WO1999016112A1 - Aligner, scanning aligner and scanning exposure method - Google Patents

Abstract

A mask stage (16) and a wafer stage (14) are supported above a base member (12), and consequently both the stages (16 and 14) can be driven by a linear motor (13) in scanning directions opposite to each other in a non-contact manner. At that time, the movements of both the stages do not exert any force to the base member (12) and other parts and the momentum is conserved. Since the mass ratio of the stage (16) to the stage (14) is equal to the reduction ratio of a projection optical system (not shown), the speed ratio of the stage (16) to the stage (14) is equal to the reciprocal of the reduction factor of the projection optical system, in accordance with the momentum conservation law, so that synchronism between both the stages (16 and 14) is accurately controlled. The inclination and sway of the whole aligner can be suppressed and, further, the synchronous performance of the mask stage and the wafer stage can be improved.

Description

 Description Exposure apparatus, scanning exposure apparatus and scanning exposure method

 The present invention relates to an exposure apparatus and an exposure method, and more particularly, to a method in which a mask held on a mask stage and a photosensitive substrate held on a substrate stage are scanned synchronously using illumination light to form a mask. The present invention relates to an exposure apparatus for transferring a pattern such as a formed semiconductor circuit pattern or a liquid crystal circuit pattern onto a photosensitive substrate via a projection optical system, and particularly to a scanning exposure apparatus and a scanning exposure method. Background art

In recent years, a scanning type exposure apparatus of the scan type (hereinafter referred to as “S & S type” as appropriate) has been developed to realize a resolution line width of 0 or less as an exposure apparatus for manufacturing semiconductor devices. Aggressive improvements are being made toward full-scale commercialization on semiconductor manufacturing lines. Such an S & S type exposure apparatus is described, for example, in (1) Japanese Patent Application Laid-Open No. 56-111, and (2) SPIE Vol 1088 Optical / Laser Microelectronics 11 (1989), No. 42. Pages 4 to 43, ③ Japanese Patent Application Laid-Open No. 2-229394, ④ Japanese Patent Application Laid-Open No. 4-27776 ^ ^ and the like. Among them, in the above publication, the mask is moved one-dimensionally in the scanning direction at the time of scanning exposure in order to use the 1 × mirror projection in the S & S method, and the semiconductor wafer is scanned in the scanning direction. It is disclosed to be configured to perform a step movement in a direction orthogonal to the step movement. Also, on According to the document described above, a mask (or reticle), a wafer and a mask are used during scanning exposure using a 1/4 reduction projection optical system having an arc-shaped slit view combined with an optical lens and a reflecting mirror. An S & S type reduction projection scanning type exposure apparatus in which the speed ratio of the light beam is precisely controlled to 4: 1 is disclosed. In the above publication (3), an excimer laser is used as the illumination light, and the regular hexagon inscribed in the field of view of the circular image of the normal reduced projection lens is restricted to an effective projection area. An apparatus for performing & S type exposure is disclosed. In the above-mentioned publication, the above-mentioned publication discloses a method for effectively forming a linear slit (rectangular) area along a diameter in a circular image field of a normal reduced projection lens system. An apparatus for performing S & S type exposure with a limited projection area is disclosed. <In addition, Japanese Patent Application Laid-Open No. Hei 6-30973 discloses a method for obtaining a higher resolution. Consists of a plurality of optical lenses, a beam splitter, and a concave mirror. A reduction projection optical system applied to an ArF excimer laser having a wavelength of 200 nm or less as exposure illumination light has been disclosed. I have. A similar projection optical system is also disclosed in Japanese Patent Application Laid-Open No. 5-88087 filed by the same applicant as the present application. In each of the prior arts described above, in a scanning exposure apparatus using a reduction projection optical system, generally, a reticle stage for holding a reticle and a wafer stage for holding a wafer are moved at a speed corresponding to the reciprocal of the reduction magnification of the projection optical system. It is configured to scan by the ratio. For this purpose, a drive source for the reticle stage (for example, a linear motor) and a drive source for the wafer stage (for example, a linear camera) are separately provided in the apparatus body (column for fixing the projection optical system, etc.). Therefore, it was necessary to precisely control both driving sources so that the reticle and the wafer were relatively moved while maintaining a constant speed ratio. That is, the linear reticle stage is moved one-dimensionally with respect to the projection optical system during scanning exposure. A linear motor that moves the wafer stage one-dimensionally with respect to the projection optical system, and a linear motor that measures the movement position of each stage with respect to the projection optical system. A servo control circuit for precise control is required. In the case of a scanning exposure apparatus using such a reduced projection optical system, the reticle stage (mask stage) and the wafer stage (substrate stage) have different dynamic characteristics. The method of scanning after the inferior stage is generally adopted.However, the stage with inferior characteristics has slow settling due to the influence of the body sway which is the frame of the device, and the synchronization performance is poor. In order to improve the performance, it is not only necessary to use a stage with excellent dynamic characteristics as a stage with better characteristics, but also to reduce the deflection of the body such as a so-called active vibration isolator (vibration isolator). A special device is indispensable for this purpose, and the configuration of the device is complicated and the cost is increased. Further, in a scanning exposure apparatus using a reduction projection system in which the optical axis from the reticle to the wafer is linear as in the apparatuses described in the above publications (3) and (4), a reticle is generally used. The reticle stage is located above the body of the exposure apparatus, because both the stage and the wafer stage are arranged to move in the horizontal direction and are separated by about 80 to 15 Ocm in the vertical direction. As a result, the entire apparatus is tilted due to scanning movement during scanning exposure of the reticle stage, or excessive stress is applied to each structure (column, platen, etc.) that constitutes the apparatus body. There were also inconveniences of doing so. Also, a linear motor for the reticle stage and a linear motor for the wafer stage If a turbulence occurs in the synchronization control with the camera or a measurement error (counting mistake) occurs in the interferometer, the pattern image transferred to the shot area on the wafer is transferred in the scanning direction. Had an inconvenience when it became uneven. The present invention has been made in view of the inconveniences of the related art, and has as its object the purpose of reducing the stress generated in a structure constituting an apparatus with a simple configuration, and reducing the inclination and deviation of the entire apparatus. An object of the present invention is to provide an exposure apparatus and a scanning exposure apparatus capable of suppressing the mask stage and improving the synchronization performance between the mask stage and the substrate stage. Another object of the present invention is to provide a scanning exposure method capable of reducing stress generated in an exposure apparatus, suppressing tilt and swing of the entire apparatus, and improving synchronization performance between a mask and a substrate. is there. Disclosure of the invention

 According to a first aspect of the present invention, there is provided an exposure apparatus for transferring a pattern formed on the mask to the photosensitive substrate via a projection optical system while synchronously moving the mask and the photosensitive substrate.

