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WO1994008068A1 - Pretreatment of plastic components for electrostatic enameling - Google Patents

Pretreatment of plastic components for electrostatic enameling Download PDF

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Publication number
WO1994008068A1
WO1994008068A1 PCT/EP1993/002616 EP9302616W WO9408068A1 WO 1994008068 A1 WO1994008068 A1 WO 1994008068A1 EP 9302616 W EP9302616 W EP 9302616W WO 9408068 A1 WO9408068 A1 WO 9408068A1
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WO
WIPO (PCT)
Prior art keywords
plasma
electrostatic
electrically conductive
plastic parts
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP1993/002616
Other languages
German (de)
French (fr)
Inventor
Klaus Harth
Hartmut Hibst
Sibylle Brosius
Horst Hintze-Bruening
Andreas Holst
Wolfgang Duschek
Hans-Josef Oslowski
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BASF SE
Original Assignee
BASF SE
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Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of WO1994008068A1 publication Critical patent/WO1994008068A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/04Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
    • B05D1/045Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field on non-conductive substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/20Metallic material, boron or silicon on organic substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/407Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth

Definitions

  • the present invention relates to a method for pretreating plastic parts for electrostatic painting and a method for electrostatic painting.
  • the principle of electrostatic painting is based on charging the paint particles to be applied to a component in an electrical field.
  • the electrostatic lacquer application device is placed at a generally negative high-voltage potential, while the component to be lacquered represents the (grounded) counter electrode.
  • a suitable spray device e.g. sharp-edged bell-shaped rotating bodies, sharp-edged rotating disks or pressure guns
  • the paint particles to be applied are atomized into the electric field and charged. Because of their charge, the component to be coated causes an electrostatic attraction. Since the movement path of the particles essentially corresponds to the electrical field lines opening onto the component, the paint particles hit the component to be painted with a high probability. In comparison to conventional painting processes, the overspray in electrostatic painting is therefore greatly reduced.
  • the electrostatic paintability can be improved by depositing the plastic parts with an electrically conductive material.
  • the deposit leads to the desired formation of a high density of electrical field lines which penetrate the plastic part and ensure the impact of the paint particles.
  • the electrical charge can be discharged through the freshly applied paint, although good electrical contact between the paint and the conductive mask must also be ensured. Since the conductive mask covers part of the component, the process is only suitable for the partial painting of plastic parts. In addition, complicated geometries, e.g. in the case of plastic parts with ribs, problems with regard to the formation of the desired field line density were observed.
  • the electrostatic paintability of plastics can also be improved by applying a conductive solution.
  • the lead solution usually contains quaternary ammonium salts or amines. It is usually applied inline with the paint using the usual spraying methods.
  • the guiding solution must have good compatibility with both the plastic and the paint system, with a slight dissolving of the plastic being desirable in order to achieve good paint adhesion.
  • these compatibility requirements restrict the use of control solutions to selected plastics and coating systems.
  • the application of the master solution is associated with an undesirable increase in the solvent emission in the paint shop.
  • a frequently used method for improving the electrostatic paintability is the application of primers which are made electrically conductive by additives such as graphite, metal salts or metal particles. With this method too, the conductivity or antistatic equipment can impair the optical and sometimes also the mechanical properties of the plastic.
  • the production of thin layers by plasma-assisted chemical vapor deposition is known (see Kirk-Othmer, Encyclopedia of Chemical Technology, Third Ed., P. 47f.-, Wiley Intererscience, John Wiley and Sons, New York, 1982) .
  • the electrically conductive, thin intermediate layer can be a metallic layer which contains at least one of the metals mentioned below: aluminum, copper, silver, gold, titanium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, Iron, cobalt, nickel, palladium or platinum. Furthermore, the electrically conductive intermediate layer can consist of carbon (graphite). Layers of copper or stainless steel made of, for example, VA 4 steel are preferred.
  • the electrically conductive thin layer can consist of conductive oxides which contain at least one of the following elements from the series indium, tin, cadmium or zinc or alloys of such elements.
  • Mixed oxides of indium and tin are preferred, the tin content being 5 to 20 atom% of the indium content and oxygen not being stoichiometrically bound, for example In 9 oSn ⁇ oO x .
  • the person skilled in the art knows how to adjust the oxygen content to achieve the desired conductivity via the process oxygen pressure.
  • the electrically conductive intermediate layer according to the invention should be as neutral as possible in color and have very good electrical conductivity.
  • the thickness of the intermediate layer should be in the range from 0.5 to 5000 nm, preferably 1 to 100 nm and particularly preferably between 5 and 20 nm.
  • the setting of the desired layer thickness and its chemical composition can be achieved by setting the process parameters such as process gas pressure, process gas composition, atomization performance, coating time.
  • process parameters such as process gas pressure, process gas composition, atomization performance, coating time.
  • the intermediate layer does not necessarily have to form a closed film.
  • the coating can also be in the form of islands which do not cover the entire area but are interconnected or form a rather irregular network.
  • the electrically conductive layer can be applied as a so-called gradient layer, i.e. by varying the process parameters accordingly, the chemical composition within the layer can be changed or a different morphology, for example different crystallites, can be achieved.
  • One method is the sputtering of a metallic or oxidic target in a low-pressure plasma.
  • cathode sputtering such as magnetron sputtering, direct current sputtering (DC sputtering), radio frequency sputtering (RF sputtering), bias sputtering or reactive sputtering, and combinations thereof, are suitable for producing the layers.
  • magnetron sputtering the target to be atomized is located in an external magnetic field, which causes a high plasma density in the region of the target and thus an increase in the atomization rate.
  • DC or RF sputtering the excitation of the Dust plasma in a manner known per se by DC or RF generators.
  • bias sputtering the molded body to be coated is usually subjected to a negative bias (bias), as a result of which the component to be coated is exposed to an intensive interaction with the plasma.
  • bias sputtering the molded body to be coated is usually subjecte
  • the targets to be atomized can either be in the form of flat plates, cylindrical hollow bodies or in the form of flat or three-dimensionally shaped sheets or nets.
  • the component to be coated is arranged so that the most uniform possible coating is achieved.
  • Several targets can be used to improve the homogeneity of the coating. It is also possible to move the object to be coated during the treatment. .
  • Cathode sputtering is carried out in a plasma-assisted manner in a noble gas plasma, usually made of argon, but also from other noble gases such as He, Ne, Kr or Xe.
  • a noble gas plasma usually made of argon, but also from other noble gases such as He, Ne, Kr or Xe.
