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USD267942S - Heat-sink for electronic semiconductor devices - Google Patents

Heat-sink for electronic semiconductor devices Download PDF

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Publication number
USD267942S
USD267942S US06/208,924 US20892480F USD267942S US D267942 S USD267942 S US D267942S US 20892480 F US20892480 F US 20892480F US D267942 S USD267942 S US D267942S
Authority
US
United States
Prior art keywords
sink
heat
semiconductor devices
electronic semiconductor
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/208,924
Inventor
Alfred F. McCarthy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LaSalle Business Credit LLC
Original Assignee
Aavid Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Engineering Inc filed Critical Aavid Engineering Inc
Priority to US06/208,924 priority Critical patent/USD267942S/en
Assigned to AAVID ENGINEERING, INC., A CORP. OF NEW HAMPSHIRE reassignment AAVID ENGINEERING, INC., A CORP. OF NEW HAMPSHIRE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: MC CARTHY, ALFRED F.
Application granted granted Critical
Publication of USD267942S publication Critical patent/USD267942S/en
Assigned to MNC COMMERCIAL CORP. reassignment MNC COMMERCIAL CORP. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC., A NH CORP.
Assigned to MNC COMMERCIAL CORP., A MD CORP. reassignment MNC COMMERCIAL CORP., A MD CORP. SPECIAL POWER ATTY., ASSIGNOR HEREBY APPOINTS ASSIGNEE AS ITS POWER OF ATTORNEY TO ACT IN ALL MATTERS INVOLVING SAID PATENTS. Assignors: AAVID ENGINEERING, INC., A N.H. CORP.
Assigned to MNC COMMERCIAL CORP., A MD CORP. reassignment MNC COMMERCIAL CORP., A MD CORP. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC., A N.H. CORP.
Assigned to AAVID ENGINEERING, INC. reassignment AAVID ENGINEERING, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MARYLAND NATIONAL BANK (AS SUCCESSOR-IN-INTEREST TO MNC CREDIT CORP.)
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AAVID ENGINEERING, INC.
Anticipated expiration legal-status Critical
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. CORRECTIVE ASSIGNMENT OF SECURITY INTEREST IN PATENTS TO AMEND THE CONVEYING PARTY NAME, PREVIOUSLY RECORDED AT REEL 6747, FRAME 0635. Assignors: AAVID THERMAL PRODCUTS, INC.
Assigned to LASALLE BUSINESS CREDIT, INC. reassignment LASALLE BUSINESS CREDIT, INC. AMENDMENT: AMEND CONVEYING PARTY'S NAME ON PREVIOUSLY RECORDED ASSIGNMENT OF SECURITY INTEREST IN PATENTS, REEL 8059 FRAME 0087, RECORDED 10/07/96 Assignors: AAVID THERMAL PRODUCTS, INC.
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a heat sink for electronic semiconductor devices showing my new design, the semiconductor being shown in broken lines for illustrative purposes only;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof, looking toward the right side of the heat-sink as it is shown in FIG. 1;
FIG. 5 is a side elevational view thereof, looking toward the left side of the heat-sink as it is shown in FIG. 1;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a heat-sink for electronic semiconductor devices, substantially as shown and described.
US06/208,924 1980-11-21 1980-11-21 Heat-sink for electronic semiconductor devices Expired - Lifetime USD267942S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US06/208,924 USD267942S (en) 1980-11-21 1980-11-21 Heat-sink for electronic semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/208,924 USD267942S (en) 1980-11-21 1980-11-21 Heat-sink for electronic semiconductor devices

Publications (1)

Publication Number Publication Date
USD267942S true USD267942S (en) 1983-02-15

Family

ID=64048137

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/208,924 Expired - Lifetime USD267942S (en) 1980-11-21 1980-11-21 Heat-sink for electronic semiconductor devices

Country Status (1)

Country Link
US (1) USD267942S (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD287121S (en) 1984-04-23 1986-12-09 Aavid Engineering, Inc. Sheet-metal heat sink for electronic devices
USD303786S (en) 1987-02-26 1989-10-03 Aavid Engineering, Inc. Spring-clip heat sink for a pair of electronic devices
US6633485B1 (en) 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting
USD894849S1 (en) * 2017-05-24 2020-09-01 Osram Sylvania Inc. Heat sink
USD902163S1 (en) * 2017-05-24 2020-11-17 Osram Sylvania Inc. Surface-mountable heat sink
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893161A (en) 1974-02-04 1975-07-01 Jr Albert Pesak Frictionally engageable heat sink for solid state devices
US4012769A (en) 1975-08-04 1977-03-15 Thermalloy Incorporated Heat sink with parallel flat faces

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893161A (en) 1974-02-04 1975-07-01 Jr Albert Pesak Frictionally engageable heat sink for solid state devices
US4012769A (en) 1975-08-04 1977-03-15 Thermalloy Incorporated Heat sink with parallel flat faces

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD287121S (en) 1984-04-23 1986-12-09 Aavid Engineering, Inc. Sheet-metal heat sink for electronic devices
USD303786S (en) 1987-02-26 1989-10-03 Aavid Engineering, Inc. Spring-clip heat sink for a pair of electronic devices
US6633485B1 (en) 2002-11-20 2003-10-14 Illinois Tool Works Inc. Snap-in heat sink for semiconductor mounting
US20040201964A1 (en) * 2002-11-20 2004-10-14 Sigl Dennis R. Snap-in heat sink for semiconductor mounting
USD894849S1 (en) * 2017-05-24 2020-09-01 Osram Sylvania Inc. Heat sink
USD894848S1 (en) * 2017-05-24 2020-09-01 Osram Sylvania Inc. Lightweight heat sink
USD902163S1 (en) * 2017-05-24 2020-11-17 Osram Sylvania Inc. Surface-mountable heat sink
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

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