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USD868123S1 - Wire bonding wedge tool - Google Patents

Wire bonding wedge tool Download PDF

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Publication number
USD868123S1
USD868123S1 US29/588,393 US201629588393F USD868123S US D868123 S1 USD868123 S1 US D868123S1 US 201629588393 F US201629588393 F US 201629588393F US D868123 S USD868123 S US D868123S
Authority
US
United States
Prior art keywords
wire bonding
wedge tool
bonding wedge
depicts
side elevation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/588,393
Inventor
Russell Bell
Cesar Alfaro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek Inc
Original Assignee
Coorstek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coorstek Inc filed Critical Coorstek Inc
Assigned to COORSTEK, INC. reassignment COORSTEK, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ALFARO, CESAR, BELL, RUSSELL
Priority to US29/588,393 priority Critical patent/USD868123S1/en
Priority to JPD2017-13126F priority patent/JP1593382S/ja
Priority to TW107302004F priority patent/TWD193353S/en
Priority to JPD2017-13143F priority patent/JP1603893S/ja
Priority to TW107302009F priority patent/TWD193357S/en
Priority to TW106303395F priority patent/TWD191943S/en
Priority to JPD2017-13144F priority patent/JP1603998S/ja
Priority to JPD2017-13142F priority patent/JP1603997S/ja
Priority to TW107302006F priority patent/TWD193354S/en
Priority to TW107302007F priority patent/TWD193355S/en
Priority to TW107302008F priority patent/TWD193356S/en
Priority to JPD2017-13141F priority patent/JP1603892S/ja
Priority to JPD2017-13145F priority patent/JP1593493S/ja
Publication of USD868123S1 publication Critical patent/USD868123S1/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 depicts a perspective view of a wire bonding wedge tool illustrating a first embodiment of our new design.
FIG. 2 depicts a front side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 3 depicts a right side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 4 depicts a rear side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 5 depicts a left side elevation view of the wire bonding wedge tool of FIG. 1.
FIG. 6 depicts a bottom plan view of the wire bonding wedge tool of FIG. 1.
FIG. 7 depicts a top plan view of the wire bonding wedge tool of FIG. 1.
FIG. 8 depicts an enlarged perspective view of a tip of the wire bonding wedge tool of FIG. 1.
FIG. 9 depicts an enlarged front side elevation view of the tip of the wire bonding wedge tool of FIG. 1.
FIG. 10 depicts an enlarged right side elevation view of the tip of the wire bonding wedge tool of FIG. 1.
FIG. 11 depicts an enlarged rear side elevation view of the tip of the wire bonding wedge tool of FIG. 1.
FIG. 12 depicts an enlarged left side elevation view of the tip of the wire bonding wedge tool of FIG. 1.
FIG. 13 depicts an enlarged bottom plan view of the tip of the wire bonding wedge tool of FIG. 1.
FIG. 14 depicts a perspective view of a wire bonding wedge tool illustrating a second embodiment of our new design.
FIG. 15 depicts a front side elevation view of the wire bonding wedge tool of FIG. 14.
FIG. 16 depicts a right side elevation view of the wire bonding wedge tool of FIG. 14.
FIG. 17 depicts a rear side elevation view of the wire bonding wedge tool of FIG. 14.
FIG. 18 depicts a left side elevation view of the wire bonding wedge tool of FIG. 14.
FIG. 19 depicts a bottom plan view of the wire bonding wedge tool of FIG. 14.
FIG. 20 depicts a top plan view of the wire bonding wedge tool of FIG. 14.
FIG. 21 depicts an enlarged perspective view of a tip of the wire bonding wedge tool of FIG. 14.
FIG. 22 depicts an enlarged front side elevation view of the tip of the wire bonding wedge tool of FIG. 14.
FIG. 23 depicts an enlarged right side elevation view of the tip of the wire bonding wedge tool of FIG. 14.
FIG. 24 depicts an enlarged rear side elevation view of the tip of the wire bonding wedge tool of FIG. 14.
FIG. 25 depicts an enlarged left side elevation view of the tip of the wire bonding wedge tool of FIG. 14; and,
FIG. 26 depicts an enlarged bottom plan view of the tip of the wire bonding wedge tool of FIG. 14.
Features shown in dash-dot lines are boundaries that form no part of the claimed design.
Features shown in broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a wire bonding wedge tool, as shown and described.
US29/588,393 2016-12-20 2016-12-20 Wire bonding wedge tool Active USD868123S1 (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
US29/588,393 USD868123S1 (en) 2016-12-20 2016-12-20 Wire bonding wedge tool
JPD2017-13144F JP1603998S (en) 2016-12-20 2017-06-19
TW107302006F TWD193354S (en) 2016-12-20 2017-06-19 Wire bonding wedge tool
JPD2017-13143F JP1603893S (en) 2016-12-20 2017-06-19
TW107302009F TWD193357S (en) 2016-12-20 2017-06-19 Wire bonding wedge tool
TW106303395F TWD191943S (en) 2016-12-20 2017-06-19 Wire bonding wedge tool
JPD2017-13126F JP1593382S (en) 2016-12-20 2017-06-19
JPD2017-13142F JP1603997S (en) 2016-12-20 2017-06-19
TW107302004F TWD193353S (en) 2016-12-20 2017-06-19 Wire bonding wedge tool
TW107302007F TWD193355S (en) 2016-12-20 2017-06-19 Wire bonding wedge tool
TW107302008F TWD193356S (en) 2016-12-20 2017-06-19 Wire bonding wedge tool
JPD2017-13141F JP1603892S (en) 2016-12-20 2017-06-19
JPD2017-13145F JP1593493S (en) 2016-12-20 2017-06-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/588,393 USD868123S1 (en) 2016-12-20 2016-12-20 Wire bonding wedge tool