  • the application of the electrically conductive layer is usually carried out at pressures in the range from 10 " 4 to 10 -1 , preferably 10 -3 to 5 x 10" 2 mbar.
  • the temperatures during the treatment are in the range from 20 to 150 ° C.
  • Oxidic layers are usually produced by sputtering appropriate oxide targets, or metal targets in a reactive plasma which contains oxygen or gases containing oxygen.
  • the intermediate layer according to the invention can be applied by sputtering a metallic or oxide target using an arc plasma. It is also conceivable to atomize the metallic or oxidic target in a laser-induced plasma.
  • plasma-assisted vapor deposition processes can also be used to produce the intermediate layers, with hot metal vapors being condensed on the substrate.
  • the intermediate layer can also be applied by plasma-assisted chemical vapor deposition of an organometallic compound such as metal carbonyls, for example nickel tetracarbonyl, iron pentacarbonyl or metal alkyls, metal alkenyls, metal alkynyls, aromatic metal complexes or substituted metal complexes.
  • an organometallic compound such as metal carbonyls, for example nickel tetracarbonyl, iron pentacarbonyl or metal alkyls, metal alkenyls, metal alkynyls, aromatic metal complexes or substituted metal complexes.
  • a gas mixture which contains at least one corresponding organometallic compound is let into the plasma treatment chamber.
  • the plasma conditions are set so that in the plasma area there is a decomposition of the organometallic compound with simultaneous formation of a metallic or oxidic coating on the plastic component.
  • the gas mixture can contain oxygen or nitrogen and noble gases such as helium, neon, krypton, xenon or, preferably, argon. Due to the excellent splitting ability of the plasma, the plasma-assisted CVD deposition is particularly suitable for the uniform coating of components with complicated geometries.
  • the deposition of the metal-organic starting compound can take place both in vacuum and at atmospheric pressure. A vacuum deposition at a pressure of 10 -3 to 10 mbar is preferred.
  • Either direct current (DC), high frequency (RF, e.g. 13.56 MHz) or microwave generators (frequency e.g. 2.45 GHz) can be used for the electrical supply of the plasma.
  • the DC voltage is fed into the plasma chamber in a known manner via a round, rod-shaped, cylindrical, box-shaped or insulated electrode provided with another suitable geometry.
  • the RF voltage is supplied in a comparable manner, but an electrical tuning unit between the generator and the electrode is used to maximize the coupled-in and to minimize the reflected electrical power.
  • the microwave excitation which can be used alternatively is carried out in a known manner without electrodes, with hollow or coaxial conductors being used outside the coating space to supply the electrical power. Horn antennas or rod antennas, for example, can be used to feed the microwave into the plasma area.
  • the treatment time for applying the thin electrically conductive intermediate layer is in the range from 0.1 to 1000 s, preferably 1 to 20 s.
  • Preferred methods for applying the intermediate layer are plasma-assisted cathode sputtering and plasma-assisted chemical vapor deposition, with RF bias cathode sputtering being preferred.
  • Thermoplastic, thermosetting and thermosetting plastic parts are suitable for the pretreatment process according to the invention, which can contain additives for mechanical reinforcement, coloring, heat stabilization, UV stabilization, fire protection equipment or other additives.
  • the method is preferably used for the improvement of the electrostatic paintability of homopolymers, copolymers or blends of polymers from the series polyethylene, polypropylene, polyvinyl chloride, polystyrene, polymethyl methacrylate, polycarbonate, diethylene glycol dialyl carbonate (CR 39), styrene / butadiene Copolymer, acrylonitrile / butadiene / styrene polymer, polyethylene terephthalate, polybutylene terephthalate, polyoxymethylene, polyamide, polysulfone, polyether sulfone, poly (aryl) ether ketone, polyimide or polyurethane.
  • the method is particularly preferably used for blends of polypropylene and an ethylene-propylene diene copolymer.
  • the electrical surface conductivity of the plastics mentioned is significantly increased by the method according to the invention, which ensures the formation of a high field line density and the discharge of the electrical charge in the electrostatic coating.
  • the intermediate layers used show very good adhesive strength on the plastic substrates mentioned. If necessary, the adhesive strength of the intermediate layer can be additionally improved by a previous plasma treatment of the carrier, for example by a low-pressure plasma treatment in an oxygen-containing gas mixture.
  • the electrostatic painting of the parts equipped according to the invention can be carried out in a known manner
  • the method is suitable for
  • Paints based on a physically drying binder system such as polyurethane dispersions or polyacrylate dispersions. Both paint systems based on organic solvents (eg esters, ketones, glycol ethers, aromatics) and water-based paints are suitable. Lacquers with a high solids content (“high solids”) and powder lacquers such as, for example, epoxy polyester, epoxy polyester hybrid, polyurethane, acrylate, polyester triglycidyl isocyanate lacquers can also be used.
  • high solids lacquers with a high solids content
  • powder lacquers such as, for example, epoxy polyester, epoxy polyester hybrid, polyurethane, acrylate, polyester triglycidyl isocyanate lacquers can also be used.
  • plastic parts treated according to the invention can be used as a plastic part.
  • Components in the automotive exterior such as bumpers, flaps, doors, spoilers, side panels, ram protection strips, wheel covers, spreading discs,
  • Components in the automotive interior such as steering column covers or phono housings
  • the substrates used in the following examples are injection-molded sheets (15 ⁇ 15 cm 2 ) made from a blend of polypropylene and ethylene-propylene-diene copolymers, with an ethylene content of 15 to 20% by weight. , a rubber content of approx. 30% by weight and a melt flow index according to DIN 53735 of 2.5 g / 10 min at 230 ° C / 2.16 kg.
  • a plate-shaped copper target (0 200 mm) was attached to a magnetron cathode in a cathode sputtering system.
  • an injection-molded plastic plate 150x150 mm 2
  • a metallic holder (0 700 mm) at a distance of 60 mm.
  • the system was evacuated to a pressure of 10 "7 mbar. Thereafter, argon was introduced into the system and a pressure of 8xl0 ⁇ 3 mbar was set.
  • An AC voltage with a frequency was applied to the Cu target with the aid of a radio frequency generator of 13.56 MHz, with a power output of the generator of 200 W.
  • An alternating voltage was also applied to the metallic holder of the plastic plate the frequency applied 13.56 MHz, with a generator power of 500 W.
  • the treatment time of the plastic plate was 10 s.
  • the treated plastic plate was coated with an aqueous primer based on epoxy resin and polyamine components by means of electrostatic high-speed rotation (layer thicknesses approx. 20 ⁇ ).
  • the application efficiency i.e. the ratio of the amount of paint applied to the atomized amount of paint is determined by measuring the weight of the two plates.
  • the application efficiency of the treated plate was 2.5 times greater than that of the untreated plate.
  • a plate-shaped target (0 150 mm) made of I goSnio was attached to a magnetron cathode in a cathode sputtering system.
  • an injection-molded plastic plate 150x150 mm was attached to a metallic holder (0 700 mm) at a distance of 90 mm. The facility was opened

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention pertains to a method of pretreating plastic components for electrostatic enamelling by applying a thin film of an electrically conductive material in a plasma atmosphere.

Description

Vorbehandlung von Kunststoffteilen für die elektrostatische LackierungPretreatment of plastic parts for electrostatic painting

Beschreibungdescription

Die vorliegende Erfindung betrifft ein Verfahren zur Vorbehand¬ lung von Kunststoffteilen für die elektrostatische Lackierung und ein Verfahren zur elektrostatischen Lackierung.The present invention relates to a method for pretreating plastic parts for electrostatic painting and a method for electrostatic painting.

