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USD477291S1 - Radiator for a heat generating components in electronic equipment - Google Patents

Radiator for a heat generating components in electronic equipment Download PDF

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Publication number
USD477291S1
USD477291S1 US29/159,903 US15990302F USD477291S US D477291 S1 USD477291 S1 US D477291S1 US 15990302 F US15990302 F US 15990302F US D477291 S USD477291 S US D477291S
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US
United States
Prior art keywords
radiator
electronic equipment
heat generating
generating components
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/159,903
Inventor
Sang-Cheol Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zalman Tech Co Ltd
Original Assignee
Zalman Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zalman Tech Co Ltd filed Critical Zalman Tech Co Ltd
Assigned to ZALMAN TECH CO., LTD. reassignment ZALMAN TECH CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, SANG-CHEOL
Application granted granted Critical
Publication of USD477291S1 publication Critical patent/USD477291S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 2 is a front view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 3 is a rear view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 4 is a right side view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 5 is a left side view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 6 is a top plan view of a radiator for heat generating components in electronic equipment according to the present invention.
FIG. 7 is a bottom plan view of a radiator for heat generating components in electronic equipment according to the present invention; and,
FIG. 8 is an exploded perspective view for illustrating the use of the radiator wherein the environment in which the radiator is associated, including a bracket, a fan, and a surface of a CPU, is shown in broken lines.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Claims (1)

  1. I claim the ornamental design for a radiator for a heat generating components in electronic equipment, as shown and described.
US29/159,903 2001-11-05 2002-05-01 Radiator for a heat generating components in electronic equipment Expired - Lifetime USD477291S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2001030972 2001-11-05
KR2001-0030972 2001-11-05

Publications (1)

Publication Number Publication Date
USD477291S1 true USD477291S1 (en) 2003-07-15

Family

ID=19710322

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/159,903 Expired - Lifetime USD477291S1 (en) 2001-11-05 2002-05-01 Radiator for a heat generating components in electronic equipment

Country Status (1)

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US (1) USD477291S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD540750S1 (en) * 2004-11-23 2007-04-17 Zalman Tech Co., Ltd. Radiator for a chipset of a graphic card
USD541230S1 (en) * 2004-11-23 2007-04-24 Zalman Tech Co., Ltd. Radiator for a chipset of a graphic card
USD541756S1 (en) * 2004-09-20 2007-05-01 Zalman Tech Co., Ltd. Radiator for a chipset of a graphic card
USD579420S1 (en) * 2007-09-24 2008-10-28 Hon Hai Precision Industry Co., Ltd. Heat sink
US20090129023A1 (en) * 2007-11-20 2009-05-21 Kuo-Sheng Lin Thermal module allowing adjustment in the height of heat sink relative to fixing rack
USD626519S1 (en) * 2009-08-24 2010-11-02 Acpa Energy Conversion Devices Co., Ltd. Heat dissipation module for a streetlamp

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4103192A (en) 1976-06-14 1978-07-25 General Electric Company Heat dissipating motor mounting arrangement
US4715438A (en) 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
USD428857S (en) 1999-09-03 2000-08-01 Agilent Technologies Cooling device
US6330908B1 (en) 2000-03-15 2001-12-18 Foxconn Precision Components Co., Ltd. Heat sink
US6336499B1 (en) 2001-05-31 2002-01-08 Hong Tsai Liu CPU heat sink mounting structure
US6386274B1 (en) 2001-06-28 2002-05-14 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6386275B1 (en) 2001-08-16 2002-05-14 Chaun-Choung Technology Corp. Surrounding type fin-retaining structure of heat radiator
US6439298B1 (en) 2001-04-17 2002-08-27 Jia Hao Li Cylindrical heat radiator

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4103192A (en) 1976-06-14 1978-07-25 General Electric Company Heat dissipating motor mounting arrangement
US4715438A (en) 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
USD428857S (en) 1999-09-03 2000-08-01 Agilent Technologies Cooling device
US6330908B1 (en) 2000-03-15 2001-12-18 Foxconn Precision Components Co., Ltd. Heat sink
US6439298B1 (en) 2001-04-17 2002-08-27 Jia Hao Li Cylindrical heat radiator
US6336499B1 (en) 2001-05-31 2002-01-08 Hong Tsai Liu CPU heat sink mounting structure
US6386274B1 (en) 2001-06-28 2002-05-14 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6386275B1 (en) 2001-08-16 2002-05-14 Chaun-Choung Technology Corp. Surrounding type fin-retaining structure of heat radiator

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD541756S1 (en) * 2004-09-20 2007-05-01 Zalman Tech Co., Ltd. Radiator for a chipset of a graphic card
USD540750S1 (en) * 2004-11-23 2007-04-17 Zalman Tech Co., Ltd. Radiator for a chipset of a graphic card
USD541230S1 (en) * 2004-11-23 2007-04-24 Zalman Tech Co., Ltd. Radiator for a chipset of a graphic card
USD579420S1 (en) * 2007-09-24 2008-10-28 Hon Hai Precision Industry Co., Ltd. Heat sink
US20090129023A1 (en) * 2007-11-20 2009-05-21 Kuo-Sheng Lin Thermal module allowing adjustment in the height of heat sink relative to fixing rack
US7583503B2 (en) * 2007-11-20 2009-09-01 Asia Vital Components Co., Ltd. Thermal module allowing adjustment in the height of heat sink relative to fixing rack
USD626519S1 (en) * 2009-08-24 2010-11-02 Acpa Energy Conversion Devices Co., Ltd. Heat dissipation module for a streetlamp

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