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WO1997037522A1 - Dispositif a equiper un support de composants electriques - Google Patents

Dispositif a equiper un support de composants electriques Download PDF

Info

Publication number
WO1997037522A1
WO1997037522A1 PCT/DE1997/000626 DE9700626W WO9737522A1 WO 1997037522 A1 WO1997037522 A1 WO 1997037522A1 DE 9700626 W DE9700626 W DE 9700626W WO 9737522 A1 WO9737522 A1 WO 9737522A1
Authority
WO
WIPO (PCT)
Prior art keywords
suction pipette
placement device
component
placement
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1997/000626
Other languages
German (de)
English (en)
Inventor
Rainer DÜBEL
Ernst Karpfinger
Gerhard Jonke
Johann Melf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to EP97920552A priority Critical patent/EP0890298A1/fr
Priority to JP9534809A priority patent/JP2000507743A/ja
Publication of WO1997037522A1 publication Critical patent/WO1997037522A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Definitions

  • Fitting device for placing an electrical component on a component carrier
  • the invention relates to placement devices for placing an electrical component on a carrier for the components with at least one suction pipette that can be lowered toward the carrier.
  • the object of the invention is to accelerate the placement process and to reduce the mechanical load on the device and the components.
  • the tactile sensor makes it possible to directly monitor the placement process with short transmission paths. Reaching the circuit board is signaled without any significant delay and the drive device is stopped. However, this requires a small overtravel, which is compensated for by the interposed telescopic suspension. This can work with a spring tension that limits the placement force to a harmless value. With such a placement device, the component can be placed on the printed circuit board at a constant high speed without it becoming too tight high mechanical stress. This makes it possible to shorten the placement time considerably and to increase the placement performance of the device accordingly.
  • the unsprung masses are reduced to a minimum, whereby the lowering speed can be increased even more.
  • the suspension is integrated in the pipette so that it itself serves as a sensor. This has the advantage that no additional disruptive parts can act on the differently designed components.
  • optical scanning according to claims 3 and 4 can be made very sensitive, so that the brake signals can be triggered after a very short spring travel.
  • the switching travel of the signal ring is 0.1 mm.
  • the drive device After sending the brake signal, the drive device runs on e.g. 0.2 to 0.3 mm, so that the movement of the unsprung part of the pipette can be completed after a distance of 0.3 to 0.4 mm. With such short spring travel, the mechanical load on the telescopic guide is reduced, so that the guide can be made very compact. This results in low unsprung masses and correspondingly low mass forces when the component is placed on the carrier.
  • the development according to claim 5 ensures that the part of the light beam which is aimed next to the signal ring is not thrown back to the reflection light barrier, so that when the signal ring is deflected into the area of the sensor, correspondingly marked differences in intensity at the receiving diode result.
  • the light barrier is mechanically separated from the suction pipette. It is assigned to the drive device and follows its feed movement. When the pipette tip is deflected into the suction pipette, there is a relative movement between the signal ring and the sensor, the input signal of which is modulated accordingly.
  • a particular advantage is that only one sensor is required for 12 suction pipettes of a turret, for example.
  • FIG. 1 shows a section through a turret head 1 of an assembly device (not shown) with an electrical component before it is placed on a printed circuit board
  • FIG. 2 shows part of the turret head according to FIG. 1 when the component is placed on it
  • Figure 3 shows the parts of Figure 2 in an enlarged view shortly after placing the component.
  • a turret 1 can be rotated step by step around a central axis according to the circular arrow shown. It is provided with star-shaped, radially displaceable suction pipettes 2, at the tip 3 of which an electrical component 4 can be held temporarily by means of a vacuum from a suction hose 10. In each case one of the suction pipettes 2 is in a loading position above a carrier 5 for the components 4, for example a printed circuit board.
  • the suction pipette 2 is gripped by a driver 6 of a drive tappet 7 of a drive device (not shown in more detail).
  • the drive plunger 7 can be displaced in the direction of the carrier 5 in accordance with the arrow direction indicated, this movement being transmitted to the suction pipette 2 and the component 4 being placed on the carrier 5.
  • the tip 3 of the suction pipette 2 is spring-mounted in the mounting direction and connected to a signal ring 8 which follows the relative movement between the tip 3 and the suction pipette 2.
  • an optical sensor 9 is attached to the driver 6, which is designed as an RP reflection light barrier. This emits a light beam in the direction of the signal ring 8, which is only partially reflected by the signal ring 8.
  • the other part of the light beam strikes an inclined conical surface 12 of the suction pipette 2 and is deflected by it so strongly that it is not reflected back to the receiving diode of the sensor 9.
  • FIG. 2 shows part of the turret 1 when the component 4 is placed on the carrier 5, the tip 3 not yet being compressed into the rest of the suction pipette 2.
  • the light beam of the sensor 9 indicated by the arrow is still directed unchanged at the upper edge of the signal ring 8.
  • FIG. 3 shows the end position of the suction pipette 2 with the component 4 above the carrier 5.
  • the drive plunger 7 is lowered slightly further toward the carrier 5 with the suction pipette 2 compared to the position according to FIG. 2, the tip 3 having been pressed accordingly into the remaining part of the suction pipette 2.
  • the force acting on the component 4 is limited by a compression spring, not shown, which presses the tip 3 in the direction of the carrier 5.
  • the signal ring 8 is connected to the tip 3 such that it follows the spring movement. It is accordingly raised here in relation to the remaining suction pipette 2 and the sensor 9.
  • the light beam now strikes the white, well reflecting surface of the signal ring 8, for example, and is largely reflected in a receiving diode of the sensor 9.
  • the intensity of the reflected radiation is increased so much that a signal for braking the drive device can be emitted by the sensor 9.
  • the lowering movement has come to a standstill.
  • the vacuum of the suction pipette can now be switched off, for example by means of a valve II (FIG. 1), as a result of which the component 4 detaches from the tip 3.
  • the drive device with the drive plunger 7 can then lift the suction pipette 2 again and pull it back into its starting position for receiving a new component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)

