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USD673921S1 - Portion of a substrate for an electronic circuit - Google Patents

Portion of a substrate for an electronic circuit Download PDF

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Publication number
USD673921S1
USD673921S1 US29/393,902 US201129393902F USD673921S US D673921 S1 USD673921 S1 US D673921S1 US 201129393902 F US201129393902 F US 201129393902F US D673921 S USD673921 S US D673921S
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US
United States
Prior art keywords
substrate
electronic circuit
view
elevational view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/393,902
Inventor
Isao Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OZAWA, ISAO
Application granted granted Critical
Publication of USD673921S1 publication Critical patent/USD673921S1/en
Assigned to TOSHIBA MEMORY CORPORATION reassignment TOSHIBA MEMORY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to KIOXIA CORPORATION reassignment KIOXIA CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA MEMORY CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front, bottom and left side perspective view of a portion of a substrate for an electronic circuit, showing my new design;
FIG. 2 is a rear, top and left side perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevational view thereof; and,
FIG. 8 is a rear elevational view thereof.
The uneven spaced broken lines define the bounds of the claimed design and form no part thereof. The even spaced broken line showing of the substrate for an electronic circuit is for illustrative purpose only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a portion of a substrate for an electronic circuit, as shown and described.
US29/393,902 2011-04-21 2011-06-10 Portion of a substrate for an electronic circuit Active USD673921S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011009239 2011-04-21
JP2011-009239 2011-04-21

Publications (1)

Publication Number Publication Date
USD673921S1 true USD673921S1 (en) 2013-01-08

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Family Applications (1)

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US29/393,902 Active USD673921S1 (en) 2011-04-21 2011-06-10 Portion of a substrate for an electronic circuit

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US (1) USD673921S1 (en)

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USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
USD702690S1 (en) * 2012-10-17 2014-04-15 Kingston Digital, Inc. Memory module
USD702689S1 (en) * 2012-08-17 2014-04-15 Kingston Digital, Inc. Memory module
USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD712854S1 (en) * 2013-04-26 2014-09-09 Nok Corporation Integrated circuit tag
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD729249S1 (en) * 2013-12-25 2015-05-12 Silicon Power Computer & Communications Inc. Memory access device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD733145S1 (en) * 2014-03-14 2015-06-30 Kingston Digital, Inc. Memory module
USD733713S1 (en) * 2013-01-04 2015-07-07 Samsung Electronics Co., Ltd. SSD storage device
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD794034S1 (en) * 2009-01-07 2017-08-08 Samsung Electronics Co., Ltd. Memory device
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD794641S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794643S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794642S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794644S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795261S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD795262S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD819037S1 (en) * 2016-01-22 2018-05-29 Shenzhen Longsys Electronics Co., Ltd. SSD storage module
USD848432S1 (en) * 2017-02-17 2019-05-14 Samsung Electronics Co., Ltd. SSD storage device
USD855577S1 (en) * 2018-04-12 2019-08-06 Telebox Industries Corp. Circuit board for electrical connector
USD868069S1 (en) * 2017-06-29 2019-11-26 V-Color Technology Inc. Memory device
USD869470S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card
USD930601S1 (en) * 2019-04-26 2021-09-14 The Noco Company Circuit board
USD938374S1 (en) * 2019-09-09 2021-12-14 The Noco Company Circuit board
USD944219S1 (en) * 2019-09-09 2022-02-22 The Noco Company Circuit board
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module
USD949117S1 (en) * 2019-09-09 2022-04-19 The Noco Company Circuit board
USD954006S1 (en) * 2020-11-03 2022-06-07 Linxens Holding Microcircuit for smart card
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board
USD958762S1 (en) * 2019-09-09 2022-07-26 The Noco Company Circuit board
USD1009777S1 (en) 2019-09-09 2024-01-02 The Noco Company Battery
USD1009815S1 (en) 2021-01-22 2024-01-02 The Noco Company Circuit board
USD1010591S1 (en) 2021-01-22 2024-01-09 The Noco Company Circuit board
USD1012872S1 (en) 2021-01-22 2024-01-30 The Noco Company Circuit board
USD1032499S1 (en) 2019-09-09 2024-06-25 The Noco Company Battery
USD1034430S1 (en) 2019-09-09 2024-07-09 The Noco Company Battery
US12040457B2 (en) 2019-04-26 2024-07-16 The Noco Company Lithium-ion battery management system (BMS) having diagonal arrangement
USD1035579S1 (en) 2021-12-15 2024-07-16 The Noco Company Battery box
USD1042320S1 (en) 2019-09-09 2024-09-17 The Noco Company Battery
USD1045774S1 (en) 2019-09-09 2024-10-08 The Noco Company Battery
USD1083851S1 (en) 2019-09-09 2025-07-15 The Noco Company Circuit board
USD1087043S1 (en) * 2022-09-06 2025-08-05 Marvell Asia Pte. Ltd. Integrated circuit substrate