 A substrate stage levitated and supported on a base member;

 A mask stage having a mass that is twice the reduction magnification of the projection optical system of the mass of the substrate stage; and a mask stage floatingly supported on the base member;

An exposure apparatus is provided between the two stages, and has a first linear motor that drives the substrate stage and the mask stage so as to move the mask and the substrate in directions opposite to each other. According to this exposure apparatus, since the mask stage and the substrate stage are supported by floating above the base member, the two stages are not in contact with each other in the direction opposite to each other along the moving direction by the first linear motion. The movement of both stages at this time does not exert any force on the base member or the like, and the momentum is preserved. Here, since the mass of the mask stage is set to be the magnification of the projection optical system times the mass of the substrate stage, the velocity ratio between the mask stage and the substrate stage is determined by the law of conservation of momentum. As the reciprocal of the reduction ratio, both stages are accurately synchronized. Also, since the position of the center of gravity of the entire system hardly changes, the body body including the base member does not shake or tilt due to movement of both stages (synchronous scanning of the mask and the substrate). In the exposure apparatus of the present invention, the projection optical system may be an optical system that projects an inverted image of the pattern formed on the photosensitive substrate on the photosensitive substrate. With this configuration, even when the mask pattern is an asymmetric pattern, the mask stage and the substrate stage are synchronously moved in opposite directions by the first linear motion. The image of the pattern is accurately projected and exposed on the photosensitive substrate. In the exposure apparatus of the present invention, the photosensitive substrate is horizontally held on a substrate stage, the mask is vertically held on the mask stage, and the projection optical system includes a plurality of transmission optical elements, The optical system may include a splitter and a reflection optical element, and project the pattern of the mask disposed on the object plane onto the photosensitive substrate disposed on the image plane at a predetermined reduction magnification. By configuring the exposure apparatus in this way, for example, the half TTL alignment element according to claim 4 on the opposite side to the mask stage via a light splitter. In this case, a half TTL alignment detection system can be used to arrange an alignment mark formed on a mask through a light splitter and a photosensitive substrate. The above alignment marks can be detected separately or simultaneously, and the detection of reticle alignment marks and the detection of wafer alignment marks can be shared by a single detection system. Becomes possible. In the exposure apparatus of the present invention, a second linear motor for driving the mask stage may be provided between the base member and the mask stage. <According to this structure, the first linear motor is set to 0FF. By driving the second linear motor in this state, it is possible to independently drive the mask stage relative to the base member, thereby resetting the position of the mask stage. And fine-tuning is possible. In the exposure apparatus of the present invention, a third linear motor that drives the substrate stage may be provided between the base member and the substrate stage. By configuring the exposure apparatus in this manner, the first By driving the third linear motor with the first linear motor (and the second linear motor) turned off, the substrate stage can be driven independently with respect to the base member. Thus, reset and fine adjustment of the position of the substrate stage can be performed. In the exposure apparatus of the present invention, a regenerative braking control circuit that finely adjusts a speed ratio during synchronous movement of the two stages by the first linear motor includes a small number of the second linear motor and the third linear motor. At least one can be attached to one. With this configuration of the exposure apparatus, the regenerative braking control circuit allows the second By causing at least one of the linear motor and the third linear motor to perform a regenerative braking action, at least one of the mask stage and the substrate stage that are moved in opposite directions by the first linear motor. It is possible to increase the apparent mass of one of them, and to fine-tune the speed ratio when moving both stages. Here, the regenerative braking means that the motor functions as a kind of generator to generate a braking action, thereby increasing the load driven by the first linear motor ( That is, the apparent mass of at least one of the mask stage and the substrate stage can be increased. According to the exposure apparatus according to this configuration, when the mass ratio of both stages is not accurately set to a desired value, it is possible to adjust the speed ratio of both stages to secure desired synchronization performance. By intentionally shifting the mass ratio of both stages slightly from the desired value and adjusting the amount of regenerative braking appropriately during movement (scanning), the speed ratio of both stages is always projected The reciprocal of the reduction ratio of the optical system By ensuring that the momentum is not completely preserved, stable synchronization performance can be ensured. In the exposure apparatus of the present invention, the substrate stage may include a first stage driven in a first direction in which the photosensitive substrate is synchronously moved, and the first stage holding the photosensitive substrate and being integrated with the first stage. And a second stage movable in a first direction and guided by the first stage and movable in a second direction orthogonal to the first direction. By configuring the exposure apparatus in this manner, the second stage holding the substrate is moved in the first direction integrally with the first stage to perform scanning exposure, and then the second stage is moved relative to the first stage. By repeating the movement in the second direction orthogonal to the first direction, so-called step-and-scan exposure can be easily realized. According to a second aspect of the present invention, there is provided a scanning optical system including a projection optical system having an optical axis substantially orthogonal to a mask and a substrate, and transferring a pattern of the mask to the substrate via the projection optical system. In the device,

 Base and

 A first stage for moving the mask on the base;

 A second stage for moving the substrate on the base;

 A drive system connected to the first stage and the second stage for synchronously moving the mask and the substrate at a speed ratio according to a magnification of the projection optical system;

 The drive exposure system drives the first stage and the second stage in opposite directions along a predetermined direction so as to substantially cancel a reaction force generated by the synchronous movement. Is done. According to a third aspect of the present invention, in a scanning exposure method for transferring a pattern of a mask to a substrate via a projection optical system,

 The mask and the substrate are arranged on the same plane perpendicular to the optical axis of the projection optical system,

 Projecting a partial inverted image of the pattern of the mask onto the substrate,

 A scanning exposure method for synchronously moving the mask and the substrate in opposite directions along a predetermined direction on the plane, thereby substantially canceling a reaction force generated by the synchronous movement. .

BRIEF DESCRIPTION OF THE FIGURES

 FIG. 1 is a diagram showing a basic configuration of the present invention.

 FIG. 2 is a schematic configuration diagram showing the exposure apparatus of the first embodiment.

 FIG. 3 is a schematic plan view of the apparatus of FIG.

FIG. 4 is a block diagram showing the configuration of the control system of the apparatus shown in FIG. FIG. 5 is a block diagram showing a configuration of a control system of the device of the second embodiment.

 FIG. 6A is a schematic front view of a modified example of the exposure apparatus according to the present invention.