Das Prinzip der elektrostatischen Lackierung beruht auf der Auf¬ ladung der auf ein Bauteil aufzubringenden Lackpartikel in einem elektrischen Feld. Die elektrostatische Lackapplikationsvorrich¬ tung wird hierzu auf ein in der Regel negatives Hochspannungspo- tential gelegt, während das zu lackierende Bauteil die (geerdete) Gegenelektrode darstellt. Durch eine geeignete Sprühvorrichtung wie z.B. scharfkantige glockenförmige Rotationskörper, scharfkan¬ tige rotierende Scheiben oder Druckpistolen werden die zu appli- zierenden Lackpartikel in das elektrische Feld zerstäubt und auf- geladen. Aufgrund ihrer Ladung erfolgt eine elektrostatische An¬ ziehung durch das zu beschichtende Bauteil. Da die Bewegungsbahn der Partikel im wesentlichen den auf das Bauteil mündenden elek¬ trischen Feldlinien entspricht, treffen die Lackpartikel mit ho¬ her Wahrscheinlichkeit auf das zu lackierende Bauteil auf. Im Vergleich zu konventionellen Lackierverfahren wird daher der Overspray bei der elektrostatischen Lackierung sehr stark redu¬ ziert. Damit können in Lackieranlagen wesentliche Vorteile hin¬ sichtlich einer Erhöhung der Lackausnutzung, einer Verringerung der Lackierzeit, einer Reduktion des Lackschlamms, einer Reduk- tion der Abluft sowie einer Verringerung der Rückläuferquote er¬ zielt werden. Elektrostatische Lackierverfahren haben daher bei der Lackierung metallischer Bauteile bereits eine breite Anwen¬ dung gefunden.The principle of electrostatic painting is based on charging the paint particles to be applied to a component in an electrical field. For this purpose, the electrostatic lacquer application device is placed at a generally negative high-voltage potential, while the component to be lacquered represents the (grounded) counter electrode. With a suitable spray device, e.g. sharp-edged bell-shaped rotating bodies, sharp-edged rotating disks or pressure guns, the paint particles to be applied are atomized into the electric field and charged. Because of their charge, the component to be coated causes an electrostatic attraction. Since the movement path of the particles essentially corresponds to the electrical field lines opening onto the component, the paint particles hit the component to be painted with a high probability. In comparison to conventional painting processes, the overspray in electrostatic painting is therefore greatly reduced. In this way, significant advantages can be achieved in painting systems with regard to an increase in paint utilization, a reduction in painting time, a reduction in paint sludge, a reduction in the exhaust air and a reduction in the return rate. Electrostatic painting processes have therefore already been widely used in painting metallic components.

Dagegen bereitet der Einsatz elektrostatischer Lackierverfahren auf Kunststoffbauteilen noch große Probleme. Der Grund liegt in der sehr geringen elektrischen Leitfähigkeit der Kunststoffober¬ fläche, durch welche die Ausbildung einer möglichst hohen und gleichmäßigen Feldliniendichte sowie die Ableitung der auf das Bauteil auftreffenden elektrischen Ladung verhindert wird. Infol¬ gedessen kommt es zu einer Aufladung des KunstStoffbauteils, wo¬ durch nachfolgende Lackpartikel elektrostatisch abgestoßen werden und somit den Overspray wiederum drastisch erhöhen.In contrast, the use of electrostatic painting processes on plastic components still poses great problems. The reason for this lies in the very low electrical conductivity of the plastic surface, which prevents the formation of a field line density that is as high and uniform as possible and the derivation of the electrical charge impinging on the component. As a result, the plastic component is charged, which causes subsequent paint particles to be electrostatically repelled and thus in turn drastically increases the overspray.

Es sind schon verschiedene Verfahren zur Verbesserung der elek¬ trostatischen Lackierbarkeit von Kunststoffen bekannt. So kann beispielsweise die elektrische Leitfähigkeit von Kunststoffen durch geeignete Zusätze wie z.B. Graphit, Ruß oder Edelstahlfa¬ sern erhöht werden. In der Regel führt jedoch diese Ausrüstung zu einer wesentlichen Verteuerung des Kunststoffes oder zu einer nicht tolerierbaren Beeinträchtigung seiner mechanischen Eigen- Schäften bzw. seines optischen Erscheinungsbildes. Diese Art der Leitfähigkeitsausrüstung von Kunststoffen ist daher bei der Mehr¬ zahl der Lackieranwendungen nicht einsetzbar.Various methods for improving the electrostatic paintability of plastics are already known. For example, the electrical conductivity of plastics can be increased by suitable additives such as graphite, carbon black or stainless steel fibers. As a rule, however, this equipment leads to a significant increase in the cost of the plastic or to an intolerable impairment of its mechanical properties or its visual appearance. This type of conductivity equipment for plastics can therefore not be used in the majority of painting applications.

Weiterhin ist bekannt, daß die elektrostatische Lackierbarkeit durch eine Hinterlegung der Kunststoffteile mit einem elektrisch leitfähigen Material verbessert werden kann. Die Hinterlegung führt zu der gewünschten Ausbildung einer hohen Dichte von elek¬ trischen Feldlinien, die das Kunststoffteil durchdringen und das Auftreffen der Lackpartikel sicherstellen. Bei einer Lackierung Zug um Zug kann die elektrische Ladung durch den frisch appli- zierten Lack abgeleitet werden, wobei jedoch zusätzlich für eine gute elektrische Kontaktierung zwischen dem Lack und der leitfä¬ higen Maske gesorgt werden muß. Da die leitfähige Maske einen Teil des Bauteils abdeckt, ist das Verfahren nur für die parti- eile Lackierung von Kunststoffteilen geeignet. Darüberhinaus wer¬ den bei komplizierten Geometrien, z.B. bei Kunststoffteilen mit Verrippungen, Probleme hinsichtlich der Ausbildung der gewünsch¬ ten Feldliniendichte beobachtet.It is also known that the electrostatic paintability can be improved by depositing the plastic parts with an electrically conductive material. The deposit leads to the desired formation of a high density of electrical field lines which penetrate the plastic part and ensure the impact of the paint particles. In the case of painting step by step, the electrical charge can be discharged through the freshly applied paint, although good electrical contact between the paint and the conductive mask must also be ensured. Since the conductive mask covers part of the component, the process is only suitable for the partial painting of plastic parts. In addition, complicated geometries, e.g. in the case of plastic parts with ribs, problems with regard to the formation of the desired field line density were observed.

Die elektrostatische Lackierbarkeit von Kunststoffen kann auch durch das Auftragen einer Leitlösung verbessert werden. Die Leit¬ lösung enthält üblicherweise quaternäre Ammoniu salze oder Amine. Sie wird in der Regel inline mit der Lackierung mit den üblichen Sprühverfahren aufgebracht. Die Leitlösung muß eine gute Verträg- lichkeit sowohl mit dem Kunststoff als auch mit dem Lacksystem besitzen, wobei ein leichtes Anlösen des Kunststoffes zur Erzie¬ lung einer guten Lackhaftung erwünscht ist. Diese Verträglich¬ keitsanforderungen beschränken den Einsatz von Leitlösungen al¬ lerdings auf ausgewählte Kunststoffe und Lacksysteme. Außerdem ist das Aufbringen der Leitlösung mit einer unerwünschten Erhö¬ hung der Lösungsmittelemission in der Lackieranlage verbunden.The electrostatic paintability of plastics can also be improved by applying a conductive solution. The lead solution usually contains quaternary ammonium salts or amines. It is usually applied inline with the paint using the usual spraying methods. The guiding solution must have good compatibility with both the plastic and the paint system, with a slight dissolving of the plastic being desirable in order to achieve good paint adhesion. However, these compatibility requirements restrict the use of control solutions to selected plastics and coating systems. In addition, the application of the master solution is associated with an undesirable increase in the solvent emission in the paint shop.

