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USD676118S1 - Heat exchanger panel - Google Patents

Heat exchanger panel Download PDF

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Publication number
USD676118S1
USD676118S1 US29/409,211 US201129409211F USD676118S US D676118 S1 USD676118 S1 US D676118S1 US 201129409211 F US201129409211 F US 201129409211F US D676118 S USD676118 S US D676118S
Authority
US
United States
Prior art keywords
heat exchanger
exchanger panel
panel
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/409,211
Inventor
P{dot over (a)}l Francis Hansen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hiform AS
Original Assignee
Hiform AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hiform AS filed Critical Hiform AS
Assigned to HIFORM AS reassignment HIFORM AS ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HANSEN, PAL FRANCIS
Application granted granted Critical
Publication of USD676118S1 publication Critical patent/USD676118S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front view of a heat exchanger panel showing my new design;
FIG. 2 is a top view thereof;
FIG. 3 is a top, right perspective view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a bottom, left perspective view thereof;
FIG. 6 is a rear view thereof;
FIG. 7 is a left side view thereof; and,
FIG. 8 is a right side view thereof.

Claims (1)

  1. The ornamental design for a heat exchanger panel, as shown and described.
US29/409,211 2011-06-24 2011-12-21 Heat exchanger panel Active USD676118S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO20110497 2011-03-31
NO20110497 2011-06-24

Publications (1)

Publication Number Publication Date
USD676118S1 true USD676118S1 (en) 2013-02-12

Family

ID=47632383

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/409,211 Active USD676118S1 (en) 2011-06-24 2011-12-21 Heat exchanger panel

Country Status (1)

Country Link
US (1) USD676118S1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD714956S1 (en) * 2014-03-07 2014-10-07 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718472S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718470S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718471S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718469S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718466S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-Dimensional large capacity cell encapsulation device
USD718468S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718467S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD720469S1 (en) * 2013-03-07 2014-12-30 Viacyte, Inc. Cell encapsulation device
USD757662S1 (en) * 2014-02-06 2016-05-31 Kobe Steel, Ltd. Plate for heat exchanger
USD763804S1 (en) * 2014-02-06 2016-08-16 Kobe Steel, Ltd. Plate for heat exchanger
USD798830S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798829S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD1051080S1 (en) * 2021-03-23 2024-11-12 G.Skill International Enterprise Co., Ltd. Memory heat dissipation sink

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3291206A (en) * 1965-09-13 1966-12-13 Nicholson Terence Peter Heat exchanger plate
US4476855A (en) * 1982-04-15 1984-10-16 Unified Technologies, Inc. Solar heating device
USD317500S (en) * 1986-01-31 1991-06-11 Hidaka Engineering Co., Ltd. Finned heat exchanger plate
US20110220340A1 (en) * 2008-09-30 2011-09-15 Suncore Ab Heat exchanger element
US20120125582A1 (en) * 2010-11-16 2012-05-24 Hiform AS, Pal Francis HANSEN Heat exchanger of the plate type

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3291206A (en) * 1965-09-13 1966-12-13 Nicholson Terence Peter Heat exchanger plate
US4476855A (en) * 1982-04-15 1984-10-16 Unified Technologies, Inc. Solar heating device
USD317500S (en) * 1986-01-31 1991-06-11 Hidaka Engineering Co., Ltd. Finned heat exchanger plate
US20110220340A1 (en) * 2008-09-30 2011-09-15 Suncore Ab Heat exchanger element
US20120125582A1 (en) * 2010-11-16 2012-05-24 Hiform AS, Pal Francis HANSEN Heat exchanger of the plate type

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD720469S1 (en) * 2013-03-07 2014-12-30 Viacyte, Inc. Cell encapsulation device
USD755986S1 (en) 2013-03-07 2016-05-10 Viacyte, Inc. Cell encapsulation device
USD763804S1 (en) * 2014-02-06 2016-08-16 Kobe Steel, Ltd. Plate for heat exchanger
USD757662S1 (en) * 2014-02-06 2016-05-31 Kobe Steel, Ltd. Plate for heat exchanger
USD718469S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718466S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-Dimensional large capacity cell encapsulation device
USD718468S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718467S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD714956S1 (en) * 2014-03-07 2014-10-07 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718471S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718470S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD718472S1 (en) * 2014-03-07 2014-11-25 Viacyte, Inc. 3-dimensional large capacity cell encapsulation device
USD798830S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798829S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD1051080S1 (en) * 2021-03-23 2024-11-12 G.Skill International Enterprise Co., Ltd. Memory heat dissipation sink

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