 FIG. 6B is a right side view of a modified example of the exposure apparatus shown in FIG. 6A. BEST MODE FOR CARRYING OUT THE INVENTION

 Hereinafter, the principle configuration of the exposure apparatus of the present invention will be described with reference to FIG. FIG. 1 shows a basic configuration of an exposure apparatus 10 according to the present invention. The exposure apparatus 10 includes a vibration isolation table 12 as a base member, and a substrate stage 1 floatingly supported on the vibration isolation table 12 via an air-bearing (air bearing) 13. 4 and a mask stage 16 which is floated and supported on the substrate stage 14. Further, a linear motor 18 is provided between the substrate stage 14 and the mask stage 16. That is, for example, the drive coil 18 A of the linear motor 18 is provided on the mask stage 16 side having the mass M r, and the magnet of the linear motor 18 is provided on the substrate stage 14 side having the mass M w. A rack section 18B is provided. Also, the ratio of the mass Mr of the mask stage 16 to the mass Mw of the substrate stage 14 is twice the reduction magnification of the projection optical system (not shown). According to the exposure apparatus 10 of the present invention configured as described above, since both stages 14 and 16 are supported by floating, only the internal force is generated when the linear motor 18 is excited. Working, equal in magnitude and <opposite direction acting force F 1 and reaction force F 2 (F 2 = — F 1) are applied to the respective stages 16, 14. Assuming that the moving speeds of both stages 16 and 14 caused by this force are Vr and Vw, and ignoring air resistance etc., according to the law of conservation of momentum,

MrVr = MwVw Holds. Therefore, the speed ratio of both stages 16 and 14 is

 Vr / Vw = Mw / Mr

Becomes However, in the case of the present invention, the mass ratio Mr / Mw of the two stages 16 and 14 is set to be equal to the aforementioned <reduction magnification Mpi of the projection optical system (not shown). ,

 Vr / Vw = Mw / Mr = 1 / Mpl

Thus, the speed ratio between the two stages 16 and 14 matches the reciprocal of the reduction ratio of the projection optical system. Therefore, ideally, when a system in which the momentum is stored is configured, if the speed (and position) of only one of the substrate stage 14 and the mask stage 16 is servo-controlled, Synchronous scanning (movement) of both stages 14 and 16 is always possible. For example, if the mask stage 16 is subjected to a servo, even if the mask stage 16 moves in an oscillating manner, the substrate stage 14 has the same speed ratio as the reciprocal of the mass ratio. Makes an oscillating movement similar to 6. In addition, since the momentum is preserved, the position of the center of gravity of the system is always constant, so that the vibration isolator 12 does not swing. Therefore, the synchronization error at the time of scanning of both stages 16 and 14 (the mask and the substrate held at both stages 16 and 14) is always zero. Example