Publications (1)

Publication Number Publication Date
USD868123S1 true USD868123S1 (en) 2019-11-26

Family

ID=60655360

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/588,393 Active USD868123S1 (en) 2016-12-20 2016-12-20 Wire bonding wedge tool

Country Status (3)

Country Link
US (1) USD868123S1 (en)
JP (6) JP1603892S (en)
TW (6) TWD193353S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD967210S1 (en) * 2020-03-25 2022-10-18 SEVENTY EIGHT Co., Ltd. Welding nozzle cleaner
USD973738S1 (en) * 2019-11-13 2022-12-27 SEVENTY EIGHT Co., Ltd. Welding nozzle cleaner

Citations (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721250A (en) 1953-01-15 1955-10-18 Milton N Franklin Inert gas welding torch nozzle
US3101634A (en) 1960-09-12 1963-08-27 Gulton Ind Inc Sonic welder
US3289452A (en) 1963-07-23 1966-12-06 Siemens Ag Method and device for bonding a contact wire to a semiconductor member
US3453142A (en) 1966-03-14 1969-07-01 Air Reduction Welding electrode and composition
US3585352A (en) 1969-11-24 1971-06-15 Stoody Co Arc welding process and electrode for stainless steel
US3690538A (en) 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US3698646A (en) 1971-01-08 1972-10-17 Pfizer Composite carbon insert for gas shielded welding torch nozzle
US4030657A (en) 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
USD255318S (en) 1977-11-22 1980-06-10 Bakkeren Hans A Ultrasonic welding head for polypropylene strapping
US4343983A (en) 1979-09-20 1982-08-10 Westinghouse Electric Corp. Non-consumable composite welding electrode
USD269521S (en) 1980-12-02 1983-06-28 Aga Aktiebolag Nozzle component for a cutting torch
US4405074A (en) 1981-08-31 1983-09-20 Kulicke And Soffa Industries Inc. Composite bonding tool and method of making same
US4411411A (en) 1983-02-22 1983-10-25 Barthelmess Casey E Cutting torch guide attachment
US4415115A (en) 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
USD271741S (en) 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4600138A (en) 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
JPS62190343U (en) 1986-05-26 1987-12-03
JPS6380845U (en) 1986-11-14 1988-05-27
USD297704S (en) 1985-03-11 1988-09-20 Carol Bulow Miniature welding torch with disposable tip
USD305720S (en) 1987-02-09 1990-01-30 Olgesby & Butler Plc Soldering iron with removable cap
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
US5248076A (en) 1989-08-22 1993-09-28 Cooper Industries, Inc. Soldering tool
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5683603A (en) 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US5816472A (en) 1994-01-28 1998-10-06 Hewlett-Packard Company Bonding tool for tape automated assembly
US5954260A (en) 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
JPH11354569A (en) 1998-06-05 1999-12-24 Hitachi Ltd Wire bonding method and apparatus, and semiconductor device manufacturing method
US6041995A (en) 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
USD431434S (en) 1998-01-08 2000-10-03 Hakko Corporation Soldering iron tip
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6247631B1 (en) 1999-01-18 2001-06-19 Hakko Corporation Electric soldering iron
USD444175S1 (en) 2000-05-23 2001-06-26 Pentel Kabushiki Kaisha Correction pen
US6260753B1 (en) 1998-08-07 2001-07-17 Stmicroelectronics S.R.L. Gold bumps bonding on connection pads and subsequent coining of their vertex
US6352197B1 (en) 1999-01-29 2002-03-05 Rohm Co., Ltd. Method and apparatus for wire-bonding for electric components
US20020096551A1 (en) 1999-02-25 2002-07-25 Reiber Steven Frederick Dissipative ceramic bonding tool tip
US6457627B1 (en) 2000-03-09 2002-10-01 Oki Electric Industry Co., Ltd. Bonding capillary and semiconductor device
US6511389B2 (en) 1999-09-16 2003-01-28 Callaway Golf Company Golf ball with an aerodynamic surface on a thermoset cover
JP2003068784A (en) 2001-08-28 2003-03-07 Kyocera Corp Capillary for wire bonding
US6564989B2 (en) 2000-08-22 2003-05-20 Mitsubishi Denki Kabushiki Kaisha Wire bonding method and wire bonding apparatus
