[go: up one dir, main page]

USD587222S1 - Attracting plate of an electrostatic chuck for semiconductor manufacturing - Google Patents

Attracting plate of an electrostatic chuck for semiconductor manufacturing Download PDF

Info

Publication number
USD587222S1
USD587222S1 US29/276,663 US27666307F USD587222S US D587222 S1 USD587222 S1 US D587222S1 US 27666307 F US27666307 F US 27666307F US D587222 S USD587222 S US D587222S
Authority
US
United States
Prior art keywords
semiconductor manufacturing
electrostatic chuck
attracting plate
attracting
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/276,663
Inventor
Yasuharu Sasaki
Mamoru Kosakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Sumitomo Osaka Cement Co Ltd
Original Assignee
Tokyo Electron Ltd
Sumitomo Osaka Cement Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Sumitomo Osaka Cement Co Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED, SUMITOMO OSAKA CEMENT CO., LTD. reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOSAKAI, MAMORU, SASAKI, YASUHARU
Application granted granted Critical
Publication of USD587222S1 publication Critical patent/USD587222S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 is a front elevational view of an attracting plate of an electrostatic chuck for semiconductor manufacturing, showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is an enlarged view thereof taken along sections A—A and B—B in FIG. 1;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a cross-sectional view taken along line 77 in FIG. 4 with portions of the internal mechanism omitted; and,
FIG. 8 is a front perspective view thereof.
The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an attracting plate of an electrostatic chuck for semiconductor manufacturing, as shown and described.
US29/276,663 2006-08-01 2007-02-01 Attracting plate of an electrostatic chuck for semiconductor manufacturing Expired - Lifetime USD587222S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-020297 2006-01-30
JP2006020297 2006-08-01

Publications (1)

Publication Number Publication Date
USD587222S1 true USD587222S1 (en) 2009-02-24

Family

ID=40364983

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/276,663 Expired - Lifetime USD587222S1 (en) 2006-08-01 2007-02-01 Attracting plate of an electrostatic chuck for semiconductor manufacturing

Country Status (2)

Country Link
US (1) USD587222S1 (en)
TW (1) TWD125773S1 (en)

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
US20100032310A1 (en) * 2006-08-16 2010-02-11 Novellus Systems, Inc. Method and apparatus for electroplating
US20100044236A1 (en) * 2000-03-27 2010-02-25 Novellus Systems, Inc. Method and apparatus for electroplating
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD648289S1 (en) * 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
USD650344S1 (en) * 2008-10-20 2011-12-13 Ebara Corporation Vacuum contact pad
US20120087774A1 (en) * 2006-01-27 2012-04-12 Camtek Ltd Diced Wafer Adaptor and a Method for Transferring a Diced Wafer
USD685335S1 (en) * 2008-11-18 2013-07-02 Applied Materials, Inc. Substrate support
USD689032S1 (en) * 2011-04-21 2013-09-03 Panasonic Corporation Electrostatic atomized water particle generating module
US8540857B1 (en) 2008-12-19 2013-09-24 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9512538B2 (en) 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US20180366360A1 (en) * 2017-06-16 2018-12-20 Tokyo Electron Limited Electrostatic attraction method
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3078565A (en) * 1957-07-29 1963-02-26 Goddard & Goddard Company Magnetic chuck adapter plate
US4502094A (en) * 1981-09-14 1985-02-26 U.S. Philips Corporation Electrostatic chuck
US6278600B1 (en) * 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
US20020159217A1 (en) * 2001-01-29 2002-10-31 Ngk Insulators, Ltd. Electrostatic chuck and substrate processing apparatus
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
US6721162B2 (en) * 1996-04-26 2004-04-13 Applied Materials Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
US20040218339A1 (en) * 2003-01-29 2004-11-04 Kyocera Corporation Electrostatic chuck
US20060164785A1 (en) * 2003-02-05 2006-07-27 Semco Engineering S.A. Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means
US20060221539A1 (en) * 2005-03-31 2006-10-05 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548200S1 (en) * 2005-09-29 2007-08-07 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3078565A (en) * 1957-07-29 1963-02-26 Goddard & Goddard Company Magnetic chuck adapter plate
US4502094A (en) * 1981-09-14 1985-02-26 U.S. Philips Corporation Electrostatic chuck
US6278600B1 (en) * 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
US6721162B2 (en) * 1996-04-26 2004-04-13 Applied Materials Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
US20040190215A1 (en) * 1996-04-26 2004-09-30 Applied Materials, Inc. Electrostatic chuck having dielectric member with stacked layers and manufacture
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
US20020159217A1 (en) * 2001-01-29 2002-10-31 Ngk Insulators, Ltd. Electrostatic chuck and substrate processing apparatus
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
US20040218339A1 (en) * 2003-01-29 2004-11-04 Kyocera Corporation Electrostatic chuck
US20060164785A1 (en) * 2003-02-05 2006-07-27 Semco Engineering S.A. Electrostatic bonding chuck with integrated radio frequency electrode and thermostatic means
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
US20060221539A1 (en) * 2005-03-31 2006-10-05 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548200S1 (en) * 2005-09-29 2007-08-07 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production

