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WO1997021229A3 - Melange electroconducteur de resine de reaction - Google Patents

Melange electroconducteur de resine de reaction Download PDF

Info

Publication number
WO1997021229A3
WO1997021229A3 PCT/DE1996/002322 DE9602322W WO9721229A3 WO 1997021229 A3 WO1997021229 A3 WO 1997021229A3 DE 9602322 W DE9602322 W DE 9602322W WO 9721229 A3 WO9721229 A3 WO 9721229A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conducting
resin mixture
reaction resin
hardened
conducting reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1996/002322
Other languages
German (de)
English (en)
Other versions
WO1997021229A2 (fr
Inventor
Heiner Bayer
Wilhelm Hekele
Erich Kattner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to JP9520867A priority Critical patent/JP2000501551A/ja
Priority to EP96946140A priority patent/EP0865653A2/fr
Publication of WO1997021229A2 publication Critical patent/WO1997021229A2/fr
Publication of WO1997021229A3 publication Critical patent/WO1997021229A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)

Abstract

L'invention concerne un mélange de résine de réaction à base d'époxyde pour produire des composés adhésifs électroconducteurs et des structures électroconductrices. Ce mélange peut durcir au moyen d'un système initiateur sélectionné, aussi bien par rayonnement ultraviolet que par voie thermique. Ce mélange de résine de réaction à un composant, stable au stockage, peut être appliqué, par exemple, par sérigraphie. Il durcit rapidement aux UV et complètement par voie thermique.
PCT/DE1996/002322 1995-12-06 1996-12-04 Melange electroconducteur de resine de reaction Ceased WO1997021229A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9520867A JP2000501551A (ja) 1995-12-06 1996-12-04 導電性反応樹脂混合物
EP96946140A EP0865653A2 (fr) 1995-12-06 1996-12-04 Melange electroconducteur de resine de reaction

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19545522.3 1995-12-06
DE19545522 1995-12-06

Publications (2)

Publication Number Publication Date
WO1997021229A2 WO1997021229A2 (fr) 1997-06-12
WO1997021229A3 true WO1997021229A3 (fr) 1997-08-07

Family

ID=7779358

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/002322 Ceased WO1997021229A2 (fr) 1995-12-06 1996-12-04 Melange electroconducteur de resine de reaction

Country Status (3)

Country Link
EP (1) EP0865653A2 (fr)
JP (1) JP2000501551A (fr)
WO (1) WO1997021229A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU711786B2 (en) * 1997-05-16 1999-10-21 National Starch And Chemical Investment Holding Corporation Reactive radiation- or thermally-initiated cationically- curable epoxide monomers and compositions made from those monomers
US6020508A (en) * 1997-05-16 2000-02-01 National Starch And Chemical Investment Holding Corporation Radiation- or thermally-initiated cationically-curable epoxide compounds and compositions made from those compounds
JP2002097443A (ja) * 2000-09-21 2002-04-02 Hitachi Chem Co Ltd 接着剤組成物及びこれを用いた回路接続材料並びに接続体
DE10062865A1 (de) * 2000-12-16 2002-07-04 Technoplast Beschichtungsgmbh Leitfähige, kratzfeste und bedruckbare Oberflächen
WO2004022662A1 (fr) 2002-09-04 2004-03-18 Koninklijke Philips Electronics N.V. Procede et dispositif pour fixer des objets sous forme de plaques
JP5953131B2 (ja) * 2011-06-10 2016-07-20 積水化学工業株式会社 異方性導電材料、接続構造体及び接続構造体の製造方法
CN103087640A (zh) * 2011-11-08 2013-05-08 汉高股份有限公司 双固化粘合剂组合物及其用途以及粘合基底的方法
BR112015007082A2 (pt) * 2012-09-29 2017-07-04 3M Innovative Properties Co composição adesiva e fita adesiva
JP2015168803A (ja) * 2014-03-10 2015-09-28 日立化成株式会社 導電性接着剤組成物、接続体、太陽電池モジュール及びその製造方法
WO2018180685A1 (fr) * 2017-03-30 2018-10-04 デクセリアルズ株式会社 Adhésif électroconducteur anisotrope et procédé de production de corps de connexion
JP2018178125A (ja) * 2018-06-26 2018-11-15 日立化成株式会社 導電性接着剤組成物、接続体、太陽電池モジュール及びその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0234347A1 (fr) * 1986-02-24 1987-09-02 International Business Machines Corporation Composition conduisant l'électricité et son utilisation
DE3939628A1 (de) * 1989-11-30 1991-06-06 Siemens Ag Verfahren zur befestigung von bauelementen und integrierten halbleiterschaltungen auf schichtschaltungen
JPH04255776A (ja) * 1991-02-07 1992-09-10 Hitachi Chem Co Ltd 紫外線硬化型接着剤シートその製造法その製造法に用いる装置その接着剤シートを用いて配線板用基板を製造する方法およびその接着剤シートを用いて配線板を製造する方法
EP0584570A1 (fr) * 1992-08-10 1994-03-02 Siemens Aktiengesellschaft Composition de résine époxy contenant des sels de sulphonium
EP0653763A1 (fr) * 1993-11-17 1995-05-17 SOPHIA SYSTEMS Co., Ltd. Matériau polymère durcissable par rayonnement UV, sans solvent, conducteur

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0234347A1 (fr) * 1986-02-24 1987-09-02 International Business Machines Corporation Composition conduisant l'électricité et son utilisation
DE3939628A1 (de) * 1989-11-30 1991-06-06 Siemens Ag Verfahren zur befestigung von bauelementen und integrierten halbleiterschaltungen auf schichtschaltungen
JPH04255776A (ja) * 1991-02-07 1992-09-10 Hitachi Chem Co Ltd 紫外線硬化型接着剤シートその製造法その製造法に用いる装置その接着剤シートを用いて配線板用基板を製造する方法およびその接着剤シートを用いて配線板を製造する方法
EP0584570A1 (fr) * 1992-08-10 1994-03-02 Siemens Aktiengesellschaft Composition de résine époxy contenant des sels de sulphonium
EP0653763A1 (fr) * 1993-11-17 1995-05-17 SOPHIA SYSTEMS Co., Ltd. Matériau polymère durcissable par rayonnement UV, sans solvent, conducteur

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 9243, Derwent World Patents Index; Class A18, AN 92-353606, XP002032213 *

Also Published As

Publication number Publication date
EP0865653A2 (fr) 1998-09-23
JP2000501551A (ja) 2000-02-08
WO1997021229A2 (fr) 1997-06-12

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