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WO1994004376A1 - Plaque de circuit integre - Google Patents

Plaque de circuit integre Download PDF

Info

Publication number
WO1994004376A1
WO1994004376A1 PCT/JP1993/001055 JP9301055W WO9404376A1 WO 1994004376 A1 WO1994004376 A1 WO 1994004376A1 JP 9301055 W JP9301055 W JP 9301055W WO 9404376 A1 WO9404376 A1 WO 9404376A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
card
long side
long
card according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1993/001055
Other languages
English (en)
Japanese (ja)
Inventor
Shiro Atsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to EP93916231A priority Critical patent/EP0618083B1/fr
Priority to JP50387194A priority patent/JP3169965B2/ja
Priority to US08/211,570 priority patent/US5544014A/en
Priority to DE69314466T priority patent/DE69314466T2/de
Publication of WO1994004376A1 publication Critical patent/WO1994004376A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
    • G06K19/083—Constructional details
    • H10W90/754—

Definitions

  • the present invention provides an IC card with a built-in semiconductor integrated circuit device, and in particular, a connection terminal for connecting an external device on the surface of the card, and a magnetic line (magnetic stripe) for storing information on the back of the card. It concerns the structure of IC cards. Background art
  • the IC card has a built-in central processing unit (CPU) and a memory circuit.
  • CPU central processing unit
  • memory circuit a type of computer. Therefore, various applications are possible.
  • IS0 International Organization for Standadization
  • JIS Japanese Industrial Standard
  • JISX 6303 JIS standard
  • the distance A to the upper side of -2 (the side closest to the upper end 101 of the sides defining the terminal) is specified as a maximum of 19.23nim.
  • IS 078 1 1-5 of the IS 0 standard (corresponding to JISX 6302 of the JIS standard) specifies the upper end 101 of the IC card 100 as shown in Fig. 16.
  • the distance B from the magnetic stripe 105 to the lower side of the third track 105a of the magnetic stripe 105 is specified as a minimum of 15.32 mm and a maximum of 15.82 mm.
  • FIG. 17 is an enlarged sectional view of a main part of an IC card with a magnetic stripe satisfying the above-mentioned standard (referred to as JIS-I type IC card in Japan). From this figure, the positional relationship between the IC chip module 103 and the magnetic stripe 105 can be easily understood.
  • the distance C from the upper end 101 of the force to the lower side of the magnetic stripe 105 covers the error of the maximum value of the distance B from the upper end 101 to the lower side of the third track 105a of 15.82 mm.
  • An object of the present invention is to alleviate such stress and to provide an IC card having higher durability than before. Disclosure of the invention
  • a first invention of the present application is directed to a semiconductor integrated circuit having a card base having a front surface and a back surface, a magnetic stripe for storing information on the back surface, and a connection terminal for connecting to an external device in a predetermined area on the front surface.
  • Module with built-in device In the IC module with the module, the end of the module is located in the vertical direction of the magnetic stripe.
  • the second invention of the present application is configured such that the thickness of the end portion is gradually reduced.
  • the third invention of the present application is configured such that a part of the end portion has a pointed shape. More specifically, the module is formed in a pentagonal or hexagonal shape, and the module is arranged so that the end of the module has a pointed shape.
  • FIG. 1 is a plan view showing an appearance of an IC card according to a first embodiment of the present invention
  • FIG. 2 is a plan view of an IC card showing a first embodiment of the present invention
  • FIG. FIG. 4 is an enlarged cross-sectional view for explaining in detail a main part cross-sectional view shown in FIG. 3, and
  • FIG. 5 is a second embodiment of the present invention.
  • FIG. 6 is a plan view of the IC chip module in the second embodiment
  • FIG. 7 is a cross-sectional view of the IC chip module shown in FIG. 6
  • FIG. 9 is a cross-sectional view of a main part showing a positional relationship between an IC chip module and a magnetic stripe in the embodiment of FIG. 9;
  • FIG. 9 is a cross-sectional view of a main part showing a positional relationship between an IC chip module and a magnetic stripe in the embodiment of FIG. 9;
  • FIG. 9 is an enlarged cross-sectional view for explaining in detail the cross-sectional view of the main part shown in FIG.
  • FIG. 0 is a plan view of an IC card showing a third embodiment of the present invention
  • FIG. 11 is a plan view of an IC chip module in the third embodiment
  • FIG. FIG. 13 is a cross-sectional view of the IC chip module