Cited By (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100044236A1 (en) * 2000-03-27 2010-02-25 Novellus Systems, Inc. Method and apparatus for electroplating
US8475644B2 (en) 2000-03-27 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US20120087774A1 (en) * 2006-01-27 2012-04-12 Camtek Ltd Diced Wafer Adaptor and a Method for Transferring a Diced Wafer
US8308931B2 (en) 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US20100032310A1 (en) * 2006-08-16 2010-02-11 Novellus Systems, Inc. Method and apparatus for electroplating
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD650344S1 (en) * 2008-10-20 2011-12-13 Ebara Corporation Vacuum contact pad
US20100116672A1 (en) * 2008-11-07 2010-05-13 Novellus Systems, Inc. Method and apparatus for electroplating
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US9309604B2 (en) 2008-11-07 2016-04-12 Novellus Systems, Inc. Method and apparatus for electroplating
USD685335S1 (en) * 2008-11-18 2013-07-02 Applied Materials, Inc. Substrate support
US9512538B2 (en) 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
US8540857B1 (en) 2008-12-19 2013-09-24 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9394620B2 (en) 2010-07-02 2016-07-19 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9464361B2 (en) 2010-07-02 2016-10-11 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US10190230B2 (en) 2010-07-02 2019-01-29 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
USD648289S1 (en) * 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
USD689032S1 (en) * 2011-04-21 2013-09-03 Panasonic Corporation Electrostatic atomized water particle generating module
US10053792B2 (en) 2011-09-12 2018-08-21 Novellus Systems, Inc. Plating cup with contoured cup bottom
US10662545B2 (en) 2012-12-12 2020-05-26 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9834852B2 (en) 2012-12-12 2017-12-05 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US10301739B2 (en) 2013-05-01 2019-05-28 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9899230B2 (en) 2013-05-29 2018-02-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10923340B2 (en) 2015-05-14 2021-02-16 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US11047059B2 (en) 2016-05-24 2021-06-29 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US20180366360A1 (en) * 2017-06-16 2018-12-20 Tokyo Electron Limited Electrostatic attraction method
US10832930B2 (en) * 2017-06-16 2020-11-10 Tokyo Electron Limited Electrostatic attraction method
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD984972S1 (en) * 2021-03-29 2023-05-02 Beijing Naura Microelectronics Equipment Co., Ltd. Electrostatic chuck for semiconductor manufacture
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate

Also Published As

Publication number Publication date
TWD125773S1 (en) 2008-11-01

Similar Documents

Publication Publication Date Title
USD587222S1 (en) Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD609652S1 (en) Wafer attracting plate
USD505400S1 (en) Semiconductor device
USD591251S1 (en) Handset
USD615718S1 (en) Vacuum cleaner
USD588439S1 (en) Escutcheon
USD593969S1 (en) Processing chamber for manufacturing semiconductors
USD575153S1 (en) Actuator
USD570310S1 (en) Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD575816S1 (en) Contactless token with aperture
USD589471S1 (en) Heater for manufacturing semiconductor
USD561651S1 (en) Electrically-powered wheelchair
USD598536S1 (en) Inhaler
USD552549S1 (en) Switch
USD572271S1 (en) Internal-combustion engine
USD589474S1 (en) Wafer holding member
USD599822S1 (en) Internal-combustion engine
USD573870S1 (en) Deadbolt button
USD537383S1 (en) Body of an automobile
USD545333S1 (en) Sprocket
USD556647S1 (en) Electrically-powered wheelchair
USD556136S1 (en) Electrical contact
USD544894S1 (en) Sprocket
USD547759S1 (en) Keyboard
USD556300S1 (en) Toilet