WO1996028846A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- WO1996028846A1 WO1996028846A1 PCT/GB1996/000567 GB9600567W WO9628846A1 WO 1996028846 A1 WO1996028846 A1 WO 1996028846A1 GB 9600567 W GB9600567 W GB 9600567W WO 9628846 A1 WO9628846 A1 WO 9628846A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fins
- metal
- heat sink
- walls
- wax
- Prior art date
Links
- 239000004411 aluminium Substances 0.000 claims abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 8
- 230000004927 fusion Effects 0.000 claims description 5
- 239000001993 wax Substances 0.000 description 16
- 239000007788 liquid Substances 0.000 description 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Definitions
- This invention relates to heat sinks particularly for use with devices, typically electrical or electronic devices for dissipating heat generated by such devices.
- heat sinks are well known some of which comprise a metal structure having an extended surface area which is exposed to a current of air or liquid as the heat dissipating medium.
- the air current may be by natural convection or may be fan generated.
- the liquid may be pumped.
- Another known form of heat sink which may also be force cooled, has the metal structure in the form of a framework forming a plurality of cells each housing a body of wax. The wax absorbs heat delivered to one of the metal walls of the framework firstly by temperature increase and then by phase change, from solid to liquid, which is equivalent to a temperature rise of about 150°C.
- a heat sink comprising a unitary metal framework made of highly thermally-conductive metal, having a pair of metal walls extending substantially parallel to each other and held in spaced mutual relationship by a plurality of metal fins, the fins being substantially parallel to each other and extending transversely to the metal walls, the arrangement being such that the framework defines a plurality of cells between adjacent fins, the cells being substantially filled with a fill material of low thermal conductivity and high latent heat of fusion, characterised by selecting the following features in combination: i) the metal is aluminium; ii) the fins have a thickness in the range 0.10 to
- the fill material is a wax.
- the effective thermal resistance of the heat sink is very low, significantly lower than hitherto which results in the temperature of the metal wall input face being maintained at a comparatively low temperature, typically not more than 5°C greater than the temperature at which the wax fill material melts, until the entirety of the wax fill material has melted.
- the heat sink is comparatively small in size and weight.
- the wax fill material may be any one of a number of different waxes having different melt temperatures and latent heat of fusion.
- Particular waxes may be selected for any particular application of the heat sink, for example from the data listed in the "Handbook of Chemistry and Physics" published from time to time by CRC Press, Inc. (for example, the 65th edition published in 1984/5) .
- the waxes may be long-chain hydrocarbons or silicone based materials. They are selected because they are inexpensive and non-toxic, usually with a melting temperature below 150°C. Also, they have comparatively low thermal conductivity.
- the drawing shows a heat sink 10 comprising a unitary metal framework made of aluminium which is a highly thermally-conductive metal.
- the framework is formed of a pair of substantially parallel walls 1 which are comparatively thick and which are interconnected and held in spaced mutual relationship by a plurality of spaced fins 2 which are comparatively thin.
- the fins 2 are substantially parallel to each other and extend transversely, preferably orthogonally, to the walls 1.
- the spaces between adjacent fins 2 and bonded by the walls 1 define cells 4 which are substantially filled with wax material of low thermal conductivity and high latent heat of fusion.
- the fins 2 are about 0.15 mm thick and have a pitch or spacing 3 which is less than 1.5 mm and for example 0.'65mm.
- the walls 1 are typically 0.4mm in thickness and are spaced apart typically by about 5 to 10mm although this is not critical.
- the wax may for example be Naphthalene 1,7- dichloro which has a melting point of about 63°C and a latent heat of fusion of about 250 KJ/kg.
- one of the metal walls 1 forms the heat input face of the heat sink 10 and is placed in intimate contact with a device which is to be cooled. Because the aluminium is highly thermally conductive heat is rapidly transferred by conduction to each of the fins 2.
- the fins 2 are both thin and closely spaced so that there is a very large increase in surface area of fins and wax.
- the thickness of each wax filled cell 4 is comparatively small so that the thermal path length to the centre of each cell 4 is comparatively small and accordingly the thermal resistance of the sink 10 is comparatively low notwithstanding the low thermal conductivity of the wax.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat sink (10) is formed by an aluminium framework composed of thick walls (1) interconnected by thin fins (2). The fins (2) are about 0.10 to 0.20 mm in thickness and are spaced apart by about 0.5 mm to 1.5 mm so as to form cells (4). The cells (4) are filled with a wax.
Description
HEAT S INK
This invention relates to heat sinks particularly for use with devices, typically electrical or electronic devices for dissipating heat generated by such devices.
Various forms of heat sinks are well known some of which comprise a metal structure having an extended surface area which is exposed to a current of air or liquid as the heat dissipating medium. The air current may be by natural convection or may be fan generated. The liquid may be pumped. Another known form of heat sink, which may also be force cooled, has the metal structure in the form of a framework forming a plurality of cells each housing a body of wax. The wax absorbs heat delivered to one of the metal walls of the framework firstly by temperature increase and then by phase change, from solid to liquid, which is equivalent to a temperature rise of about 150°C.