Ein häufig eingesetztes Verfahren zur Verbesserung der elektro¬ statischen Lackierbarkeit ist das Aufbringen von Grundierungen, die durch Additive wie Graphit, Metallsalze oder Metallpartikel elektrisch leitfähig gemacht werden. Auch bei diesem Verfahren kann die Leitfähigkeits- oder Antistatikausrüstung zu einer Be¬ einträchtigung der optischen und bisweilen auch der mechanischen Kunststoffeigenschaften führen. Die Herstellung von dünnen Schichten durch plasmaunterstützte chemische Gasphasenabscheidung ist bekannt (vgl. Kirk-Othmer, En- cyclopedia of Chemical Technology, Third Ed., S. 47f.-, Wiley In- terscience, John Wiley and Sons, New York, 1982) .A frequently used method for improving the electrostatic paintability is the application of primers which are made electrically conductive by additives such as graphite, metal salts or metal particles. With this method too, the conductivity or antistatic equipment can impair the optical and sometimes also the mechanical properties of the plastic. The production of thin layers by plasma-assisted chemical vapor deposition is known (see Kirk-Othmer, Encyclopedia of Chemical Technology, Third Ed., P. 47f.-, Wiley Intererscience, John Wiley and Sons, New York, 1982) .

Ebenso ist bekannt, dünne Schichten durch Kathodenzerstäubung in einem Argon-Plasma herzustellen (vgl. Kirle-Othmer, Third Ed., S. 692f.) . Diese Technik wird vor allem für die Herstellung von magnetischen Festplatten eingesetzt.It is also known to produce thin layers by sputtering in an argon plasma (cf. Kirle-Othmer, Third Ed., P. 692f.). This technology is mainly used for the production of magnetic hard disks.

Aufgabe der vorliegenden Erfindung war es, ein Verfahren zu fin¬ den, welches für eine breite Klasse von KunststoffSubstraten und Lacksystemen wirtschaftlich einsetzbar ist, dabei die optischen und mechanischen Eigenschaften nicht beeinflußt und. eine hohe Haftfestigkeit der Lackschicht gewährleistet.It was an object of the present invention to find a process which can be used economically for a broad class of plastic substrates and coating systems, without influencing the optical and mechanical properties, and. ensures a high adhesive strength of the paint layer.

Demgemäß wurde ein Verfahren zur Vorbehandlung von Kunststofftei¬ len für die elektrostatische Lackierung gefunden, welches dadurch gekennzeichnet ist, daß man die Kunststoffteile in einem plasma- unterstützten Prozeß mit einer dünnen, elektrisch leitendenAccordingly, a process for the pretreatment of plastic parts for electrostatic painting has been found, which is characterized in that the plastic parts are processed in a plasma-assisted process with a thin, electrically conductive

Schicht versieht. Weiterhin wurde ein Verfahren zur elektrostati¬ schen Lackierung von Kunststoffteilen gefunden, welches dadurch gekennzeichnet ist, daß man die KunstStoffteile zunächst in einem plasmaunterstützten Prozeß mit einer dünnen elektrisch leitenden Zwischenschicht versieht und anschließend durch elektrostatische Lackierung eine Lackschicht aufbringt.Layer provides. Furthermore, a process for the electrostatic painting of plastic parts has been found, which is characterized in that the plastic parts are first provided with a thin electrically conductive intermediate layer in a plasma-assisted process and then a layer of paint is applied by electrostatic painting.

Die elektrisch leitende, dünne Zwischenschicht kann eine metalli¬ sche Schicht sein, welche mindestens eines der im folgenden ge- nannten Metalle enthält: Aluminium, Kupfer, Silber, Gold, Titan, Vanadin, Niob, Tantal, Chrom, Molybdän, Wolfram, Mangan, Eisen, Kobalt, Nickel, Palladium oder Platin. Weiterhin kann die elek¬ trisch leitende Zwischenschicht aus Kohlenstoff (Graphit) beste¬ hen. Bevorzugt werden Schichten aus Kupfer oder Edelstahl aus beispielsweise VA 4-Stahl.The electrically conductive, thin intermediate layer can be a metallic layer which contains at least one of the metals mentioned below: aluminum, copper, silver, gold, titanium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, Iron, cobalt, nickel, palladium or platinum. Furthermore, the electrically conductive intermediate layer can consist of carbon (graphite). Layers of copper or stainless steel made of, for example, VA 4 steel are preferred.

Weiterhin kann die elektrisch leitende dünne Schicht aus leitfä¬ higen Oxiden bestehen, welche mindestens eines der folgenden Ele¬ mente aus der Reihe Indium, Zinn, Cadmium oder Zink oder Legie- rungen solcher Elemente enthalten. Bevorzugt werden Mischoxide von Indium und Zinn, wobei der Zinn-Anteil 5 bis 20 Atom-% des Indiumgehalts beträgt und Sauerstoff nicht stöchiometrisch gebun¬ den ist, beispielsweise In9oSnιoOx. Dem Fachmann ist bekannt, wie er über den Prozeßsauerstoffdruck den Sauerstoffanteil zur Erreichung der gewünschten Leitfähigkeit einstellen kann.Furthermore, the electrically conductive thin layer can consist of conductive oxides which contain at least one of the following elements from the series indium, tin, cadmium or zinc or alloys of such elements. Mixed oxides of indium and tin are preferred, the tin content being 5 to 20 atom% of the indium content and oxygen not being stoichiometrically bound, for example In 9 oSnιoO x . The person skilled in the art knows how to adjust the oxygen content to achieve the desired conductivity via the process oxygen pressure.

Die erfindungsgemäße elektrisch leitfähige Zwischenschicht soll möglichst farbneutral sein und eine sehr gute elektrische Leitfä¬ higkeit aufweisen.The electrically conductive intermediate layer according to the invention should be as neutral as possible in color and have very good electrical conductivity.

Die Dicke der Zwischenschicht soll im Bereich von 0,5 bis 5000 nm, bevorzugt 1 bis 100 nm und besonders bevorzugt zwischen 5 und 20 nm liegen.The thickness of the intermediate layer should be in the range from 0.5 to 5000 nm, preferably 1 to 100 nm and particularly preferably between 5 and 20 nm.

Die Einstellung der gewünschten Schichtdicke und deren chemische Zusammensetzung kann durch Einstellung der Prozeßparameter wie Prozeßgasdruck, Prozeßgaszusammensetzung, Zerstäubungsleistung, Beschichtungszeit erreicht werden. Dem Fachmann ist bekannt, wie er die einzelnen Parameter abzustimmen hat.The setting of the desired layer thickness and its chemical composition can be achieved by setting the process parameters such as process gas pressure, process gas composition, atomization performance, coating time. The person skilled in the art knows how to adjust the individual parameters.

