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WO1999051069A3 - Fiber heat sink and fiber heat exchanger - Google Patents

Fiber heat sink and fiber heat exchanger Download PDF

Info

Publication number
WO1999051069A3
WO1999051069A3 PCT/US1999/004282 US9904282W WO9951069A3 WO 1999051069 A3 WO1999051069 A3 WO 1999051069A3 US 9904282 W US9904282 W US 9904282W WO 9951069 A3 WO9951069 A3 WO 9951069A3
Authority
WO
WIPO (PCT)
Prior art keywords
fiber heat
fiber
heat exchanger
heat sink
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1999/004282
Other languages
French (fr)
Other versions
WO1999051069A2 (en
Inventor
Igor Ivakhnenko
Michael M Ohadi
Serguei V Dessiatoun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Maryland Baltimore
University of Maryland College Park
Original Assignee
University of Maryland Baltimore
University of Maryland College Park
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Maryland Baltimore, University of Maryland College Park filed Critical University of Maryland Baltimore
Priority to AU31819/99A priority Critical patent/AU3181999A/en
Publication of WO1999051069A2 publication Critical patent/WO1999051069A2/en
Publication of WO1999051069A3 publication Critical patent/WO1999051069A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W40/43—
    • H10W40/228—
    • H10W40/257—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)

Abstract

A fiber heat sink and a fiber heat exchanger utilize the high thermal conductivity and the high surface area achieved by fibers, such as carbon fibers (10), (43), for enhanced cooling of electronic components (12, 13) and other devices. The utilization of fiber technology provides an inexpensive, durable, and effective method of heat transfer and exchange.
PCT/US1999/004282 1998-03-30 1999-03-30 Fiber heat sink and fiber heat exchanger Ceased WO1999051069A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU31819/99A AU3181999A (en) 1998-03-30 1999-03-30 Fiber heat sink and fiber heat exchanger

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US7997798P 1998-03-30 1998-03-30
US60/079,977 1998-03-30
US9866998P 1998-09-01 1998-09-01
US60/098,669 1998-09-01

Publications (2)

Publication Number Publication Date
WO1999051069A2 WO1999051069A2 (en) 1999-10-07
WO1999051069A3 true WO1999051069A3 (en) 1999-12-09

Family

ID=26762644

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/004282 Ceased WO1999051069A2 (en) 1998-03-30 1999-03-30 Fiber heat sink and fiber heat exchanger

Country Status (2)

Country Link
AU (1) AU3181999A (en)
WO (1) WO1999051069A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9382874B2 (en) 2010-11-18 2016-07-05 Etalim Inc. Thermal acoustic passage for a stirling cycle transducer apparatus
US9394851B2 (en) 2009-07-10 2016-07-19 Etalim Inc. Stirling cycle transducer for converting between thermal energy and mechanical energy

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0008897D0 (en) * 2000-04-12 2000-05-31 Cheiros Technology Ltd Improvements relating to heat transfer
DE10212754B4 (en) * 2002-03-20 2004-04-08 Krause, Günter Heat exchanger
WO2006041325A1 (en) * 2004-10-08 2006-04-20 Verteletsky, Pavel Vasilievich Multi-filament heat sink
SE541352C2 (en) * 2015-06-03 2019-08-13 Apr Tech Ab Microfluidic array
SE543734C2 (en) 2019-03-11 2021-07-06 Apr Tech Ab Cooling of electronic components with an electrohydrodynamic flow unit
SE543441C2 (en) * 2019-03-26 2021-02-16 Centropy Ab Heat transfer device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4485429A (en) * 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US5077637A (en) * 1989-09-25 1991-12-31 The Charles Stark Draper Lab., Inc. Solid state directional thermal cable
US5150748A (en) * 1990-06-18 1992-09-29 Mcdonnell Douglas Corporation Advanced survivable radiator
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5542471A (en) * 1993-11-16 1996-08-06 Loral Vought System Corporation Heat transfer element having the thermally conductive fibers
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
US5655600A (en) * 1995-06-05 1997-08-12 Alliedsignal Inc. Composite plate pin or ribbon heat exchanger
US5769158A (en) * 1996-03-28 1998-06-23 Mitsubishi Denki Kabushiki Kaisha Interface portion structure and reinforcing structure of flexible thermal joint
US5852548A (en) * 1994-09-09 1998-12-22 Northrop Grumman Corporation Enhanced heat transfer in printed circuit boards and electronic components thereof

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4485429A (en) * 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US5077637A (en) * 1989-09-25 1991-12-31 The Charles Stark Draper Lab., Inc. Solid state directional thermal cable
US5150748A (en) * 1990-06-18 1992-09-29 Mcdonnell Douglas Corporation Advanced survivable radiator
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5542471A (en) * 1993-11-16 1996-08-06 Loral Vought System Corporation Heat transfer element having the thermally conductive fibers
US5852548A (en) * 1994-09-09 1998-12-22 Northrop Grumman Corporation Enhanced heat transfer in printed circuit boards and electronic components thereof
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
US5655600A (en) * 1995-06-05 1997-08-12 Alliedsignal Inc. Composite plate pin or ribbon heat exchanger
US5769158A (en) * 1996-03-28 1998-06-23 Mitsubishi Denki Kabushiki Kaisha Interface portion structure and reinforcing structure of flexible thermal joint

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9394851B2 (en) 2009-07-10 2016-07-19 Etalim Inc. Stirling cycle transducer for converting between thermal energy and mechanical energy
US9382874B2 (en) 2010-11-18 2016-07-05 Etalim Inc. Thermal acoustic passage for a stirling cycle transducer apparatus

Also Published As

Publication number Publication date
AU3181999A (en) 1999-10-18
WO1999051069A2 (en) 1999-10-07

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