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USD479828S1 - Inside-out heat sink - Google Patents

Inside-out heat sink Download PDF

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Publication number
USD479828S1
USD479828S1 US29/172,257 US17225702F USD479828S US D479828 S1 USD479828 S1 US D479828S1 US 17225702 F US17225702 F US 17225702F US D479828 S USD479828 S US D479828S
Authority
US
United States
Prior art keywords
heat sink
out heat
view
ornamental design
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/172,257
Inventor
Roger Dugas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanger Solutions LLC
Original Assignee
Xanoptix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xanoptix Inc filed Critical Xanoptix Inc
Priority to US29/172,257 priority Critical patent/USD479828S1/en
Assigned to XANOPTIX, INC. reassignment XANOPTIX, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DUGAS, ROGER
Priority to CA 103243 priority patent/CA103243S/en
Application granted granted Critical
Publication of USD479828S1 publication Critical patent/USD479828S1/en
Assigned to CUFER ASSET LTD. L.L.C. reassignment CUFER ASSET LTD. L.L.C. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CUBIC WAFER, INC.
Assigned to CUBIC WAFER, INC. reassignment CUBIC WAFER, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: XAN3D TECHNOLOGIES, INC.
Assigned to XAN3D TECHNOLOGIES, INC. reassignment XAN3D TECHNOLOGIES, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: XANOPTIX, INC.
Anticipated expiration legal-status Critical
Assigned to HANGER SOLUTIONS, LLC reassignment HANGER SOLUTIONS, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INTELLECTUAL VENTURES ASSETS 161 LLC
Assigned to INTELLECTUAL VENTURES ASSETS 161 LLC reassignment INTELLECTUAL VENTURES ASSETS 161 LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CUFER ASSET LTD. L.L.C.
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view illustrating the top, front and right side of a design for the inside out heat sink;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof, with the opposite side being a mirror image;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof; and,
FIG. 6 is a bottom plan view thereof.

Claims (1)

  1. I claim the ornamental design for an inside-out heat sink, as shown and described.
US29/172,257 2002-12-09 2002-12-09 Inside-out heat sink Expired - Lifetime USD479828S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/172,257 USD479828S1 (en) 2002-12-09 2002-12-09 Inside-out heat sink
CA 103243 CA103243S (en) 2002-12-09 2003-06-05 Inside-out heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/172,257 USD479828S1 (en) 2002-12-09 2002-12-09 Inside-out heat sink

Publications (1)

Publication Number Publication Date
USD479828S1 true USD479828S1 (en) 2003-09-23

Family

ID=28041279

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/172,257 Expired - Lifetime USD479828S1 (en) 2002-12-09 2002-12-09 Inside-out heat sink

Country Status (2)

Country Link
US (1) USD479828S1 (en)
CA (1) CA103243S (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD543953S1 (en) * 2003-09-02 2007-06-05 Cubic Wafer, Inc. Wing portion of a butterfly-style inside-out heat sink
USD662897S1 (en) * 2011-01-04 2012-07-03 Technicolor S.A. Heat sink
USD856945S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD856944S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD896767S1 (en) 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD912061S1 (en) * 2019-06-03 2021-03-02 Apple Inc. Lattice
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD1035642S1 (en) * 2019-05-31 2024-07-16 Apple Inc. Electronic device
USD1066322S1 (en) * 2019-06-01 2025-03-11 Apple Inc. Electronic device
USD1098108S1 (en) * 2019-05-31 2025-10-14 Apple Inc. Electronic device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546405A (en) 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US4942497A (en) 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US5113315A (en) 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation
USD341820S (en) 1992-03-04 1993-11-30 Itoh Research & Development Laboratory Co., Ltd. Heat dissipating device for a semiconductor package
US5653285A (en) 1993-03-31 1997-08-05 Lee; Yong N. Heat sink apparatus
USD403666S (en) 1998-04-01 1999-01-05 Rockford Corporation Heat sink
US6244331B1 (en) 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
USD449587S1 (en) 2001-02-28 2001-10-23 Andrew Corporation Heat sink

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546405A (en) 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US4942497A (en) 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US5113315A (en) 1990-08-07 1992-05-12 Cirqon Technologies Corporation Heat-conductive metal ceramic composite material panel system for improved heat dissipation
USD341820S (en) 1992-03-04 1993-11-30 Itoh Research & Development Laboratory Co., Ltd. Heat dissipating device for a semiconductor package
US5653285A (en) 1993-03-31 1997-08-05 Lee; Yong N. Heat sink apparatus
USD403666S (en) 1998-04-01 1999-01-05 Rockford Corporation Heat sink
US6244331B1 (en) 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
USD449587S1 (en) 2001-02-28 2001-10-23 Andrew Corporation Heat sink

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Honeycomb Heat Sink Drawing, Nov. 1, 2001, 1 page.
Press Release JARO Intros Honeycomb™ BGA Heat Sink, Nov. 2002, 2 pages.

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD543953S1 (en) * 2003-09-02 2007-06-05 Cubic Wafer, Inc. Wing portion of a butterfly-style inside-out heat sink
USD662897S1 (en) * 2011-01-04 2012-07-03 Technicolor S.A. Heat sink
USD856945S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD856944S1 (en) * 2019-01-31 2019-08-20 Advanced Thermal Solutions, Inc. Fluid mover enclosure
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD1035642S1 (en) * 2019-05-31 2024-07-16 Apple Inc. Electronic device
USD1098108S1 (en) * 2019-05-31 2025-10-14 Apple Inc. Electronic device
USD1066322S1 (en) * 2019-06-01 2025-03-11 Apple Inc. Electronic device
USD912061S1 (en) * 2019-06-03 2021-03-02 Apple Inc. Lattice
USD1079706S1 (en) 2019-06-03 2025-06-17 Apple Inc. Lattice
USD896767S1 (en) 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD969760S1 (en) 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure

Also Published As

Publication number Publication date
CA103243S (en) 2004-08-26

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