USD715748S1 - Inverted floating core heat sink - Google Patents
Inverted floating core heat sink Download PDFInfo
- Publication number
- USD715748S1 USD715748S1 US29/473,922 US201329473922F USD715748S US D715748 S1 USD715748 S1 US D715748S1 US 201329473922 F US201329473922 F US 201329473922F US D715748 S USD715748 S US D715748S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- floating core
- core heat
- inverted floating
- inverted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The generic circuit boards and the modules shown FIGS. 9-11 form no part of the claimed design.
The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.
Claims (1)
- The ornamental design for an inverted floating core heat sink, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/473,922 USD715748S1 (en) | 2013-11-26 | 2013-11-26 | Inverted floating core heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/473,922 USD715748S1 (en) | 2013-11-26 | 2013-11-26 | Inverted floating core heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD715748S1 true USD715748S1 (en) | 2014-10-21 |
Family
ID=51702711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/473,922 Active USD715748S1 (en) | 2013-11-26 | 2013-11-26 | Inverted floating core heat sink |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD715748S1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190132938A1 (en) * | 2017-10-31 | 2019-05-02 | Heatscape.Com, Inc. | Floating core heat sink assembly |
| USD977488S1 (en) * | 2021-05-29 | 2023-02-07 | Junbo Lin | Heat sink |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969949A (en) * | 1998-03-31 | 1999-10-19 | Sun Microsystems, Inc. | Interfitting heat sink and heat spreader slug |
| US6407445B1 (en) * | 2000-10-06 | 2002-06-18 | National Semiconductor Corporation | MOSFET-based electrostatic discharge (ESD) protection structure with a floating heat sink |
| US20030081382A1 (en) * | 2001-10-31 | 2003-05-01 | Lin Ching Huan | Thermal module |
| US20060056153A1 (en) * | 2004-09-16 | 2006-03-16 | Industrial Design Laboratories Inc. | Multi-heatsink integrated cooling device |
| USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
| USD589003S1 (en) * | 2008-02-15 | 2009-03-24 | Delta Electronics Inc. | Heat sink |
| US20090223647A1 (en) * | 2008-03-05 | 2009-09-10 | Sinan Alousi | Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members |
| US7625223B1 (en) * | 2008-10-01 | 2009-12-01 | Tyco Electronics Corporation | Connector system with floating heat sink |
| US8072762B2 (en) * | 2009-10-21 | 2011-12-06 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Printed circuit board assembly |
| US8289699B2 (en) * | 2010-09-21 | 2012-10-16 | Foxconn Technology Co., Ltd. | Heat dissipation module and electronic device having the same |
| US20120300401A1 (en) * | 2011-05-27 | 2012-11-29 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat dissipation device |
| US20140111939A1 (en) * | 2012-10-18 | 2014-04-24 | Tai-Wei Lin | Electronic device with heat dissipation module |
| US8724326B2 (en) * | 2011-12-16 | 2014-05-13 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation structure |
-
2013
- 2013-11-26 US US29/473,922 patent/USD715748S1/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969949A (en) * | 1998-03-31 | 1999-10-19 | Sun Microsystems, Inc. | Interfitting heat sink and heat spreader slug |
| US6407445B1 (en) * | 2000-10-06 | 2002-06-18 | National Semiconductor Corporation | MOSFET-based electrostatic discharge (ESD) protection structure with a floating heat sink |
| US20030081382A1 (en) * | 2001-10-31 | 2003-05-01 | Lin Ching Huan | Thermal module |
| US20060056153A1 (en) * | 2004-09-16 | 2006-03-16 | Industrial Design Laboratories Inc. | Multi-heatsink integrated cooling device |
| USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
| USD589003S1 (en) * | 2008-02-15 | 2009-03-24 | Delta Electronics Inc. | Heat sink |
| US20090223647A1 (en) * | 2008-03-05 | 2009-09-10 | Sinan Alousi | Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members |
| US7625223B1 (en) * | 2008-10-01 | 2009-12-01 | Tyco Electronics Corporation | Connector system with floating heat sink |
| US8072762B2 (en) * | 2009-10-21 | 2011-12-06 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Printed circuit board assembly |
| US8289699B2 (en) * | 2010-09-21 | 2012-10-16 | Foxconn Technology Co., Ltd. | Heat dissipation module and electronic device having the same |
| US20120300401A1 (en) * | 2011-05-27 | 2012-11-29 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat dissipation device |
| US8724326B2 (en) * | 2011-12-16 | 2014-05-13 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation structure |
| US20140111939A1 (en) * | 2012-10-18 | 2014-04-24 | Tai-Wei Lin | Electronic device with heat dissipation module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190132938A1 (en) * | 2017-10-31 | 2019-05-02 | Heatscape.Com, Inc. | Floating core heat sink assembly |
| USD977488S1 (en) * | 2021-05-29 | 2023-02-07 | Junbo Lin | Heat sink |
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