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WO1999048139A3 - Apparatus for reducing heat loss - Google Patents

Apparatus for reducing heat loss Download PDF

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Publication number
WO1999048139A3
WO1999048139A3 PCT/US1999/003979 US9903979W WO9948139A3 WO 1999048139 A3 WO1999048139 A3 WO 1999048139A3 US 9903979 W US9903979 W US 9903979W WO 9948139 A3 WO9948139 A3 WO 9948139A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermal cycling
heat loss
perimeter
heat exchanger
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1999/003979
Other languages
French (fr)
Other versions
WO1999048139A2 (en
Inventor
Charles D Shaper
Khalid El-Awady
Hooman Bolandi
Peter Knoot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO1999048139A2 publication Critical patent/WO1999048139A2/en
Publication of WO1999048139A3 publication Critical patent/WO1999048139A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)

Abstract

An apparatus for reducing heat loss around the perimeter of a material substrate during thermal cycling is provided. The apparatus for reducing heat loss comprises a perimeter apparatus for surrounding the substrate. The apparatus rests in the same plane as a material substrate during thermal cycling and can be made of the same material as the substrate. Additionally, the apparatus can be one continuous piece or can be several perimeter pieces. To sense the temperature of a substrate during thermal cycling, a representative temperature can be obtained by embedding sensors in an auxiliary heater or in a heat exchanger, both of which are components of a thermal cycling module. A relatively flat sensor can be embedded between film layers in a foil heater. Additionally, sensors can be embedded inserted into a passageway in a heat exchanger so that they are flush with the each exchanger's top surface. The wires to the sensor can then be enclosed in casing that also removably secures the sensor in the heat exchanger.
PCT/US1999/003979 1998-03-18 1999-02-23 Apparatus for reducing heat loss Ceased WO1999048139A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4422298A 1998-03-18 1998-03-18
US09/044,222 1998-03-18

Publications (2)

Publication Number Publication Date
WO1999048139A2 WO1999048139A2 (en) 1999-09-23
WO1999048139A3 true WO1999048139A3 (en) 2000-03-09

Family

ID=21931158

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/003979 Ceased WO1999048139A2 (en) 1998-03-18 1999-02-23 Apparatus for reducing heat loss

Country Status (1)

Country Link
WO (1) WO1999048139A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8047643B2 (en) * 2008-09-03 2011-11-01 Xerox Corporation Temperature sensor mount for melt plate

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
JPH0637049A (en) * 1992-07-17 1994-02-10 Oki Electric Ind Co Ltd Plasma etching apparatus
EP0644578A2 (en) * 1993-09-16 1995-03-22 Hitachi, Ltd. Method of holding substrate and substrate holding system
EP0723141A1 (en) * 1995-01-17 1996-07-24 Applied Materials, Inc. Sensors for measuring temperature and methods of measuring workpiece temperatures
US5620560A (en) * 1994-10-05 1997-04-15 Tokyo Electron Limited Method and apparatus for heat-treating substrate
EP0821403A2 (en) * 1996-07-24 1998-01-28 Applied Materials, Inc. Semiconductor wafer support with graded thermal mass
WO1998005060A1 (en) * 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Multizone bake/chill thermal cycling module
EP0915499A2 (en) * 1997-11-05 1999-05-12 Tokyo Electron Limited Semiconductor wafer holding apparatus and semiconductor wafer storage chamber

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084671A (en) * 1987-09-02 1992-01-28 Tokyo Electron Limited Electric probing-test machine having a cooling system
US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
JPH0637049A (en) * 1992-07-17 1994-02-10 Oki Electric Ind Co Ltd Plasma etching apparatus
EP0644578A2 (en) * 1993-09-16 1995-03-22 Hitachi, Ltd. Method of holding substrate and substrate holding system
US5620560A (en) * 1994-10-05 1997-04-15 Tokyo Electron Limited Method and apparatus for heat-treating substrate
EP0723141A1 (en) * 1995-01-17 1996-07-24 Applied Materials, Inc. Sensors for measuring temperature and methods of measuring workpiece temperatures
EP0821403A2 (en) * 1996-07-24 1998-01-28 Applied Materials, Inc. Semiconductor wafer support with graded thermal mass
WO1998005060A1 (en) * 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Multizone bake/chill thermal cycling module
EP0915499A2 (en) * 1997-11-05 1999-05-12 Tokyo Electron Limited Semiconductor wafer holding apparatus and semiconductor wafer storage chamber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 252 (E - 1547) 13 May 1994 (1994-05-13) *

Also Published As

Publication number Publication date
WO1999048139A2 (en) 1999-09-23

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