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USD471168S1 - Heat dissipating RF electronics housing - Google Patents

Heat dissipating RF electronics housing Download PDF

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Publication number
USD471168S1
USD471168S1 US29/152,997 US15299702F USD471168S US D471168 S1 USD471168 S1 US D471168S1 US 15299702 F US15299702 F US 15299702F US D471168 S USD471168 S US D471168S
Authority
US
United States
Prior art keywords
heat dissipating
electronics housing
electronics
housing
housing according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/152,997
Inventor
David Ge
Mohammed Nusrat Jamal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TELTRONICS INTERNATIONAL Inc
Teletronics International Inc
Original Assignee
Teletronics International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teletronics International Inc filed Critical Teletronics International Inc
Priority to US29/152,997 priority Critical patent/USD471168S1/en
Assigned to TELTRONICS INTERNATIONAL, INC. reassignment TELTRONICS INTERNATIONAL, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GE, DAVID, JAMAL, MOHAMMED NUSRAT
Application granted granted Critical
Publication of USD471168S1 publication Critical patent/USD471168S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective photographic view from a first side of the electronics housing according to the invention.
FIG. 2 is a perspective photographic view from the opposite side of the housing according to FIG. 1.
FIG. 3 is a top photographic view of the housing according to FIG. 1.
FIG. 4 is a side photographic view of the housing according to FIG. 1.
FIG. 5 is a perspective photographic view from an end of the housing according to FIG. 1.
FIG. 6 is an end view of the housing according to FIG. 5; and,
FIG. 7 is a photographic view of the bottom of the housing according to FIG. 1.

Claims (1)

  1. The ornamental design for a heat dissipating RF electronics housing, as shown and described.
US29/152,997 2002-01-07 2002-01-07 Heat dissipating RF electronics housing Expired - Lifetime USD471168S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/152,997 USD471168S1 (en) 2002-01-07 2002-01-07 Heat dissipating RF electronics housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/152,997 USD471168S1 (en) 2002-01-07 2002-01-07 Heat dissipating RF electronics housing

Publications (1)

Publication Number Publication Date
USD471168S1 true USD471168S1 (en) 2003-03-04

Family

ID=22545356

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/152,997 Expired - Lifetime USD471168S1 (en) 2002-01-07 2002-01-07 Heat dissipating RF electronics housing

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US (1) USD471168S1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD519980S1 (en) * 2001-11-09 2006-05-02 Milwaukee Electric Tool Corporation Base portion for a radio
US20080144279A1 (en) * 2006-11-30 2008-06-19 Fuji Electric Fa Components & Systems Co., Ltd. Heat sink
USD618630S1 (en) * 2009-03-24 2010-06-29 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD621796S1 (en) * 2009-08-14 2010-08-17 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD621797S1 (en) * 2009-09-11 2010-08-17 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622229S1 (en) * 2009-11-09 2010-08-24 Foxsemicon Integrated Technology, Inc. Illumination device
USD622230S1 (en) * 2009-11-02 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622227S1 (en) * 2009-09-11 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622228S1 (en) * 2009-09-11 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD627746S1 (en) * 2009-12-25 2010-11-23 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD634720S1 (en) * 2009-10-13 2011-03-22 Askey Computer Corp. Housing for communication equipment
USD635106S1 (en) * 2009-10-13 2011-03-29 Askey Computer Corp. Housing for communication equipment
USD758301S1 (en) * 2013-03-29 2016-06-07 Gs Yuasa International Ltd. Rechargeable battery
USD927435S1 (en) * 2019-04-12 2021-08-10 Shin-Etsu Polymer Co., Ltd. Heat dissipating device for batteries or electric devices

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4541004A (en) 1982-11-24 1985-09-10 Burroughs Corporation Aerodynamically enhanced heat sink
US5358032A (en) 1992-02-05 1994-10-25 Hitachi, Ltd. LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted
US5509465A (en) 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
US5581442A (en) 1995-06-06 1996-12-03 Wakefield Engineering, Inc. Spring clip for clamping a heat sink module to an electronic module
USD387333S (en) 1995-09-25 1997-12-09 Curtis Instruments, Inc. Heatsink enclosure for an electrical controller
US5862038A (en) 1996-08-27 1999-01-19 Fujitsu Limited Cooling device for mounting module
US5964285A (en) 1999-02-12 1999-10-12 Yung-Tsai Chu Heat sink
USD423502S (en) 1999-02-22 2000-04-25 Lanclos Kenneth W Heat dissipating audio amplifier housing with LED window
US6055159A (en) 1999-08-20 2000-04-25 Compal Electronics, Inc. Heat dissipating module for a heat generating electronic component
US6295202B1 (en) 2000-06-29 2001-09-25 Hewlett-Packard Company Heatsink for actively cooled daughterboard system

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4541004A (en) 1982-11-24 1985-09-10 Burroughs Corporation Aerodynamically enhanced heat sink
US5358032A (en) 1992-02-05 1994-10-25 Hitachi, Ltd. LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted
US5509465A (en) 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
US5581442A (en) 1995-06-06 1996-12-03 Wakefield Engineering, Inc. Spring clip for clamping a heat sink module to an electronic module
USD387333S (en) 1995-09-25 1997-12-09 Curtis Instruments, Inc. Heatsink enclosure for an electrical controller
US5862038A (en) 1996-08-27 1999-01-19 Fujitsu Limited Cooling device for mounting module
US5964285A (en) 1999-02-12 1999-10-12 Yung-Tsai Chu Heat sink
USD423502S (en) 1999-02-22 2000-04-25 Lanclos Kenneth W Heat dissipating audio amplifier housing with LED window
US6055159A (en) 1999-08-20 2000-04-25 Compal Electronics, Inc. Heat dissipating module for a heat generating electronic component
US6295202B1 (en) 2000-06-29 2001-09-25 Hewlett-Packard Company Heatsink for actively cooled daughterboard system

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
HyperLink Technologies, Inc., "HyperAmp™ HA2401A," Jan. 20, 2001, Web Article: www.hyperlinktech.com/html/products/ha2401a.html.
Young Design, Inc., "AMP 2440," Jan. 20, 2001, Web Article: www.ydi.com/Products/Amplifiers/AMP2440/amp2440.html.

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD519980S1 (en) * 2001-11-09 2006-05-02 Milwaukee Electric Tool Corporation Base portion for a radio
US20080144279A1 (en) * 2006-11-30 2008-06-19 Fuji Electric Fa Components & Systems Co., Ltd. Heat sink
USD618630S1 (en) * 2009-03-24 2010-06-29 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD621796S1 (en) * 2009-08-14 2010-08-17 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD621797S1 (en) * 2009-09-11 2010-08-17 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622227S1 (en) * 2009-09-11 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622228S1 (en) * 2009-09-11 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD634720S1 (en) * 2009-10-13 2011-03-22 Askey Computer Corp. Housing for communication equipment
USD635106S1 (en) * 2009-10-13 2011-03-29 Askey Computer Corp. Housing for communication equipment
USD622230S1 (en) * 2009-11-02 2010-08-24 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD622229S1 (en) * 2009-11-09 2010-08-24 Foxsemicon Integrated Technology, Inc. Illumination device
USD627746S1 (en) * 2009-12-25 2010-11-23 Foxsemicon Integrated Technology, Inc. Heat dissipation apparatus
USD758301S1 (en) * 2013-03-29 2016-06-07 Gs Yuasa International Ltd. Rechargeable battery
USD927435S1 (en) * 2019-04-12 2021-08-10 Shin-Etsu Polymer Co., Ltd. Heat dissipating device for batteries or electric devices

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