US6646228B2 (en) 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool
US6715658B2 (en) 2001-07-17 2004-04-06 Kulicke & Soffa Investments, Inc. Ultra fine pitch capillary
US6729527B2 (en) 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
US20040109980A1 (en) 2002-12-10 2004-06-10 Chen Sam H. Grip tape with self-textured surface
US6910612B2 (en) 2001-07-17 2005-06-28 Kulicke & Soffa Investments, Inc. Capillary with contained inner chamfer
USD517384S1 (en) 2004-01-22 2006-03-21 Pentel Kabushiki Kaisha Wire solder applicator
US7051915B2 (en) 2002-08-29 2006-05-30 Rohm Co., Ltd. Capillary for wire bonding and method of wire bonding using it
US20060273140A1 (en) 2005-04-22 2006-12-07 Regents Of The University Of Michigan Rotatable multi-pin apparatus, and process for friction driven stitch welding and structural modification of materials
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US7247588B2 (en) 2002-11-22 2007-07-24 Saint-Gobain Ceramics & Plastics, Inc. Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
USD549255S1 (en) 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
US7261230B2 (en) 2003-08-29 2007-08-28 Freescale Semiconductor, Inc. Wirebonding insulated wire and capillary therefor
US7320425B2 (en) 2004-05-12 2008-01-22 Kulicke And Soffa Industries, Inc. Low-profile capillary for wire bonding
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
JP2009147103A (en) 2007-12-14 2009-07-02 Renesas Technology Corp Semiconductor device and manufacturing method thereof
USD598721S1 (en) 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
JP2009283814A (en) 2008-05-26 2009-12-03 Toshiba Lighting & Technology Corp Capillary for wire bonding and electronic component assembling apparatus
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
US8056794B2 (en) 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
US20120045614A1 (en) 2010-08-19 2012-02-23 Hon Hai Precision Industry Co., Ltd. Coating, article coated with coating, and method for manufacturing article
USD667857S1 (en) 2009-06-04 2012-09-25 Smk Co., Ltd. Electrode tip for resistive welders
US8292160B2 (en) 2009-02-23 2012-10-23 Shinkawa Ltd. Method of manufacturing semiconductor device, and bonding apparatus
JP2013135008A (en) 2011-12-26 2013-07-08 Fuji Electric Co Ltd Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device
US20130341874A1 (en) 2012-06-26 2013-12-26 Garlock Sealing Technologies Llc Gasket Material, Gaskets, and Related Methods
USD697956S1 (en) 2013-01-24 2014-01-21 Tesa Tape Inc. Ultrasonic welding sheath
TW201412448A (en) 2012-09-26 2014-04-01 Toto股份有限公司 Soldering iron tip
TW201429601A (en) 2013-01-25 2014-08-01 Toto股份有限公司 Solder pin
TW201429600A (en) 2013-01-25 2014-08-01 Toto股份有限公司 Solder pin
US8820059B1 (en) * 2013-02-22 2014-09-02 Caterpillar Inc. Mounting assembly for reductant injector with thermal isolation and sealing gasket
US8850801B2 (en) * 2013-01-25 2014-10-07 Caterpillar Inc. Catalytic converter and muffler
JP2014222729A (en) 2013-05-14 2014-11-27 住友電気工業株式会社 Method and apparatus for manufacturing semiconductor device
USD720785S1 (en) 2013-10-30 2015-01-06 Sei Optifrontier Co., Ltd. Electrode bar for optical fiber fusion splicer
USD735787S1 (en) 2014-09-22 2015-08-04 Victor Equipment Company Tapered nozzle
USD741127S1 (en) 2013-11-14 2015-10-20 Robert Bosch Gmbh Glue applicator
USD744560S1 (en) 2014-09-22 2015-12-01 Victor Equipment Company Tapered contact tip
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
US9337166B2 (en) 2011-05-17 2016-05-10 Shinkawa Ltd. Wire bonding apparatus and bonding method
US9455544B2 (en) 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
US9816422B2 (en) * 2013-04-11 2017-11-14 Perkins Engines Company Limited Flowhood and emissions cleaning module
USD821468S1 (en) 2015-02-03 2018-06-26 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824970S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824969S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip

