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USD357671S - Hybrid integrated circuit for electric power control - Google Patents

Hybrid integrated circuit for electric power control Download PDF

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Publication number
USD357671S
USD357671S US29/019,286 US1928694F USD357671S US D357671 S USD357671 S US D357671S US 1928694 F US1928694 F US 1928694F US D357671 S USD357671 S US D357671S
Authority
US
United States
Prior art keywords
integrated circuit
electric power
power control
hybrid integrated
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/019,286
Inventor
Noriho Terasawa
Shin Soyano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SOYANO, SHIN, TERASAWA, NORIHO
Application granted granted Critical
Publication of USD357671S publication Critical patent/USD357671S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the top, front and right side of a hybrid integrated circuit for electric power control showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a rear elevational view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a hybrid integrated circuit for electric power control, as shown.
US29/019,286 1993-09-16 1994-02-28 Hybrid integrated circuit for electric power control Expired - Lifetime USD357671S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5-27996 1993-09-16
JP2799693 1993-09-16

Publications (1)

Publication Number Publication Date
USD357671S true USD357671S (en) 1995-04-25

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Family Applications (1)

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US29/019,286 Expired - Lifetime USD357671S (en) 1993-09-16 1994-02-28 Hybrid integrated circuit for electric power control

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US (1) USD357671S (en)

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD453746S1 (en) 2001-07-26 2002-02-19 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD456787S1 (en) 2000-12-08 2002-05-07 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD465463S1 (en) 2001-06-15 2002-11-12 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD466093S1 (en) 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD470825S1 (en) 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD690672S1 (en) * 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
USD693318S1 (en) * 2011-10-27 2013-11-12 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD699675S1 (en) * 2011-09-09 2014-02-18 Zenovia Electronics Inc. Amplifier module
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD745476S1 (en) * 2012-10-19 2015-12-15 Solumatics CVBA Print board
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD903612S1 (en) * 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD983759S1 (en) * 2019-05-31 2023-04-18 Fuji Electric Co., Ltd. Semiconductor module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3825876A (en) 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US4780795A (en) 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
US4943676A (en) 1989-07-12 1990-07-24 Air Products And Chemicals, Inc. Thermolysis of poly(N-vinylformamide) to poly(N-vinylamine)
US5053634A (en) 1988-07-25 1991-10-01 Sawafuji Electric Co., Ltd. Waterproofing device for control circuit used in outboard engines
US5130881A (en) 1988-01-11 1992-07-14 The United States Of Americas As Represented By The Secretary Of The Air Force IC socket having overvoltage protection

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3825876A (en) 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US4780795A (en) 1986-04-28 1988-10-25 Burr-Brown Corporation Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
US5130881A (en) 1988-01-11 1992-07-14 The United States Of Americas As Represented By The Secretary Of The Air Force IC socket having overvoltage protection
US5053634A (en) 1988-07-25 1991-10-01 Sawafuji Electric Co., Ltd. Waterproofing device for control circuit used in outboard engines
US4943676A (en) 1989-07-12 1990-07-24 Air Products And Chemicals, Inc. Thermolysis of poly(N-vinylformamide) to poly(N-vinylamine)

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Hybrid integrated circuit on p. 106 of Electronic Design, Feb. 4, 1993.
Powerex control module on p. 208 of EDN, Apr. 23, 1992.
Sampling amplifier on p. 126 of Electronic Design, Jan. 21, 1993.

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD456787S1 (en) 2000-12-08 2002-05-07 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD466093S1 (en) 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD471167S1 (en) 2001-04-27 2003-03-04 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
USD471524S1 (en) 2001-04-27 2003-03-11 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD465463S1 (en) 2001-06-15 2002-11-12 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD453746S1 (en) 2001-07-26 2002-02-19 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD470825S1 (en) 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD699675S1 (en) * 2011-09-09 2014-02-18 Zenovia Electronics Inc. Amplifier module
USD690672S1 (en) * 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
USD693318S1 (en) * 2011-10-27 2013-11-12 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD745476S1 (en) * 2012-10-19 2015-12-15 Solumatics CVBA Print board
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD827593S1 (en) 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD903612S1 (en) * 2019-03-26 2020-12-01 Fuji Electric Co., Ltd. Semiconductor module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD983759S1 (en) * 2019-05-31 2023-04-18 Fuji Electric Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module

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