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WO1991011269A1 - Procede de nettoyage d'ensembles electriques - Google Patents

Procede de nettoyage d'ensembles electriques Download PDF

Info

Publication number
WO1991011269A1
WO1991011269A1 PCT/US1991/000594 US9100594W WO9111269A1 WO 1991011269 A1 WO1991011269 A1 WO 1991011269A1 US 9100594 W US9100594 W US 9100594W WO 9111269 A1 WO9111269 A1 WO 9111269A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
vapor
boiling point
electrical assembly
cleaned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1991/000594
Other languages
English (en)
Inventor
Robert C. Pfahl, Jr.
James A. Wrezel
Lawrence R. Hagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of WO1991011269A1 publication Critical patent/WO1991011269A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/04—Apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Definitions

  • Pentafluoropropanol which has a zero ozone depletion potential, has the following significant properties:
  • the assembly ( ⁇ 04) to be cleaned is first placed in the primary liquid (103) by passing it through the vapor.
  • the assembly (104) is positioned in the vapor layer (102) where it can be sprayed with the primary liquid (105) to remove the remaining contaminants.
  • the primary liquid (105) when it strikes the assembly (104), will atomize. This atomization may present the risk of explosion if the atomized mist was exposed to the atmosphere.
  • the vapor (102) mixes with the atomized primary liquid from the assembly being cleaned. This vapor mixture is then condensed by the condensing elements (101). The now liquid primary and secondary mixture is returned to the heated primary liquid (103) below where the secondary liquid is again vaporized to repeat the cycle.
  • the condensing elements (101) therefore, retains the vapor (102) which, in turn, retains the primary liquid (103).
  • FIG 2 illustrates another embodiment of this invention.
  • This embodiment is suited for assembly line cleaning of electronic assemblies.
  • the electronic assembly is first moved into a terpene wash (201) where it is emersed in heated terpene.
  • the assembly next travels through a high pressure terpene spray (202) to remove any remaining impurities.
  • the assembly finally travels through an isopropyl alcohol immersion (203) to remove the terpene residue.
  • Figure 3 illustrates yet another embodiment of this invention.
  • the electronic assembly is lowered through the vapor layer (302) for either immersion in the primary liquid (305) or spraying with primary liquid (301).
  • the primary liquid (305) should be kept at a temperature above 83°C to prevent the vapor (302) from condensing on the surface of the primary liquid.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Detergent Compositions (AREA)

Abstract

On chauffe un mélange d'un liquide primaire et d'un liquide secondaire dans un appareil de chauffage. On chauffe le mélange au moins jusqu'au point d'ébullition du liquide secondaire, mais à une température inférieure au point d'ébullition du liquide primaire. Le liquide secondaire s'évapore (102), formant une couche de vapeur au-dessus du liquide primaire (103). Des éléments de condensation (101), situés à proximité de la partie supérieure de l'appareil de nettoyage, condensent la vapeur (102), la renvoyant au liquide primaire chauffé (103) pour une nouvelle évaporation. L'ensemble électronique (104) à nettoyer est abaissé dans la vapeur, puis il est immergé dans le liquide primaire (103) avant d'être positionné dans la vapeur (102) où il peut être exposé à une pulvérisation de liquide primaire (105) afin d'éliminer les éventuels contaminants restants. La vapeur (102) se mélange au liquide primaire atomisé formé par la pulvérisation, et elle le renvoie au liquide primaire (103).
PCT/US1991/000594 1990-01-24 1991-01-18 Procede de nettoyage d'ensembles electriques Ceased WO1991011269A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46911790A 1990-01-24 1990-01-24
US469,117 1990-01-24

Publications (1)

Publication Number Publication Date
WO1991011269A1 true WO1991011269A1 (fr) 1991-08-08

Family

ID=23862491

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1991/000594 Ceased WO1991011269A1 (fr) 1990-01-24 1991-01-18 Procede de nettoyage d'ensembles electriques

Country Status (2)

Country Link
IE (1) IE910220A1 (fr)
WO (1) WO1991011269A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993011280A1 (fr) * 1991-12-02 1993-06-10 Allied-Signal, Inc. Systeme de nettoyage a base de solvants multiples
EP0588978A4 (fr) * 1991-06-14 1994-03-17 Petroferm Inc Composition et procede d'elimination du flux a souder a la resine a l'aide de terpene et d'hydrocarbures.
US6355113B1 (en) 1991-12-02 2002-03-12 3M Innovative Properties Company Multiple solvent cleaning system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1907875A (en) * 1929-05-10 1933-05-09 Carrier Engineering Co Ltd Method and apparatus for cleaning articles
US3904430A (en) * 1972-09-07 1975-09-09 Ici Ltd Cleaning process using a non-azeotrope forming contaminated cleaning mixture
US4640719A (en) * 1985-07-01 1987-02-03 Petroleum Fermentations N.V. Method for printed circuit board and/or printed wiring board cleaning
US4828751A (en) * 1987-08-28 1989-05-09 Pcr, Inc. Solvent composition for cleaning silicon wafers
US4867800A (en) * 1988-07-21 1989-09-19 E. I. Du Pont De Nemours And Company Cleaning composition of terpene compound and dibasic ester

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1907875A (en) * 1929-05-10 1933-05-09 Carrier Engineering Co Ltd Method and apparatus for cleaning articles
US3904430A (en) * 1972-09-07 1975-09-09 Ici Ltd Cleaning process using a non-azeotrope forming contaminated cleaning mixture
US4640719A (en) * 1985-07-01 1987-02-03 Petroleum Fermentations N.V. Method for printed circuit board and/or printed wiring board cleaning
US4640719B1 (fr) * 1985-07-01 1993-04-27 Petroferm Inc
US4828751A (en) * 1987-08-28 1989-05-09 Pcr, Inc. Solvent composition for cleaning silicon wafers
US4867800A (en) * 1988-07-21 1989-09-19 E. I. Du Pont De Nemours And Company Cleaning composition of terpene compound and dibasic ester
US4867800B1 (en) * 1988-07-21 1995-02-14 Du Pont Cleaning composition of terpene compound and dibasic ester

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0588978A4 (fr) * 1991-06-14 1994-03-17 Petroferm Inc Composition et procede d'elimination du flux a souder a la resine a l'aide de terpene et d'hydrocarbures.
US5679175A (en) * 1991-06-14 1997-10-21 Petroferm Inc. Cleaning process including use of solvating and rinsing agents
US5716457A (en) * 1991-06-14 1998-02-10 Petroferm Inc. Cleaning with solvating and rinsing agents
WO1993011280A1 (fr) * 1991-12-02 1993-06-10 Allied-Signal, Inc. Systeme de nettoyage a base de solvants multiples
AU664586B2 (en) * 1991-12-02 1995-11-23 Minnesota Mining And Manufacturing Company Multiple solvent cleaning system
US6355113B1 (en) 1991-12-02 2002-03-12 3M Innovative Properties Company Multiple solvent cleaning system

Also Published As

Publication number Publication date
IE910220A1 (en) 1991-07-31

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