 << First Example >>

Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIGS. 2 to 3 show the configuration of the main part of an exposure apparatus 100 of the step 1 and scan type according to the first embodiment. The exposure apparatus 100 includes a base structure 200 as a base member horizontally held on a vibration isolating pad (not shown), and a floating support on the base structure 200. And a reticle stage body 206 as a mask stage, and a base structure 200 held by a main body column (not shown) above the wafer stage 14. It includes a fixed projection optical type PL and an illumination optical system 2 12 similarly held by a main body column (not shown) and fixed to a base structure 200. Here, the wafer stage 14 has a first wafer stage body 208 as a first stage movable in the X direction (scanning direction) and a first wafer stage body 208. A second wafer stage body 220 is provided as a second stage that is guided and movable in the Y direction orthogonal to the X direction. This specific configuration will be described later in detail. On the top surface of the base structure 200, two prisms extending parallel to each other in the X direction (the direction perpendicular to the paper) perpendicular to the Y direction on the one end (left end) side in the Y direction in FIG. Fixed guide rails 202, 204 are protruded, and the other top surface of the base structure 200 supports each moving body (stages) in the Z direction and is smooth in the XY plane. Flat polished to move to On one fixed guide rail 202, a guide surface 202 that defines the reticle stage body 206 movable in the X direction in the Z direction and a guide surface 202 that defines the reticle stage body 206 in the Y direction are provided. B is formed, and the other fixed guide rail 204 has a guide surface 204 A that defines the first wafer stage body 208 movable in the X direction in the Y direction. . As the reticle stage body 206, as shown in FIG. 2, a vertical type that holds a reticle R as a mask vertically is used. The reticle fine stage 2 holds the reticle R vertically and performs fine translation and rotation in a plane perpendicular to the optical axis AX of the projection optical system PL (XZ plane in the figure). 10 is provided. The illumination optical system 211 is disposed on the side opposite to the projection optical system PL with respect to the reticle R, and slits the rectangular pattern area of the reticle R in a direction orthogonal to the scanning direction (X direction) during scanning exposure. Irradiation is performed with illumination light having an intensity distribution extending in a rectangular shape (or rectangular shape). The pattern portion of the reticle R illuminated by the linear slit illumination light is located at the center of the circular visual field on the object plane perpendicular to the horizontal optical axis AX of the projection optical system PL, and the transmission optical element The first lens group G 1, the second lens group G 2, the third lens group G 3, the beam splitter BS as a light splitter, and the reflecting optical element For example, with a resolution of 0.35 m or less, through a projection optical system PL of a predetermined reduction magnification M pi (1/4 in this embodiment) constituted by a concave mirror MR into bilateral telecentric lenses at a predetermined reduction magnification M pi (in this embodiment, 1/4). Projected onto wafer W. Here, as the projection optical system, one that projects an inverted image (inverted on the X axis) of a circuit pattern (not shown) formed on the pattern surface of the reticle R onto the wafer W is used. You. The detailed configuration of such a projection optical system PL is disclosed in detail in the above-mentioned Japanese Patent Application Laid-Open No. 5-88087, which is disclosed in Japanese Patent Application Laid-Open No. 6-30973. Therefore, further explanation is omitted here. Now, on the bottom of the reticle stage body 206, an air bearing (air bearing) supporting the own weight of the reticle stage body 206 facing the guide surface 202A of the fixed guide rail 202 is provided. Pad PDA for air bearing and pad PDB for air bearing that constrains Y-direction displacement of reticle stage body 206 facing guide surface 202 B of fixed guide rail 202 For the air bearing, which supports the weight of the reticle stage body 206 facing the surface 200A of the base structure 200 between the guide rails 202 and 204. Head PDC is fixed. Of these pads, the pad PDB for constraining displacement in the Y direction is composed of a plurality of air pads that emit pressurized air and is alternately arranged in the X direction (a direction perpendicular to the paper) to suck air. It consists of a pneumatic / vacuum combination pad (vacuum preload type air bearing) that combines multiple vacuum pads. According to this pneumatic / vacuum combi- sion-type pad, the reticle stage body is formed by the balance between the suction force (preload) of the vacuum pad section and the pressure of the air ejected from the air pad section. 206 is levitated and supported with a predetermined clearance from the guide surface. _(In addition, in the case of a PDC, a PPD, a PPD, the weight of the reticle stage body 206 is Acts as a preload, and the reticle stage body 206 is moved from the guide surface by the balance between the dead weight and the pressure of the air ejected from the head PDA. In the following description, the pad is used to mean that the pad supports its own weight In this sense, the base structure of the fixed guide rail 204 at the other end in the Y direction is used. The first wafer stage body 208 and the second wafer stage The wafer stage 14 composed of a solid body 220 and a floating body is formed on the base structure 200. The first wafer stage body 208 is formed on a rectangular frame extending on the XY plane on the base structure 200. (See Fig. 3.) However, its own weight is supported by pads PDD and PDE for air bearings arranged at the four corners facing the upper surface of the base structure 200. The displacement of the first wafer stage body 208 in the Y direction (the left-right direction in the drawing) is caused by the first wafer stage body 2 facing the vertical guide surface 204 A of the fixed guide rail 204. Fixed to 0 8 Pneumatic / vacuum combination type pad restrained by PDF. Thus, the first wafer stage body 208 can be moved in a frictionless manner in the X direction by being guided by the guide surface 204 A and the surface of the base structure 200. Then, between the first wafer stage body 208 and the reticle stage body 206, a first linear motor 211 disposed along the X direction is provided. The first linear motor 21 6 is fixed to the first wafer stage body 208 side, and extends over a moving stroke in the X direction. The magnet track portion 21A includes a yoke extending in the X-axis direction and having a U-shaped cross section and a pair of magnets fixed to the upper and lower surfaces of the yoke) and a reticle stage body 20. It consists of a drive coil section 2 16 B fixed to the 6 side, and generates thrust in the X direction. That is, in the first embodiment, by driving the linear motor 2 16, for example, the reticle stage section 206 is integrally driven with the drive coil section 2 16 B toward the front of the drawing. As a result, the reaction causes the wafer stage 14 to be driven integrally with the magnet track unit 2 16 A toward the back side of the drawing (the reticle stage body 20). 6 can be independently moved in the X direction by a second linear motor 2 14 provided along the X direction.This linear motor 2 14 is fixed to the base structure 200 side, Magnet track section 2 14 A over the movement stroke of the reticle stage body 206 in the X direction (The magnet track section 2 14 A is the guide surface 200 A A U-shaped yoke fixed on the top and one fixed on the left and right inner surfaces of this yoke And of consisting of the magnet door), reticle stage body 2 0 6 It is composed of a drive coil section 2 14 B fixed to the side, and produces a thrust in the X direction. The second linear motor 214 is used for returning the reticle stage body 206 to a predetermined reset position, and has various functions. This will be described later. Further, inside the frame of the first wafer stage body 208, as shown in FIGS. 2 and 3, a wafer holder 218 for vacuum-sucking the wafer W and a fiducial mark plate FM are mounted. The second wafer stage body 220 thus held is movably held in the Y direction. FIG. 3 shows the configuration of the wafer stage body viewed on the XY plane. As shown in FIG. 2, a plurality of air bearings for supporting its own weight are provided below the second wafer stage body 220 so as to face the upper surface of the base structure 200 as shown in FIG. Pads PDI and PDG are installed. In addition, the inner surface of one of the two linear frame portions of the first wafer stage body 208 extending in the Y direction with the second wafer stage body 220 interposed therebetween is also shown in FIG. As shown in the figure, a guide surface 222 is formed with the second wafer stage body 220 for guiding in the Y direction (constraining the displacement in the X direction), and one of the second wafer stage bodies 220 is formed. A pair of pneumatic / vacuum combination pads PDH facing the guide surfaces 222 are fixed to the ends. Further, between each of the two linear frame portions of the first wafer stage body 208 extending in the Y direction and the second wafer stage body 220, as shown in FIG. 2 A pair of linear motors 240 and 242 are provided to move the wafer stage body 220 in the Y direction with respect to the first wafer stage body 208. Can be Since the drive coil portions 240 A and 242 A of the pair of linear motors 240 and 242 are fixed to both sides of the second wafer stage body 220, respectively. By subtly changing the drive amount of 242, the second wafer stage body 220 can be minutely rotated (on the order of seconds) on the surface of the base structure body 200. Here, with reference to FIG. 3, the reciprocal configuration of the reticle R and the first and second wafer stage bodies 208 and 220 on the XY plane will be further described. In FIG. 3, the movement position of reticle R in the X direction (scanning direction) in the XZ plane and the minute rotation amount (retinal error) of reticle R in the XZ plane are represented by reticle stage 2 The laser interferometers RIFX and RIF0 project a laser beam for length measurement onto a reflecting mirror CMX fixed to a part of the fine movement stage 210 provided at 06, and receive the reflected beam. You. Although not shown in either of FIGS. 2 and 3, the position of the reticle fine movement stage 210 in the Z direction (the vertical direction in the plane of FIG. 2 and the direction perpendicular to the plane of FIG. 3 in FIG. 3) is sequentially measured. A laser interferometer RIF y is also provided. Here, this laser interferometer RIF y measures the Z-direction position of the reticle fine movement stage 210, but in the wafer stage coordinate system. Since this Z-direction position corresponds to the Y-direction position, The laser interferometer RIF y is used. Therefore, in the following description, the measurement value of the laser interferometer RIF y is expressed as PY. The coordinate position of the wafer W in the XY plane is determined by a movable mirror My extending in the X-axis direction at the other end (right end) in the Y-direction on the second wafer stage body 220 for measuring the length. A laser interferometer WIF y that projects a laser beam and receives the reflected beam, and a Y-axis direction at one end in the X direction on the second wafer stage body 220 The laser interferometer WIFX, which projects a laser beam for length measurement onto the moving mirror M x extending in the direction and receives the reflected beam, is sequentially measured. Each of the interferometers WIFX and WIFy simultaneously measures the minute rotation amount (jewing error) of the second wafer stage body 220 at the same time. The illustration of both the moving mirror and the interferometer is omitted in FIG. Each of the above interferometers RIF x, RIF Θ RIF y, WIF x, WIF y is a reference for measuring the coordinate position of reticle R or wafer W with reference to base structure 200. The plane mirror and the corner prism (both not shown) are fixed to the base structure 200. By the way, one shot area SA is shown in the wafer W in FIG. 3, but in the state of FIG. 3, the center point of the shot area SA is a vertical optical axis AX ( The moment coincides exactly with the optical axis of the lens group G3 in Fig. 2; at this time, the center point of the pattern area of the reticle R also has a horizontal optical axis AX (the lens groups G1 and G2 in Fig. 2). Optical axis). In addition, in the exposure apparatus 100 of the first embodiment, between the projection optical system PL and the reticle R, via the periphery of the projection field of the projection optical system PL, the wafer W or the reference mark plate FM TTL (through-the-lens) type alignment optical system 230 that photoelectrically detects the alignment mark formed on the top, beam splitter BS, and third lens group Alignment mark on wafer W or fiducial mark plate FM is detected via G3, and reticle R is detected via beam splitter BS and second and first lens groups G2 and G1. A half TTL type alignment optical system 232 for detecting the above alignment mark is provided. In the above configuration, the total value Mr of the masses of both the reticle stage body 206 and the reticle fine movement stage 210, and the wafer stage 14, that is, the first wafer stage body 208 The ratio of the mass of both the second wafer stage body 220 to the total value Mw is set to be equal to the reduction magnification Mpi of the projection optical system PL. In the case of this embodiment, as described above, since the magnification Mpl of the projection optical system is 1/4, the mass ratio Mr / Mw is also set to 1/4. To give a specific example, it depends largely on the diameter of the wafer W used, but the total mass Mw of the wafer stage body is about 40 to 100 Kg, and the total mass of the reticle stage body M can be set to about 10 to 25 Kg. FIG. 4 shows a configuration of a control system of the exposure apparatus 100 according to the first embodiment. , Alignment control system 255, stage main control system 260, drive circuit 253, drive system 254, main scan drive system 255, drive circuit 256, etc. Here, the above components of the control system will be described together with their operations, and the detection information from the TTL alignment detection system 230 described above and the half TTL alignment detection system 23 The detection information from 2 is input to the alignment control system 259, where the wafer W, reticle R, and Reference mark board The coordinate position and displacement error of the alignment mark on the FM are determined. O The stage main control system 260 is a mini-operation (not shown) for operation. Interface, and the above-mentioned linear motors 2 1 4 and 2 16, 24, 24, 24, drive system 25 4 for driving and controlling reticle fine movement stage 210, main scanning drive system 25 5, drive circuit 25 6, drive circuit 25 3 Is done. Among them, the drive circuit 253 is composed of position information PX, PY, P P in the X direction, Y direction, and rotation (jowing) direction measured by the reticle-side interferometers RIFX, RIF Θ RIF y. The reticle fine movement stage 210 is servo-controlled based on the command information from the main control system 260, and the reticle R is minutely moved during alignment or during scanning exposure. Further, the drive system 255 is based on the position information PX (and the speed information Vx) measured by the reticle-side interferometer RIFX and the command information from the main control system 260, and the second linear motor Servo control of 2 1 4 drive. The main scanning drive circuit 255 operates mainly during scanning exposure, and is measured by the speed information VX (or position information PX) measured by the reticle side interferometer RIFX and the wafer side interferometer WIFX. While monitoring one or both of the speed information VX (or the position information PX), at least one of the absolute speeds of the reticle stage body 206 and the first wafer stage body 208 is monitored. The first linear motor 216 is servo-controlled so that it becomes equal to the speed command information from the main control system 260. The drive circuit 256 is based on the position information PX, PY, PS measured by the wafer-side interferometers WIFX, WIFy and the command information from the main control system 260, and the pair of linear motors described above. Servo control of the drive of 240 and 242 is performed. Next, the operation at the time of scanning exposure of the exposure apparatus 100 of the first embodiment configured as described above will be described. Here, the reticle alignment by the half TTL alignment detection system 232 and the global alignment of the reticle R and wafer W by the TTL alignment detection system 230 and the reference plate FM are determined. Advance preparations such as baseline measurement used shall be completed. First, in the stage main control system 260, one end in the X-axis direction of a predetermined shot area on the wafer W should be positioned in the exposure field of the projection optical system PL. A command is given to the scanning drive system 254 and the drive circuit 256 to drive the linear motor 216 and the linear motors 240, 242. As a result, the second wafer stage body 220 is moved X with the first wafer stage body 208 in the direction opposite to the reticle stage body 206 and the first wafer stage body 2 It is driven in the Y direction with respect to 08, and one end in the X axis direction of the shot area is positioned in the exposure field of the projection optical system PL. Next, the stage main control system 260 drives the second linear motor 214 via the drive system 254 to return the reticle stage body 206 to a predetermined reset position. As a result, the other end of the reticle in the X-axis direction matches the exposure field of the projection optical system PL. In this case, the second linear motor 214 was servo-controlled based on the measurement value of the reticle interferometer 250 so that the position of the reticle stage body 206 did not change in the X direction. In this state, the first linear motor 2 16 is driven to

