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WO1997008741A1 - Plaque d'aspiration pour tranche - Google Patents

Plaque d'aspiration pour tranche Download PDF

Info

Publication number
WO1997008741A1
WO1997008741A1 PCT/DE1996/001451 DE9601451W WO9708741A1 WO 1997008741 A1 WO1997008741 A1 WO 1997008741A1 DE 9601451 W DE9601451 W DE 9601451W WO 9708741 A1 WO9708741 A1 WO 9708741A1
Authority
WO
WIPO (PCT)
Prior art keywords
webs
double
suction
suction plate
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1996/001451
Other languages
German (de)
English (en)
Inventor
Wilfried Weininger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO1997008741A1 publication Critical patent/WO1997008741A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/78—

Definitions

  • the invention relates to a suction plate for wafers.
  • Suction plates for wafers so-called chucks, are known in which a plurality of concentric webs are arranged on a suction surface at a short distance from one another, which are at a small distance from one another.
  • the upper edges of the webs form a wafer support surface.
  • the invention has for its object to provide a suction plate for wafers in which the problem of the uneven support of wafers caused by dirt particles is less.
  • a vacuum can be generated in the first cavity system, which enables a wafer to be sucked in with the suction plate.
  • the suction plate according to the invention can be produced with less effort than this due to the smaller number of webs compared to the subject of the prior art described, so that considerable cost savings are possible.
  • Figure 1 shows an embodiment of the suction plate in a plan view of the suction surface
  • Figure 2 shows an enlarged detail of Figure 1 in one
  • Figure 3b shows an interrupted, circular double web in plan view.
  • Figure 1 shows on a suction surface 2 five double webs 1, which are circular and are arranged concentrically to the center of the suction surface 2. They are regularly spaced from one another so that they are regularly distributed over the entire suction surface 2.
  • the suction surface 2 has approximately the dimensions of a wafer that can be sucked with the suction plate.
  • the upper edges of the double webs 1, which form a plane, form a wafer support surface on which a wafer rests during suction. They are to be kept as narrow as possible in order to make the contact area as small as possible, since this is the area critical for deposits of dirt particles.
  • the outermost double web 1 has a rectilinear section 6, so that it is adapted to the shape of a conventional wafer. It is also possible for several of the double webs 1 to have such straight sections 6.
  • Each double web 1 is formed by two webs 3. The distance between these two webs 3 is much smaller than that between two of the double webs 1.
  • a double web 1 lying further outside encloses a respectively further inner double bar 1 completely.
  • FIG. 3a shows one of these double webs 1 again in a top view.
  • the double webs 1 may be interrupted in accordance with FIG. 3b, so that, for example in a modification of FIG. 1 or FIG. 3a, they have double web segments 1a which, according to FIG. 3b, can represent circular segments, for example.
  • non-circular double webs 1 of course there are no circular segments as double web segments 1 a, but other shapes.
  • the double webs 1 do not have to be circular, but can also be rectangular, for example.
  • first openings 7 in the suction surface 2 Between the two webs 3 of each double web 1 in FIG. 1 there are first openings 7 in the suction surface 2 to a first cavity system 4 located below it.
  • the openings 7 have the shape of holes, but they can also have other shapes, such as for example Slits.
  • the first cavity system 4 has interconnected first cylindrical channels in which a negative pressure can be generated. They run radially to the center of the suction surface 2 and are arranged here regularly, approximately at an angle of 60 ° to each other. If the negative pressure is now generated in the first cavity system 4, suction is generated between the webs 3 of each double web 1, so that a wafer can be sucked up by the suction plate. The distance between the webs 3 should be as small as possible so that a strong suction is created. In addition, this prevents the wafer from bending downward in this area due to the suction.
  • compressed air can otherwise escape through the wafer between the double webs 1 via the second cavity system 5, so that the wafer is not arched away from the suction surface 2.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne une plaque d'aspiration pour une tranche, dans laquelle se trouvent quelques segments doubles concentriques (1) sur une surface d'aspiration (2). La distance entre les deux segments respectifs (3) formant les segments doubles (1) est très faible par rapport à celle entre les segments doubles (1). Lors de l'aspiration d'une tranche, une dépression est créée entre les segments (3) de chaque segment double (1), tandis que la pression entre les segments doubles (1) est la même que la pression ambiante. La surface de support de tranche formée par les surfaces supérieures très étroites des segments (3) est de ce fait très petite et ainsi, seules quelques particules de poussière s'y déposent. En outre, la réalisation et le nettoyage de la plaque d'aspiration sont très simples.
PCT/DE1996/001451 1995-08-22 1996-08-02 Plaque d'aspiration pour tranche Ceased WO1997008741A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19530858A DE19530858C1 (de) 1995-08-22 1995-08-22 Ansaugplatte für Wafer
DE19530858.1 1995-08-22

