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USD632266S1 - Heat dissipating module - Google Patents

Heat dissipating module Download PDF

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Publication number
USD632266S1
USD632266S1 US29/343,811 US34381109F USD632266S US D632266 S1 USD632266 S1 US D632266S1 US 34381109 F US34381109 F US 34381109F US D632266 S USD632266 S US D632266S
Authority
US
United States
Prior art keywords
heat dissipating
dissipating module
module
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/343,811
Inventor
Yu-Hung Huang
Kun-Yu Kuo
Chun-Yang Hung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to US29/343,811 priority Critical patent/USD632266S1/en
Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, YU-HUNG, HUNG, CHUN YANG, KUO, KUN-YU
Application granted granted Critical
Publication of USD632266S1 publication Critical patent/USD632266S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top, front perspective view from the front and left side of a heat dissipating module showing our new design:
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plane view thereof; and,
FIG. 7 is a bottom plane view thereof.

Claims (1)

  1. The ornamental design for a heat dissipating module, as shown and described herein.
US29/343,811 2009-09-18 2009-09-18 Heat dissipating module Expired - Lifetime USD632266S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/343,811 USD632266S1 (en) 2009-09-18 2009-09-18 Heat dissipating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/343,811 USD632266S1 (en) 2009-09-18 2009-09-18 Heat dissipating module

Publications (1)

Publication Number Publication Date
USD632266S1 true USD632266S1 (en) 2011-02-08

Family

ID=43532363

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/343,811 Expired - Lifetime USD632266S1 (en) 2009-09-18 2009-09-18 Heat dissipating module

Country Status (1)

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US (1) USD632266S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD927435S1 (en) * 2019-04-12 2021-08-10 Shin-Etsu Polymer Co., Ltd. Heat dissipating device for batteries or electric devices
USD1059361S1 (en) * 2020-12-11 2025-01-28 Samsung Display Co., Ltd. Display module

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6151214A (en) * 1999-05-25 2000-11-21 First International Computer, Inc. Bearing structure of a central processing unit
USD483019S1 (en) * 2002-12-10 2003-12-02 Vanner, Inc. Heat sink for electronic equipment
US7277280B2 (en) * 2005-11-25 2007-10-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a dual-fan arrangement
US20070251677A1 (en) * 2006-04-26 2007-11-01 Foxconn Technology Co., Ltd. Heat dissipation apparatus with guilding plates for guiding airflow flowing through a fin assembly
US20080011454A1 (en) * 2006-07-12 2008-01-17 Ching-Bai Hwang Heat dissipation apparatus
US7382618B2 (en) * 2006-10-13 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating apparatus for computer add-on cards
US7492588B2 (en) * 2007-04-06 2009-02-17 Furui Precise Component (Kunshan) Co., Ltd. Heat dissipation apparatus with porous type heat dissipater
US20090135563A1 (en) * 2007-11-27 2009-05-28 Sony Corporation Heat radiation structure of electronic component and display device
US20090147476A1 (en) * 2007-12-11 2009-06-11 Evga Corporation Circuit board apparatus with induced air flow for heat dissipation
US20090168352A1 (en) * 2008-01-02 2009-07-02 Tzu-Lun Lan Heat sink device for a display card
USD597497S1 (en) * 2007-10-26 2009-08-04 Delta Electronics Inc. Heat dissipating module
US20090321058A1 (en) * 2006-03-02 2009-12-31 Sony Computer Enterainment Inc. Heat sink provided with centrifugal fan

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6151214A (en) * 1999-05-25 2000-11-21 First International Computer, Inc. Bearing structure of a central processing unit
USD483019S1 (en) * 2002-12-10 2003-12-02 Vanner, Inc. Heat sink for electronic equipment
US7277280B2 (en) * 2005-11-25 2007-10-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a dual-fan arrangement
US20090321058A1 (en) * 2006-03-02 2009-12-31 Sony Computer Enterainment Inc. Heat sink provided with centrifugal fan
US20070251677A1 (en) * 2006-04-26 2007-11-01 Foxconn Technology Co., Ltd. Heat dissipation apparatus with guilding plates for guiding airflow flowing through a fin assembly
US20080011454A1 (en) * 2006-07-12 2008-01-17 Ching-Bai Hwang Heat dissipation apparatus
US7382618B2 (en) * 2006-10-13 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating apparatus for computer add-on cards
US7492588B2 (en) * 2007-04-06 2009-02-17 Furui Precise Component (Kunshan) Co., Ltd. Heat dissipation apparatus with porous type heat dissipater
USD597497S1 (en) * 2007-10-26 2009-08-04 Delta Electronics Inc. Heat dissipating module
US20090135563A1 (en) * 2007-11-27 2009-05-28 Sony Corporation Heat radiation structure of electronic component and display device
US20090147476A1 (en) * 2007-12-11 2009-06-11 Evga Corporation Circuit board apparatus with induced air flow for heat dissipation
US20090168352A1 (en) * 2008-01-02 2009-07-02 Tzu-Lun Lan Heat sink device for a display card

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD927435S1 (en) * 2019-04-12 2021-08-10 Shin-Etsu Polymer Co., Ltd. Heat dissipating device for batteries or electric devices
USD1059361S1 (en) * 2020-12-11 2025-01-28 Samsung Display Co., Ltd. Display module

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