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US6101096A (en) * 1999-06-10 2000-08-08 Intel Corporation Heat sink clip for an electronic assembly
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
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US20030094628A1 (en) * 2001-11-21 2003-05-22 Yeh Nai Hua Memory module structure
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US20100296236A1 (en) * 2009-05-21 2010-11-25 Ocz Technology Group, Inc. Mass storage device for a computer system and method therefor
US20110051351A1 (en) * 2009-08-25 2011-03-03 Elpida Memory, Inc. Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board
US20110063790A1 (en) * 2009-09-14 2011-03-17 Park Kwang-Soo Apparatus capable of selectively using different types of connectors
US8040680B2 (en) * 2007-12-27 2011-10-18 Kabushiki Kaisha Toshiba Information processing apparatus and nonvolatile semiconductor storage device
US8189328B2 (en) * 2006-10-23 2012-05-29 Virident Systems, Inc. Methods and apparatus of dual inline memory modules for flash memory
US8199521B2 (en) * 2006-10-31 2012-06-12 Qimonda Ag Memory module and method for operating a memory module

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Publication number Priority date Publication date Assignee Title
US5973399A (en) * 1998-02-17 1999-10-26 Intel Corporation Tamper resistant attach mechanism between plastic cover and thermal plate assembly for processor cartridges
US6101096A (en) * 1999-06-10 2000-08-08 Intel Corporation Heat sink clip for an electronic assembly
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
US20070274032A1 (en) * 2000-01-06 2007-11-29 Super Talent Electronics Inc. Thin Flash-Hard-Drive with Two-Piece Casing
US6930889B2 (en) * 2001-03-16 2005-08-16 Intel Corporation Circuit board and slot connector assembly
US20030006064A1 (en) * 2001-05-22 2003-01-09 Infineon Technologies Ag Circuit board for memory components
US20030094628A1 (en) * 2001-11-21 2003-05-22 Yeh Nai Hua Memory module structure
US7502231B2 (en) * 2003-07-16 2009-03-10 Samsung Electronics Co., Ltd. Thin printed circuit board for manufacturing chip scale package
US20080089020A1 (en) * 2004-11-16 2008-04-17 Super Talent Electronics, Inc. Solid State Drive (SSD) With Open Top And Bottom Covers
US7489025B2 (en) * 2004-11-16 2009-02-10 International Business Machines Corporation Device and method for fabricating double-sided SOI wafer scale package with optical through via connections
US20060186520A1 (en) * 2005-02-03 2006-08-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device and manufacturing method thereof
US7315454B2 (en) * 2005-10-31 2008-01-01 Infineon Technologies Ag Semiconductor memory module
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US8199521B2 (en) * 2006-10-31 2012-06-12 Qimonda Ag Memory module and method for operating a memory module
US20080123318A1 (en) * 2006-11-08 2008-05-29 Atmel Corporation Multi-component electronic package with planarized embedded-components substrate
US20080137278A1 (en) * 2006-12-11 2008-06-12 Kreton Corporation Memory chip and insert card having the same thereon
US20080200041A1 (en) * 2007-02-16 2008-08-21 Ritek Corporation Storage device
US7685337B2 (en) * 2007-05-24 2010-03-23 Siliconsystems, Inc. Solid state storage subsystem for embedded applications
US8040680B2 (en) * 2007-12-27 2011-10-18 Kabushiki Kaisha Toshiba Information processing apparatus and nonvolatile semiconductor storage device
US20090279243A1 (en) * 2009-05-13 2009-11-12 Amidi Mike H Memory Module with Vertically Accessed Interposer Assemblies
US20100296236A1 (en) * 2009-05-21 2010-11-25 Ocz Technology Group, Inc. Mass storage device for a computer system and method therefor
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US20110063790A1 (en) * 2009-09-14 2011-03-17 Park Kwang-Soo Apparatus capable of selectively using different types of connectors