(2) After moving the wafer stage bodies 208 and 220 together in the X direction on the base structure body 200 alone, only the second linear motor 2 14 interferes with the reticle. Servo control based on a total of 250 measured values The tickle stage body 206 may be moved alone in the X direction on the base structure 200. Next, the stage main control system 260 gives a command to the main scanning drive system 255 to drive the linear motor 216 to start exposure of the shot area. In the case of the first embodiment, the wafer stage 14 and the reticle stage body 206 are both supported on the base structure 200 via air bearings (vacuum bearings). When a driving current is supplied to the driving coil section 2 16 B of the linear motor 2 16 of the first stage, the first wafer stage body 208 and the second wafer stage body 220 are integrated according to the law of conservation of momentum. As a result, the top surface of the base structure 200 is moved at a speed Vw in the + X direction, for example, and the reticle stage body 206 is moved along the top surface of the base structure 200 in a speed V in the X direction. Move with r. In this case, as described above, the ratio of the total mass M r of both the reticle stage body 206 and the reticle fine movement stage 210 to the total mass M w of the wafer stage 14 is determined by the projection optical system. The reticle stage body 206 and the wafer stage are set according to the law of conservation of momentum, regardless of whether the vehicle is accelerating, at a constant speed, or decelerating, because it is set to be equal to 1/4 of the PL reduction magnification. The speed ratio to 14 is 4: 1, which is equal to the reciprocal of the reduction factor M pi. Therefore, if only the speed (or position) of one of the wafer stage 14 and the reticle stage body 206 is servo-controlled, the two can always be reliably and synchronously scanned. Here, the absolute values of the respective scanning speeds Vw and Vr (the speeds with respect to the base structure 200) determine the amount of exposure given on the wafer W during scanning exposure. In the case of 255, the interferometer RIFX for measuring the reticle stage body 206 in the X direction or the X direction position meter of the first wafer stage body 208 While monitoring the speed information output from one of the measurement interferometers WIFx, the servo of the drive of the first linear motor 2 16 is controlled so that the speed becomes a specified constant value. Is required. For example, if the reticle stage body 206 is subjected to servo, even if the reticle stage body 206 vibrates, the wafer stage 14 has the same speed ratio as the reciprocal of the mass ratio. The reticle stage body 206 performs a vibrating movement similar to that of the reticle stage body 206 while maintaining the state. In addition, since the momentum is conserved, the position of the center of gravity of the system is always constant, so that the base structure 200 does not shake. Therefore, the synchronization error at the time of both scanning exposures is always zero. Thus, when the exposure of one shot area on the wafer W is completed. The stage main control system 260 drives the linear motors 240, 242 via the drive circuit 256. Then, a shot area adjacent to the exposed shot on the wafer W is positioned in the exposure field of the projection optical system PL (stepping is performed). After this positioning, the stage main control system 260 drives the linear motor 216 via the main scanning drive system 255 to move the reticle stage body 206 in the opposite direction (+ X direction) from the front. Scanning starts exposure of the shot. In this case, the wafer stage 14 is scanned in the X direction at a speed of 1/4 of the reticle stage body 206. Thereafter, similarly, the exposure of the shot area on the wafer is performed by the step-and-scan method. As described above, according to the first embodiment, the mass ratio M r / M w between the reticle-side stage body and the wafer-side stage body is reduced by the reduction of the projection optical system PL. Equal to the small magnification M pi <Just by setting, there is no need to provide a complicated synchronization control circuit, etc., and use a special vibration isolation device such as a stage with excellent dynamic characteristics and an active vibration isolation device In addition, the reticle structure 206 and the wafer stage 12 can be always scanned with a synchronization error of zero based on the law of conservation of momentum with a simple configuration. Also, since the reticle stage body 206 and the wafer stage 14 (wafer stage bodies 208, 220) move in opposite directions according to the law of conservation of momentum, the entire apparatus body including the base structure 200 is moved. The position of the center of gravity with respect to the X direction hardly changes, and the effect of reducing the shaking of the device can be obtained. In the first embodiment, as described above, the reticle stage 206 and the substrate stage (wafer stage 208, 220) extend in the scanning direction (X direction) as described above. A linear motor 2 16 is arranged, and the wafer stage 14 is supported by air bearing so as to move one-dimensionally in the X direction in a non-contact state on the base structure 200, and a reticle stage. The body 206 is supported by air bearing so as to move one-dimensionally in the X direction on the base structure 200 in a non-contact state. Therefore, while the drive current is being supplied to the drive coil section 21 B of the linear camera, the relative positional relationship between the reticle R and the wafer W in the X direction is controlled according to the law of conservation of momentum. Becomes However, when the power supply to the linear motor 211 is cut off, the forcing force for maintaining the relative positional relationship between the reticle stage body 206 and the wafer stage 14 in the X direction is lost. For this reason, vibration from a vibration source (other motor, etc.) inside the exposure apparatus that occurs when power supply to the linear motor 211 is cut off, and an air conditioner outside the exposure apparatus The relative positional relationship between the reticle stage body 206 and the wafer stage 14 in the X direction is gradually shifted due to vibration of the equipment, vibration of the floor on which the exposure apparatus is installed, or slight inclination of the entire exposure apparatus. There is a possibility that it will come. In this case, the relative displacement of the reticle stage body 206 and the wafer stage 14 in the X direction is devised by devising the coil arrangement of the linear motor 216, the winding structure of each coil, and the control of the drive current supply. It is also possible to use a linear motor that can perform servo control so as to maintain zero. In this case, the relative positional relationship between the reticle R and the wafer W in the X direction can be easily stopped simply by controlling the supply current to the linear motor 216. However, even in such a case, there is a possibility that the reticle stage body 206 and the wafer stage 14 are integrally moved on the base structure 200 in the X direction due to various vibrations, inclination of the exposure apparatus, and the like. In either case, there is no difference that the reticle stage body 206 shifts the wafer stage 14 with respect to the base structure 200, which is fixed with respect to the base structure 200. Step and scan exposure means that the relative positional relationship in the X direction between the optical axis (or illuminating light flux) of the illumination system 211 and the reticle R to be set at the start of scanning exposure changes. This will have a significant effect on the sequence. The second linear motor 214 functions to solve such inconvenience. That is, in the exposure apparatus 100 of the first embodiment, the relative positions of the reticle stage body 206 and the wafer stage 14 (wafer stage bodies 208, 220) are controlled at a speed ratio according to the law of conservation of momentum. In addition to the first linear motor 2 16 for controlling the positional relationship, a reticle stage body for the base structure 200 Since a second linear camera 2 14 for controlling the absolute position of 206 is provided, the reticle stage 206 and wear stage 14 (wafer stage 2) are used in accordance with the law of conservation of momentum during scanning exposure. 0 8 and 2 20) in the opposite direction, the power supply terminal of the drive coil section 2 14 B of the second linear motor 2 14 is opened to make it no load, while the reticle stage When controlling the absolute position of the body 206, the second position is controlled based on the position information and speed information from the interferometer RIFX for measuring the X direction position of the reticle stage body 206 with respect to the base structure 200. It is possible to perform servo control of the linear camera. Therefore, the position of the reticle R with respect to the illuminating light beam can always be managed accurately by controlling each linear motor in cooperation with the S & S type wafer exposure sequence. Furthermore, since the positional relationship between the reticle R and the wafer W with respect to the base structure 200 after the completion of the exposure processing can be kept from the positional relationship at the start of the exposure processing, the reticle exchange and the wafer exchange can be performed. In this case, there is also an advantage that a transfer position between the arm and the like of the automatic transport mechanism is prevented from being shifted. In the first embodiment, an example in which an inverted optical system that projects an inverted image of the pattern of the reticle R onto the wafer W is used as the projection optical system, but a vertically symmetric circuit pattern is exposed. In such a case, an erecting optical system that forms an erect image of the circuit pattern on the photosensitive substrate can be used as the projection optical system. Further, in the first embodiment, the reduction magnification of the projection optical system is 1/4. Although the case has been exemplified, the reduction ratio of the projection optical system may be any number. For example, even if the reduction ratio is 1 (1 ×), the advantages of the present invention are large. . That is, according to the present invention, since the momentum is conserved, the position of the center of gravity of the system does not move due to the movement of the stage, and the body does not shake due to the reaction force due to the movement of the stage. An expensive vibration isolator such as a vibration isolator is not required, and even if one stage vibrates, the other stage performs the same vibratory motion accordingly, resulting in a synchronization error. This is because no problem occurs.

