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USD715748S1 - Inverted floating core heat sink - Google Patents

Inverted floating core heat sink Download PDF

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Publication number
USD715748S1
USD715748S1 US29/473,922 US201329473922F USD715748S US D715748 S1 USD715748 S1 US D715748S1 US 201329473922 F US201329473922 F US 201329473922F US D715748 S USD715748 S US D715748S
Authority
US
United States
Prior art keywords
heat sink
floating core
core heat
inverted floating
inverted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/473,922
Inventor
Ali Mira
Yashar Mira
Michael Mira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEATSCAPE, LLC
Original Assignee
Heatscape Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heatscape Inc filed Critical Heatscape Inc
Priority to US29/473,922 priority Critical patent/USD715748S1/en
Assigned to HEATSCAPE, INC. reassignment HEATSCAPE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIRA, ALI, MIRA, MICHAEL, MIRA, YASHAR
Application granted granted Critical
Publication of USD715748S1 publication Critical patent/USD715748S1/en
Assigned to HEATSCAPE, LLC reassignment HEATSCAPE, LLC CHANGE OF NAME Assignors: HEATSCAPE.COM, INC.
Assigned to EAST WEST BANK reassignment EAST WEST BANK SECURITY INTEREST Assignors: HEATSCAPE, LLC
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of an inverted floating core heat sink showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is an enlarged left side elevational view thereof;
FIG. 8 is an enlarged right side elevational view thereof;
FIG. 9 is a top perspective view of the inverted floating core heat sink disassembled from a generic circuit board;
FIG. 10 is a bottom perspective view corresponding to FIG. 9; and,
FIG. 11 shows a top perspective view of the inverted floating core heat sink assembled with a generic circuit board.
The generic circuit boards and the modules shown FIGS. 9-11 form no part of the claimed design.
The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an inverted floating core heat sink, as shown and described.
US29/473,922 2013-11-26 2013-11-26 Inverted floating core heat sink Active USD715748S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/473,922 USD715748S1 (en) 2013-11-26 2013-11-26 Inverted floating core heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/473,922 USD715748S1 (en) 2013-11-26 2013-11-26 Inverted floating core heat sink

Publications (1)

Publication Number Publication Date
USD715748S1 true USD715748S1 (en) 2014-10-21

Family

ID=51702711

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/473,922 Active USD715748S1 (en) 2013-11-26 2013-11-26 Inverted floating core heat sink

Country Status (1)

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US (1) USD715748S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190132938A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Floating core heat sink assembly
USD977488S1 (en) * 2021-05-29 2023-02-07 Junbo Lin Heat sink

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969949A (en) * 1998-03-31 1999-10-19 Sun Microsystems, Inc. Interfitting heat sink and heat spreader slug
US6407445B1 (en) * 2000-10-06 2002-06-18 National Semiconductor Corporation MOSFET-based electrostatic discharge (ESD) protection structure with a floating heat sink
US20030081382A1 (en) * 2001-10-31 2003-05-01 Lin Ching Huan Thermal module
US20060056153A1 (en) * 2004-09-16 2006-03-16 Industrial Design Laboratories Inc. Multi-heatsink integrated cooling device
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
USD589003S1 (en) * 2008-02-15 2009-03-24 Delta Electronics Inc. Heat sink
US20090223647A1 (en) * 2008-03-05 2009-09-10 Sinan Alousi Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
US7625223B1 (en) * 2008-10-01 2009-12-01 Tyco Electronics Corporation Connector system with floating heat sink
US8072762B2 (en) * 2009-10-21 2011-12-06 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Printed circuit board assembly
US8289699B2 (en) * 2010-09-21 2012-10-16 Foxconn Technology Co., Ltd. Heat dissipation module and electronic device having the same
US20120300401A1 (en) * 2011-05-27 2012-11-29 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipation device
US20140111939A1 (en) * 2012-10-18 2014-04-24 Tai-Wei Lin Electronic device with heat dissipation module
US8724326B2 (en) * 2011-12-16 2014-05-13 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation structure

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969949A (en) * 1998-03-31 1999-10-19 Sun Microsystems, Inc. Interfitting heat sink and heat spreader slug
US6407445B1 (en) * 2000-10-06 2002-06-18 National Semiconductor Corporation MOSFET-based electrostatic discharge (ESD) protection structure with a floating heat sink
US20030081382A1 (en) * 2001-10-31 2003-05-01 Lin Ching Huan Thermal module
US20060056153A1 (en) * 2004-09-16 2006-03-16 Industrial Design Laboratories Inc. Multi-heatsink integrated cooling device
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
USD589003S1 (en) * 2008-02-15 2009-03-24 Delta Electronics Inc. Heat sink
US20090223647A1 (en) * 2008-03-05 2009-09-10 Sinan Alousi Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members
US7625223B1 (en) * 2008-10-01 2009-12-01 Tyco Electronics Corporation Connector system with floating heat sink
US8072762B2 (en) * 2009-10-21 2011-12-06 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Printed circuit board assembly
US8289699B2 (en) * 2010-09-21 2012-10-16 Foxconn Technology Co., Ltd. Heat dissipation module and electronic device having the same
US20120300401A1 (en) * 2011-05-27 2012-11-29 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipation device
US8724326B2 (en) * 2011-12-16 2014-05-13 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation structure
US20140111939A1 (en) * 2012-10-18 2014-04-24 Tai-Wei Lin Electronic device with heat dissipation module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190132938A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Floating core heat sink assembly
USD977488S1 (en) * 2021-05-29 2023-02-07 Junbo Lin Heat sink

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