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WO1987000670A1 - Procede et dispositif de localisation de liaisons defectueuses entre des materiaux identiques ou differents - Google Patents

Procede et dispositif de localisation de liaisons defectueuses entre des materiaux identiques ou differents Download PDF

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Publication number
WO1987000670A1
WO1987000670A1 PCT/EP1986/000380 EP8600380W WO8700670A1 WO 1987000670 A1 WO1987000670 A1 WO 1987000670A1 EP 8600380 W EP8600380 W EP 8600380W WO 8700670 A1 WO8700670 A1 WO 8700670A1
Authority
WO
WIPO (PCT)
Prior art keywords
connection
sound emission
applying
loaded
fault
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP1986/000380
Other languages
German (de)
English (en)
Inventor
Siegbert ERLENKÄMPER
Jürgen Eisenblätter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Battelle Institut eV
Original Assignee
Battelle Institut eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Battelle Institut eV filed Critical Battelle Institut eV
Publication of WO1987000670A1 publication Critical patent/WO1987000670A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/227—Details, e.g. general constructional or apparatus details related to high pressure, tension or stress conditions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/14—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/228—Details, e.g. general constructional or apparatus details related to high temperature conditions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials

Definitions

  • the invention relates to a method for locating faulty connections between the same or different materials, in which a sound emission analysis is carried out while the connection is loaded. Furthermore, a device for carrying out this method is described, with devices for applying a load, sound emission sensors and with an electronic signal evaluation.
  • a load on the component is necessary to stimulate the emission, the entire component being loaded. If an error location is now to be carried out, several sound emission sensors, at least two for linear location and at least three for planar location, are necessary. In this case, the differences in the arrival times of the signals at the various sensors are measured and the location is determined using a computer. This method requires a lot of equipment.
  • the invention is based on the object of specifying a method by means of which the faulty connections can be quickly and easily located in welded, soldered or glued materials and in composite materials.
  • connection is loaded locally and in a scanning manner, the occurrence of sound emission signals indicating an error at the point of the connection which is currently loaded.
  • Claims 2 to 6 relate to advantageous embodiments of the method according to the invention.
  • the device according to the invention for carrying out the method with devices for applying a load, sound emission sensors and with an electronic signal evaluation is characterized in that a device for local loading of the connection is provided, with which the connection can be scanned, and that from the recorded sound emission signals an error in the currently loaded part of the Connection is detectable.
  • Advantageous embodiments of the device according to the invention are described in subclaims 8 to 13.
  • the local load is preferably introduced by thermal energy.
  • the expansion of the heated material at the faulty joint creates noise caused by friction and crack growth, the timing and intensity of which are determined by sound emission sensors and electronic signal evaluation.
  • the fault location can be determined after comparison with the respective position of the heating unit.
  • the thermal energy can be introduced via a hot air nozzle or locally via electromagnetic radiation in the infrared or visible frequency range, in particular via a laser beam.
  • the thermal energy can also be introduced into the connection point inductively.
  • connection is continuously loaded point by point along a line.
  • a z. B. meandering scanning possible.
  • For the position-defined introduction of the load z. B. serve a manipulator.
  • the location coordinates of the load can be z. B. also win by using a so-called electronic mouse and use it to display the location results.
  • the joint between two joining partners 1 and 2 is locally, e.g. B. punctiform, thermal energy, z. B. introduced via a hot air nozzle 4.
  • This causes an inhomogeneous expansion of the joining partners 1 and 2 which separate from each other.
  • This creates friction and crack growth noises in the faulty connection, which propagate from the place of origin and reach one or more permanently installed sound emission sensors 5.
  • the location of the sound emission sensor 5 is not critical. These can be attached to the workpiece to be tested at any suitable location.
  • a device which is coupled to the electronic signal evaluation and which marks the faulty connection point, for example with a dye or a laser beam, on the component to be tested.
  • a device serving for this purpose can be controlled either directly or by means of the electronic signal evaluation, or indirectly via the marking indicator.
  • the devices for local introduction of the thermal energy and the marking and, if necessary, also the troubleshooting can be designed to be fixed while the object to be examined is moving.