Zur Verbesserung der elektrostatischen Lackierbarkeit von Kunst- Stoffen muß die Zwischenschicht nicht notwendigerweise einen ge¬ schlossenen Film bilden. So kann die Beschichtung beispielsweise auch in Form von nicht flächendeckenden, aber untereinander zu¬ sammenhängenden Inseln vorliegen oder ein eher unregelmäßiges Netzwerk bilden.In order to improve the electrostatic paintability of plastics, the intermediate layer does not necessarily have to form a closed film. For example, the coating can also be in the form of islands which do not cover the entire area but are interconnected or form a rather irregular network.

Weiterhin kann die elektrisch leitende Schicht als sogenannte Gradientenschicht aufgebracht werden, d.h. durch entsprechende Variierung der Prozeßparameter kann man innerhalb der Schicht die chemische Zusammensetzung ändern oder eine unterschiedliche Mor- phologie, beispielsweise unterschiedliche Kristallite, erzielen.Furthermore, the electrically conductive layer can be applied as a so-called gradient layer, i.e. by varying the process parameters accordingly, the chemical composition within the layer can be changed or a different morphology, for example different crystallites, can be achieved.

Das Aufbringen der Zwischenschicht kann nach verschiedenen, an sich bekannten Methoden erfolgen. Dabei kommen sowohl die physi¬ kalische Gasphasenabscheidung (PVD = Physical Vapor Deposition) als auch die chemische Gasphasenabscheidung (CVD = Chemical Vap. Dep.) in Betracht.The intermediate layer can be applied by various methods known per se. Both physical vapor deposition (PVD = Physical Vapor Deposition) and chemical vapor deposition (CVD = Chemical Vap. Dep.) Can be considered.

Eine Methode ist die Kathodenzerstäubung eines metallischen oder oxidischen Targets in einem Niederdruckplasma. Zur Herstellung der Schichten sind verschiedene methodische Varianten der Katho¬ denzerstäubung wie Magnetron-Sputtern, Gleichstrom-Sputtern (DC- Sputtern), Radiofrequenz-Sputtern (RF-Sputtern) , Bias-Sputtern oder reaktives Sputtern sowie deren Kombinationen geeignet. Beim Magnetron-Sputtern befindet sich das zu zerstäubende Target in einem äußeren Magnetfeld, welches eine hohe Plasmadichte im Be¬ reich des Targets und damit eine Erhöhung der Zerstäubungsrate bewirkt. Beim DC- bzw. RF-Sputtern erfolgt die Anregung des Zer- stäubungsplasmas in an sich bekannter Weise durch DC- bzw. RF-Ge- neratoren. Beim Bias-Sputtern wird der zu beschichtende Formkör¬ per mit einer in der Regel negativen Vorspannung (Bias) belegt, wodurch das zu beschichtende Bauteil einer intensiven Wechselwir- kung mit dem Plasma ausgesetzt wird.One method is the sputtering of a metallic or oxidic target in a low-pressure plasma. Various method variants of cathode sputtering, such as magnetron sputtering, direct current sputtering (DC sputtering), radio frequency sputtering (RF sputtering), bias sputtering or reactive sputtering, and combinations thereof, are suitable for producing the layers. In magnetron sputtering, the target to be atomized is located in an external magnetic field, which causes a high plasma density in the region of the target and thus an increase in the atomization rate. With DC or RF sputtering, the excitation of the Dust plasma in a manner known per se by DC or RF generators. In the case of bias sputtering, the molded body to be coated is usually subjected to a negative bias (bias), as a result of which the component to be coated is exposed to an intensive interaction with the plasma.

Die zu zerstäubenden Targets können entweder in Form von flachen Platten, zylindrischen Hohlkörpern oder in Form von flachen oder dreidimensional geformten Blechen oder Netzen vorliegen. Das zu beschichtende Bauteil wird dabei so angeordnet, daß eine mög¬ lichst gleichmäßige Beschichtung erreicht wird. Zur Verbesserung der Homogenität der Beschichtung können mehrere Targets einge¬ setzt werden. Ebenso ist es möglich, den zu beschichtenden Gegen¬ stand während der Behandlung zu bewegen. ,The targets to be atomized can either be in the form of flat plates, cylindrical hollow bodies or in the form of flat or three-dimensionally shaped sheets or nets. The component to be coated is arranged so that the most uniform possible coating is achieved. Several targets can be used to improve the homogeneity of the coating. It is also possible to move the object to be coated during the treatment. .

Die Kathodenzerstäubung wird plasmaunterstützt in einem Edelgas¬ plasma, üblicherweise aus Argon, aber auch aus anderen Edelgasen wie He, Ne, Kr oder Xe, durchgeführt.Cathode sputtering is carried out in a plasma-assisted manner in a noble gas plasma, usually made of argon, but also from other noble gases such as He, Ne, Kr or Xe.

Üblicherweise führt man die Auftragung der elektrisch leitenden Schicht bei Drücken im Bereich von 10"4 bis 10-1, vorzugsweise 10~3 bis 5 x 10"2 mbar durch. Die Temperaturen bei der Behandlung lie¬ gen im Bereich von 20 bis 150°C.The application of the electrically conductive layer is usually carried out at pressures in the range from 10 " 4 to 10 -1 , preferably 10 -3 to 5 x 10" 2 mbar. The temperatures during the treatment are in the range from 20 to 150 ° C.

Die Herstellung oxidischer Schichten erfolgt üblicherweise durch die Zerstäubung entsprechender Oxidtargets, oder von Metalltar¬ gets in einem Reaktivplasma, welches Sauerstoff oder sauerstoff- haltige Gase enthält.Oxidic layers are usually produced by sputtering appropriate oxide targets, or metal targets in a reactive plasma which contains oxygen or gases containing oxygen.

In alternativer Weise kann die erfindungsgemäße Zwischenschicht durch die Zerstäubung eines metallischen oder oxidischen Targets mit Hilfe eines Lichtbogenplasmas aufgebacht werden. Weiterhin ist denkbar, die Zerstäubung des metallischen oder oxidischen Targets in einem laserinduzierten Plasma durchzuführen.Alternatively, the intermediate layer according to the invention can be applied by sputtering a metallic or oxide target using an arc plasma. It is also conceivable to atomize the metallic or oxidic target in a laser-induced plasma.

Schließlich können zur Herstellung der Zwischenschichten auch plasmaunterstützte Aufdampfprozesse eingesetzt werden, wobei heiße Metalldämpfe auf dem Substrat kondensiert werden.Finally, plasma-assisted vapor deposition processes can also be used to produce the intermediate layers, with hot metal vapors being condensed on the substrate.

