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WO1998038652A3 - Pave resistif en couche epaisse et sa fabrication - Google Patents

Pave resistif en couche epaisse et sa fabrication Download PDF

Info

Publication number
WO1998038652A3
WO1998038652A3 PCT/IB1998/000133 IB9800133W WO9838652A3 WO 1998038652 A3 WO1998038652 A3 WO 1998038652A3 IB 9800133 W IB9800133 W IB 9800133W WO 9838652 A3 WO9838652 A3 WO 9838652A3
Authority
WO
WIPO (PCT)
Prior art keywords
sub
thick film
tcr
chip resistor
film chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB1998/000133
Other languages
English (en)
Other versions
WO1998038652A2 (fr
WO1998038652A9 (fr
Inventor
Hong Jyh Li
Ruey Tzong Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Philips Norden AB
Original Assignee
Koninklijke Philips Electronics NV
Philips Norden AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Philips Norden AB filed Critical Koninklijke Philips Electronics NV
Priority to JP10529230A priority Critical patent/JP2000509907A/ja
Priority to EP98900968A priority patent/EP0919061A2/fr
Publication of WO1998038652A2 publication Critical patent/WO1998038652A2/fr
Publication of WO1998038652A3 publication Critical patent/WO1998038652A3/fr
Anticipated expiration legal-status Critical
Publication of WO1998038652A9 publication Critical patent/WO1998038652A9/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

L'invention concerne un procédé amélioré permettant de fabriquer des pavés résistifs en couches épaisses pour la production de masse. En appliquant au moins deux couches de résistance par pavé résistif, on obtient moins de variance dans la valeur de la résistance finale si on fabrique les résistances, en production de masse, en utilisant des plaques de substrat. Moins de variance dans la valeur de la résistance implique moins d'activité d'ajustement, ce qui aboutit à une réduction considérable des coûts. De plus, quand on applique au moins deux sous-couches, on peut compenser le coefficient de température de la résistance (CTR) en utilisant un matériau résistant ayant un CTR positif pour une sous-couche et un matériau résistant ayant un CTR négatif pour l'autre sous-couche.
PCT/IB1998/000133 1997-02-26 1998-02-02 Pave resistif en couche epaisse et sa fabrication Ceased WO1998038652A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10529230A JP2000509907A (ja) 1997-02-26 1998-02-02 厚膜チップ抵抗器及びその製造
EP98900968A EP0919061A2 (fr) 1997-02-26 1998-02-02 Pave resistif en couche epaisse et sa fabrication

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP97200545 1997-02-26
EP97200545.8 1997-02-26

Publications (3)

Publication Number Publication Date
WO1998038652A2 WO1998038652A2 (fr) 1998-09-03
WO1998038652A3 true WO1998038652A3 (fr) 1998-12-10
WO1998038652A9 WO1998038652A9 (fr) 2001-07-05

Family

ID=8228051

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1998/000133 Ceased WO1998038652A2 (fr) 1997-02-26 1998-02-02 Pave resistif en couche epaisse et sa fabrication

Country Status (4)

Country Link
EP (1) EP0919061A2 (fr)
JP (1) JP2000509907A (fr)
TW (1) TW340976B (fr)
WO (1) WO1998038652A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7038572B2 (en) 2001-03-19 2006-05-02 Vishay Dale Electronics, Inc. Power chip resistor

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4803457A (en) * 1987-02-27 1989-02-07 Chapel Jr Roy W Compound resistor and manufacturing method therefore
US5258738A (en) * 1991-04-16 1993-11-02 U.S. Philips Corporation SMD-resistor
JPH0774002A (ja) * 1993-09-02 1995-03-17 Koa Corp 電子部品の製造方法
EP0657898A1 (fr) * 1993-12-10 1995-06-14 Koninklijke Philips Electronics N.V. Résistance électrique
JPH07153601A (ja) * 1993-12-01 1995-06-16 Hokuriku Toryo Kk チップ抵抗器の製造方法
JPH08172004A (ja) * 1994-10-18 1996-07-02 Taiyo Yuden Co Ltd チップ抵抗器の製造方法
JPH09190902A (ja) * 1996-01-10 1997-07-22 Rohm Co Ltd チップ型抵抗器の構造及びその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4803457A (en) * 1987-02-27 1989-02-07 Chapel Jr Roy W Compound resistor and manufacturing method therefore
US5258738A (en) * 1991-04-16 1993-11-02 U.S. Philips Corporation SMD-resistor
JPH0774002A (ja) * 1993-09-02 1995-03-17 Koa Corp 電子部品の製造方法
JPH07153601A (ja) * 1993-12-01 1995-06-16 Hokuriku Toryo Kk チップ抵抗器の製造方法
EP0657898A1 (fr) * 1993-12-10 1995-06-14 Koninklijke Philips Electronics N.V. Résistance électrique
JPH08172004A (ja) * 1994-10-18 1996-07-02 Taiyo Yuden Co Ltd チップ抵抗器の製造方法
JPH09190902A (ja) * 1996-01-10 1997-07-22 Rohm Co Ltd チップ型抵抗器の構造及びその製造方法

Also Published As

Publication number Publication date
JP2000509907A (ja) 2000-08-02
WO1998038652A2 (fr) 1998-09-03
EP0919061A2 (fr) 1999-06-02
TW340976B (en) 1998-09-21
WO1998038652A9 (fr) 2001-07-05

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