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USD355411S - Integrated circuit electronic package - Google Patents

Integrated circuit electronic package Download PDF

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Publication number
USD355411S
USD355411S US29/009,137 US913793F USD355411S US D355411 S USD355411 S US D355411S US 913793 F US913793 F US 913793F US D355411 S USD355411 S US D355411S
Authority
US
United States
Prior art keywords
integrated circuit
electronic package
circuit electronic
package
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/009,137
Inventor
Amir-Akbar Sadigh-Behzadi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cicon Components Inc
Original Assignee
Cicon Components Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cicon Components Inc filed Critical Cicon Components Inc
Priority to US29/009,137 priority Critical patent/USD355411S/en
Assigned to Cicon Components, Inc. reassignment Cicon Components, Inc. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SADIGH-BEHZADI, AMIR-AKBAR
Application granted granted Critical
Publication of USD355411S publication Critical patent/USD355411S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a left, front perspective view showing my new integrated circuit electronic package design as it is attached to an integrated circuit;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a right side elevational view thereof which is a mirror image of the left side elevational view.

Claims (1)

  1. The ornamental design for an integrated circuit electronic package, as shown and described.
US29/009,137 1993-06-04 1993-06-04 Integrated circuit electronic package Expired - Lifetime USD355411S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/009,137 USD355411S (en) 1993-06-04 1993-06-04 Integrated circuit electronic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/009,137 USD355411S (en) 1993-06-04 1993-06-04 Integrated circuit electronic package

Publications (1)

Publication Number Publication Date
USD355411S true USD355411S (en) 1995-02-14

Family

ID=65243117

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/009,137 Expired - Lifetime USD355411S (en) 1993-06-04 1993-06-04 Integrated circuit electronic package

Country Status (1)

Country Link
US (1) USD355411S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD555106S1 (en) * 2006-01-20 2007-11-13 Watlow Electric Manufacturing Company Power controller housing
USD558683S1 (en) * 2006-01-20 2008-01-01 Watlow Electric Manufacturing Company Power controller base housing
USD601103S1 (en) * 2007-01-23 2009-09-29 Watlow Electric Manufacturing Company Power controller housing
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356532A (en) 1980-07-18 1982-10-26 Thomas & Betts Corporation Electronic package and accessory component assembly
USD271197S (en) 1981-02-23 1983-11-01 Robinson-Nugent, Inc. Combined integrated circuit package carrier and socket assembly
US4637670A (en) 1984-04-23 1987-01-20 Amp Incorporated Dual in-line package carrier assembly
US4826440A (en) 1987-10-23 1989-05-02 Molex Incorporated Chip carrier and header assembly and terminals therefor
US4936784A (en) 1988-07-18 1990-06-26 Hirose Electric Co., Ltd. Electronic component socket
US5208529A (en) 1991-07-03 1993-05-04 Sym-Tek Systems, Inc. Electric device contact assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356532A (en) 1980-07-18 1982-10-26 Thomas & Betts Corporation Electronic package and accessory component assembly
USD271197S (en) 1981-02-23 1983-11-01 Robinson-Nugent, Inc. Combined integrated circuit package carrier and socket assembly
US4637670A (en) 1984-04-23 1987-01-20 Amp Incorporated Dual in-line package carrier assembly
US4826440A (en) 1987-10-23 1989-05-02 Molex Incorporated Chip carrier and header assembly and terminals therefor
US4936784A (en) 1988-07-18 1990-06-26 Hirose Electric Co., Ltd. Electronic component socket
US5208529A (en) 1991-07-03 1993-05-04 Sym-Tek Systems, Inc. Electric device contact assembly

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Data sheet for "Ansley 28-Position Low-Profile Prom Socket and Header Module", Thomas & Betts Corp., catalog, 1988, 6 pages.
Data sheet for "Ansley Dip Sockets with Decoupling Capacitor", Thomas & Betts Corp. catalog, 1988, 2 pages.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD555106S1 (en) * 2006-01-20 2007-11-13 Watlow Electric Manufacturing Company Power controller housing
USD558683S1 (en) * 2006-01-20 2008-01-01 Watlow Electric Manufacturing Company Power controller base housing
USD601103S1 (en) * 2007-01-23 2009-09-29 Watlow Electric Manufacturing Company Power controller housing
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package

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