Die Aufbringung der Zwischenschicht kann auch durch plasmaunter¬ stützte chemische Gasphasenabscheidung einer metallorganischen Verbindung wie Metallcarbonylen, beispielsweise Nickeltetracarbo- nyl, Eisenpentacarbonyl oder Metallalkylen, Metallalkenylen, Me- tallalkinylen, aromatischen Metallkomplexen oder substituierten Metallkomplexen erfolgen. Dabei wird ein Gasgemisch, welches mindestens eine ensprechende metallorganische Verbindung enthält, in die Plasmabehandlungskam¬ mer eingelassen. Die Plasmabedingungen werden so eingestellt, daß im Plasmabereich eine Zersetzung der metallorganischen Verbindung unter gleichzeitiger Bildung einer metallischen oder oxidischen Beschichtung auf dem Kunststoffbauteil erfolgt. Das Gasgemisch kann neben der metallorganischen Verbindung Sauerstoff oder Stickstoff sowie Edelgase wie Helium, Neon, Krypton, Xenon oder bevorzugt Argon enthalten. Aufgrund der hervorragenden Spaltgän- gigkeit des Plasmas ist die plasmaunterstützte CVD-Abscheidung insbesondere für die gleichmäßige Beschichtung von Bauteilen mit komplizierter Geometrie gut geeignet. Die Abscheidung der metall¬ organischen Ausgangsverbindung kann dabei sowohl im Vakuum als auch bei Atmosphärendruck erfolgen. Bevorzugt ist ein Abscheidung im Vakuum bei einem Druck von 10~3 bis 10 mbar.The intermediate layer can also be applied by plasma-assisted chemical vapor deposition of an organometallic compound such as metal carbonyls, for example nickel tetracarbonyl, iron pentacarbonyl or metal alkyls, metal alkenyls, metal alkynyls, aromatic metal complexes or substituted metal complexes. A gas mixture which contains at least one corresponding organometallic compound is let into the plasma treatment chamber. The plasma conditions are set so that in the plasma area there is a decomposition of the organometallic compound with simultaneous formation of a metallic or oxidic coating on the plastic component. In addition to the organometallic compound, the gas mixture can contain oxygen or nitrogen and noble gases such as helium, neon, krypton, xenon or, preferably, argon. Due to the excellent splitting ability of the plasma, the plasma-assisted CVD deposition is particularly suitable for the uniform coating of components with complicated geometries. The deposition of the metal-organic starting compound can take place both in vacuum and at atmospheric pressure. A vacuum deposition at a pressure of 10 -3 to 10 mbar is preferred.

Zur elektrischen Versorgung des Plasmas können entweder Gleich¬ strom- (DC) , Hochfrequenz (RF, z.B. 13,56 MHz) oder Mikrowellen¬ generatoren (Frequenz z.B. 2,45 GHz) eingesetzt werden. Die Zu- führung der DC-Spannung in die Plas akammer erfolgt dabei in be¬ kannter Weise über eine runde, stabförmige, zylindrische, kasten¬ förmige oder mit einer sonstigen geeigneten Geometrie versehenen, isolierten Elektrode. Die Zuführung der RF-Spannung erfolgt in vergleichbarer Weise, wobei jedoch zur Maximierung der eingekop- pelten und zur Minimierung der reflektierten elektrischen Lei¬ stung eine elektrische Abstimmeinheit zwischen Generator und Elektrode verwendet wird. Die alternativ verwendbare Mikrowellen¬ anregung erfolgt in bekannter Weise elektrodenlos, wobei außer¬ halb des Beschichtungsraums Hohl- oder Koaxialleiter zur Zufüh- rung der elektrischen Leistung benutzt werden. Zur Zuführung der Mikrowelle in den Plasmabereich können beispielsweise Hornanten- nen oder Stabantennen benutzt werden.Either direct current (DC), high frequency (RF, e.g. 13.56 MHz) or microwave generators (frequency e.g. 2.45 GHz) can be used for the electrical supply of the plasma. The DC voltage is fed into the plasma chamber in a known manner via a round, rod-shaped, cylindrical, box-shaped or insulated electrode provided with another suitable geometry. The RF voltage is supplied in a comparable manner, but an electrical tuning unit between the generator and the electrode is used to maximize the coupled-in and to minimize the reflected electrical power. The microwave excitation which can be used alternatively is carried out in a known manner without electrodes, with hollow or coaxial conductors being used outside the coating space to supply the electrical power. Horn antennas or rod antennas, for example, can be used to feed the microwave into the plasma area.

Die Behandlungszeit zur Aufbringung der dünnen elektrisch leiten- den Zwischenschicht liegt im Bereich von 0,1 bis 1000 s, vorzugs¬ weise 1 bis 20 s.The treatment time for applying the thin electrically conductive intermediate layer is in the range from 0.1 to 1000 s, preferably 1 to 20 s.

Bevorzugte Methoden zur Aufbringung der Zwischenschicht sind die plasmaunterstützte Kathodenzerstäubung und die plasmaunterstützte chemische Gasphasenabscheidung, wobei die RF-Bias-Kathodenzer- stäubung bevorzugt ist.Preferred methods for applying the intermediate layer are plasma-assisted cathode sputtering and plasma-assisted chemical vapor deposition, with RF bias cathode sputtering being preferred.

Für das erfindungsgemäße Vorbehandlungsverfahren sind thermopla¬ stische, duroplastische und duromere Kunststoffteile geeignet, die Zusätze zur mechanischen Verstärkung, Färbung, Wärmestabili¬ sierung, UV-Stabilisierung, Brandschutzausrüstung oder sonstige Zusätze enthalten können. Bevorzugt wird das Verfahren eingesetzt für die Verbesserung der elektrostatischen Lackierbarkeit von Ho- mopolymerisaten, Copolymerisaten oder Blends von Polymeren aus der Reihe Polyethylen, Polypropylen, Polyvinylchlorid, Polysty¬ rol, Polymethylmethacrylat, Polycarbonat, Diethylen-Glykol-Dial- lyl-Carbonat (CR 39), Styrol/Butadien-Copolymer, Acrylnitril/Bu- tadien/Styrol-Polymer, Polyethylenterephthalat, Polybutylente- rephthalat, Polyoxymethylen, Polyamid, Polysulfon, Polyethersul- fon, Poly(aryl)etherketon, Polyimid oder Polyurethan. Besonders bevorzugt wird das Verfahren eingesetzt für Blends von Polypropy- len und einem Ethylenpropylendienmischpolymerisat. Die elektri¬ sche Oberflächenleitfähigkeit der genannten Kunststoffe wird durch das erfindungsgemäße Verfahren deutlich erhöht, wodurch die Ausbildung einer hohen Feldliniendichte und die Ableitung der elektrischen Ladung bei der elektrostatischen Lackierung sicher- gestellt wird. Die dabei eingesetzten Zwischenschichten zeigen eine sehr gute Haftfestigkeit auf den genannten KunststoffSub¬ straten. Bei Bedarf kann die Haftfestigkeit der Zwischenschicht durch eine vorherige Plasmabehandlung des Trägers, beispielsweise durch eine Niederdruckplasmabehandlung in einem Sauerstoffhalti- gen Gasgemisch zusätzlich verbessert werden.Thermoplastic, thermosetting and thermosetting plastic parts are suitable for the pretreatment process according to the invention, which can contain additives for mechanical reinforcement, coloring, heat stabilization, UV stabilization, fire protection equipment or other additives. The method is preferably used for the improvement of the electrostatic paintability of homopolymers, copolymers or blends of polymers from the series polyethylene, polypropylene, polyvinyl chloride, polystyrene, polymethyl methacrylate, polycarbonate, diethylene glycol dialyl carbonate (CR 39), styrene / butadiene Copolymer, acrylonitrile / butadiene / styrene polymer, polyethylene terephthalate, polybutylene terephthalate, polyoxymethylene, polyamide, polysulfone, polyether sulfone, poly (aryl) ether ketone, polyimide or polyurethane. The method is particularly preferably used for blends of polypropylene and an ethylene-propylene diene copolymer. The electrical surface conductivity of the plastics mentioned is significantly increased by the method according to the invention, which ensures the formation of a high field line density and the discharge of the electrical charge in the electrostatic coating. The intermediate layers used show very good adhesive strength on the plastic substrates mentioned. If necessary, the adhesive strength of the intermediate layer can be additionally improved by a previous plasma treatment of the carrier, for example by a low-pressure plasma treatment in an oxygen-containing gas mixture.

