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WO1996028364A1 - Packaging damper for electronic components - Google Patents

Packaging damper for electronic components Download PDF

Info

Publication number
WO1996028364A1
WO1996028364A1 PCT/FI1996/000144 FI9600144W WO9628364A1 WO 1996028364 A1 WO1996028364 A1 WO 1996028364A1 FI 9600144 W FI9600144 W FI 9600144W WO 9628364 A1 WO9628364 A1 WO 9628364A1
Authority
WO
WIPO (PCT)
Prior art keywords
packaging
damper
pad section
corrugated board
board sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FI1996/000144
Other languages
French (fr)
Inventor
Juhani Pelander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Original Assignee
Nokia Telecommunications Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Telecommunications Oy filed Critical Nokia Telecommunications Oy
Priority to AU48813/96A priority Critical patent/AU4881396A/en
Publication of WO1996028364A1 publication Critical patent/WO1996028364A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/03—Wrappers or envelopes with shock-absorbing properties, e.g. bubble films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/46—Applications of disintegrable, dissolvable or edible materials
    • B65D65/466—Bio- or photodegradable packaging materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
    • Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics

Definitions

  • the present invention relates to a packaging damper for electronic components and devices, especially for printed circuit boards, said packaging damper comprising a pad section, which consists of an envelope manufactured of wood fibre material and of shredded wood fibre material provided inside the envelope.
  • dampers fulfill the tasks required of them fairly well, they also have disadvantages.
  • the greatest disadvantage is that they burden the environment, since the material used in them is poorly suited for recycling. Thus, they usually end up in dumping grounds or in the environment to pollute nature. Their disposal also causes problems, since for instance their burning liberates toxic gases.
  • dampers are also rather expensive, especially as they cannot be recycled.
  • the object of the present invention is to obviate the problems described above, without compromising in any manner over the effectiveness of the damping, however.
  • This is achieved with the packaging damper according to the invention mainly characterized in that a corrugated board sheet manufactured of wood fibre material is attached on at least one side of the pad section.
  • the keyword of the present invention is recyclability, since the packaging damper consists of recyclable material in its entirety, preferably of unbleached wood fibre material .
  • the pad section damps blows directed to the package and the corrugated board attached to the pad section ensures that the packaging damper endures well the sharp shapes of different components. This is particularly important when the packaging damper of the invention is used as an intermediate layer in packing printed circuit boards. If the corrugated board in located on only one side of the packaging damper, the corrugated board must naturally face the component side of the printed circuit board.
  • a product packed by means of the present invention is also protected, if possible, from electrostatic discharge (ESD) , and thus the surface conductance of the pad section and the corrugated side of the corrugated board sheet is preferably about 10 8 - 10 10 ohm/ ⁇ .
  • ESD electrostatic discharge
  • the invention can thus be applied as a packaging damper for all electronic devices which are at the risk of such a discharge.
  • Figure 1 shows the packaging damper of the invention as a perspective view
  • Figure 2 shows a cross section of Figure 1 as taken along the line II - II.
  • the rectangular packaging damper shown in the drawing consists of two components, i.e. a pad section 1 and a corrugated board sheet 2 attached on one side of the pad section.
  • the pad section 1 comprises an envelope la manufactured of wood fibre material and a shredded wood fibre filling lb, which is provided inside the envelope and which absorbs blows.
  • the corrugated board sheet 2 is cut from single- faced corrugated board, and it is attached with pulpable glue to the pad section 1 by means of gluing 3 provided on two opposite edges of the pad section 1 and the sheet 2.
  • the sheet 2 is glued in such a manner that its corrugated side 2a provides one outer surface of the packaging damper.
  • the pad section 1 and the corrugated board sheet 2, i.e. the packaging damper in its entirety, are manufactured of unbleached wood fibre.
  • the electric surface conductance of the pad section 1 and the corrugated side 2a of the corrugated board sheet 2 is arranged to be within a range of about 10 e - 10 10 ohm/ ⁇ (the surface conductance of the flat side of the corrugated board sheet being about 10" - 10 6 ohm/ ⁇ ) .
  • the shape of the packaging damper can be selected freely according to the requirements, as well as the fastening or the fastening area of the corrugated board sheet and the pad section. If necessary, a corrugated board sheet can also be attached on both sides of the pad section.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Buffer Packaging (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

The present invention relates to a packaging damper for electronic components and devices, especially for printed circuit boards, said packaging damper comprising a pad section (1), which consists of an envelope (1a) manufactured of wood fibre material and of shredded wood fibre material (1b) provided inside the envelope; and a corrugated board sheet (2) manufactured of wood fibre material, attached on at least one side of the pad section.