Abstract

Ce dispositif à équiper des supports de composants électriques comprend une pipette d'aspiration (2) que l'on peut faire descendre au moyen d'un mécanisme d'entraînement sur une plaquette de circuits imprimés (par exemple 5) avec le composant (4) qu'elle porte par aspiration. La pipette d'aspiration (2) comprend une pointe (3) montée sur ressorts dont la déviation lorsque la pipette se pose sur la plaquette de circuits imprimés déclenche un signal d'arrêt du mécanisme d'entraînement et compense le mouvement de freinage du mécanisme d'entraînement. Les composants (4) peuvent ainsi être posés rapidement et fiablement sur la plaquette de circuits imprimés (par exemple 5).
PCT/DE1997/000626 1996-03-28 1997-03-27 Dispositif a equiper un support de composants electriques Ceased WO1997037522A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP97920552A EP0890298A1 (fr) 1996-03-28 1997-03-27 Dispositif a equiper un support de composants electriques
JP9534809A JP2000507743A (ja) 1996-03-28 1997-03-27 電気的な構成エレメントを、構成エレメントのための担体に載着する装着装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19612391 1996-03-28
DE19612391.7 1996-03-28

Publications (1)

Publication Number Publication Date
WO1997037522A1 true WO1997037522A1 (fr) 1997-10-09

Family

ID=7789759

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/000626 Ceased WO1997037522A1 (fr) 1996-03-28 1997-03-27 Dispositif a equiper un support de composants electriques

Country Status (3)

Country Link
EP (1) EP0890298A1 (fr)
JP (1) JP2000507743A (fr)
WO (1) WO1997037522A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0906010A3 (fr) * 1997-09-30 2000-05-24 Siemens Aktiengesellschaft Dispositif pour le montage de composants électriques sur des supports de composants
US6250538B1 (en) 1999-04-30 2001-06-26 Siemens Aktiengesellschaft Method and apparatus for mounting electrical components that employs a compensation element
EP0997801A3 (fr) * 1998-10-27 2001-08-08 Karl-Heinz Schmall Méchanisme d'avancement linéaire pour outils d'usinage
US6516514B1 (en) 1999-06-01 2003-02-11 Siemens Aktiengesellschaft Method for mounting components onto a substrate
US6973713B1 (en) 1999-04-30 2005-12-13 Siemens Aktiengesellschaft Apparatus and system for operating an automatic component mounting unit for mounting components onto a substrate of an electrical assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657470A (en) * 1984-11-15 1987-04-14 Westinghouse Electric Corp. Robotic end effector
US5420488A (en) * 1993-12-03 1995-05-30 Motorola, Inc. Vacuum nozzle having dynamically adjustable placement force

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657470A (en) * 1984-11-15 1987-04-14 Westinghouse Electric Corp. Robotic end effector
US5420488A (en) * 1993-12-03 1995-05-30 Motorola, Inc. Vacuum nozzle having dynamically adjustable placement force

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0906010A3 (fr) * 1997-09-30 2000-05-24 Siemens Aktiengesellschaft Dispositif pour le montage de composants électriques sur des supports de composants
EP0997801A3 (fr) * 1998-10-27 2001-08-08 Karl-Heinz Schmall Méchanisme d'avancement linéaire pour outils d'usinage
US6250538B1 (en) 1999-04-30 2001-06-26 Siemens Aktiengesellschaft Method and apparatus for mounting electrical components that employs a compensation element
US6973713B1 (en) 1999-04-30 2005-12-13 Siemens Aktiengesellschaft Apparatus and system for operating an automatic component mounting unit for mounting components onto a substrate of an electrical assembly
US6516514B1 (en) 1999-06-01 2003-02-11 Siemens Aktiengesellschaft Method for mounting components onto a substrate

Also Published As

Publication number Publication date
EP0890298A1 (fr) 1999-01-13
JP2000507743A (ja) 2000-06-20

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