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USD561710S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD561710S1
USD561710S1 US29/275,646 US27564607F USD561710S US D561710 S1 USD561710 S1 US D561710S1 US 27564607 F US27564607 F US 27564607F US D561710 S USD561710 S US D561710S
Authority
US
United States
Prior art keywords
heat sink
ornamental design
sink
heat
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/275,646
Inventor
Pei-Hsi Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermaltake Technology Co Ltd
Original Assignee
Thermaltake Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermaltake Technology Co Ltd filed Critical Thermaltake Technology Co Ltd
Priority to US29/275,646 priority Critical patent/USD561710S1/en
Assigned to THERMALTAKE TECHNOLOGY CO., LTD. reassignment THERMALTAKE TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, PEI-HSI
Application granted granted Critical
Publication of USD561710S1 publication Critical patent/USD561710S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a heat sink;
FIG. 2 is a front elevation thereof;
FIG. 3 is a rear elevation thereof;
FIG. 4 is a left side elevation thereof;
FIG. 5 is a right side elevation thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink, as shown and described.
US29/275,646 2007-01-03 2007-01-03 Heat sink Expired - Lifetime USD561710S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/275,646 USD561710S1 (en) 2007-01-03 2007-01-03 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/275,646 USD561710S1 (en) 2007-01-03 2007-01-03 Heat sink

Publications (1)

Publication Number Publication Date
USD561710S1 true USD561710S1 (en) 2008-02-12

Family

ID=39031843

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/275,646 Expired - Lifetime USD561710S1 (en) 2007-01-03 2007-01-03 Heat sink

Country Status (1)

Country Link
US (1) USD561710S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD954005S1 (en) * 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD971862S1 (en) 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD426195S (en) * 1999-08-23 2000-06-06 Heat sink
USD426814S (en) * 1999-06-28 2000-06-20 Zalman Tech Co., Ltd. Radiator for heat generating components in electronic equipment
US6289975B2 (en) * 1999-06-23 2001-09-18 Ching-Sung Kuo Heat dissipating device
USD458232S1 (en) * 2000-09-27 2002-06-04 Zalman Tech Co., Ltd. Radiator for heat generating components in electronic equipment
US6883592B2 (en) * 1998-11-04 2005-04-26 Zalman Tech Co., Ltd. Heatsink for electronic component
US20060028798A1 (en) * 2004-08-06 2006-02-09 Jun-Qian Wang Heat-radiating device assembly
US20070131389A1 (en) * 2005-12-09 2007-06-14 Kuo-Hsin Chen Heat dissipating device and method of fabricating the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6883592B2 (en) * 1998-11-04 2005-04-26 Zalman Tech Co., Ltd. Heatsink for electronic component
US6289975B2 (en) * 1999-06-23 2001-09-18 Ching-Sung Kuo Heat dissipating device
USD426814S (en) * 1999-06-28 2000-06-20 Zalman Tech Co., Ltd. Radiator for heat generating components in electronic equipment
USD426195S (en) * 1999-08-23 2000-06-06 Heat sink
USD458232S1 (en) * 2000-09-27 2002-06-04 Zalman Tech Co., Ltd. Radiator for heat generating components in electronic equipment
US20060028798A1 (en) * 2004-08-06 2006-02-09 Jun-Qian Wang Heat-radiating device assembly
US20070131389A1 (en) * 2005-12-09 2007-06-14 Kuo-Hsin Chen Heat dissipating device and method of fabricating the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD971862S1 (en) 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
USD954005S1 (en) * 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink

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