WO1989001385A1 - Dispositif d'usinage de pieces a usiner - Google Patents
Dispositif d'usinage de pieces a usiner Download PDFInfo
- Publication number
- WO1989001385A1 WO1989001385A1 PCT/DE1988/000424 DE8800424W WO8901385A1 WO 1989001385 A1 WO1989001385 A1 WO 1989001385A1 DE 8800424 W DE8800424 W DE 8800424W WO 8901385 A1 WO8901385 A1 WO 8901385A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- radiation
- laser
- wavelength
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/06—Surface hardening
- C21D1/09—Surface hardening by direct application of electrical or wave energy; by particle radiation
Definitions
- the invention relates to a workpiece processing device according to the preamble of the main claim.
- a device for machining workpieces by means of laser beams has become known which allows an accurate, direct temperature measurement of a heated area of the workpiece to be machined.
- the device is equipped with a radiation detector which is exposed to the heat radiation of the workpiece heated by the laser beam.
- the radiation detector emits an output signal which is dependent on the strength of the thermal radiation and which is evaluated for the power control of the laser.
- the zone of the workpiece to be processed, for example to be hardened, is heated by the laser beam, which essentially has a single, relatively large wavelength.
- the intensity of the heat radiation emitted as a result of the local heating of the workpiece is measured and the power of the laser beam is controlled as a function of the intensity of the measured heat radiation.
- the heating of the workpiece zone is ended as soon as the measured intensity reaches a predetermined threshold value.
- the laser is either switched off or the laser beam is interrupted by means of a cover which can be introduced into the beam path. Good results can be achieved with this because the Workpiece surface is no longer heated and not at a higher temperature than is required for the respective processing.
- the radiation detector is arranged in such a way that it is hit directly by the heat radiation emanating from the workpiece.
- the workpiece machining device according to the invention with the characterizing features of the main claim has the advantage that it is suitable for temperature-controlled or temperature-controlled machining of both external and internal workpiece surfaces by means of laser radiation with constant accuracy of the temperature measurement.
- Each heat treatment process on a workpiece can be carried out in a temperature-controlled or temperature-controlled manner.
- a particularly advantageous embodiment of the device consists in that a heat reflection filter is used as the reflector, which filter is essentially transparent to the radiation with the wavelength of the laser radiation and is essentially impermeable to the heat radiation emanating from the workpiece.
- FIG. 1 An embodiment of the invention is shown in the drawing and explained in more detail in the following description.
- the figure shows an overall schematic view of the workpiece machining device.
- 1 designates a laser which is known per se and which emits a beam 2 which is essentially of a single wavelength.
- a workpiece 3 to be machined with an inner bore 4 is arranged on an adjustable support (not shown) in such a way that the bottom 5 of the bore 4 is heated by the laser beam 2, for example for the purpose of surface hardening.
- a mirror 6 is arranged, which deflects the radiation in the direction of the workpiece 3.
- a focusing device 7, for example in the form of a lens, lies between the mirror 6 and the workpiece 3 in the beam path of the laser beam 2 in order to focus it on the bottom 5 of the bore 4 or at another desired location on the workpiece.
- the heat radiation emanating from the workpiece 3 when it is heated (IR radiation of the wavelength 780 nm-1 mm) is recorded by a radiation detector 9 which responds to the wavelength range of this radiation.
- a reflector 10 designed as a plane plate is arranged in the beam path 2 of the laser 1, which is transparent to the laser radiation 2 while deflecting the heat radiation 8 emitted by the workpiece 3 in the direction of the detector 9.
- the latter supplies an electrical output signal which is proportional to the strength of the heat radiation 8 and which, after amplification, is fed as an actual value to a control circuit 11 to which the laser 1 is connected.
- the control circuit 11 endeavors to keep the laser power, ie the energy of the beam 2, at a setpoint previously entered in the control circuit.
- a carbon dioxide (CO) laser whose radiation has a wavelength of approximately 10.6 ⁇ m is preferably used as the laser.