Die elektrostatische Lackierung der erfindungsgemäß ausgerüsteten Teile kann in bekannter Weise mitThe electrostatic painting of the parts equipped according to the invention can be carried out in a known manner

- Hochrotationsglockenanlagen- Rotation bell systems

ScheibenanlagenDisc systems

luftfreie oder preßluftbetriebene Pistolenanlagenair-free or compressed air operated gun systems

erfolgen.respectively.

Das Verfahren ist geeignet fürThe method is suitable for

- Lacke auf der Basis von chemisch vernetzenden Bindemittel¬ systemen wie z.B. Polyurethane, Polyacrylate- Lacquers based on chemically crosslinking binder systems such as Polyurethanes, polyacrylates

Lacke auf der Basis eines physikalisch trocknenden Bindemit¬ telsystems wie z.B. Polyurethandispersionen oder Polyacrylat- dispersionen. Geeignet sind sowohl Lacksysteme auf Basis or¬ ganischer Lösungsmittel (z.B. Ester, Ketone, Gylkolether, Aromaten) als auch Wasserbasislacke. Verwendbar sind auch Lacke mit hohem Feststoffgehalt ("High So- lids") und Pulverlacke wie z.B. Epoxy-Polyester, Epoxy-Polyester- Hybrid-, Polyurethan-, Acrylat-, Polyester-Triglycidylisocyanu- rat-Lacke.Paints based on a physically drying binder system such as polyurethane dispersions or polyacrylate dispersions. Both paint systems based on organic solvents (eg esters, ketones, glycol ethers, aromatics) and water-based paints are suitable. Lacquers with a high solids content ("high solids") and powder lacquers such as, for example, epoxy polyester, epoxy polyester hybrid, polyurethane, acrylate, polyester triglycidyl isocyanate lacquers can also be used.

Dabei können aus den genannten Lacksystemen mehrschichtige Auf¬ bauten, bestehend ausIn this case, multi-layer structures consisting of

- Haftprimer/Füller/Decklack - Füller/Decklack- primer / filler / top coat - filler / top coat

hergestellt werden.getting produced.

Die erfindungsgemäß behandelten Kunststoffteile können verwendet werden alsThe plastic parts treated according to the invention can be used as

Bauteile im Automobilaußenbereich wie Stoßfänger, Klappen, Türen, Spoiler, Seitenverkleidungen, Rammschutzleisten, Rad¬ kappen, Streuscheiben,Components in the automotive exterior such as bumpers, flaps, doors, spoilers, side panels, ram protection strips, wheel covers, spreading discs,

Bauteile im Automobilinnenbereich wie Lenksäulenverkleidungen oder PhonogehäuseComponents in the automotive interior such as steering column covers or phono housings

HaushaltsgegenständeHousehold items

Gehäuse in der Unterhaltungselektronik.Housing in consumer electronics.

Bei den in den folgenden Beispielen verwendeten Substraten han¬ delt es sich um spritzgegossene Platten (15x15 cm2) aus einem Blend von Polypropylen und Ethylen-Propylen-Dien-Mischpolymerisa- ten, mit einem Ethylen-Anteil von 15 bis 20 Gew.-%, einem Kau¬ tschuk-Anteil von ca. 30 Gew.-% und einem Schmelzflußindex nach DIN 53735 von 2,5 g/10 min bei 230°C/2,16 kg.The substrates used in the following examples are injection-molded sheets (15 × 15 cm 2 ) made from a blend of polypropylene and ethylene-propylene-diene copolymers, with an ethylene content of 15 to 20% by weight. , a rubber content of approx. 30% by weight and a melt flow index according to DIN 53735 of 2.5 g / 10 min at 230 ° C / 2.16 kg.

Beispiel 1example 1

In einer Kathodenzerstäubungsanlage wurde ein plattenförmiges Kupfer-Target (0 200 mm) auf einer Magnetron-Kathode befestigt. Parallel zu dem Target würde in einem Abstand von 60 mm eine spritzgegossene Kunststoffplatte (150x150 mm2) auf einem metallis¬ chen Halter (0 700 mm) angebracht. Die Anlage wurde bis zu einem Druck von 10"7 mbar evakuiert. Danach wurde Argon in die Anlage eingelassen und ein Druck von 8xl0~3 mbar eingestellt. An das Cu- Target wurde mit Hilfe eines Radiofrequenz-Generators eine Wech- selspannung mit einer Frequenz von 13,56 MHz angelegt, bei einer Leistungsabgabe des Generators von 200 W. An den metallischen Halter der Kunststoffplatte wurde ebenfalls eine Wechselspannung der Frequenz 13,56 MHz angelegt, bei einer Generatorleistung von 500 W. Die Behandlungsdauer der Kunststoffplatte betrug 10 s.A plate-shaped copper target (0 200 mm) was attached to a magnetron cathode in a cathode sputtering system. In parallel to the target, an injection-molded plastic plate (150x150 mm 2 ) would be attached to a metallic holder (0 700 mm) at a distance of 60 mm. The system was evacuated to a pressure of 10 "7 mbar. Thereafter, argon was introduced into the system and a pressure of 8xl0 ~ 3 mbar was set. An AC voltage with a frequency was applied to the Cu target with the aid of a radio frequency generator of 13.56 MHz, with a power output of the generator of 200 W. An alternating voltage was also applied to the metallic holder of the plastic plate the frequency applied 13.56 MHz, with a generator power of 500 W. The treatment time of the plastic plate was 10 s.

Die behandelte Kunststoffplatte wurde mit einem wäßrigen Primer auf Basis von Epoxyharz und Polyamin-Komponenten durch elektro¬ statische Hochrotation beschichtet (Schichtdicken ca. 20 μ ) .The treated plastic plate was coated with an aqueous primer based on epoxy resin and polyamine components by means of electrostatic high-speed rotation (layer thicknesses approx. 20 μ).

Zum Vergleich wurden unbehandelte Kunststoffplatten analog be¬ schichtet.For comparison, untreated plastic plates were coated analogously.

Nach Trocknung des Lackes wurde der Auftragswirkungsgrad, d.h. das Verhältnis von aufgebrachter Lackmenge zu zerstäubter Lack¬ menge durch Gewichtsmessung bei beiden Platten bestimmt.After the paint had dried, the application efficiency, i.e. the ratio of the amount of paint applied to the atomized amount of paint is determined by measuring the weight of the two plates.

Der Auftragswirkungsgrad der behandelten Platte war um einen Fak¬ tor von 2,5 größer als der der unbehandelten Platte.The application efficiency of the treated plate was 2.5 times greater than that of the untreated plate.

