USD588080S1 - 2021-8J matrix leadframe - Google Patents
2021-8J matrix leadframe Download PDFInfo
- Publication number
- USD588080S1 USD588080S1 US29/292,066 US29206607F USD588080S US D588080 S1 USD588080 S1 US D588080S1 US 29206607 F US29206607 F US 29206607F US D588080 S USD588080 S US D588080S
- Authority
- US
- United States
- Prior art keywords
- matrix
- matrix leadframe
- leadframe
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
Claims (1)
- The ornamental design for 2021-8J matrix leadframe, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/292,066 USD588080S1 (en) | 2007-09-26 | 2007-09-26 | 2021-8J matrix leadframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/292,066 USD588080S1 (en) | 2007-09-26 | 2007-09-26 | 2021-8J matrix leadframe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD588080S1 true USD588080S1 (en) | 2009-03-10 |
Family
ID=40417371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/292,066 Expired - Lifetime USD588080S1 (en) | 2007-09-26 | 2007-09-26 | 2021-8J matrix leadframe |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD588080S1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130292811A1 (en) * | 2012-05-02 | 2013-11-07 | Texas Instruments Incorporated | Leadframe having selective planishing |
| US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
| USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
| USD702240S1 (en) * | 2012-04-13 | 2014-04-08 | Blackberry Limited | UICC apparatus |
| US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
| USD761216S1 (en) * | 2014-12-12 | 2016-07-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED leadframe |
| USD803801S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
| USD803800S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
| USD803799S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
Citations (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD298231S (en) * | 1985-04-24 | 1988-10-25 | Sumitomo Electric Industries, Ltd. | Lead frame for a semiconductor element or the like |
| US4846700A (en) * | 1987-04-06 | 1989-07-11 | Dennis Richard K | Lead frame for semi-conductor device |
| US4870474A (en) * | 1986-12-12 | 1989-09-26 | Texas Instruments Incorporated | Lead frame |
| US5486722A (en) * | 1993-05-11 | 1996-01-23 | Sumitomo Metal Mining Company, Limited | Lead frame having small pitch between outer leads |
| US6566740B2 (en) * | 2000-03-23 | 2003-05-20 | Mitsui High-Tec, Inc. | Lead frame for a semiconductor device and method of manufacturing a semiconductor device |
| USD483337S1 (en) * | 2002-11-25 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD483336S1 (en) * | 2002-11-15 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD484103S1 (en) * | 2002-11-15 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD484104S1 (en) * | 2002-11-25 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD484859S1 (en) * | 2003-02-07 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD484858S1 (en) * | 2002-11-15 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD485244S1 (en) * | 2002-12-17 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD485243S1 (en) * | 2002-10-22 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD485808S1 (en) * | 2003-01-03 | 2004-01-27 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD486802S1 (en) * | 2002-12-17 | 2004-02-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD487432S1 (en) * | 2003-02-07 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD487431S1 (en) * | 2003-01-03 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD488136S1 (en) * | 2003-01-03 | 2004-04-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD491900S1 (en) * | 2002-12-17 | 2004-06-22 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD492266S1 (en) * | 2002-11-15 | 2004-06-29 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD494939S1 (en) * | 2002-12-17 | 2004-08-24 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| US6885086B1 (en) * | 2002-03-05 | 2005-04-26 | Amkor Technology, Inc. | Reduced copper lead frame for saw-singulated chip package |
| USD505122S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD513608S1 (en) * | 2003-01-03 | 2006-01-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
-
2007
- 2007-09-26 US US29/292,066 patent/USD588080S1/en not_active Expired - Lifetime
Patent Citations (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD298231S (en) * | 1985-04-24 | 1988-10-25 | Sumitomo Electric Industries, Ltd. | Lead frame for a semiconductor element or the like |
| US4870474A (en) * | 1986-12-12 | 1989-09-26 | Texas Instruments Incorporated | Lead frame |
| US4846700A (en) * | 1987-04-06 | 1989-07-11 | Dennis Richard K | Lead frame for semi-conductor device |
| US5486722A (en) * | 1993-05-11 | 1996-01-23 | Sumitomo Metal Mining Company, Limited | Lead frame having small pitch between outer leads |
| US6566740B2 (en) * | 2000-03-23 | 2003-05-20 | Mitsui High-Tec, Inc. | Lead frame for a semiconductor device and method of manufacturing a semiconductor device |
| US6885086B1 (en) * | 2002-03-05 | 2005-04-26 | Amkor Technology, Inc. | Reduced copper lead frame for saw-singulated chip package |
| USD485243S1 (en) * | 2002-10-22 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD483336S1 (en) * | 2002-11-15 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD492266S1 (en) * | 2002-11-15 | 2004-06-29 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD484858S1 (en) * | 2002-11-15 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD484103S1 (en) * | 2002-11-15 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD483337S1 (en) * | 2002-11-25 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD484104S1 (en) * | 2002-11-25 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD494939S1 (en) * | 2002-12-17 | 2004-08-24 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD486802S1 (en) * | 2002-12-17 | 2004-02-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD491900S1 (en) * | 2002-12-17 | 2004-06-22 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD485244S1 (en) * | 2002-12-17 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD487431S1 (en) * | 2003-01-03 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD488136S1 (en) * | 2003-01-03 | 2004-04-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD485808S1 (en) * | 2003-01-03 | 2004-01-27 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD505122S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD513608S1 (en) * | 2003-01-03 | 2006-01-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD487432S1 (en) * | 2003-02-07 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
| USD484859S1 (en) * | 2003-02-07 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
| USD703208S1 (en) * | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
| US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
| USD702240S1 (en) * | 2012-04-13 | 2014-04-08 | Blackberry Limited | UICC apparatus |
| USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
| US9006038B2 (en) * | 2012-05-02 | 2015-04-14 | Texas Instruments Incorporated | Selective leadframe planishing |
| US8587099B1 (en) * | 2012-05-02 | 2013-11-19 | Texas Instruments Incorporated | Leadframe having selective planishing |
| US8963300B2 (en) | 2012-05-02 | 2015-02-24 | Texas Instruments Incorporation | Semiconductor device with selective planished leadframe |
| US20130292811A1 (en) * | 2012-05-02 | 2013-11-07 | Texas Instruments Incorporated | Leadframe having selective planishing |
| US20150221526A1 (en) * | 2012-05-02 | 2015-08-06 | Texas Instruments Incorporated | Selective planishing method for making a semiconductor device |
| US9972506B2 (en) * | 2012-05-02 | 2018-05-15 | Texas Instruments Incorporated | Selective planishing method for making a semiconductor device |
| US10438816B2 (en) | 2012-05-02 | 2019-10-08 | Texas Instruments Incorporated | Selective planishing method for making a semiconductor device |
| USD761216S1 (en) * | 2014-12-12 | 2016-07-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED leadframe |
| USD803801S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
| USD803800S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
| USD803799S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
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