- Pyroelectric detectors can be used as radiation detectors, which have their greatest sensitivities at wavelengths of approximately 800 nm - 5 ⁇ m.
- the wavelength and the intensity of the heat radiation of the workpiece 3 depend on its temperature. When the temperature rises, the intensity of the heat radiation increases and its peak wavelength shifts in the direction of smaller wavelengths. However, the values always differ significantly from the wavelength of the laser radiation, which in the case of a CO laser is considerably longer-wave than the thermal radiation of the workpiece 3. It is thus possible to determine the temperatures in the area in which the workpiece is heated to measure directly. The workpiece can thus always be brought to the same temperature, regardless of the output power of the laser.
- That part of the heat radiation of the heated workpiece 3 which is coaxial or parallel to the laser beam 2 is detected and evaluated in the proposed workpiece processing device.
- This part of the heat radiation is reflected out of the beam path at one point - in the exemplary embodiment between deflecting mirror 6 and laser 1 - and fed to the radiation detector 9. Since the wavelengths of the heat radiation and the laser radiation differ significantly from one another, a clean separation by means of a heat reflection filter 12 is possible, which is impermeable to the heat radiation 8 but essentially transparent to the laser radiation 2.
- the heat reflection filter 12 is applied in the form of, for example, a vapor-deposited coating on a carrier which is transparent to the laser radiation 2, for example a glass plate 13.
- the heat reflection filter 11 is preferably designed as a multilayer interference filter with a blocking area for the heat radiation 8 emanating from the workpiece 3 and a pass-through area for the laser radiation 2.
- the workpiece machining device described is preferably used for surface hardening of workpieces, with the advantage that internal zones, for example bores and the like, can also be hardened in a heat-controlled manner.
- the device can also be used for cutting and welding materials, the radiation detector 9 ensuring that the power of the laser 1 is in each case based on a predetermined setpoint. Both the surface treatment and the joining and separating are possible with a minimum of heat introduced, the beam guidance allowing a heat-controlled treatment in difficult to access places.
- the laser selected is a CO laser with an initial wavelength of approximately 10.6 ⁇ m
- lasers which work at a different wavelength can also be used.
- a YAG laser could be used, the radiation of which has a wavelength of approximately 1.06 ⁇ m. It is essential that the wavelength of the laser radiation differs from the wavelength of the IR radiation emitted by the heated workpiece.
- the parallel beam guidance of the cavity radiation to the laser radiation enables precise heat treatment at every point on the workpiece that can be reached by the laser beam.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
Un dispositif d'usinage de pièces à usiner comprend un laser (1) et un détecteur (1) de rayonnements exposé au rayonnement thermique (8) émis par la pièce à usiner (3) chauffée et qui permet de régler la puissance du laser (1). Un réflecteur (10) tranparent au rayonnement laser (2) est agencé dans le trajet du rayonnement du laser (1) et dévie le rayonnement thermique (8) émis par la pièce à usiner (3) vers le détecteur (9) agencé à l'extérieur du trajet du rayonnement.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19873726466 DE3726466A1 (de) | 1987-08-08 | 1987-08-08 | Werkstueckbearbeitungsvorrichtung |
| DEP3726466.4 | 1987-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1989001385A1 true WO1989001385A1 (fr) | 1989-02-23 |
Family