It is an object of the present invention to provide a new and improved form of heat sink.
According to the present invention there is provided a heat sink comprising a unitary metal framework made of highly thermally-conductive metal, having a pair of metal walls extending substantially parallel to each other and held in spaced mutual relationship by a plurality of metal fins, the fins being substantially parallel to each other and extending transversely to the metal walls, the arrangement being such that the framework defines a plurality of cells between adjacent fins, the cells being substantially filled with a fill material of low thermal conductivity and high latent heat of fusion, characterised by selecting the following features in combination: i) the metal is aluminium; ii) the fins have a thickness in the range 0.10 to
0.20 mm; iii) the spacing between the fins is in the range 0.5 to 1.5 mm; iv) the fill material is a wax.
By virtue of the present invention the effective thermal resistance of the heat sink is very low, significantly lower than hitherto which results in the temperature of the metal wall input face being maintained at a comparatively low temperature, typically not more than 5°C greater than the temperature at which the wax fill material melts, until the entirety of the wax fill material has melted. Thus there is highly efficient removal of heat from the heat source and forced cooling of the heat sink is not required. Additionally, the heat sink is comparatively small in size and weight.
It will be understood that the wax fill material may be any one of a number of different waxes having different melt temperatures and latent heat of fusion. Particular waxes may be selected for any particular application of the heat sink, for example from the data listed in the "Handbook of Chemistry and Physics" published from time to time by CRC Press, Inc. (for example, the 65th edition published in 1984/5) . The waxes may be long-chain hydrocarbons or silicone based materials. They are selected because they are inexpensive and non-toxic, usually with a melting temperature below 150°C. Also, they have comparatively low thermal conductivity.
An embodiment of the present invention will now be described by way of example with reference to the accompany diagrammatic drawing.
The drawing shows a heat sink 10 comprising a unitary metal framework made of aluminium which is a highly thermally-conductive metal. The framework is formed of a pair of substantially parallel walls 1 which are comparatively thick and which are interconnected and held in spaced mutual relationship by a plurality of spaced fins 2 which are comparatively thin. The fins 2 are substantially parallel to each other and extend transversely, preferably orthogonally, to the walls 1. The spaces between adjacent fins 2 and bonded by the walls 1 define cells 4 which are substantially filled with wax
material of low thermal conductivity and high latent heat of fusion.
The fins 2 are about 0.15 mm thick and have a pitch or spacing 3 which is less than 1.5 mm and for example 0.'65mm. The walls 1 are typically 0.4mm in thickness and are spaced apart typically by about 5 to 10mm although this is not critical. The wax may for example be Naphthalene 1,7- dichloro which has a melting point of about 63°C and a latent heat of fusion of about 250 KJ/kg.
In use, one of the metal walls 1 forms the heat input face of the heat sink 10 and is placed in intimate contact with a device which is to be cooled. Because the aluminium is highly thermally conductive heat is rapidly transferred by conduction to each of the fins 2. The fins 2 are both thin and closely spaced so that there is a very large increase in surface area of fins and wax. The thickness of each wax filled cell 4 is comparatively small so that the thermal path length to the centre of each cell 4 is comparatively small and accordingly the thermal resistance of the sink 10 is comparatively low notwithstanding the low thermal conductivity of the wax. This results in the temperature of the heat input face 1 being held at not more than about 68°C which is only 5°C more than the temperature at which the wax melts until such time as the entirety of the wax has melted. Heat dissipation is therefore highly efficient without any requirement to have forced cooling or large exposed surface areas with fin pitches typically greater than 2mm suitable for natural or forced convection.
Claims
Claims
1 A heat sink comprising a unitary metal framework made of highly thermally-conductive metal, having a pair of metal walls (1) extending substantially parallel to each other and held in spaced mutual relationship by a plurality of metal fins (2) , the fins (2) being substantially parallel to each other and extending transversely to the metal walls (1) , the arrangement being such that the framework defines a plurality of cells (4) between adjacent fins, the cells being substantially filled with a fill material of low thermal conductivity and high latent heat of fusion, characterised by selecting the following features in combination: i) the metal is aluminium; ii) the fins have a thickness in the range 0.10 to 0.20 mm; iii) the spacing between the fins is in the range 0.5 to 1.5 mm; iv) the fill material is a wax.
2 A heat sink as claimed in Claim 1, wherein the walls (1) are about 0.4mm in thickness and are spaced apart by a distance in the range 5 to 10mm.