Cited By (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD794034S1 (en) * 2009-01-07 2017-08-08 Samsung Electronics Co., Ltd. Memory device
USD795262S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD795261S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD794644S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794642S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794643S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794641S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD691101S1 (en) * 2011-11-08 2013-10-08 Seiko Epson Corporation Circuit board for an ink cartridge
USD702689S1 (en) * 2012-08-17 2014-04-15 Kingston Digital, Inc. Memory module
USD702690S1 (en) * 2012-10-17 2014-04-15 Kingston Digital, Inc. Memory module
USD733713S1 (en) * 2013-01-04 2015-07-07 Samsung Electronics Co., Ltd. SSD storage device
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD712854S1 (en) * 2013-04-26 2014-09-09 Nok Corporation Integrated circuit tag
USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD729249S1 (en) * 2013-12-25 2015-05-12 Silicon Power Computer & Communications Inc. Memory access device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD733145S1 (en) * 2014-03-14 2015-06-30 Kingston Digital, Inc. Memory module
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD819037S1 (en) * 2016-01-22 2018-05-29 Shenzhen Longsys Electronics Co., Ltd. SSD storage module
USD848432S1 (en) * 2017-02-17 2019-05-14 Samsung Electronics Co., Ltd. SSD storage device
USD868069S1 (en) * 2017-06-29 2019-11-26 V-Color Technology Inc. Memory device
USD869470S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD855577S1 (en) * 2018-04-12 2019-08-06 Telebox Industries Corp. Circuit board for electrical connector
USD947800S1 (en) * 2018-07-23 2022-04-05 CACI, Inc.—Federal Integrated module
US11662698B2 (en) 2018-07-23 2023-05-30 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using machine learning models
US11747775B2 (en) 2018-07-23 2023-09-05 CACI, Inc.—Federal Integrated tamper detection system and methods
US11333677B2 (en) 2018-07-23 2022-05-17 CACI, Inc.—Federal Methods and apparatuses for detecting tamper using heuristic models
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card
USD930601S1 (en) * 2019-04-26 2021-09-14 The Noco Company Circuit board
USD1045795S1 (en) 2019-04-26 2024-10-08 The Noco Company Battery tray
USD1083852S1 (en) 2019-04-26 2025-07-15 The Noco Company Circuit board
US12040457B2 (en) 2019-04-26 2024-07-16 The Noco Company Lithium-ion battery management system (BMS) having diagonal arrangement
USD937792S1 (en) * 2019-04-26 2021-12-07 The Noco Company Circuit board
USD1009778S1 (en) 2019-04-26 2024-01-02 The Noco Company Battery
USD1003822S1 (en) 2019-04-26 2023-11-07 The Noco Company Battery
USD937793S1 (en) * 2019-04-26 2021-12-07 The Noco Company Circuit board
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USD1045774S1 (en) 2019-09-09 2024-10-08 The Noco Company Battery
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board
USD954006S1 (en) * 2020-11-03 2022-06-07 Linxens Holding Microcircuit for smart card
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