1996-06-19 Fuji Electric Co. Ltd. Cell structure of a MOS type semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0665595A1 (en) * 1994-01-07 1995-08-02 Fuji Electric Co. Ltd. MOS type semiconductor device
EP0749163A2 (en) * 1994-01-07 1996-12-18 Fuji Electric Co. Ltd. MOS type semiconductor device
EP0717449A2 (en) * 1994-11-21 1996-06-19 Fuji Electric Co. Ltd. Cell structure of a MOS type semiconductor device

Also Published As

Publication number Publication date
JP2001512629A (en) 2001-08-21
GB9726829D0 (en) 1998-02-18
EP0970526A2 (en) 2000-01-12
WO1999033119A2 (en) 1999-07-01

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