<< 2nd Example >>

Next, a second embodiment of the present invention will be described with reference to FIG. Here, the same reference numerals are used for the same or equivalent components as in the first embodiment described above, and the description thereof is simplified or omitted. As shown in FIG. 5, the second embodiment consumes a current from the power generation coil 2557 and the coil 2557 in functional relation with the linear motor 214. It is characterized in that a regenerative braking load circuit 258 is provided. Other configurations of the control system and other device configurations are the same as those of the first embodiment. In the second embodiment, the reticle stage 206 and the wafer stage 14 (wafer stage bodies 208, 220) at the time of scanning exposure are utilized by using the second linear motor 214. The regenerative control circuit that finely adjusts the speed ratio within a range of, for example, about ± 0.1% with a resolution of the order P-P.m, specifically, the power generation coil 2557 shown in Fig. 5 With a load circuit 258, the transfer magnification in the scanning direction is slightly changed. (When the design dimension in the scanning direction on the wafer W is 35 mm, the entire circuit expands and contracts by several hundred nm.) ) In more detail, the power generation coil 257 may be provided with a special power generation coil in the second linear motor 221 or the driving coil may be used for power generation. While the reticle stage and the wafer stage are moved in opposite directions by the first linear motor 216, the load circuit 258 (appropriate load) is connected to the terminal of the power generation coil. (Including a resistor) to perform regenerative control to increase the dynamic load in the X direction of reticle stage body 206. The speed ratio between reticle stage body 206 and wafer stage 14 is slightly changed. Let it. In order to control the amount of regenerative braking, the load circuit 258 is configured so that the current from the power generating coil 257 flows through the load resistor via a high-speed switching element or the like. The on / off frequency of the element and the duty ratio of the on-time and the expiration time can be varied over a wide range. Here, in order to finely and finely adjust the speed ratio Vw / Vr to the reduction ratio Mpi, the power generation unit integrated with the drive coil unit 2 14 B of the second linear motor 2 14 The control is performed so that a dynamic load is applied to the moving direction of the reticle stage body 206 using the coil 257 (see Fig. 5) and the load circuit 258. The load circuit 258 acts as a variable load resistor for the power generation coil 257, and the current extracted from the power generation coil 257 is controlled by the main scanning drive circuit 255. It has the function of changing almost continuously according to the command. During scanning exposure, the reticle stage body 206 tries to move at the speed Vr, but an appropriate load is applied to the terminal of the power generation coil 255. If a resistor is connected, the momentum corresponding to the energy consumed by the load resistor will be added to the reticle stage 206. This is a reticle stage This is equivalent to increasing the apparent mass M of the body 206 by a very small amount. Therefore, the speed ratio V w / V r between the wafer stage 14 and the reticle stage body 206 is finely adjusted. In this case, since the apparent mass of the reticle stage body 206 acts only in the increasing direction, the mass ratio M r / M w increases, and the speed ratio V w / V r becomes M pK ( V w / V r) The weight of each stage is set so that the mass ratio M r / M w in the stationary state is slightly smaller than the reduction ratio M ρ In addition, the speed ratio and the reduction ratio may be made to match by always adjusting the regenerative damping amount appropriately during scanning exposure.