  • FIG. 13 is a cross-sectional view of a principal part showing a positional relationship between the IC chip module and the magnetic strip in the third embodiment
  • FIG. 14 is a cross-sectional view of FIG.
  • FIG. 15 is a plan view showing the appearance of the surface of a general IC force
  • FIG. 16 is a view showing FIG.
  • FIG. 15 Plan view showing the appearance of the back side of the C-force, No. 17 The figure is a cross-sectional view of the principal part of the IC card shown in FIG. 15, and FIG. 18 is I shown in FIG.
  • FIG. 4 is a cross-sectional view for explaining a state in which a stress is applied to a force.
  • FIG. 1 is a plan view of an IC card 1 in the present embodiment. This plan view is schematically shown to explain the present invention.
  • This IC card 1 has a plurality of connection terminals 5-1 for connecting to external devices on the surface of a card base 3, and an IC chip module (hereinafter, referred to as a module) 5 with a built-in semiconductor integrated circuit. Magnetic stripes 7 for storing information are formed on the back side, similar to a general IC card.
  • a characteristic part of the present invention is that the end 5 a (indicated by a dashed line in the figure) of the module 5 is formed so as to extend above the magnetic stripe 7 formed on the back surface. It is a point.
  • FIG. Fig. 2 schematically shows the IC card in Fig. 1.
  • the main part of the sectional view taken along line XX of FIG. 2 is shown in FIG.
  • the IC card in this embodiment is a module 5 is formed so as to extend to a position above the magnetic stripe 7. That is, the module 5 is arranged so that the distance L is smaller than the distance M as described above.
  • the module 5 covers a substrate 5-2, a semiconductor integrated circuit device 5-3 mounted on one surface of the substrate 5-2, and covers these. It is composed of a mold resin 5-4 and a connection terminal 5-1 mounted on the other surface of the substrate 5-2 for connecting to an external device (not shown).
  • the module is generally formed with a module receiving portion called a spot facing on the substrate surface and in the vicinity thereof, and is accommodated therein.
  • the magnetic stripe is also contained in a counterbore formed on the back surface of the substrate and in the vicinity thereof.
  • the thickness of the substrate changes gradually in the vicinity of the gap between the module and the magnetic stripe, so that the stress applied to this portion is reduced.
  • FIG. 5 is a plan view schematically showing an IC force in the present embodiment.
  • the IC card in this embodiment has a pointed shape 5b as shown in FIG. 6 at the end 5a of the module 5 of the IC card in the first embodiment, and furthermore, as shown in FIG. In this way, the thickness of the end is gradually reduced toward the tip 5c.
  • the module 5 has a pentagonal shape in plan view, and its thickness gradually decreases from the bottom 5 d of the end 5 b toward the tip 5 c. That is, the end 5b has a tapered shape 5e.
  • this IC card has a distance N from the upper end 3a of the card base 3 to the upper end of the module 5, that is, the tip 5c, and the distance N from the upper end 3a to the lower side 7a of the magnetic stripe 7 It is formed so as to be smaller.
  • FIG. 5 In order to easily understand the positional relationship between such a module 5 and the magnetic stripe 7, a main part of a cross-sectional view taken along line YY of FIG. 5 is shown in FIG.
  • the IC card according to the present embodiment is configured such that the end of the module 5 is positioned to extend above the magnetic stripe 7 and that the thickness of the end is gradually reduced. Is formed.
  • Fig. 9 shows an enlarged detail of this part. As is clear from this figure, the end 5b of the module 5 is formed so that its thickness gradually decreases toward the tip 5c.
  • the change in the thickness of the substrate near the gap between the module and the magnetic stripe becomes more gradual than in the first embodiment.
  • the applied stress is further reduced.
  • FIGS. 10 to 14 a third embodiment of the present invention will be described with reference to FIGS. 10 to 14.
  • the same parts as those described in the first and second embodiments are denoted by the same reference numerals, and description thereof will be omitted.
  • FIG. 10 is a plan view schematically showing the IC force in the present embodiment.o
  • FIG. 10 is a plan view schematically showing an IC force in this embodiment.
  • the IC card in this embodiment is such that the module 5 in the second embodiment is further provided with an end 5f at a portion facing the end 5b.
  • the IC card is bent in the short side direction.
  • the bending force 5 ' was considered only for the most concentrated "gap".
  • the lower part of the module 5 where such stress is concentrated secondly is also considered, and further, an IC card with improved durability is obtained.