Patent Citations (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721250A (en) 1953-01-15 1955-10-18 Milton N Franklin Inert gas welding torch nozzle
US3101634A (en) 1960-09-12 1963-08-27 Gulton Ind Inc Sonic welder
US3289452A (en) 1963-07-23 1966-12-06 Siemens Ag Method and device for bonding a contact wire to a semiconductor member
US3453142A (en) 1966-03-14 1969-07-01 Air Reduction Welding electrode and composition
US3585352A (en) 1969-11-24 1971-06-15 Stoody Co Arc welding process and electrode for stainless steel
US3690538A (en) 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US3698646A (en) 1971-01-08 1972-10-17 Pfizer Composite carbon insert for gas shielded welding torch nozzle
US4030657A (en) 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
USD255318S (en) 1977-11-22 1980-06-10 Bakkeren Hans A Ultrasonic welding head for polypropylene strapping
US4343983A (en) 1979-09-20 1982-08-10 Westinghouse Electric Corp. Non-consumable composite welding electrode
USD269521S (en) 1980-12-02 1983-06-28 Aga Aktiebolag Nozzle component for a cutting torch
USD271741S (en) 1981-02-02 1983-12-13 Eldon Industries, Inc. Soldering iron tip
US4415115A (en) 1981-06-08 1983-11-15 Motorola, Inc. Bonding means and method
US4405074A (en) 1981-08-31 1983-09-20 Kulicke And Soffa Industries Inc. Composite bonding tool and method of making same
US4411411A (en) 1983-02-22 1983-10-25 Barthelmess Casey E Cutting torch guide attachment
US4600138A (en) 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method
USD297704S (en) 1985-03-11 1988-09-20 Carol Bulow Miniature welding torch with disposable tip
JPS62190343U (en) 1986-05-26 1987-12-03
JPS6380845U (en) 1986-11-14 1988-05-27
USD305720S (en) 1987-02-09 1990-01-30 Olgesby & Butler Plc Soldering iron with removable cap
US5217154A (en) 1989-06-13 1993-06-08 Small Precision Tools, Inc. Semiconductor bonding tool
US5248076A (en) 1989-08-22 1993-09-28 Cooper Industries, Inc. Soldering tool
US5485949A (en) 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
US5816472A (en) 1994-01-28 1998-10-06 Hewlett-Packard Company Bonding tool for tape automated assembly
US5445306A (en) 1994-05-31 1995-08-29 Motorola, Inc. Wedge wire bonding tool tip
US5683603A (en) 1995-04-19 1997-11-04 Fortune; William S. Electric soldering iron tip improvements
US6068174A (en) 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US5954260A (en) 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
US6041995A (en) 1997-03-06 2000-03-28 Kabushiki Kaisha Shinkawa Wire bonding method
USD431434S (en) 1998-01-08 2000-10-03 Hakko Corporation Soldering iron tip
JPH11354569A (en) 1998-06-05 1999-12-24 Hitachi Ltd Wire bonding method and apparatus, and semiconductor device manufacturing method