Landscapes

  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Optics & Photonics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

Dans le procédé ci-décrit, la liaison est sollicitée localement et par balayage, l'apparition de signaux d'émission acoustique révélant la présence d'un défaut à l'endroit de la liaison momentanément sollicité. De préférence, la sollicitation est appliquée au moyen de l'énergie thermique et la liaison est sollicitée par points le long d'une ligne droite ou d'une ligne courbe recouvrant la surface.
PCT/EP1986/000380 1985-07-19 1986-06-26 Procede et dispositif de localisation de liaisons defectueuses entre des materiaux identiques ou differents Ceased WO1987000670A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853525859 DE3525859A1 (de) 1985-07-19 1985-07-19 Verfahren und vorrichtung zur ortung von fehlerhaften verbindungen zwischen gleichen oder unterschiedlichen materialien
DEP3525859.4 1985-07-19

Publications (1)

Publication Number Publication Date
WO1987000670A1 true WO1987000670A1 (fr) 1987-01-29

Family

ID=6276226

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1986/000380 Ceased WO1987000670A1 (fr) 1985-07-19 1986-06-26 Procede et dispositif de localisation de liaisons defectueuses entre des materiaux identiques ou differents

Country Status (2)

Country Link
DE (1) DE3525859A1 (fr)
WO (1) WO1987000670A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9038473B2 (en) 2011-12-22 2015-05-26 United Technologies Corporation Energy absorbent ultrasonic inspection system with laser pointer

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29717736U1 (de) * 1997-12-29 1998-05-20 GMuG Gesellschaft für Materialprüfung und Geophysik mbH, 61239 Ober-Mörlen Gerät zur zerstörungsfreien Ermittlung von Haftungsfehlern in Schichten, Verbundwerkstoffen und Werkstoffverbunden mit Hilfe der Schallemission
DE10004212C1 (de) * 2000-02-01 2001-07-19 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur zerstörungsfreien Ermittlung der Haftung an Grenzflächen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1056482A (en) * 1963-04-09 1967-01-25 Republic Steel Corp Improvements relating to defect marking apparatus
EP0122076A2 (fr) * 1983-03-25 1984-10-17 Kabushiki Kaisha Toshiba Méthode d'évaluation de défauts pour des produits en céramique
FR2550627A1 (fr) * 1983-08-10 1985-02-15 Rolls Royce Inspection de composants par detection d'ondes transitoires de contrainte auto-produites

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1773531B2 (de) * 1968-05-30 1971-03-18 Reisholz Stahl & Roehrenwerk Vorrichtung zum ultraschallpruefen von rohren zur fest stellung von laengs und querfehlern durch in mehreren pruefebenen angeordneten impuls ultraschallgeraeten
US4111053A (en) * 1977-06-24 1978-09-05 The Boeing Company Audible bond tester
DE3034944C2 (de) * 1980-09-01 1985-01-17 Gerhard Dr. 8029 Sauerlach Busse Verfahren und Einrichtung zur photothermischen Struktur-Untersuchung fester Körper
DE3224637C2 (de) * 1982-07-01 1984-12-06 Siemens AG, 1000 Berlin und 8000 München Opto-akustisches Licht-Raster-Mikroskop
US4519245A (en) * 1983-04-05 1985-05-28 Evans Herbert M Method and apparatus for the non-destructive testing of materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1056482A (en) * 1963-04-09 1967-01-25 Republic Steel Corp Improvements relating to defect marking apparatus
EP0122076A2 (fr) * 1983-03-25 1984-10-17 Kabushiki Kaisha Toshiba Méthode d'évaluation de défauts pour des produits en céramique
FR2550627A1 (fr) * 1983-08-10 1985-02-15 Rolls Royce Inspection de composants par detection d'ondes transitoires de contrainte auto-produites

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9038473B2 (en) 2011-12-22 2015-05-26 United Technologies Corporation Energy absorbent ultrasonic inspection system with laser pointer

Also Published As

Publication number Publication date
DE3525859A1 (de) 1987-01-29

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