3 A heat sink as claimed in Claim 1 and substantially as hereinbefore described with reference to the accompanying drawing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9505069.6 | 1995-03-14 | ||
GBGB9505069.6A GB9505069D0 (en) | 1995-03-14 | 1995-03-14 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996028846A1 true WO1996028846A1 (en) | 1996-09-19 |
Family
ID=10771136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB1996/000567 WO1996028846A1 (en) | 1995-03-14 | 1996-03-12 | Heat sink |
Country Status (3)
Country | Link |
---|---|
GB (1) | GB9505069D0 (en) |
IL (1) | IL117464A0 (en) |
WO (1) | WO1996028846A1 (en) |
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---|---|---|---|---|
WO2000037873A1 (en) * | 1998-12-22 | 2000-06-29 | Telefonaktiebolaget Lm Ericsson (Publ) | A device for temperature control |
EP0987799A3 (en) * | 1998-09-11 | 2001-01-10 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
WO2001069360A1 (en) * | 2000-03-16 | 2001-09-20 | Ekl Ag | Cooling device for electronic components |
US6351478B1 (en) | 1998-09-11 | 2002-02-26 | Cutting Edge Optronics, Inc. | Passively cooled solid-state laser |
US7170919B2 (en) | 2003-06-23 | 2007-01-30 | Northrop Grumman Corporation | Diode-pumped solid-state laser gain module |
US7305016B2 (en) | 2005-03-10 | 2007-12-04 | Northrop Grumman Corporation | Laser diode package with an internal fluid cooling channel |
US7495848B2 (en) | 2003-07-24 | 2009-02-24 | Northrop Grumman Corporation | Cast laser optical bench |
CN100568492C (en) * | 2006-12-06 | 2009-12-09 | 中国科学院电工研究所 | Heat radiator of computer CPU |
CN102065669A (en) * | 2010-11-16 | 2011-05-18 | 浙江大学 | Efficient cooling system for outdoor mobile communication base station equipment |
WO2011159455A1 (en) * | 2010-06-18 | 2011-12-22 | Midtronics, Inc. | Battery maintenance device with thermal buffer |
WO2012107523A1 (en) * | 2011-02-11 | 2012-08-16 | Commissariat à l'énergie atomique et aux énergies alternatives | Heat-absorbing device with phase-change material |
US8513949B2 (en) | 2000-03-27 | 2013-08-20 | Midtronics, Inc. | Electronic battery tester or charger with databus connection |
US20140268564A1 (en) * | 2013-03-15 | 2014-09-18 | Finsix Corporation | Method and apparatus for controlling heat in power conversion systems |
US8872516B2 (en) | 2000-03-27 | 2014-10-28 | Midtronics, Inc. | Electronic battery tester mounted in a vehicle |
US8872517B2 (en) | 1996-07-29 | 2014-10-28 | Midtronics, Inc. | Electronic battery tester with battery age input |
US8937976B2 (en) | 2012-08-15 | 2015-01-20 | Northrop Grumman Systems Corp. | Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier |
US8958998B2 (en) | 1997-11-03 | 2015-02-17 | Midtronics, Inc. | Electronic battery tester with network communication |
US8963550B2 (en) | 2004-08-20 | 2015-02-24 | Midtronics, Inc. | System for automatically gathering battery information |
US9018958B2 (en) | 2003-09-05 | 2015-04-28 | Midtronics, Inc. | Method and apparatus for measuring a parameter of a vehicle electrical system |
US9052366B2 (en) | 2000-03-27 | 2015-06-09 | Midtronics, Inc. | Battery testers with secondary functionality |
US9201120B2 (en) | 2010-08-12 | 2015-12-01 | Midtronics, Inc. | Electronic battery tester for testing storage battery |
US9229062B2 (en) | 2010-05-27 | 2016-01-05 | Midtronics, Inc. | Electronic storage battery diagnostic system |
US9244100B2 (en) | 2013-03-15 | 2016-01-26 | Midtronics, Inc. | Current clamp with jaw closure detection |
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US9851411B2 (en) | 2012-06-28 | 2017-12-26 | Keith S. Champlin | Suppressing HF cable oscillations during dynamic measurements of cells and batteries |
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JPH04263000A (en) * | 1991-02-19 | 1992-09-18 | Aisin Seiki Co Ltd | Body temperature remover for space suit |
-
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-
1996
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- 1996-03-13 IL IL11746496A patent/IL117464A0/en unknown
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EP0987799A3 (en) * | 1998-09-11 | 2001-01-10 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
US6351478B1 (en) | 1998-09-11 | 2002-02-26 | Cutting Edge Optronics, Inc. | Passively cooled solid-state laser |
US6570895B2 (en) | 1998-09-11 | 2003-05-27 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
WO2000037873A1 (en) * | 1998-12-22 | 2000-06-29 | Telefonaktiebolaget Lm Ericsson (Publ) | A device for temperature control |
WO2001069360A1 (en) * | 2000-03-16 | 2001-09-20 | Ekl Ag | Cooling device for electronic components |
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