  • the end 5f has the same shape as the end 5b. That is, the end 5f is symmetrical to the end 5b as shown in FIG. Further, as shown in FIG. 12, the end 5 gradually becomes thinner toward the tip 5 g. As can be easily understood from FIGS. 11 and 12, this module 5 has a hexagonal shape in plan view and has a thickness from the bottom 5 h at the end 5 mm to the tip 5 g at the end 5 mm. Is gradually becoming thinner. That is, the end 5f has a tapered shape 5i.
  • this IC card has a distance N from the upper end 3a of the card base 3 to the upper end of the module 5, that is, the tip 5c, is smaller than the distance M from the upper end 3a to the lower side 7a of the magnetic stripe 7. Needless to say, it is formed as follows.
  • the IC force in the present embodiment is formed so that the end of the module 5 is positioned to extend above the magnetic stripe 7 and the thickness of the end gradually decreases.
  • the opposite end has a similar shape symmetrically. .
  • Fig. 14 shows an enlarged view of this part.
  • the end 5f of the module 5 is formed so that its thickness gradually decreases toward the tip 5g like the end 5b.
  • the module, the magnetic strap, the change in the thickness of the substrate near the gap is moderated, so that the stress applied to this portion is alleviated, and the stress is also alleviated in the second portion where the stress is concentrated.
  • the present invention relates to an IC card with a built-in semiconductor integrated circuit device, and in particular, a connection terminal for connecting an external device to the surface of the card, and a magnetic line (magnetic stripe) for storing information on the back of the force card. It can be applied to the provided IC skills.
  • the step change of the substrate near the upper part of the module is reduced, and the portion thereof is reduced.
  • the stress on the surface is reduced o
  • the thickness of the end portion is configured to be gradually reduced, furthermore, the step change force s ′ of the substrate near the upper part of the module becomes smaller, and the portion has The applied stress is further reduced.
  • the module is formed in a pentagonal or hexagonal shape, and Since the module is arranged so that the tip of the part has a pointed shape, the change in the level difference of the substrate near the upper part of the module is reduced, and the stress applied to that part is reduced.
  • the invention when the first, second, and third inventions of the present application are added to the upper part of the module of the IC card, and the present invention is applied to the lower part of the module, the invention is applied to the IC card.
  • the stress can be reduced at the portion where the stress in the short side direction is most concentrated and the portion where the stress is concentrated second. As a result, a highly durable IC card can be provided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Une première invention concerne une plaque de circuit intégré (1) comprenant un substrat (3) pourvu d'une face frontale et d'une face dorsale; des bandes électromagnétiques (7) disposées sur la face dorsale du substrat et pouvant stocker des informations; et un module (5) comprenant un circuit à semiconducteur pourvu de bornes de raccordement (5-1), disposées dans une zone donnée de la face frontale du substrat (3) pour permettre le raccordement de la plaque (1) à un équipement extérieur, l'extrémité (5a) du module (5) étant disposée dans un sens perpendiculaire aux bandes électromagnétiques (7). La structure décrite ci-dessus permet de réduire le décrochement par rapport au substrat (3) à proximité de la partie supérieure du module (5), et donc d'avoir un affaiblissement des contraintes s'exerçant sur cette partie. En outre, selon une seconde invention, la plaque (1) possède une structure telle que l'épaisseur (5b) diminue graduellement. Le décrochement, à proximité de la partie principale du module (5) est encore plus petit, de sorte que les containtes s'exerçant sur cette partie sont relâchées. De plus, selon une troisième invention, une partie de l'extrémité (5b) a une forme cuspidée et le module (5) a une forme telle que la partie avancée (5c) de l'extrémité (5b) est cuspidée. Ainsi, le décrochement à proximité de la partie supérieure du substrat (3) est plus petit, ce qui permet un affaiblissement des contraintes s'exerçant sur cette partie. La plaque de circuit intégré selon l'invention est d'une grande durabilité.
PCT/JP1993/001055 1992-08-12 1993-07-27 Plaque de circuit integre Ceased WO1994004376A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP93916231A EP0618083B1 (fr) 1992-08-12 1993-07-27 Carte à circuit intégré
JP50387194A JP3169965B2 (ja) 1992-08-12 1993-07-27 Ｉｃカード
US08/211,570 US5544014A (en) 1992-08-12 1993-07-27 IC card having a built-in semiconductor integrated circuit device
DE69314466T DE69314466T2 (de) 1992-08-12 1993-07-27 Chip-Karte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4/215100 1992-08-12
JP21510092 1992-08-12