ID=6333379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE1988/000424 Ceased WO1989001385A1 (fr) | 1987-08-08 | 1988-07-07 | Dispositif d'usinage de pieces a usiner |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE3726466A1 (fr) |
| WO (1) | WO1989001385A1 (fr) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5041714A (en) * | 1987-11-25 | 1991-08-20 | Robert Bosch Gmbh | Workpiece processing arrangement |
| WO1994006943A1 (fr) * | 1992-09-24 | 1994-03-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Procede pour modifier la microstructure de rails metalliques |
| US7046267B2 (en) | 2003-12-19 | 2006-05-16 | Markem Corporation | Striping and clipping correction |
| US7167194B2 (en) | 2000-04-18 | 2007-01-23 | Laserink | Printing a code on a product |
| US7394479B2 (en) | 2005-03-02 | 2008-07-01 | Marken Corporation | Pulsed laser printing |
| WO2015197249A1 (fr) * | 2014-06-27 | 2015-12-30 | Robert Bosch Gmbh | Procédé de production d'un composant |
| US10583668B2 (en) | 2018-08-07 | 2020-03-10 | Markem-Imaje Corporation | Symbol grouping and striping for wide field matrix laser marking |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3934640C1 (de) * | 1989-10-17 | 1991-02-28 | Messerschmitt Boelkow Blohm | Verfahren und Vorrichtung zur Temperaturregelung bei Laserbestrahlung |
| DE4025851A1 (de) * | 1990-08-16 | 1992-02-20 | Messerschmitt Boelkow Blohm | Einrichtung zur messung rueckgestreuter strahlung |
| DE4028974A1 (de) * | 1990-09-12 | 1992-03-19 | Siemens Ag | Verfahren zur bestimmung der fokuslage |
| DE4310409C2 (de) * | 1993-03-31 | 1998-01-15 | Dresden Ev Inst Festkoerper | Verfahren und Vorrichtung zur Strahldiagnose bei der definierten Laserbestrahlung |
| DE9403822U1 (de) * | 1994-03-08 | 1995-07-06 | Berkenhoff & Drebes GmbH, 35614 Aßlar | Überwachungsvorrichtung für Laserstrahlung |
| DE10259177B4 (de) * | 2002-12-18 | 2010-11-04 | Robert Bosch Gmbh | Verfahren zur Durchführung eines Schweißprozesses |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2200696A1 (de) * | 1971-01-11 | 1972-07-20 | Honeywell Inc | Verarbeitungseinrichtung zur Bearbeitung von Werkstuecken mittels Laserstrahlen |
| US4009453A (en) * | 1974-10-16 | 1977-02-22 | Siemens Aktiengesellschaft | Narrow-band interference filter and its application in a laser system |
| US4544839A (en) * | 1982-12-16 | 1985-10-01 | The United States Of America As Represented By The United States Department Of Energy | Laser beam monitoring system |
| US4581280A (en) * | 1982-09-07 | 1986-04-08 | Nippon Soken, Inc. | Heat-blocking glass |
| US4673795A (en) * | 1984-10-15 | 1987-06-16 | General Electric Company | Integrated robotic laser material processing and imaging system |
-
1987
- 1987-08-08 DE DE19873726466 patent/DE3726466A1/de not_active Withdrawn
-
1988
- 1988-07-07 WO PCT/DE1988/000424 patent/WO1989001385A1/fr not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2200696A1 (de) * | 1971-01-11 | 1972-07-20 | Honeywell Inc | Verarbeitungseinrichtung zur Bearbeitung von Werkstuecken mittels Laserstrahlen |
| US4009453A (en) * | 1974-10-16 | 1977-02-22 | Siemens Aktiengesellschaft | Narrow-band interference filter and its application in a laser system |
| US4581280A (en) * | 1982-09-07 | 1986-04-08 | Nippon Soken, Inc. | Heat-blocking glass |
| US4544839A (en) * | 1982-12-16 | 1985-10-01 | The United States Of America As Represented By The United States Department Of Energy | Laser beam monitoring system |
| US4673795A (en) * | 1984-10-15 | 1987-06-16 | General Electric Company | Integrated robotic laser material processing and imaging system |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5041714A (en) * | 1987-11-25 | 1991-08-20 | Robert Bosch Gmbh | Workpiece processing arrangement |
| WO1994006943A1 (fr) * | 1992-09-24 | 1994-03-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Procede pour modifier la microstructure de rails metalliques |