US6260753B1 (en) 1998-08-07 2001-07-17 Stmicroelectronics S.R.L. Gold bumps bonding on connection pads and subsequent coining of their vertex
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6247631B1 (en) 1999-01-18 2001-06-19 Hakko Corporation Electric soldering iron
US6352197B1 (en) 1999-01-29 2002-03-05 Rohm Co., Ltd. Method and apparatus for wire-bonding for electric components
US20020096551A1 (en) 1999-02-25 2002-07-25 Reiber Steven Frederick Dissipative ceramic bonding tool tip
US6646228B2 (en) 1999-08-18 2003-11-11 Hyperion Innovations, Inc. Cordless soldering iron
US6511389B2 (en) 1999-09-16 2003-01-28 Callaway Golf Company Golf ball with an aerodynamic surface on a thermoset cover
US6457627B1 (en) 2000-03-09 2002-10-01 Oki Electric Industry Co., Ltd. Bonding capillary and semiconductor device
USD444175S1 (en) 2000-05-23 2001-06-26 Pentel Kabushiki Kaisha Correction pen
US6564989B2 (en) 2000-08-22 2003-05-20 Mitsubishi Denki Kabushiki Kaisha Wire bonding method and wire bonding apparatus
US6729527B2 (en) 2001-01-30 2004-05-04 Kulicke & Soffa Investments, Inc. Bonding tool with polymer coating
US6715658B2 (en) 2001-07-17 2004-04-06 Kulicke & Soffa Investments, Inc. Ultra fine pitch capillary
US6910612B2 (en) 2001-07-17 2005-06-28 Kulicke & Soffa Investments, Inc. Capillary with contained inner chamfer
JP2003068784A (en) 2001-08-28 2003-03-07 Kyocera Corp Capillary for wire bonding
JP2004087822A (en) 2002-08-27 2004-03-18 Mitsubishi Materials Corp Wedge tool
US7051915B2 (en) 2002-08-29 2006-05-30 Rohm Co., Ltd. Capillary for wire bonding and method of wire bonding using it
US7247588B2 (en) 2002-11-22 2007-07-24 Saint-Gobain Ceramics & Plastics, Inc. Zirconia toughened alumina ESD safe ceramic composition, component, and methods for making same
US20040109980A1 (en) 2002-12-10 2004-06-10 Chen Sam H. Grip tape with self-textured surface
US7261230B2 (en) 2003-08-29 2007-08-28 Freescale Semiconductor, Inc. Wirebonding insulated wire and capillary therefor
US7249702B2 (en) 2003-12-04 2007-07-31 Kulicke And Soffa Industries, Inc. Multi-part capillary
US7500590B2 (en) 2003-12-04 2009-03-10 Kulicke And Soffa Industries, Inc. Multi-part capillary
USD517384S1 (en) 2004-01-22 2006-03-21 Pentel Kabushiki Kaisha Wire solder applicator
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
US7320425B2 (en) 2004-05-12 2008-01-22 Kulicke And Soffa Industries, Inc. Low-profile capillary for wire bonding
USD549255S1 (en) 2004-11-08 2007-08-21 Dragos Axinte Soldering iron tip
US20060273140A1 (en) 2005-04-22 2006-12-07 Regents Of The University Of Michigan Rotatable multi-pin apparatus, and process for friction driven stitch welding and structural modification of materials
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US8056794B2 (en) 2006-10-09 2011-11-15 Kulicke And Soffa Industries, Inc. Combination wedge bonding and ball bonding transducer