When the wafer stage 14 and the reticle stage body 206 are moved by scanning in opposite directions according to the law of conservation of momentum, the driving coil section 2 14 of the second linear motor 2 14 When the power is supplied to Β and used to drive the reticle stage body 206, the apparent dynamic mass of the reticle stage body 206 can be slightly reduced, so that the speed ratio V w / V “ It is also possible to adjust in the direction of M pl> (V w / V r) According to the second embodiment described above, the scanning speed ratio between the reticle R and the wafer W during scanning exposure is regenerated. Fine adjustment can be made very easily by controlling the braking amount (current value from the power generation coil). The speed ratio between the reticle R and the wafer is detected from the measurement result of the interferometer, and the detected value is set in advance. The regenerative braking amount so that By controlling this, not only can the transfer magnification in the scanning direction be finely adjusted uniformly, but also the speed ratio between the scanning start and end portions of the shot area on the wafer W and the center of the shot area can be adjusted. The transfer distortion (distortion) is adjusted by subtly changing the speed ratio. Can also be adjusted. In the first and second embodiments, the linear motor 2 14 is provided to move the reticle stage body 206 independently in the scanning direction on the base structure 200. Alternatively or together with this, the X and Y positions of the first and second wafer stage bodies 208 and 220 can be reliably stopped, or the first and second wafer stage bodies 208 and 22 can be stopped. In order to move the first wafer stage body 208 independently on the base structure body 200, a third thrust force in the X direction is generated between the base structure body 200 and the first wafer stage body 208. A linear motor may be provided. The third linear motor may be subjected to servo control based on the measurement value of the wafer interferometer 25 2 (WIFX). Next, in the case where a third linear motor (not shown) is added to the apparatus of the second embodiment, the pattern area of the reticle R is aligned with the shot area on the wafer W and scanning exposure is performed. A series of sequences in the case of performing is described.

(1) Move the reticle stage to the mouthing position, and place the reticle R on the stage. At this time, the wafer stage 14 may be moved in the opposite direction in accordance with the law of conservation of momentum accompanying the movement of the reticle stage body, or the third linear motor may be forcibly stopped at a predetermined position by servo-controlling the third linear motor. You may leave.

(2) Each stage body 206, 208, 220 is set so that the reticle stage body 206 and the wafer stage body 220 are set at predetermined positions with respect to the image field of the projection optical system. Moved and fixed on the wafer stage body 220 The reference mark and the alignment mark on the reticle R are mutually photoelectrically detected by the alignment detection system 232 through the projection optical system PL, and are compared with the moving coordinate system of the wafer stage body 220. The fine movement stage 210 on the reticle stage body 206 is controlled so that the reticle R is aligned in the X, Y, and 0 directions. When the reticle R is aligned with the moving coordinate system of the wafer stage body 220, the X and Y measurement values from the reticle interferometer 250 and the Store the X and Y measurement values as the primary alignment achievement position. Thereafter, the positional relationship is managed so as to be immediately reproduced.

(3) In order to place the wafer W on the wafer stage body 220, the wafer stage body 220 is moved to a predetermined loading position. After that, the wafer stage is arranged so that each of the alignment marks formed along with several shot areas on the wafer W are arranged one after another in the field of view of the projection optical system PL. The body 220 is moved, and each alignment mark is sequentially detected by the alignment detection system 230 via the projection optical system PL. Based on the detection result, the relative positional relationship (X, Y, 0 directions) between the arrangement coordinate system of the shot area on the wafer W and the pattern area of the reticle R is determined.

(4) If the determined positional relationship is misaligned in the X direction, the third linear motor is driven to move the wafer stage 14 so that the wafer stage 14 is not displaced with respect to the base structure. In this state, the first linear motor 2 16 is driven to move the reticle stage body 206 slightly in the X direction with respect to the wafer stage 14. The relative positional error between the shot array coordinate system on the wafer W and the pattern area of the reticle R in the vertical direction is either the wafer stage body 220 or the fine movement stage 210 on the reticle stage body 206. And the relative position error in the Θ direction is calculated as follows: It is corrected by the minute rotation of the wafer stage body 220. It should be noted that a zero stage may be separately provided on the wafer stage body 220.

(5) When the pattern area of reticle R and the coordinate system of the shot array on wafer W are precisely aligned in the X, Y, and 0 directions, reticle stage 206 and wafer stage The relative position relationship in the X and Υ directions with 220 is read from the interferometer and stored as the position where secondary alignment is achieved. The position at which the secondary alignment is achieved is used as a reference for managing the movement position of each stage during the exposure processing of the wafer W.

(6) Next, the reticle stage body 206 is positioned in the X direction so that the pattern area on the reticle R comes to a position where irradiation by the illumination light beam is started, and one shot area on the wafer W is placed. The wafer stage 14 is positioned in the X direction so that the position of the wafer stage 14 starts exposure.

() Then, the first linear motor 216 is driven, and the reticle stage body 206 and the wafer stage 14 are made to correspond to the image forming magnification Mpi of the projection optical system Ρ L according to the law of conservation of momentum. It is moved in the opposite direction at the predetermined speed ratio. In this case, fine adjustment of the transfer magnification in the scanning direction requires precise measurement of the change in the speed ratio (or the change in the relative positional relationship) if it is necessary to suppress the change in the speed ratio between the two stages within the allowable range. Actively control the second linear motor 214 and the third linear motor based on the results to continuously fine-tune the apparent dynamic mass of the reticle stage body 206 or wafer stage 14. Good _c

《Modification》

Next, a modified example will be described with reference to FIGS. 6A and 6B. The exposure apparatus of this modification is characterized in that not only a wafer W as a photosensitive substrate but also a reticle R as a mask is horizontally held on a reticle stage 16. This exposure apparatus is composed of a reticle stage 16 and a substrate stage 14 which are supported by air bearing (air bearings) 13 on a surface plate 12 and a reflection optical system for reducing and projecting a circuit pattern. And a light source 20. In the exposure apparatus of this modified example, the substrate stage 14 is a first stage 14 A which is supported by floating on the surface plate 12 and is movable in the X-axis direction, and a linear motor is mounted on the first stage 14 A. And a second stage 14 B driven in the Y-axis direction. The wafer W is held on the second stage 14B. As shown in FIG. 6B, reticle stage 16 is arranged so as to straddle first stage 14 A, and between both stages 16 and 14 A, coil 18 A and Linimo-evenings 18 and 18 consisting of magnets 18B are interposed. When the exposure light from the light source 20 illuminates the reticle R from below through an illumination optical system (not shown), the circuit pattern in the elongated illumination area (corresponding to the exposure field of the projection optical system) is formed. Image reduced on wafer W via projection optics PL