Description

PACKAGING DAMPER FOR ELECTRONIC COMPONENTS
The present invention relates to a packaging damper for electronic components and devices, especially for printed circuit boards, said packaging damper comprising a pad section, which consists of an envelope manufactured of wood fibre material and of shredded wood fibre material provided inside the envelope.
Today, the most commonly used packaging dampers are different dampers manufactured of plastic material, for instance cellular plastic dampers, which may be pieces cast to a certain shape, following the shape of an item to be protected, or in a "flake-like" form, which are also used together with the above-mentioned pieces cast to shape. In addition, plastic films containing bubbles filled with air are widely used.
Even though these known dampers fulfill the tasks required of them fairly well, they also have disadvantages. The greatest disadvantage is that they burden the environment, since the material used in them is poorly suited for recycling. Thus, they usually end up in dumping grounds or in the environment to pollute nature. Their disposal also causes problems, since for instance their burning liberates toxic gases. These dampers are also rather expensive, especially as they cannot be recycled.
In addition, especially in packing printed circuit boards, for instance known packaging pads filled with fine material do not endure components mounted on a printed circuit board since such components are often sharp-edged, whereby material causing disturbances in the operation of the printed circuit board may get caught in it.
The object of the present invention is to obviate the problems described above, without compromising in any manner over the effectiveness of the damping, however. This is achieved with the packaging damper according to the invention, mainly characterized in that a corrugated board sheet manufactured of wood fibre material is attached on at least one side of the pad section.
The keyword of the present invention is recyclability, since the packaging damper consists of recyclable material in its entirety, preferably of unbleached wood fibre material . The pad section damps blows directed to the package and the corrugated board attached to the pad section ensures that the packaging damper endures well the sharp shapes of different components. This is particularly important when the packaging damper of the invention is used as an intermediate layer in packing printed circuit boards. If the corrugated board in located on only one side of the packaging damper, the corrugated board must naturally face the component side of the printed circuit board. A product packed by means of the present invention is also protected, if possible, from electrostatic discharge (ESD) , and thus the surface conductance of the pad section and the corrugated side of the corrugated board sheet is preferably about 108 - 1010 ohm/φ. The invention can thus be applied as a packaging damper for all electronic devices which are at the risk of such a discharge.
In the following, the invention will be described in more detail by means of one preferred embodiment with reference to the accompanying drawing, in which
Figure 1 shows the packaging damper of the invention as a perspective view, and
Figure 2 shows a cross section of Figure 1 as taken along the line II - II. The rectangular packaging damper shown in the drawing consists of two components, i.e. a pad section 1 and a corrugated board sheet 2 attached on one side of the pad section.
The pad section 1 comprises an envelope la manufactured of wood fibre material and a shredded wood fibre filling lb, which is provided inside the envelope and which absorbs blows.
The corrugated board sheet 2 is cut from single- faced corrugated board, and it is attached with pulpable glue to the pad section 1 by means of gluing 3 provided on two opposite edges of the pad section 1 and the sheet 2. The sheet 2 is glued in such a manner that its corrugated side 2a provides one outer surface of the packaging damper. Most preferably, the pad section 1 and the corrugated board sheet 2, i.e. the packaging damper in its entirety, are manufactured of unbleached wood fibre.
To ensure sufficient electrostatic discharge (ESD) protection, the electric surface conductance of the pad section 1 and the corrugated side 2a of the corrugated board sheet 2 is arranged to be within a range of about 10e - 1010 ohm/φ (the surface conductance of the flat side of the corrugated board sheet being about 10" - 106 ohm/φ) .
The invention has been described above by means of only one of its preferred embodiments. However, one skilled in the art may implement its details in various other alternative ways within the scope of the appended claims. Accordingly, for instance the shape of the packaging damper can be selected freely according to the requirements, as well as the fastening or the fastening area of the corrugated board sheet and the pad section. If necessary, a corrugated board sheet can also be attached on both sides of the pad section.