JP2009147103A (en) 2007-12-14 2009-07-02 Renesas Technology Corp Semiconductor device and manufacturing method thereof
USD598721S1 (en) 2008-04-24 2009-08-25 Luis Meza Motorcycle maintenance tool
JP2009283814A (en) 2008-05-26 2009-12-03 Toshiba Lighting & Technology Corp Capillary for wire bonding and electronic component assembling apparatus
US8292160B2 (en) 2009-02-23 2012-10-23 Shinkawa Ltd. Method of manufacturing semiconductor device, and bonding apparatus
USD667857S1 (en) 2009-06-04 2012-09-25 Smk Co., Ltd. Electrode tip for resistive welders
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
US9455544B2 (en) 2010-08-10 2016-09-27 Kulicke And Soffa Industries, Inc. Wire loops, methods of forming wire loops, and related processes
US20120045614A1 (en) 2010-08-19 2012-02-23 Hon Hai Precision Industry Co., Ltd. Coating, article coated with coating, and method for manufacturing article
US9337166B2 (en) 2011-05-17 2016-05-10 Shinkawa Ltd. Wire bonding apparatus and bonding method
JP2013135008A (en) 2011-12-26 2013-07-08 Fuji Electric Co Ltd Wedge tool for wire bonding, bonding device, wire bonding method, and method of manufacturing semiconductor device
US20130341874A1 (en) 2012-06-26 2013-12-26 Garlock Sealing Technologies Llc Gasket Material, Gaskets, and Related Methods
TW201412448A (en) 2012-09-26 2014-04-01 Toto股份有限公司 Soldering iron tip
JP2014082450A (en) 2012-09-26 2014-05-08 Toto Ltd Bonding capillary
USD697956S1 (en) 2013-01-24 2014-01-21 Tesa Tape Inc. Ultrasonic welding sheath
TW201429600A (en) 2013-01-25 2014-08-01 Toto股份有限公司 Solder pin
US8850801B2 (en) * 2013-01-25 2014-10-07 Caterpillar Inc. Catalytic converter and muffler
TW201429601A (en) 2013-01-25 2014-08-01 Toto股份有限公司 Solder pin
US8820059B1 (en) * 2013-02-22 2014-09-02 Caterpillar Inc. Mounting assembly for reductant injector with thermal isolation and sealing gasket
US9816422B2 (en) * 2013-04-11 2017-11-14 Perkins Engines Company Limited Flowhood and emissions cleaning module
JP2014222729A (en) 2013-05-14 2014-11-27 住友電気工業株式会社 Method and apparatus for manufacturing semiconductor device
USD720785S1 (en) 2013-10-30 2015-01-06 Sei Optifrontier Co., Ltd. Electrode bar for optical fiber fusion splicer
USD741127S1 (en) 2013-11-14 2015-10-20 Robert Bosch Gmbh Glue applicator
USD744560S1 (en) 2014-09-22 2015-12-01 Victor Equipment Company Tapered contact tip
USD735787S1 (en) 2014-09-22 2015-08-04 Victor Equipment Company Tapered nozzle
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD821468S1 (en) 2015-02-03 2018-06-26 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824970S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824969S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
TWD177555S (en) 2015-04-17 2016-08-11 闊斯泰股份有限公司 Portion of wire bonding wedge tool