It is T again. Therefore, in the case of this modification as well, if the mass ratio of the reticle stage 16 and the substrate stage 14 is set to be the same as the reduction magnification M pi of the projection optical system PL, as in each of the above embodiments, Scanning exposure of the circuit pattern is performed with the synchronization error of stages 16 and 14 always being zero. Similar effects can be obtained. In the first and second embodiments, the case where the photosensitive substrate is held horizontally on the substrate stage, that is, the case where a horizontal substrate stage is used has been exemplified, but the photosensitive substrate is held vertically on the substrate stage. That is, the present invention can be applied to an exposure apparatus that uses a vertically placed substrate stage.o In the first and second embodiments, a driving unit that drives the second stage in the non-scanning direction As an example, a case where a linear motor is used has been described, but the present invention is not limited to this, and a configuration may be used in which the second stage is driven in the non-scanning direction using a feed screw mechanism. good. As described above, according to the present invention, with a simple configuration, the stress generated in the structure constituting the apparatus is reduced, the inclination and the sway of the entire apparatus are suppressed, and the mask stage and the substrate stage can be connected. There is an unprecedented superior effect that the synchronization performance can be improved.

Claims

The scope of the claims 1. An exposure apparatus that transfers a pattern formed on the mask to the photosensitive substrate via a projection optical system while synchronously moving the mask and the photosensitive substrate. A substrate stage floating and supported on a base member When ;  A mask stage having a mass that is twice the reduction magnification of the projection optical system of the mass of the substrate stage; and a mask stage floatingly supported on the base member;  An exposure apparatus provided between the two stages and having a first linear camera that drives the substrate stage and the mask stage so as to move the mask and the substrate in opposite directions. 2. The road light according to claim 1, wherein the projection optical system is an optical system that projects an inverted image of a pattern formed on the mask on the photosensitive substrate. 3. The photosensitive substrate is horizontally held on a substrate stage, the mask is vertically held on the mask stage, and the projection optical system includes a plurality of transmission optical elements, a light splitter, and reflection optics. An optical system comprising a device and projecting the pattern of the mask arranged on an object plane onto the photosensitive substrate arranged on an image plane at a predetermined reduction magnification. 3. The exposure apparatus according to claim 1. 4. A half TTL alignment detection system capable of detecting both an alignment mark formed on the mask and the alignment mark on the photosensitive substrate via the light splitter. Item 4. The exposure apparatus according to Item 3. 5. The exposure apparatus according to claim 1, wherein a second linear motor that drives the mask stage is provided between the base member and the mask stage. 6. The exposure apparatus according to claim 5, wherein a third linear motor that drives the substrate stage is provided between the base member and the substrate stage. 7. A regenerative braking control circuit for finely adjusting the speed ratio of the two stages by the first linear motor during synchronous movement is provided in at least one of the second linear motor and the third linear motor. The exposure apparatus according to claim 6, wherein: 8. The substrate stage includes a first stage driven in a first direction in which the photosensitive substrate is synchronously moved, and the first stage holding the photosensitive substrate and moving physically in the first direction. And a second stage guided by the first stage and movable in a second direction orthogonal to the first direction, wherein the second stage is movable in a second direction orthogonal to the first direction. Exposure equipment, 9. The exposure apparatus according to claim 1, wherein the substrate stage is levitated and supported on a base member via an air bearing. 10. The exposure apparatus according to claim 1, wherein the mask stage is levitated and supported on a base member via an air bearing. 1 1. Projection optical system having an optical axis substantially orthogonal to the mask and the substrate A scanning exposure apparatus that transfers the pattern of the mask onto the substrate via the projection optical system.  Base and  A first stage for moving the mask on the base;  A second stage for moving the substrate on the base;  A driving system connected to the first stage and the second stage for synchronously moving the mask and the substrate at a speed ratio according to a magnification of the projection optical system;  The scanning exposure apparatus, wherein the drive system drives the first stage and the second stage in opposite directions along a predetermined direction so as to substantially cancel a reaction force generated by the synchronous movement. 12. The scanning exposure apparatus according to claim 11, wherein a mass ratio between the first stage and the second stage substantially matches a projection magnification of the projection optical system. 13. The projection optical system includes a refractive optical element and at least one reflective optical element, and is an optical system that reduces and projects a partially inverted image of the pattern of the mask onto the substrate. The scanning path light according to claim 11 or 12, wherein: 14. The projection optical system includes at least two reflection optical elements, and an image plane of the projection optical system is arranged on an object plane side with respect to the projection optical system. 3. The scanning exposure apparatus according to 2. 15. The projection optical system includes a mirror, a concave mirror, and a reflection optical element. 14. The scanning exposure apparatus according to claim 13, further comprising at least one of a beam splitter and a beam splitter. 16. The scanning device according to claim 14, wherein the projection optical system includes at least one of a mirror, a concave mirror, and a beam splitter as the reflection optical element. Exposure equipment. 17. The object plane and the image plane of the projection optical system are arranged in the same plane, and the first and second stages move the mask and the substrate along the plane, respectively. The scanning exposure apparatus according to claim 11. 18. The object plane and the image plane of the projection optical system are arranged in the same plane, and the first and second stages move the mask and the substrate along the plane, respectively. The scanning exposure apparatus according to claim 14. 19. The scanning exposure apparatus according to claim 14, further comprising an illumination system disposed on a side opposite to the projection optical system with respect to the base and configured to irradiate the mask with a light beam. 20. The scanning exposure apparatus according to claim 17, further comprising an illumination system arranged on a side opposite to the projection optical system with respect to the base and configured to irradiate the mask with a light beam. 21. The scanning exposure apparatus according to claim 18, further comprising an illumination system arranged on a side opposite to the projection optical system with respect to the base and configured to irradiate the mask with a light beam. 22. In a scanning exposure method for transferring a mask pattern onto a substrate via a projection optical system,  The mask and the substrate are arranged on the same plane perpendicular to the optical axis of the projection optical system,  Projecting a partial inverted image of the pattern of the mask onto the substrate,  A scanning exposure method comprising: synchronously moving the mask and the substrate in opposite directions along a predetermined direction on the plane, thereby substantially canceling a reaction force generated by the synchronous movement. 23. The scanning exposure method according to claim 22, wherein the mask and the substrate are synchronously moved at a speed ratio according to a magnification of the projection optical system. 24. In order to transfer the pattern of the mask by superimposing it on the pattern on the substrate, the speed ratio between the mask and the substrate is adjusted during the synchronous movement so that the pattern on the substrate is transferred to the pattern on the substrate. The scanning exposure method according to claim 22 or 23, wherein at least one of a magnification error and a distortion error with respect to a mask pattern image is corrected.