Claims

Claims
1. A packaging damper for electronic components and devices, especially for printed circuit boards, said packaging damper comprising a pad section (1) , which consists of an envelope (la) manufactured of wood fibre material and of shredded wood fibre material (lb) provided inside the envelope, c h a r a c t e r i z e d in that a corrugated board sheet (2) manufactured of wood fibre material is attached on at least one side of the pad section.
2. A packaging damper according to claim 1, c h a r a c t e r i z e d in that the pad section (1) and the corrugated board sheet (2) are manufactured of unbleached fibre.
3. A packaging damper according to claim 1 or 2, c h a r a c t e r i z e d in that the corrugated board sheet (2) is a single-faced corrugated board sheet, the corrugated side (2a) of which provides an outer surface of the packaging damper.
4. A packaging damper according to any one of the preceding claims, c h a r a c t e r i z e d in that the corrugated board sheet (2) is attached to the pad section (1) with pulpable glue.
5. A packaging damper according to claim 4, c h a r a c t e r i z e d in that when the packaging damper is rectangular in shape, the gluing (3) of the corrugated board sheet (2) to the pad section (1) is located on two opposite sides of said pieces.
6. A packaging damper according to any one of the preceding claims, c h a r a c t e r i z e d in that the electric surface conductance of the pad section (1) and the corrugated side (2a) of the corrugated board sheet (2) is 10θ - 1010 ohm/φ.
PCT/FI1996/000144 1995-03-09 1996-03-08 Packaging damper for electronic components Ceased WO1996028364A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU48813/96A AU4881396A (en) 1995-03-09 1996-03-08 Packaging damper for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI951103 1995-03-09
FI951103A FI102528B (en) 1995-03-09 1995-03-09 packaging Suppressors

Publications (1)

Publication Number Publication Date
WO1996028364A1 true WO1996028364A1 (en) 1996-09-19

Family

ID=8543011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI1996/000144 Ceased WO1996028364A1 (en) 1995-03-09 1996-03-08 Packaging damper for electronic components

Country Status (3)

Country Link
AU (1) AU4881396A (en)
FI (1) FI102528B (en)
WO (1) WO1996028364A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005021402A1 (en) * 2003-08-22 2005-03-10 Seeber Ag & Co. Kg Planar assembly for absorbing shocks

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2080767A (en) * 1980-07-29 1982-02-10 Edge Michael Leonard Article protectors
US4648508A (en) * 1985-06-19 1987-03-10 Robert A. Neal Flexible envelope for electronic component packaging
DE3900874A1 (en) * 1989-01-13 1990-07-26 Hauni Werke Koerber & Co Kg Filler material for resilient containers with a flexible wrapping material, and apparatus for the manufacture of such a filler material
WO1994021534A1 (en) * 1993-03-18 1994-09-29 Amcor Limited Loose fill packaging material
DK169427B1 (en) * 1992-07-31 1994-10-31 Elsebeth Hougaard Soerensen Packaging product based on wood wool
WO1996001731A1 (en) * 1994-07-07 1996-01-25 Jiffy Packaging Company Limited Packaging material, packaging pad and machine for manufacturing packaging material

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2080767A (en) * 1980-07-29 1982-02-10 Edge Michael Leonard Article protectors
US4648508A (en) * 1985-06-19 1987-03-10 Robert A. Neal Flexible envelope for electronic component packaging
DE3900874A1 (en) * 1989-01-13 1990-07-26 Hauni Werke Koerber & Co Kg Filler material for resilient containers with a flexible wrapping material, and apparatus for the manufacture of such a filler material
DK169427B1 (en) * 1992-07-31 1994-10-31 Elsebeth Hougaard Soerensen Packaging product based on wood wool
WO1994021534A1 (en) * 1993-03-18 1994-09-29 Amcor Limited Loose fill packaging material
WO1996001731A1 (en) * 1994-07-07 1996-01-25 Jiffy Packaging Company Limited Packaging material, packaging pad and machine for manufacturing packaging material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005021402A1 (en) * 2003-08-22 2005-03-10 Seeber Ag & Co. Kg Planar assembly for absorbing shocks

Also Published As

Publication number Publication date
AU4881396A (en) 1996-10-02
FI951103A0 (en) 1995-03-09
FI951103L (en) 1996-09-10
FI102528B1 (en) 1998-12-31
FI102528B (en) 1998-12-31

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