Analog wurden eine behandelte bzw. eine unbehandelte Kunststoff- platte jeweils mit einem lösungsmittelhaltigen Metallicbasislack beschichtet und der Auftragswirkungsgrad bestimmt. Die behandel¬ ten Platten wiesen einen um einen Faktor von 2,6 höheren Auf¬ tragswirkungsgrad auf.Analogously, a treated or an untreated plastic plate was coated with a solvent-based metallic basecoat and the application efficiency was determined. The treated plates had a higher application efficiency by a factor of 2.6.

Beispiel 2Example 2

In einer Kathodenzerstäubungsanlage wurde ein plattenförmiges Target (0 150 mm) aus I goSnio auf einer Magnetron-Kathode befes¬ tigt. Parallel zu dem Target wurde im Abstand von 90 mm eine spritzgegossene Kunststoffplatte (150x150 mm) auf einem metalli- sehen Halter (0 700 mm) angebracht. Die Anlage wurde aufA plate-shaped target (0 150 mm) made of I goSnio was attached to a magnetron cathode in a cathode sputtering system. In parallel to the target, an injection-molded plastic plate (150x150 mm) was attached to a metallic holder (0 700 mm) at a distance of 90 mm. The facility was opened

10"7 mbar evakuiert. Danach wurden Argon und Sauerstoff bei einem Verhältnis von 74,1 Vol-% Ar zu 25,9 Vol-% 02 (bei einem Argonfluß von 40 seem [Standard eubie cm/min], und einem 02-Fluß von 14 seem) eingelassen und ein Druck von 5xl0-3 mbar eingestellt.10 " 7 mbar. Thereafter, argon and oxygen were at a ratio of 74.1% by volume Ar to 25.9% by volume 0 2 (at an argon flow of 40 nm [standard eubie cm / min], and a 0 2 -Flow of 14 seem) and a pressure of 5xl0 -3 mbar set.

Dann wurde eine Gleichspannung (Leistung von 500 W) angelegt und das IngoSnio-Target zerstäubt. Die Behandlungsdauer der Kunst¬ stoffplatte betrug 2 min.Then a DC voltage (power of 500 W) was applied and the IngoSnio target was atomized. The treatment time of the plastic plate was 2 minutes.

So behandelten Platten wurden wie in Beispiel 1 jeweils mit einem wäßrigen Primer bzw. einem Metallicbasislack beschichtet. Nach dem Trocknen wurde der Auftragswirkungsgrad bestimmt. Im Vergleich zu analog beschichteten unbehandelten Platten wiesen die behandelten Platten einen um einen Faktor von 2,7 (Beschich¬ tung mit wäßrigem Primer) bzw. von 3,7 (Metallicbasislack) höhe¬ ren Auftragswirkungsgrad auf. Boards treated in this way were each coated with an aqueous primer or a metallic basecoat, as in Example 1. After drying, the application efficiency was determined. Compared to untreated plates coated in a similar manner, the treated plates had a coating efficiency which was higher by a factor of 2.7 (coating with aqueous primer) or 3.7 (metallic base lacquer).

Claims

Patentansprüche Claims 1. Verfahren zur Vorbehandlung von Kunststoffteilen für die elektrostatische Lackierung, dadurch gekennzeichnet, daß man die Kunststoffteile in einem plasmaunterstützten Prozeß mit einer dünnen elektrisch leitenden Schicht versieht.1. A process for pretreating plastic parts for electrostatic painting, characterized in that the plastic parts are provided with a thin electrically conductive layer in a plasma-assisted process. 2. Verfahren nach Anspruch 1, daduch gekennzeichnet, daß die dünne elektrisch leitende Schicht aus einem Metall besteht.2. The method according to claim 1, characterized in that the thin electrically conductive layer consists of a metal. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die dünne elektrisch leitende Schicht aus einem Oxid, welches mindestens ein Element ausgewählt aus der Gruppe von In, Sn, Cd und Zn enthält, besteht.3. The method according to claim 1, characterized in that the thin electrically conductive layer consists of an oxide which contains at least one element selected from the group consisting of In, Sn, Cd and Zn. 4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekenn¬ zeichnet, daß die Aufbringung der dünnen Schicht durch plasmaunterstützte Kathodenzerstäubung erfolgt.4. The method according to any one of claims 1 to 3, characterized gekenn¬ characterized in that the application of the thin layer is carried out by plasma-assisted sputtering. 5. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekenn¬ zeichnet, daß die Aufbringung der dünnen Schicht durch plasmaunterstützte chemische Gasphasenabscheidung erfolgt.5. The method according to any one of claims 1 to 3, characterized gekenn¬ characterized in that the application of the thin layer is carried out by plasma-assisted chemical vapor deposition. 6. Verwendung von gemäß dem Verfahren nach einem der Ansprüche 1 bis 5 behandelten Kunststoffteilen als Substrate für die elektrostatische Lackierung.6. Use of plastic parts treated according to the method according to one of claims 1 to 5 as substrates for electrostatic painting. 7. Verfahren zur elektrostatischen Lackierung von Kunststofftei- len, dadurch gekennzeichnet, daß man die Kunststoffteile vor dem elektrostatischen Lackieren zunächst in einem plasmaun¬ terstützten Prozeß mit einer dünnen elektrisch leitenden Zwi¬ schenschicht versieht.7. A process for the electrostatic painting of plastic parts, characterized in that the plastic parts are first provided with a thin electrically conductive intermediate layer in a plasma-assisted process before the electrostatic painting. 8. Durch elektrostatische Lackierung beschichteter Gegenstand, erhältlich gemäß dem Verfahren nach Anspruch 7. 8. Object coated by electrostatic painting, obtainable according to the method of claim 7.
PCT/EP1993/002616 1992-10-01 1993-09-25 Pretreatment of plastic components for electrostatic enameling Ceased WO1994008068A1 (en)

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DE19924233000 DE4233000A1 (en) 1992-10-01 1992-10-01 Pretreatment of plastic parts for electrostatic painting
DEP4233000.9 1992-10-01

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GB2328692A (en) * 1997-08-18 1999-03-03 Agfa Gevaert Nv Metal deposition using plasma treatment
CN1320163C (en) * 2003-10-28 2007-06-06 尚志精密化学股份有限公司 Electrophoretic painting method
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CN113798148A (en) * 2021-08-20 2021-12-17 中国电器科学研究院股份有限公司 ABS plastic part coating pretreatment process

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EP1364984A4 (en) * 2000-12-05 2004-09-08 Shipley Co Llc RESIN COMPOSITE MATERIAL AND METHOD FOR THE PRODUCTION THEREOF
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JPS58128170A (en) * 1982-01-22 1983-07-30 Toyota Motor Corp Electrostatic painting method of resin material
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Cited By (5)

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Publication number Priority date Publication date Assignee Title
GB2328692A (en) * 1997-08-18 1999-03-03 Agfa Gevaert Nv Metal deposition using plasma treatment
CN1320163C (en) * 2003-10-28 2007-06-06 尚志精密化学股份有限公司 Electrophoretic painting method
US20120263927A1 (en) * 2011-04-12 2012-10-18 Stranczek Theodore F Method for applying a powder coating to a non-conductive work piece
CN113798148A (en) * 2021-08-20 2021-12-17 中国电器科学研究院股份有限公司 ABS plastic part coating pretreatment process
CN113798148B (en) * 2021-08-20 2023-01-17 中国电器科学研究院股份有限公司 A pre-painting process for ABS plastic parts

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