Non-Patent Citations (27)

* Cited by examiner, † Cited by third party
Title
Decision of Grant dated Jan. 26, 2016 in Japanese Design Application No. 2015-21935 with a listing of references considered.
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016867.
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-016912.
Decision to Grant date Apr. 19, 2016 issued in Japanese Patent Application No. 2015-017097.
Decision to Grant dated Apr. 19, 2016 issued in Japanese Patent Application No. 2016-008039.
Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008037.
Decision to Grant dated Aug. 23, 2016 issued in Japanese Patent Application No. 2016-008038.
Design U.S. Appl. No. 29/516,521, filed Feb. 3, 2015, entitled Ceramic Bonding Tool with Textured Tip.
Design U.S. Appl. No. 29/516,523, filed Feb. 3, 2015, entitled Ceramic Bonding Tool with Textured Tip.
Design U.S. Appl. No. 29/516,524, filed Feb. 3, 2015, entitled Ceramic Bonding Tool with Textured Tip.
Gaiser Precision Bonding Tools "Capillary Wire Bonding," pp. 5-27, located at http://www.coorstek.com/markets/semiconductors_equipment/bonding-tools/capillaries.php, catalog published 2006.
Gaiser Precision Bonding Tools, "Fine-Pitch Process Requirements", pp. 41-59, located at http://www.coorstek.com/markets/semiconductors_equipment/bonding-tools/capillaries.php, catalog published 2006.
Gaiser Precision Bonding Tools, "Thermosonic Capillaries," pp. 28-40, located at http://www.coorstek.com/markets/semiconductors_equipment!bondingtools/cappillaries.php, catalog published 2006.
Gaiser Tool Company "Single Point T.A.B.", p. 109, catalog vol. 11, published 2000.
Office Action dated Oct. 28, 2016 for Design U.S. Appl. No. 29/516,523.
Office Action dated Oct. 6, 2015, issued in Japanese Design Application No. 2015-9731.
Office Action dated Oct. 6, 2016 for Design U.S. Appl. No. 29/516,521.
Office Action dated Oct. 6, 2016 for Design U.S. Appl. No. 29/516,524.
Search Report dated Dec. 7, 2015 in Taiwanese Design Patent Application No. 104302295 (English translation provided.
Search Report dated Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304080 (English Translation).
Search Report dated Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304081 (English Translation).
Search Report dated Mar. 15, 2016 in Taiwanese Design Patent Application No. 104304143 (English Translation).
Search Report dated May 13, 2016 issued in Taiwan Application No. 104305492.
Search Report issued in Taiwan Design Patent Application No. 105302375, dated Jul. 12, 2016.
Search Report issued in Taiwan Design Patent Application No. 105302376, dated Jul. 12, 2016.
Search Report issued in Taiwan Design Patent Application No. 105302377, dated Jul. 12, 2016.
Taiwan Search Report issued in Taiwan Application No. 107302004 dated Jul. 19, 2018, 1 page.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD973738S1 (en) * 2019-11-13 2022-12-27 SEVENTY EIGHT Co., Ltd. Welding nozzle cleaner
USD967210S1 (en) * 2020-03-25 2022-10-18 SEVENTY EIGHT Co., Ltd. Welding nozzle cleaner

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TWD191943S (en) 2018-08-01
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JP1603997S (en) 2018-05-14

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