| US7167194B2 (en) | 2000-04-18 | 2007-01-23 | Laserink | Printing a code on a product |
| US7046267B2 (en) | 2003-12-19 | 2006-05-16 | Markem Corporation | Striping and clipping correction |
| US7394479B2 (en) | 2005-03-02 | 2008-07-01 | Marken Corporation | Pulsed laser printing |
| WO2015197249A1 (fr) * | 2014-06-27 | 2015-12-30 | Robert Bosch Gmbh | Procédé de production d'un composant |
| CN106471137A (zh) * | 2014-06-27 | 2017-03-01 | 罗伯特·博世有限公司 | 用于制造构件元件的方法 |
| US10583668B2 (en) | 2018-08-07 | 2020-03-10 | Markem-Imaje Corporation | Symbol grouping and striping for wide field matrix laser marking |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3726466A1 (de) | 1989-02-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3739862C2 (fr) | ||
| DE3926859C2 (fr) | ||
| EP0700325B1 (fr) | Procede permettant de travailler des materiaux par rayonnement emis par des diodes | |
| DE3424825C2 (fr) | ||
| DE3202218C2 (de) | "Bearbeitungsmaschine mit einem CO↓2↓-Laser" | |
| DE4105647C2 (de) | Vorrichtung zur Laserbearbeitung eines Werkstückes | |
| WO1989001385A1 (fr) | Dispositif d'usinage de pieces a usiner | |
| DE4316829A1 (de) | Verfahren zur Materialbearbeitung mit Diodenstrahlung | |
| EP2667998A1 (fr) | Machine de traitement au laser, en particulier machine de coupe au laser, ainsi que procédé permettant de centrer un faisceau laser, en particulier un faisceau focalisé | |
| DE102011001710A1 (de) | Verfahren und Vorrichtung zur Laserstrahlbearbeitung eines Werkstücks | |
| DE102010015023B4 (de) | Verfahren und Vorrichtung zur Qualitätssicherung und Prozesskontrolle bei der Laserbearbeitung von Werkstücken | |
| DE2034341C3 (de) | Vorrichtung zur Materialbearbeitung mittels Laserstrahlen | |
| EP0421135A2 (fr) | Méthode et procédé pour la détermination de la position et du diamètre de la tache focale d'un rayon laser, en particulier pour l'usinage de matériaux avec un laser haute puissance | |
| EP0309973B1 (fr) | Procédé de traitement thermique de pièces en phase solide par un faisceau laser | |
| DE4126351A1 (de) | Verfahren zum bearbeiten von werkstueckoberflaechen mit laserstrahlung | |
| DE69300432T2 (de) | Laservorrichtung, insbesondere Laser-Roboter, mit einem Fokussierkopf, der mit Sensoren für die Qualitätsbestimmung des Prozesses in einem automatischen Produktionssystem ausgestattet ist. | |
| DE4006622C2 (de) | Vorrichtung zum Überwachen von mit Laserstrahlung bearbeiteten Werkstücken | |
| WO2019115449A1 (fr) | Procédé et unité d'ajustement servant à ajuster de manière automatisée un rayon laser d'un machine d'usinage par laser, ainsi que machine d'usinage par laser comprenant l'unité d'ajustement | |
| DE8710866U1 (de) | Werkstückbearbeitungsvorrichtung | |
| EP0674965B1 (fr) | Procédé de surveillance de la profondeur de soudage dans les pièces étant soudées au faisceau laser | |
| DE4124162C1 (en) | Optimising laser beam process quality, esp. ceramic cutting - includes measuring the intensity of e.g. UV and comparing against threshold value, increasing threshold value and measuring again when penetration occurs | |
| DE3934640C1 (de) | Verfahren und Vorrichtung zur Temperaturregelung bei Laserbestrahlung | |
| DE2700713A1 (de) | Verfahren zur beruehrungslosen messung von schleifkanten und schleifwinkeln von werkstoffen die mit schleifmaschinen bearbeitet werden | |
| DE3913786C2 (de) | Vorrichtung zur berührungslosen Schallemissionsmessung | |
| DE19522493C2 (de) | Verfahren zur Bestimmung der momentanen und Herbeiführung einer gewünschten Eindringtiefe eines Bearbeitungslaserstrahles in ein Werkstück sowie Vorrichtung zur Durchführung dieses Verfahrens |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): JP US |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE FR GB IT LU NL SE |