Publications (1)

Publication Number Publication Date
WO1994004376A1 true WO1994004376A1 (fr) 1994-03-03

Family

ID=16666756

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1993/001055 Ceased WO1994004376A1 (fr) 1992-08-12 1993-07-27 Plaque de circuit integre

Country Status (5)

Country Link
US (1) US5544014A (fr)
EP (1) EP0618083B1 (fr)
JP (1) JP3169965B2 (fr)
DE (1) DE69314466T2 (fr)
WO (1) WO1994004376A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002312743A (ja) * 2001-04-09 2002-10-25 Dainippon Printing Co Ltd 可逆表示部付きｉｃカード
JP2011521377A (ja) * 2008-05-22 2011-07-21 アメリカン エクスプレス トラベル リレイテッド サービシーズ カンパニー， インコーポレイテッド 金属を含有する取引カードおよびその作製方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
US6268237B1 (en) 1995-04-03 2001-07-31 Aptek Industries, Inc. Stress-free silicon wafer and a die or chip made therefrom and method
US6054372A (en) * 1995-04-03 2000-04-25 Aptek Industries, Inc. Stress-free silicon wafer and a die or chip made therefrom
US5733814A (en) * 1995-04-03 1998-03-31 Aptek Industries, Inc. Flexible electronic card and method
TW381236B (en) * 1995-07-07 2000-02-01 Docusystem Inc Integrated circuit chip card and the method and system for the manufacture same
JPH1097599A (ja) * 1996-09-24 1998-04-14 Hitachi Ltd Ｉｃカード用携帯端末装置
ATE469403T1 (de) * 2004-09-02 2010-06-15 Nxp Bv Identifizierungsdokument mit kontaktlosem rfid- chip
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
US10115047B2 (en) * 2016-12-09 2018-10-30 Capital One Services, Llc Transaction card with secured magnetic strip and method for making the same
JP1647727S (fr) 2018-02-01 2019-12-09
USD930000S1 (en) 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card

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JPS58125892A (ja) * 1981-12-24 1983-07-27 ゲ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− 集積回路モジユ−ルを有する識別カ−ドおよびキヤリヤ要素
JPS6384989A (ja) * 1986-09-30 1988-04-15 株式会社東芝 照合カ−ド装置
JPS63233892A (ja) * 1987-03-23 1988-09-29 松下電子工業株式会社 Ｉｃカ−ド

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DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
NL191959B (nl) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen.
JPS59228743A (ja) * 1983-06-10 1984-12-22 Kyodo Printing Co Ltd Ｉｃカ−ド用ｉｃモジユ−ル
JPS61123990A (ja) * 1984-11-05 1986-06-11 Casio Comput Co Ltd Ｉｃカ−ド
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JPS58125892A (ja) * 1981-12-24 1983-07-27 ゲ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− 集積回路モジユ−ルを有する識別カ−ドおよびキヤリヤ要素
JPS6384989A (ja) * 1986-09-30 1988-04-15 株式会社東芝 照合カ−ド装置
JPS63233892A (ja) * 1987-03-23 1988-09-29 松下電子工業株式会社 Ｉｃカ−ド

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See also references of EP0618083A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002312743A (ja) * 2001-04-09 2002-10-25 Dainippon Printing Co Ltd 可逆表示部付きｉｃカード
JP2011521377A (ja) * 2008-05-22 2011-07-21 アメリカン エクスプレス トラベル リレイテッド サービシーズ カンパニー， インコーポレイテッド 金属を含有する取引カードおよびその作製方法

Also Published As

Publication number Publication date
EP0618083A4 (fr) 1994-12-07
DE69314466D1 (de) 1997-11-13
US5544014A (en) 1996-08-06
DE69314466T2 (de) 1998-05-07
JP3169965B2 (ja) 2001-05-28
EP0618083A1 (fr) 1994-10-05
EP0618083B1 (fr) 1997-10-08

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