USD587222S1 - Attracting plate of an electrostatic chuck for semiconductor manufacturing - Google Patents
Attracting plate of an electrostatic chuck for semiconductor manufacturing Download PDFInfo
- Publication number
- USD587222S1 USD587222S1 US29/276,663 US27666307F USD587222S US D587222 S1 USD587222 S1 US D587222S1 US 27666307 F US27666307 F US 27666307F US D587222 S USD587222 S US D587222S
- Authority
- US
- United States
- Prior art keywords
- semiconductor manufacturing
- electrostatic chuck
- attracting plate
- attracting
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.
Claims (1)
- The ornamental design for an attracting plate of an electrostatic chuck for semiconductor manufacturing, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-020297 | 2006-01-30 | ||
| JP2006020297 | 2006-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD587222S1 true USD587222S1 (en) | 2009-02-24 |
Family
ID=40364983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/276,663 Expired - Lifetime USD587222S1 (en) | 2006-08-01 | 2007-02-01 | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD587222S1 (en) |
| TW (1) | TWD125773S1 (en) |
Cited By (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
| USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
| US20100032310A1 (en) * | 2006-08-16 | 2010-02-11 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US20100044236A1 (en) * | 2000-03-27 | 2010-02-25 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| USD648289S1 (en) * | 2010-10-21 | 2011-11-08 | Novellus Systems, Inc. | Electroplating flow shaping plate having offset spiral hole pattern |
| USD650344S1 (en) * | 2008-10-20 | 2011-12-13 | Ebara Corporation | Vacuum contact pad |
| US20120087774A1 (en) * | 2006-01-27 | 2012-04-12 | Camtek Ltd | Diced Wafer Adaptor and a Method for Transferring a Diced Wafer |
| USD685335S1 (en) * | 2008-11-18 | 2013-07-02 | Applied Materials, Inc. | Substrate support |
| USD689032S1 (en) * | 2011-04-21 | 2013-09-03 | Panasonic Corporation | Electrostatic atomized water particle generating module |
| US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
| US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
| US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
| US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
| USD802472S1 (en) * | 2015-08-06 | 2017-11-14 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| US20180366360A1 (en) * | 2017-06-16 | 2018-12-20 | Tokyo Electron Limited | Electrostatic attraction method |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
| USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
| USD990441S1 (en) * | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
| USD1037778S1 (en) * | 2022-07-19 | 2024-08-06 | Applied Materials, Inc. | Gas distribution plate |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1085029S1 (en) * | 2022-07-19 | 2025-07-22 | Applied Materials, Inc. | Gas distribution plate |
| USD1104086S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
| USD1103948S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3078565A (en) * | 1957-07-29 | 1963-02-26 | Goddard & Goddard Company | Magnetic chuck adapter plate |
| US4502094A (en) * | 1981-09-14 | 1985-02-26 | U.S. Philips Corporation | Electrostatic chuck |
| US6278600B1 (en) * | 1994-01-31 | 2001-08-21 | Applied Materials, Inc. | Electrostatic chuck with improved temperature control and puncture resistance |
| US20020027762A1 (en) * | 1998-09-29 | 2002-03-07 | Shinji Yamaguchi | Electrostatic chuck |
| US20020159217A1 (en) * | 2001-01-29 | 2002-10-31 | Ngk Insulators, Ltd. | Electrostatic chuck and substrate processing apparatus |
| US6628503B2 (en) * | 2001-03-13 | 2003-09-30 | Nikon Corporation | Gas cooled electrostatic pin chuck for vacuum applications |
| US6721162B2 (en) * | 1996-04-26 | 2004-04-13 | Applied Materials Inc. | Electrostatic chuck having composite dielectric layer and method of manufacture |
| US20040179323A1 (en) * | 2003-03-11 | 2004-09-16 | Alon Litman | Electrostatic chuck for wafer metrology and inspection equipment |
| US20040218339A1 (en) * | 2003-01-29 | 2004-11-04 | Kyocera Corporation | Electrostatic chuck |
| US20060164785A1 (en) * | 2003-02-05 | 2006-07-27 | Semco Engineering S.A. | Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means |
| US20060221539A1 (en) * | 2005-03-31 | 2006-10-05 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD546784S1 (en) * | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548200S1 (en) * | 2005-09-29 | 2007-08-07 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD553104S1 (en) * | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
-
2007
- 2007-01-31 TW TW096300607F patent/TWD125773S1/en unknown
- 2007-02-01 US US29/276,663 patent/USD587222S1/en not_active Expired - Lifetime
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3078565A (en) * | 1957-07-29 | 1963-02-26 | Goddard & Goddard Company | Magnetic chuck adapter plate |
| US4502094A (en) * | 1981-09-14 | 1985-02-26 | U.S. Philips Corporation | Electrostatic chuck |