Publications (1)

Publication Number Publication Date
WO1997008741A1 true WO1997008741A1 (fr) 1997-03-06

Family

ID=7770094

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1996/001451 Ceased WO1997008741A1 (fr) 1995-08-22 1996-08-02 Plaque d'aspiration pour tranche

Country Status (2)

Country Link
DE (1) DE19530858C1 (fr)
WO (1) WO1997008741A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103691704A (zh) * 2013-12-19 2014-04-02 合肥京东方光电科技有限公司 一种清洁装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19716123C2 (de) 1997-04-17 2000-01-27 Steag Hamatech Ag Vorrichtung zum Bewegen von Substraten durch eine Substrat-Behandlungseinrichtung
CH695075A5 (de) * 2000-07-03 2005-11-30 Esec Trading Sa Greifwerkzeug.
DE10216985C1 (de) * 2002-04-16 2003-04-10 Tobias Krebs Saugspannplatte für Vakuum-Spannsysteme

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03228348A (ja) * 1990-02-02 1991-10-09 Toshiba Ceramics Co Ltd 半導体ウエハ用真空チャック
EP0465017A1 (fr) * 1990-06-29 1992-01-08 Digital Equipment Corporation Fixation et méthode pour tester des circuits intégrés
JPH0582631A (ja) * 1991-09-20 1993-04-02 Toshiba Ceramics Co Ltd 半導体ウエーハ用真空チヤツク
JPH0851143A (ja) * 1992-07-20 1996-02-20 Nikon Corp 基板保持装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD256952B5 (de) * 1987-01-02 1993-05-19 Jenoptik Jena Gmbh Anordnung zur ebenen lagerung und halterung eines werkstueckes
DE69130434T2 (de) * 1990-06-29 1999-04-29 Canon K.K., Tokio/Tokyo Platte zum Arbeiten unter Vakuum

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03228348A (ja) * 1990-02-02 1991-10-09 Toshiba Ceramics Co Ltd 半導体ウエハ用真空チャック
EP0465017A1 (fr) * 1990-06-29 1992-01-08 Digital Equipment Corporation Fixation et méthode pour tester des circuits intégrés
JPH0582631A (ja) * 1991-09-20 1993-04-02 Toshiba Ceramics Co Ltd 半導体ウエーハ用真空チヤツク
JPH0851143A (ja) * 1992-07-20 1996-02-20 Nikon Corp 基板保持装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 16, no. 4 (E - 1151) 8 January 1992 (1992-01-08) *
PATENT ABSTRACTS OF JAPAN vol. 17, no. 415 (E - 1407) 3 August 1993 (1993-08-03) *
PATENT ABSTRACTS OF JAPAN vol. 960, no. 002 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103691704A (zh) * 2013-12-19 2014-04-02 合肥京东方光电科技有限公司 一种清洁装置
CN103691704B (zh) * 2013-12-19 2015-12-09 合肥京东方光电科技有限公司 一种清洁装置

Also Published As

Publication number Publication date
DE19530858C1 (de) 1997-01-23

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