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USD488135S1 - Set of modules for a modular mount for circuit boards - Google Patents

Set of modules for a modular mount for circuit boards Download PDF

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Publication number
USD488135S1
USD488135S1 US29/161,049 US16104902F USD488135S US D488135 S1 USD488135 S1 US D488135S1 US 16104902 F US16104902 F US 16104902F US D488135 S USD488135 S US D488135S
Authority
US
United States
Prior art keywords
modules
circuit boards
modular mount
modular
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/161,049
Inventor
Andrew Hatter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Camden Electronics Ltd
Original Assignee
Camden Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Camden Electronics Ltd filed Critical Camden Electronics Ltd
Assigned to CAMDEN ELECTRONICS LTD. reassignment CAMDEN ELECTRONICS LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HATTER, ANDREW
Application granted granted Critical
Publication of USD488135S1 publication Critical patent/USD488135S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view from above, of an intermediate module of the set of modules for modular mount for circuit boards showing my design;
FIG. 2 is a perspective view from below, of the modular mount of FIG. 1;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an end view from one end thereof, the other end being a mirror image thereof;
FIG. 6 is a side elevational view one side thereof, the other side being a mirror image thereof;
FIG. 7 is a perspective view of an end module of the set of modules for modular mount for circuit boards of FIG. 1 as viewed from its outer face;
FIG. 8 is a perspective view of the end module of FIG. 7, as viewed from its inner face;
FIG. 9 is a bottom plan view of the end module of FIG. 7;
FIG. 10 is an end view of the end module of FIG. 7 from its inner face;
FIG. 11 is an end elevational view of the top module of FIG. 7 from its outer face;
FIG. 12 is a side elevational view of the end module of FIG. 7; and,
FIG. 13 is a side elevational view of the end module of FIG. 7 from its outer face.

Claims (1)

  1. The ornamental design for a set of modules for a modular mount for circuit boards, as shown and described.
US29/161,049 2001-11-21 2002-05-21 Set of modules for a modular mount for circuit boards Expired - Lifetime USD488135S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB2106418 2001-11-21
GB2106418 2001-11-21

Publications (1)

Publication Number Publication Date
USD488135S1 true USD488135S1 (en) 2004-04-06

Family

ID=32011998

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/161,049 Expired - Lifetime USD488135S1 (en) 2001-11-21 2002-05-21 Set of modules for a modular mount for circuit boards

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US (1) USD488135S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD569239S1 (en) * 2007-02-01 2008-05-20 Johnsondiversey, Inc. Modular mounting system for a wall hung device
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) * 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD268754S (en) 1980-12-24 1983-04-26 Cincinnati Milacron Inc. Card cage module
US4429937A (en) 1981-07-22 1984-02-07 The Babcock & Wilcox Company Circuit board module mounting unit
US4525771A (en) 1982-09-30 1985-06-25 Contraves Ag Circuit board module mounting unit
US5375724A (en) 1991-09-12 1994-12-27 Schroff Gmbh Component carrier for plug-in modules
US5590029A (en) 1995-01-12 1996-12-31 Dell Usa, L.P. Circuit board SMT device mounting apparatus
USD396449S (en) 1995-07-07 1998-07-28 Giga Operations Corporation Circuit board module
US6081431A (en) 1994-02-15 2000-06-27 Berg Technology, Inc. Shielded circuit board connector module
US6312279B1 (en) 2000-03-07 2001-11-06 Dell Products L.P. Modular component receiving apparatus and method for installing modular components
US6487078B2 (en) 2000-03-13 2002-11-26 Legacy Electronics, Inc. Electronic module having a three dimensional array of carrier-mounted integrated circuit packages

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD268754S (en) 1980-12-24 1983-04-26 Cincinnati Milacron Inc. Card cage module
US4429937A (en) 1981-07-22 1984-02-07 The Babcock & Wilcox Company Circuit board module mounting unit
US4525771A (en) 1982-09-30 1985-06-25 Contraves Ag Circuit board module mounting unit
US5375724A (en) 1991-09-12 1994-12-27 Schroff Gmbh Component carrier for plug-in modules
US6081431A (en) 1994-02-15 2000-06-27 Berg Technology, Inc. Shielded circuit board connector module
US5590029A (en) 1995-01-12 1996-12-31 Dell Usa, L.P. Circuit board SMT device mounting apparatus
USD396449S (en) 1995-07-07 1998-07-28 Giga Operations Corporation Circuit board module
US6312279B1 (en) 2000-03-07 2001-11-06 Dell Products L.P. Modular component receiving apparatus and method for installing modular components
US6487078B2 (en) 2000-03-13 2002-11-26 Legacy Electronics, Inc. Electronic module having a three dimensional array of carrier-mounted integrated circuit packages

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD569239S1 (en) * 2007-02-01 2008-05-20 Johnsondiversey, Inc. Modular mounting system for a wall hung device
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) * 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus

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