| US6278600B1 (en) * | 1994-01-31 | 2001-08-21 | Applied Materials, Inc. | Electrostatic chuck with improved temperature control and puncture resistance |
| US6721162B2 (en) * | 1996-04-26 | 2004-04-13 | Applied Materials Inc. | Electrostatic chuck having composite dielectric layer and method of manufacture |
| US20040190215A1 (en) * | 1996-04-26 | 2004-09-30 | Applied Materials, Inc. | Electrostatic chuck having dielectric member with stacked layers and manufacture |
| US20020027762A1 (en) * | 1998-09-29 | 2002-03-07 | Shinji Yamaguchi | Electrostatic chuck |
| US20020159217A1 (en) * | 2001-01-29 | 2002-10-31 | Ngk Insulators, Ltd. | Electrostatic chuck and substrate processing apparatus |
| US6628503B2 (en) * | 2001-03-13 | 2003-09-30 | Nikon Corporation | Gas cooled electrostatic pin chuck for vacuum applications |
| US20040218339A1 (en) * | 2003-01-29 | 2004-11-04 | Kyocera Corporation | Electrostatic chuck |
| US20060164785A1 (en) * | 2003-02-05 | 2006-07-27 | Semco Engineering S.A. | Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means |
| US20040179323A1 (en) * | 2003-03-11 | 2004-09-16 | Alon Litman | Electrostatic chuck for wafer metrology and inspection equipment |
| USD553104S1 (en) * | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| US20060221539A1 (en) * | 2005-03-31 | 2006-10-05 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD546784S1 (en) * | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548200S1 (en) * | 2005-09-29 | 2007-08-07 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
Cited By (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100044236A1 (en) * | 2000-03-27 | 2010-02-25 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8475644B2 (en) | 2000-03-27 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
| US20120087774A1 (en) * | 2006-01-27 | 2012-04-12 | Camtek Ltd | Diced Wafer Adaptor and a Method for Transferring a Diced Wafer |
| US8308931B2 (en) | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US20100032310A1 (en) * | 2006-08-16 | 2010-02-11 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
| USD650344S1 (en) * | 2008-10-20 | 2011-12-13 | Ebara Corporation | Vacuum contact pad |
| US20100116672A1 (en) * | 2008-11-07 | 2010-05-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8475636B2 (en) | 2008-11-07 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US9309604B2 (en) | 2008-11-07 | 2016-04-12 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| USD685335S1 (en) * | 2008-11-18 | 2013-07-02 | Applied Materials, Inc. | Substrate support |
| US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
| US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
| USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9394620B2 (en) | 2010-07-02 | 2016-07-19 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9464361B2 (en) | 2010-07-02 | 2016-10-11 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US10190230B2 (en) | 2010-07-02 | 2019-01-29 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| USD648289S1 (en) * | 2010-10-21 | 2011-11-08 | Novellus Systems, Inc. | Electroplating flow shaping plate having offset spiral hole pattern |
| USD689032S1 (en) * | 2011-04-21 | 2013-09-03 | Panasonic Corporation | Electrostatic atomized water particle generating module |
| US10053792B2 (en) | 2011-09-12 | 2018-08-21 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
| US10662545B2 (en) | 2012-12-12 | 2020-05-26 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9834852B2 (en) | 2012-12-12 | 2017-12-05 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| US10301739B2 (en) | 2013-05-01 | 2019-05-28 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| US9899230B2 (en) | 2013-05-29 | 2018-02-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
| US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
| US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| US10923340B2 (en) | 2015-05-14 | 2021-02-16 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| USD802472S1 (en) * | 2015-08-06 | 2017-11-14 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| US11047059B2 (en) | 2016-05-24 | 2021-06-29 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US20180366360A1 (en) * | 2017-06-16 | 2018-12-20 | Tokyo Electron Limited | Electrostatic attraction method |
| US10832930B2 (en) * | 2017-06-16 | 2020-11-10 | Tokyo Electron Limited | Electrostatic attraction method |
| US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
| USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
| USD1104086S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
| USD1103948S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
| USD990441S1 (en) * | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1037778S1 (en) * | 2022-07-19 | 2024-08-06 | Applied Materials, Inc. | Gas distribution plate |
| USD1085029S1 (en) * | 2022-07-19 | 2025-07-22 | Applied Materials, Inc. | Gas distribution plate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD125773S1 (en) | 2008-11-01 |
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